JP4578457B2

JP4578457B2 - Power module device

Info

Publication number: JP4578457B2
Application number: JP2006298334A
Authority: JP
Inventors: 雅樹高田; 隆熊谷; 建一林; 浩二中島; 憲一川畑
Original assignee: Mitsubishi Electric Corp
Current assignee: Mitsubishi Electric Corp
Priority date: 2006-11-02
Filing date: 2006-11-02
Publication date: 2010-11-10
Anticipated expiration: 2026-11-02
Also published as: JP2008117870A

Description

この発明は、例えばダイオード、トランジスタ、ＭＯＳＦＥＴ、ＩＧＢＴ等をパッケージに収めたパワーモジュールとパワー配線回路板を一体化したパワーモジュール装置に関する。 The present invention relates to a power module device in which, for example, a power module in which a diode, a transistor, a MOSFET, an IGBT and the like are housed in a package and a power wiring circuit board are integrated.

従来のパワーモジュール装置として、基板と、この基板に搭載された半導体装置と、前記基板に支柱を介して支持されたプリント基板とを備える電子回路装置において、前記半導体装置はその外枠体表面に電極を構成する雌ねじを備え、この雌ねじに螺合する雄ねじが前記支柱および前記プリント基板への配線導体を兼ねるようにしたものがある（例えば特許文献１参照。）。
また、複数の入出力端子と、複数の信号端子を持ち、内部素子からの発熱を底面から放熱するパワーモジュール部品と、このパワーモジュール部品を放熱するために放熱用ベースプレートに固定する固定手段と、このパワーモジュール部品上に配置された第１のプリント基板と、この第１のプリント基板の上部位置に、第１のプリント基板とは空間を介して配置された第２のプリント基板を具備したものがある（例えば特許文献２参照。）。 As an existing power module device, in an electronic circuit device comprising a substrate, a semiconductor device mounted on the substrate, and a printed circuit board supported on the substrate via a support, the semiconductor device is placed on the outer frame surface. There is a type in which a female screw that constitutes an electrode is provided, and a male screw that is screwed into the female screw also serves as a wiring conductor to the support column and the printed circuit board (see, for example, Patent Document 1).
A power module component having a plurality of input / output terminals, a plurality of signal terminals, and radiating heat from the internal element from the bottom surface; and a fixing means for fixing the power module component to the heat dissipation base plate; A first printed circuit board disposed on the power module component, and a second printed circuit board disposed at a position above the first printed circuit board with a space between the first printed circuit board. (For example, refer to Patent Document 2).

特開平５−１０９８３６号公報（第１頁、図１）Japanese Patent Laid-Open No. 5-109836 (first page, FIG. 1) 特開２００１−５３４７４号公報（第１頁、図１）JP 2001-53474 A (first page, FIG. 1)

上記のような従来のパワーモジュール装置では、支柱や中継端子を設けて回路板とパワーモジュールを接続し、誤配線や配線長を短くしているが、パワーモジュールと接続されるパワー配線回路板上の配線パターンは、発熱部品であるパワーモジュールからの熱伝導や、大電流が流れるパワー配線回路板上の配線パターンの自己発熱により、特にパワーモジュールと接続されるパワー配線回路板の配線パターン温度が局部的に上昇し、特にパワーモジュールがねじ止めされたパワー配線回路板においては、放熱が充分ではないため、パワーモジュールと締結されるネジ端子部の配線パターンの温度上昇が最も大きく、温度上の制約となっている課題があった。 In the conventional power module device as described above, the power board is connected to the circuit board by providing support posts and relay terminals to shorten the incorrect wiring and wiring length. The wiring pattern temperature of the power wiring circuit board connected to the power module is particularly high due to heat conduction from the power module, which is a heat generating component, and self-heating of the wiring pattern on the power wiring circuit board through which a large current flows. In the power wiring circuit board where the power module is screwed locally, especially in the power wiring circuit board where the power module is screwed, since the heat radiation is not sufficient, the temperature rise of the wiring pattern of the screw terminal portion fastened to the power module is the largest, There was a problem that was a limitation.

この発明は上記のような従来技術の課題を解消するためになされたもので、パワー配線回路板を効率的に冷却し、配線パターンの局部的な温度上昇を軽減して該配線パターンのヒートサイクルが緩和された信頼性の高いパワーモジュール装置を提供することを目的としている。 The present invention has been made to solve the above-described problems of the prior art, efficiently cooling a power wiring circuit board, reducing a local temperature rise of the wiring pattern, and heat cycle of the wiring pattern. An object of the present invention is to provide a highly reliable power module device in which the above is mitigated.

この発明によるパワーモジュール装置は、パワーモジュールと、このパワーモジュールに熱的に結合された放熱器と、上記パワーモジュールに電気的に接続される回路部品が設けられたパワー配線回路板と、このパワー配線回路板及び上記パワーモジュールを電気的に接続すると共に、該パワー配線回路板を上記放熱器又は上記パワーモジュールと離間させて機械的に接続する接続部材と、これらパワー配線回路板及び上記放熱器又はパワーモジュールの間に形成された離間空間に対面するように設けられ、これらパワー配線回路板及び上記放熱器又はパワーモジュールと協働して風路を形成する仕切部材とを備え、上記パワー配線回路板と上記パワーモジュール又は上記放熱器を平行に配設して、これらの対向面の内側に上記風路を形成してなるものであって、上記パワー配線回路板は、対向する上記パワーモジュール又は放熱器の端部より外方にはみ出すように突出され、上記仕切部材は、上記はみ出した部分に対向して上記パワー配線回路板に平行に上記パワーモジュール又は放熱器の延長線上に設けられているものである。 A power module device according to the present invention includes a power module, a heat radiator thermally coupled to the power module, a power wiring circuit board provided with circuit components electrically connected to the power module, and the power module. A connection member for electrically connecting the wiring circuit board and the power module, and mechanically connecting the power wiring circuit board to the radiator or the power module, and the power wiring circuit board and the radiator. Alternatively, the power wiring includes a power supply circuit board and a partition member that forms an air passage in cooperation with the radiator or the power module. The circuit board and the power module or the radiator are arranged in parallel, and the air path is formed inside the facing surfaces. The power wiring circuit board is projected so as to protrude outward from an end portion of the opposing power module or radiator, and the partition member is opposed to the protruding portion and the power wiring circuit board. It is provided on the extension line of the power module or radiator in parallel with the circuit board.

この発明においては、接続部材によって形成されたパワー配線回路板と放熱器又はパワーモジュールの間の離間空間に対面するように設けられ、対向する上記パワーモジュール又は放熱器の端部より外方にはみ出すように突出されたパワー配線回路板のはみ出した部分に対向して上記パワー配線回路板に平行に上記パワーモジュール又は放熱器の延長線上に設けられている仕切部材が、これらパワー配線回路板及び上記放熱器又はパワーモジュールと協働して風路を形成し、自然もしくは強制的な対流発生を助長することによりパワー配線回路板が効率的に冷却され、配線パターンの局部的な温度上昇が軽減され、パワーモジュール装置の信頼性を高めることができる。 In the present invention, the power wiring circuit board formed by the connecting member is provided so as to face the space between the radiator or the power module and protrudes outward from the end of the opposing power module or radiator. The partition member provided on the extension line of the power module or the radiator parallel to the power wiring circuit board facing the protruding portion of the power wiring circuit board protruding in this manner includes the power wiring circuit board and the power wiring circuit board. In cooperation with the heatsink or power module, an air path is formed to promote natural or forced convection generation, thereby efficiently cooling the power wiring circuit board and reducing the local temperature rise of the wiring pattern. The reliability of the power module device can be improved.

参考例１．
図１は本発明の参考例１に係るパワーモジュール装置の要部を概念的に示す断面図である。図において、パワーモジュール装置１は、図示省略している筐体等に対して直接または間接的に固定された金属製の放熱器２に対して例えば密着させることにより熱的に結合されたパワーモジュール３と、このパワーモジュール３の制御回路（図示省略）等を含む配線パターン４などが設けられたパワー配線回路板５と、これらパワーモジュール３及びパワー配線回路板５を電気的に接続すると共に、パワー配線回路板５及び放熱器２又はパワーモジュール３を離間させた状態で相互を機械的に接続する接続部材７と、これらパワー配線回路板５及び放熱器２又はパワーモジュール３の間に形成された離間空間に対面するように設けられ、該パワー配線回路板５及び放熱器２又はパワーモジュール３と協働して風路６を形成する仕切部材８などを備えている。 Reference Example 1
FIG. 1 is a sectional view conceptually showing a main part of a power module device according to Reference Example 1 of the present invention. In the figure, the power module device 1 is a power module that is thermally coupled, for example, by being brought into close contact with a metal radiator 2 that is directly or indirectly fixed to a housing or the like (not shown). 3 and a power wiring circuit board 5 provided with a wiring pattern 4 including a control circuit (not shown) of the power module 3 and the like, and the power module 3 and the power wiring circuit board 5 are electrically connected, The power wiring circuit board 5 and the radiator 2 or the power module 3 are formed between the power wiring circuit board 5 and the radiator 2 or the power module 3 and the connection member 7 that mechanically connects the power wiring circuit board 5 and the radiator 2 or the power module 3 to each other. The partition member 8 is provided so as to face the separated space and forms the air passage 6 in cooperation with the power wiring circuit board 5 and the radiator 2 or the power module 3. It is equipped with a.

なお、接続部材７は間隔を形成するスペーサ部材７ａと、配線パターン４の所定部からスペーサ部材７ａを貫通してパワーモジュール３に締結されパワー配線回路板５及びパワーモジュール３を電気的、機械的に接続する固定ネジ７ｂによって構成されている。この参考例１では、パワーモジュール３及び放熱器２とパワー配線回路板５は略平行に配設され、対流方向から見た放熱器２とパワー配線回路板５は平行で、風路６はこれら放熱器２とパワー配線回路板５の対向面の内側に形成されている。そして、仕切部材８は、該仕切部材８の一端部（図１の上方部）がパワー配線回路板５の側端部付近に位置し、他端部が放熱器２の側端部付近に位置して風路６の側方部を塞ぐように配設されている。 The connection member 7 includes a spacer member 7a that forms a gap, and a spacer member 7a that passes through a predetermined portion of the wiring pattern 4 and is fastened to the power module 3. The power wiring circuit board 5 and the power module 3 are electrically and mechanically connected. It is comprised by the fixing screw 7b connected to. In this reference example 1, the power module 3 and the radiator 2 and the power wiring circuit board 5 are arranged substantially in parallel, the radiator 2 and the power wiring circuit board 5 viewed from the convection direction are parallel, and the air path 6 is defined by these. It is formed inside the opposing surfaces of the radiator 2 and the power wiring circuit board 5. The partition member 8 has one end portion (upper portion in FIG. 1) of the partition member 8 positioned near the side end portion of the power wiring circuit board 5 and the other end portion positioned near the side end portion of the radiator 2. And it is arrange | positioned so that the side part of the air path 6 may be plugged up.

なお、上記仕切部材８は図示省略している筐体の壁面を利用したものでも良い。また、この例では図示省略している電動ファンにより冷却風の少なくとも一部が風路６を通風するように構成されている。なお、該電動ファンは例えば周囲温度に応じて回転数を変えるように構成することも差し支えない。また、パワーモジュール３は、例えばダイオード、トランジスタ、ＭＯＳＦＥＴ、ＩＧＢＴ等がパッケージに収められた周知のもので、例えばインバータ装置などに用いられるものであるが、その回路構成、用途などは勿論限定されるものではない。 The partition member 8 may be one utilizing a wall surface of a housing not shown. In this example, an electric fan (not shown) is configured so that at least a part of the cooling air passes through the air passage 6. The electric fan may be configured to change the number of rotations according to the ambient temperature, for example. The power module 3 is a well-known one in which, for example, a diode, a transistor, a MOSFET, an IGBT, or the like is housed in a package. For example, the power module 3 is used in an inverter device or the like. It is not a thing.

次に、上記のように構成された参考例１の動作について説明する。パワーモジュール装置１が動作すると、図示省略している素子、及び回路に大きな電流が流れ、パワーモジュール３及びパワー配線回路板５上の配線パターン４などが発熱する。パワーモジュール３から発生した熱の大部分は熱抵抗の小さい放熱器２に伝達され、放熱器２の放熱フィンから空気中に放熱される。また、パワーモジュール３は接続部材７によりパワー配線回路板５に接続されていることにより、発生した熱の一部はパワー配線回路板５の配線パターン４の固定ネジ７ｂ部分に伝わり、配線パターン４自身の発熱も加わってパワー配線回路板５も温度が上昇する。この参考例１では、仕切部材８により風路６が形成されていることにより対流が起こり易く、更に図示省略している電動ファンによって付勢された冷却風が、該風路６を強制的に通流し、パワー配線回路板５の表面（裏面）全体から熱を効率的に奪うことにより、配線パターン４も冷却され、温度上昇が抑制される。 Next, the operation of Reference Example 1 configured as described above will be described. When the power module device 1 operates, a large current flows through elements and circuits not shown, and the power module 3 and the wiring pattern 4 on the power wiring circuit board 5 generate heat. Most of the heat generated from the power module 3 is transmitted to the radiator 2 having a small thermal resistance, and is radiated from the radiation fins of the radiator 2 into the air. Further, since the power module 3 is connected to the power wiring circuit board 5 by the connecting member 7, a part of the generated heat is transmitted to the fixing screw 7 b portion of the wiring pattern 4 of the power wiring circuit board 5, and the wiring pattern 4. The power wiring circuit board 5 also rises in temperature due to its own heat generation. In the first reference example , the air passage 6 is formed by the partition member 8 so that convection easily occurs. Further, the cooling air urged by the electric fan (not shown) forcibly causes the air passage 6 to be forced. By flowing and efficiently removing heat from the entire front surface (back surface) of the power wiring circuit board 5, the wiring pattern 4 is also cooled, and the temperature rise is suppressed.

上記のように参考例１によれば、仕切部材８がパワー配線回路板５及び放熱器２またはパワーモジュール３と協働して風路６を形成して対流を発生し易くし、更に該風路６に電動ファンにより強制的に対流を発生させ、風路６に対面するパワーモジュール３及びパワー配線回路板５を冷却する。これによりパワー配線回路板５の裏面の放熱性が向上し、配線パターン４の温度上昇が抑制されることにより、配線パターン４のヒートサイクルが緩和され、当該回路、製品の信頼性が向上するという効果が得られる。
なお、上記説明では図示していない電動ファンにより風路６に強制的に対流を発生させたが、自然的に対流を発生させるようにしても良い。この場合、対流が促進されるように、風路６の通風方向が上下方向となるように構成部材の向きを選ぶことは好ましい。さらに、仕切部材８は図の右側部に設け、あるいは左右両側に設けても良い。 As described above, according to the reference example 1, the partition member 8 cooperates with the power wiring circuit board 5 and the radiator 2 or the power module 3 to form the air passage 6 to easily generate convection. Convection is forcibly generated in the path 6 by an electric fan, and the power module 3 and the power wiring circuit board 5 facing the air path 6 are cooled. As a result, the heat radiation of the back surface of the power wiring circuit board 5 is improved, and the temperature rise of the wiring pattern 4 is suppressed, so that the heat cycle of the wiring pattern 4 is alleviated and the reliability of the circuit and product is improved. An effect is obtained.
In the above description, convection is forcibly generated in the air passage 6 by an electric fan (not shown), but convection may be generated naturally. In this case, it is preferable to select the orientation of the constituent members so that the ventilation direction of the air passage 6 is the vertical direction so that convection is promoted. Furthermore, the partition member 8 may be provided on the right side of the drawing or on both the left and right sides.

実施の形態１．
図２は本発明の実施の形態１に係るパワーモジュール装置の要部を概念的に示す断面図である。この実施の形態１では、パワー配線回路板５がパワーモジュール３又は放熱器２Ａの両端部よりも左右両外方にはみ出す如く突出され、仕切部材８は、上記はみ出した部分に対向してパワー配線回路板５に平行に上記放熱器２Ａの左右の延長線上にそれぞれ設けられ、間隙部からなる風路６Ａの側方部は開放されている。その他の構成は上記参考例１と同様であるので説明を省略する。また、各図を通じて同一符号は同一または相当部分を示すものとする。 Embodiment 1 FIG.
FIG. 2 is a cross-sectional view conceptually showing a main part of the power module device according to Embodiment 1 of the present invention. In the first embodiment, the power wiring circuit board 5 protrudes from both ends of the power module 3 or the radiator 2A so as to protrude from the left and right sides, and the partition member 8 is opposed to the protruding portion. Parallel to the circuit board 5 are provided on the left and right extension lines of the radiator 2A, respectively, and the side portion of the air passage 6A including the gap portion is opened. Since other configurations are the same as those of the first reference example, description thereof is omitted. The same reference numerals denote the same or corresponding parts throughout the drawings.

上記のように構成された実施の形態１においては、パワー配線回路板５と仕切部材８で挟まれた空間によって風路６Ａを形成し該風路６Ａの側方部を開放した事により、前記風路６Ａ内の対流方向が制約されない。このため、前記風路６Ａ内のパワーモジュール３およびパワー配線回路板５の冷却がより効果的に行なわれ、パワー配線回路板５の配線パターン４の温度上昇がさらに抑制されることにより、配線パターン４のヒートサイクルが緩和され当該回路・製品の信頼性が向上する。 In the first embodiment configured as described above, the air passage 6A is formed by the space sandwiched between the power wiring circuit board 5 and the partition member 8, and the side portion of the air passage 6A is opened. The convection direction in the air path 6A is not restricted. Therefore, the power module 3 and the power wiring circuit board 5 in the air passage 6A are cooled more effectively, and the temperature rise of the wiring pattern 4 of the power wiring circuit board 5 is further suppressed, whereby the wiring pattern 4 is relieved and the reliability of the circuit / product is improved.

参考例２．
図３は本発明の参考例２に係るパワーモジュール装置の要部を概念的に示す断面図である。この参考例２は、パワー配線回路板５を図示省略している筐体に直接、又は放熱器２Ａを介して該筐体に固定する板状の支持部材９が具備され、更に仕切部材８は、その一端部（図３の上方部）がパワー配線回路板５の側端部付近に位置し、他端部（図の右側）が放熱器２Ａの側方部方向に伸びて風路６Ｂの側方部を塞ぐように配設されている。なお、仕切部材８はパワーモジュール３に対して支持部材９とは反対側に設けられ、該仕切部材８と放熱器３によって形成された図の左側の風路６Ｂは、図の下方部が開放されている。また、支持部材９は仕切部材８の機能を兼ねている。その他の構成は上記実施の形態１と同様であるので説明を省略する。 Reference Example 2
FIG. 3 is a sectional view conceptually showing a main part of a power module device according to Reference Example 2 of the present invention. This reference example 2 is provided with a plate-like support member 9 for fixing the power wiring circuit board 5 to the housing not shown in the drawing directly or via the radiator 2A, and the partition member 8 is One end (upper part in FIG. 3) is located near the side end of the power wiring circuit board 5, and the other end (right side in the figure) extends in the direction of the side of the radiator 2A. It arrange | positions so that a side part may be plugged up. The partition member 8 is provided on the opposite side of the power module 3 from the support member 9, and the air passage 6B on the left side of the figure formed by the partition member 8 and the radiator 3 is open at the lower part of the figure. Has been. Further, the support member 9 also functions as the partition member 8. Since other configurations are the same as those of the first embodiment, description thereof is omitted.

上記のように構成された参考例２においては、参考例１とほぼ同様にパワーモジュール３とパワー配線回路板５の冷却が行なわれ、さらにパワー配線回路板５と放熱器２Ａまたは該放熱器２Ａが取り付けられた筐体とを機械的に結合する支持部材９が設けられていることにより、パワーモジュール３とパワー配線回路板５を締結する固定ネジ７ｂ近傍のパワー配線回路板５への応力が緩和されるので、上記参考例１の効果に加えて、信頼性が更に向上するという効果が得られる。 In the reference example 2 configured as described above, the power module 3 and the power wiring circuit board 5 are cooled in substantially the same manner as in the reference example 1, and the power wiring circuit board 5 and the radiator 2A or the radiator 2A are further cooled. By providing the support member 9 that mechanically couples the housing to which the power module 3 is attached, the stress on the power wiring circuit board 5 in the vicinity of the fixing screw 7b for fastening the power module 3 and the power wiring circuit board 5 is reduced. Since it is relaxed, in addition to the effect of the reference example 1, the effect of further improving the reliability is obtained.

参考例３．
図４は本発明の参考例３に係るパワーモジュール装置の要部を概念的に示す断面図である。この参考例３は、図３に示す参考例２における仕切部材８の機能を全て支持部材９に分担させ、図３に示す仕切部材８を省いたものに相当する。
即ちこの参考例３は、支持部材を兼ねる仕切部材８１を備えたもので、このように構成された参考例３では、仕切部材８１が支持部材の機能を兼ねる事で、パワー配線回路板５と放熱器２Ａと仕切部材８１で囲まれた空間で形成された風路６Ｃがより限定的となり、パワー配線回路板５の配線パターン４を効率よく冷却できるため、配線パターン４のヒートサイクルが緩和され、当該回路・製品の信頼性が向上される。また、仕切部材８１が支持部材も兼ねる事で、製造コストを安価にすることが出来る。 Reference Example 3
FIG. 4 is a sectional view conceptually showing a main part of a power module device according to Reference Example 3 of the present invention. The reference example 3 corresponds to a structure in which all the functions of the partition member 8 in the reference example 2 shown in FIG. 3 are shared by the support member 9 and the partition member 8 shown in FIG. 3 is omitted.
That is, the reference example 3 includes a partition member 81 that also serves as a support member. In the reference example 3 configured as described above, the partition member 81 also serves as a support member, so that the power wiring circuit board 5 and The air path 6C formed in the space surrounded by the radiator 2A and the partition member 81 becomes more limited, and the wiring pattern 4 of the power wiring circuit board 5 can be efficiently cooled, so that the heat cycle of the wiring pattern 4 is alleviated. The reliability of the circuit / product is improved. Further, since the partition member 81 also serves as a support member, the manufacturing cost can be reduced.

参考例４．
図５は本発明の参考例４に係るパワーモジュール装置の要部を概念的に示す断面図である。この参考例４は、図３に示す参考例２における支柱状の接続部材７を、風路の通風方向（対流方向）から見たときに略コ字状に形成されているスペーサ部材７ｃと固定ネジ７ｄからなる接続部材７Ａに変更し、支持部材９を省略して風路６Ｄを形成するようにしたもので、その他の構成は参考例２と同様である。
上記のように構成された参考例４によればコの字に形成されたスペーサ部材７ｃを用いた接続部材７Ａを用いることで、接続部材７Ａの放熱性能が向上され、接続部材７Ａと接続されたパワー配線回路板５Ａの配線パターン４Ａが更に効率よく冷却できるため、配線パターン４Ａのヒートサイクルが更に緩和され当該回路・製品の信頼性の向上が図れる。 Reference Example 4
FIG. 5 is a sectional view conceptually showing a main part of a power module device according to Reference Example 4 of the present invention. This reference example 4 is fixed to the support member 7 in the reference example 2 shown in FIG. 3 and the spacer member 7c formed in a substantially U shape when viewed from the ventilation direction (convection direction) of the air passage. The connection member 7A is a screw 7d, and the support member 9 is omitted to form the air passage 6D. Other configurations are the same as those of the reference example 2 .
According to the reference example 4 configured as described above, by using the connecting member 7A using the spacer member 7c formed in a U-shape, the heat dissipation performance of the connecting member 7A is improved and connected to the connecting member 7A. Further, since the wiring pattern 4A of the power wiring circuit board 5A can be cooled more efficiently, the heat cycle of the wiring pattern 4A can be further relaxed, and the reliability of the circuit / product can be improved.

参考例５．
図６は本発明の参考例５に係るパワーモジュール装置の要部を概念的に示す断面図である。この参考例５は、パワー配線回路板５の放熱器２Ａに対向する面に乱流促進部材１０を突出するように設け、風路６Ｅを形成したものである。なお、この乱流促進部材１０はパワー配線回路板５に実装される回路部品もしくは前記回路部品のリード線などハンダ付けされた回路部品の一部もしくは図３に示す支持部材９を兼用しても可能である。また、仕切部材８は参考例２と同様にパワー配線回路板５の端部に一端部が位置するように設けられている。
上記のように構成された参考例５では、パワー配線回路板５の放熱器２Ａに対向する面に乱流促進部材１０を突設した事により、パワー配線回路板５と放熱器２Ａと仕切部材８で囲まれた風路６Ｅに乱流を発生させた事でパワー配線回路板５や接続部材７からの放熱が促進され、配線パターン４が効率よく冷却できるため、配線パターン４のヒートサイクルが緩和されて製品の信頼性が向上する。 Reference Example 5
FIG. 6 is a sectional view conceptually showing a main part of a power module device according to Reference Example 5 of the present invention. In this reference example 5 , a turbulence promoting member 10 is provided so as to protrude from the surface of the power wiring circuit board 5 facing the radiator 2A, and an air passage 6E is formed. The turbulence promoting member 10 may be used as a circuit component mounted on the power wiring circuit board 5 or a part of a soldered circuit component such as a lead wire of the circuit component or the support member 9 shown in FIG. Is possible. Moreover, the partition member 8 is provided so that one end part may be located in the edge part of the power wiring circuit board 5 similarly to the reference example 2. FIG.
In the reference example 5 configured as described above, the power wiring circuit board 5, the radiator 2 </ b> A, and the partition member are provided by projecting the turbulence promoting member 10 on the surface of the power wiring circuit board 5 facing the radiator 2 </ b> A. Since heat generation from the power wiring circuit board 5 and the connecting member 7 is promoted by generating turbulent flow in the air passage 6E surrounded by 8, the wiring pattern 4 can be efficiently cooled. Mitigated to improve product reliability.

なお、上記実施の形態１および参考例１〜５で図示したパワーモジュール装置の構成部材は一例に過ぎず、例えば放熱器２、２Ａのフィン配置等、構成部材の形状、大きさ、位置関係、あるいは接続部材７や仕切部材８の設置個数などは図示のものに限定されないことは言うまでもない。 Note that the constituent members of the power module device illustrated in the first embodiment and the reference examples 1 to 5 are merely examples, and the shape, size, positional relationship of the constituent members such as the fin arrangement of the radiators 2 and 2A, Or it cannot be overemphasized that the installation number of the connection member 7 or the partition member 8 is not limited to the thing of illustration.

本発明の参考例１によるパワーモジュール装置の要部を概念的に示す断面図である。It is sectional drawing which shows notionally the principal part of the power module apparatus by the reference example 1 of this invention. 本発明の実施の形態１によるパワーモジュール装置の要部を概念的に示す断面図である。It is sectional drawing which shows notionally the principal part of the power module apparatus by Embodiment 1 of this invention. 本発明の参考例２によるパワーモジュール装置の要部を概念的に示す断面図である。It is sectional drawing which shows notionally the principal part of the power module apparatus by the reference example 2 of this invention. 本発明の参考例３によるパワーモジュール装置の要部を概念的に示す断面図である。It is sectional drawing which shows notionally the principal part of the power module apparatus by the reference example 3 of this invention. 本発明の参考例４によるパワーモジュール装置の要部を概念的に示す断面図である。It is sectional drawing which shows notionally the principal part of the power module apparatus by the reference example 4 of this invention. 本発明の参考例５によるパワーモジュール装置の要部を概念的に示す断面図である。It is sectional drawing which shows notionally the principal part of the power module apparatus by the reference example 5 of this invention.

１パワーモジュール装置、２、２Ａ放熱器、３パワーモジュール、４配線パターン、５、５Ａパワー配線回路板、６、６Ａ、６Ｂ、６Ｃ、６Ｄ、６Ｅ風路、７、７Ａ接続部材、７ａ、７ｃスペーサ部材、７ｂ、７ｄ固定ネジ、８仕切部材、８１（支持部材兼）仕切部材、９支持部材、１０乱流促進部材。 DESCRIPTION OF SYMBOLS 1 Power module apparatus, 2, 2A radiator, 3 Power module, 4 Wiring pattern, 5, 5A Power wiring circuit board, 6, 6A, 6B, 6C, 6D, 6E Air path, 7, 7A Connection member, 7a, 7c Spacer member, 7b, 7d fixing screw, 8 partition member, 81 (also supporting member) partition member, 9 support member, 10 turbulence promoting member.

Claims

A power module, a radiator thermally coupled to the power module, a power wiring circuit board provided with circuit components electrically connected to the power module, and the power wiring circuit board and the power module. A connection member that is electrically connected and mechanically connects the power wiring circuit board with the radiator or the power module and is formed between the power wiring circuit board and the radiator or the power module. was separated space is provided so as to face, in cooperation with these power wiring circuit board and the radiator or the power module and a partition member that forms a wind path, the power wiring circuit board and the power module or the A heatsink is disposed in parallel, and the air path is formed inside these opposing surfaces, and the power wiring circuit Is projected so as to protrude outward from the end of the opposing power module or radiator, and the partition member faces the protruding portion and is parallel to the power wiring circuit board in parallel with the power module or radiator. It is provided on the extension line | wire of the power module apparatus characterized by the above-mentioned .

2. The power module device according to claim 1 , wherein the connection member is formed in a U shape when viewed from a ventilation direction of the air passage.

The power module according to claim 1 or claim 2, characterized in that it comprises a turbulence promoting member to the air duct.