JPS62214696A - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPS62214696A JPS62214696A JP5735786A JP5735786A JPS62214696A JP S62214696 A JPS62214696 A JP S62214696A JP 5735786 A JP5735786 A JP 5735786A JP 5735786 A JP5735786 A JP 5735786A JP S62214696 A JPS62214696 A JP S62214696A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- insulating resin
- layer
- metal substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010410 layer Substances 0.000 claims description 67
- 229920005989 resin Polymers 0.000 claims description 40
- 239000011347 resin Substances 0.000 claims description 40
- 239000000758 substrate Substances 0.000 claims description 37
- 229910052751 metal Inorganic materials 0.000 claims description 34
- 239000002184 metal Substances 0.000 claims description 34
- 230000017525 heat dissipation Effects 0.000 claims description 26
- 239000000126 substance Substances 0.000 claims description 19
- 239000011247 coating layer Substances 0.000 claims description 18
- 238000004070 electrodeposition Methods 0.000 claims description 16
- 238000007739 conversion coating Methods 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 14
- 239000003973 paint Substances 0.000 claims description 14
- 239000000654 additive Substances 0.000 claims description 8
- 230000000996 additive effect Effects 0.000 claims description 7
- 239000002826 coolant Substances 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000007747 plating Methods 0.000 description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 229910052802 copper Inorganic materials 0.000 description 10
- 239000010949 copper Substances 0.000 description 10
- 238000007772 electroless plating Methods 0.000 description 9
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 239000007788 liquid Substances 0.000 description 5
- 238000004806 packaging method and process Methods 0.000 description 5
- 229920000877 Melamine resin Polymers 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 4
- 238000007788 roughening Methods 0.000 description 4
- 238000011282 treatment Methods 0.000 description 4
- 229910019142 PO4 Inorganic materials 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 3
- 239000010452 phosphate Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical compound C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 229920006332 epoxy adhesive Polymers 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002659 electrodeposit Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 238000009420 retrofitting Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 〔技術分野〕 この発明は、プリント配線板に関する。[Detailed description of the invention] 〔Technical field〕 The present invention relates to a printed wiring board.
最近、電子部品の小型化に伴って、プリント配線板上へ
の高密′度実装化が進められている。Recently, with the miniaturization of electronic components, high-density packaging on printed wiring boards is progressing.
ＬＥＤやトランジスタが搭載された電子部品が高密度で
実装されていると、電子部品により局所的に大きな熱の
発生がある。そこで、プリント配線板には、この熱を効
率良く吸収し、しかも、吸収した熱を素早く放熱する必
要性が生じる。When electronic components including LEDs and transistors are mounted at high density, a large amount of heat is locally generated by the electronic components. Therefore, there is a need for printed wiring boards to absorb this heat efficiently and to quickly radiate the absorbed heat.
たとえば、プリント配線板の放熱性を高めるための構造
として、放熱性の高い金属を基板に用いることが考えら
れる。すなわち、アルミニウム。For example, as a structure for increasing the heat dissipation of a printed wiring board, it is conceivable to use a metal with high heat dissipation for the board. Namely aluminum.
鉄などからなる金属基板に絶縁樹脂層（接着剤層）を介
して電路を形成するようにするのである。Electrical circuits are formed on a metal substrate made of iron or the like via an insulating resin layer (adhesive layer).
しかし、このプリント配線板は、電路が一層のみである
ので、単位面積あたりの電路数に制限があリ、チップ部
品を高密度に実装することができなかった。また、裏面
に電路を設けてジャンパ線で接続しようとしても、基板
が金属であるため貫通孔側面の絶縁処理が必要で高密度
化が難しがった他方、ガラスエポキシや紙エポキシ等の
有機物質を基板とした多層プリント配線板があるが、こ
れは、基板が有機物質であるため、放熱性が悪いという
欠点があった。そこで、ＬＥＤ、Ｉ−ランジスタなどの
比較的発熱の大きい電子部品を多数個実装する必要が生
じた場合は、アルミニウム等からなる放熱板を後付けす
るなど、何らかの放熱手段を設ける必要があった。その
ため、工程１部品点数が増え、コストアップを招いてい
た。However, since this printed wiring board has only one layer of electrical circuits, the number of electrical circuits per unit area is limited, and chip components cannot be mounted in high density. In addition, even if an electric circuit was set up on the back side and a jumper wire was used to connect it, since the board was made of metal, insulation treatment was required on the side of the through hole, making it difficult to achieve high density. There is a multilayer printed wiring board using a substrate as a substrate, but this has the disadvantage of poor heat dissipation because the substrate is an organic material. Therefore, when it becomes necessary to mount a large number of electronic components that generate relatively large amounts of heat, such as LEDs and I-transistors, it is necessary to provide some kind of heat dissipation means, such as retrofitting a heat dissipation plate made of aluminum or the like. As a result, the number of parts per process increases, leading to an increase in costs.
このような事情から、放熱性が良く、高密度実装に適し
たプリント配線板が求められていた。Under these circumstances, there has been a demand for a printed wiring board that has good heat dissipation properties and is suitable for high-density packaging.
〔発明の目的〕
以上の事情に濫みて、この発明は、放熱性が良く、高密
度実装に適したプリント配線板を提供することを目的と
する。[Object of the Invention] In view of the above circumstances, an object of the present invention is to provide a printed wiring board that has good heat dissipation properties and is suitable for high-density packaging.
前記目的を達成するため、この発明は、表面に絶縁樹脂
層を有する金属基板上の所望部分に２層以上の電路がそ
れぞれ絶縁樹脂層を介して積み重ねられ、前記各電路が
アディティブ法により形成され、かつ、前記金属基板に
放熱構造を備えているプリント配線板をその要旨とする
。In order to achieve the above object, the present invention provides a method in which two or more layers of electrical circuits are stacked on a desired portion of a metal substrate having an insulating resin layer on the surface thereof, each with an insulating resin layer interposed therebetween, and each of the electrical circuits is formed by an additive method. The gist of the present invention is a printed wiring board in which the metal substrate is provided with a heat dissipation structure.
以下にこれを、その一実施例をあられす図面を参照しな
がら詳しく説明する。An embodiment of this will be explained in detail below with reference to the accompanying drawings.
第１図は、この発明にかかるプリント配線板の一実施例
をあられす。FIG. 1 shows an embodiment of a printed wiring board according to the present invention.
図にみるように、このプリント配線板は、アルミニウム
や鉄からなる金属基板１の表面に第１絶縁樹脂層（第１
接着剤層）２が形成されている。As shown in the figure, this printed wiring board has a first insulating resin layer (first insulating resin layer) on the surface of a metal substrate 1 made of aluminum or iron.
An adhesive layer) 2 is formed.
第１絶縁樹脂Ｎ２上の所望部分には、第１電路３および
第２電路４が第２絶縁樹脂層（第２接着剤層）５を介し
て積み重ねられている。第１電路３および第２電路４は
、アディティブ法により形成されている。第１電路３と
第２電路４との間の一部には、第２絶縁樹脂層５が設け
られておらず、その部分で第１電路３と第２電路４とが
導通されている。金属基板１の裏面には、放熱用フィン
６が形成されている。すなわち、金属基板１は、放熱構
造を備えている。A first electric path 3 and a second electric path 4 are stacked on a desired portion on the first insulating resin N2 with a second insulating resin layer (second adhesive layer) 5 interposed therebetween. The first electric path 3 and the second electric path 4 are formed by an additive method. The second insulating resin layer 5 is not provided in a portion between the first electric path 3 and the second electric path 4, and the first electric path 3 and the second electric path 4 are electrically connected in that portion. Heat dissipation fins 6 are formed on the back surface of the metal substrate 1. That is, the metal substrate 1 has a heat dissipation structure.
以上にみるように、このプリント配線板は、電路が多層
構造になっているため、配線密度を上げることができ、
高密度実装が可能である。また、基板が金属からなって
いるため、熱の伝導性が良い、そのため、このプリント
配線板は、実装された電子部品により発生した熱を効率
良く放散することができる。しかも、金属基板１裏面に
放熱用フィン６が形成され、放熱面積が大きくなってい
るため、吸収した熱を素早く外部へ放熱することができ
る。したがって、このプリント配線板は、放熱性が極め
て良いものになっていて、高密度実装に適しているので
ある。As seen above, this printed wiring board has a multilayer structure for the electrical circuits, so it is possible to increase the wiring density.
High-density mounting is possible. Furthermore, since the substrate is made of metal, it has good thermal conductivity, so this printed wiring board can efficiently dissipate heat generated by mounted electronic components. Moreover, since the heat radiation fins 6 are formed on the back surface of the metal substrate 1 and the heat radiation area is increased, the absorbed heat can be quickly radiated to the outside. Therefore, this printed wiring board has extremely good heat dissipation properties and is suitable for high-density packaging.
絶縁樹脂層となる接着剤としては、熱硬化性樹脂あるい
はゴムを含存する熱硬化性樹脂系のもの、たとえば、ア
ルミナ、マグネシア、シリカなどの無機充填剤およびア
クリロニトリルゴムを含むエポキシ系接着剤やシリコー
ン変性エポキシ接着剤などを用いるのが好ましい。この
ような接着剤は、密着力が高く、耐熱性に優れ、熱伝導
性が良いからである。電路を形成する導電体としては、
銅、ニッケル、金などの金属等を用いる。第１絶縁樹脂
層の厚みは１００μｍ以下、第２絶縁樹脂層の厚みは８
０μｍ以下にすることが好ましい。Adhesives for the insulating resin layer include thermosetting resins or thermosetting resins containing rubber, such as epoxy adhesives containing inorganic fillers such as alumina, magnesia, and silica, and acrylonitrile rubber, and silicone. It is preferable to use a modified epoxy adhesive or the like. This is because such adhesives have high adhesion, excellent heat resistance, and good thermal conductivity. As a conductor that forms an electric path,
Metals such as copper, nickel, and gold are used. The thickness of the first insulating resin layer is 100 μm or less, and the thickness of the second insulating resin layer is 8 μm or less.
It is preferable to make it 0 μm or less.
このプリント配線板を得るには、つぎのようにする。To obtain this printed wiring board, proceed as follows.
■ 第２図（ａ）にみるように、裏面に放熱用フィン６
が形成された金属基板１を用意しておく。■ As shown in Figure 2 (a), there are heat dissipation fins 6 on the back side.
A metal substrate 1 on which is formed is prepared in advance.
■ 第２図中）にみるように、金属基板１の表面に接着
剤を塗布し、第１絶縁樹脂Ｈ２を形成する■ 液体ホー
ニングで第１絶縁樹脂層２の表面を粗面化したのち、セ
ンシタイジングーアクチベーションを行い、Ｐｄ触媒を
付与する。これを無電解めっき浴に浸漬して、第２図（
Ｃ）にみるように、第１絶縁樹脂層２上に無電解めっき
層７を形成する。■ As shown in Figure 2), apply adhesive to the surface of the metal substrate 1 to form the first insulating resin H2.■ After roughening the surface of the first insulating resin layer 2 by liquid honing, Sensitizing-activation is performed and Pd catalyst is added. This was immersed in an electroless plating bath as shown in Figure 2 (
As shown in C), an electroless plating layer 7 is formed on the first insulating resin layer 2.
■ 第２図（ｄ）にみるように、無電解めっき層７上の
第１電路となる部分を除いてめっきレジスト膜８を印刷
し、これを電気めっき浴に浸漬して、めっきレジス１−
膜８に覆われていない部分に電気めっき層９を形成する
。■ As shown in FIG. 2(d), a plating resist film 8 is printed on the electroless plating layer 7 except for the part that will become the first electric path, and this is immersed in an electroplating bath to form the plating resist 1-
An electroplated layer 9 is formed on the portion not covered by the film 8.
■ この後、めっきレジスト膜８を除去し、全面にライ
トエツチングを施して、第２図ｔ８）にみるように、第
１電路３を形成する。(2) Thereafter, the plating resist film 8 is removed and light etching is performed on the entire surface to form the first electric path 3 as shown in FIG. 2 (t8).
■ 第２図（ｆ）にみるように、第１電路３の一部を除
いて接着剤を塗布し、第２絶縁樹脂層５を形成する。(2) As shown in FIG. 2(f), an adhesive is applied except for a part of the first electric circuit 3 to form a second insulating resin layer 5.
■ 液体ホーニングで第２絶縁樹脂層５の表面を粗面化
したのち、センシタイジングーアクチベーションを行い
、Ｐｄ触媒を付与する。これを無電解めっき浴に浸漬し
て、第２図（ｇ）にみるように、第１電路３の一部およ
び第２絶縁樹脂層５上に無電解めっき層１０を形成する
。(2) After roughening the surface of the second insulating resin layer 5 by liquid honing, sensitizing-activation is performed to apply a Pd catalyst. This is immersed in an electroless plating bath to form an electroless plating layer 10 on a part of the first electric circuit 3 and on the second insulating resin layer 5, as shown in FIG. 2(g).
■ 第２図（ｈ）にみるように、第２電路となる部分を
除いて無電解めっき層ＩＯ上にめっきレジスト膜１１を
印刷し、これを電気めっき浴に浸漬して、めっきレジス
ト膜１１に覆われていない部分に電気めっき層１２を形
成する。この後、めっきレジスト膜１１を除去し、全面
にライトエツチングを施して、第２電路４を形成し、第
１図にみるプリント配線板を得る。■ As shown in FIG. 2(h), a plating resist film 11 is printed on the electroless plating layer IO except for the portion that will become the second electric path, and this is immersed in an electroplating bath to coat the plating resist film 11. An electroplating layer 12 is formed on the portions not covered. Thereafter, the plating resist film 11 is removed and the entire surface is subjected to light etching to form the second electric circuit 4, thereby obtaining the printed wiring board shown in FIG.
以上に示したプリント配線板の製法において、電路の形
成は、いわゆる、セミアディティブ法で行われているが
、他のアディティブ法、たとえば、無電解めっきのみを
用いる、いわゆる、フルアディティブ法で行われてもよ
い。また、導電ペーストによる電路を印刷形成するよう
にする方法で行われてもよい。In the method for manufacturing printed wiring boards described above, the electrical circuits are formed by a so-called semi-additive method, but they can also be formed by other additive methods, such as a so-called full additive method that uses only electroless plating. It's okay. Alternatively, a method may be used in which an electric path is formed by printing using a conductive paste.
つぎに、別の実施例を示す。Next, another example will be shown.
第３図にみるプリント配線板は、金属基板１と第１絶縁
樹脂層２との間に化成処理被膜層１３が設けられている
。その他は、前記実施例と同じである。化成処理被膜層
１３は、金属基板１表面に化成処理を施すことにより形
成されている。化成処理としては、陽極酸化、燐酸塩被
膜処理などがあるが、金属基板１がアルミニウム、チタ
ン、アルミニウム合金、チタン合金などからなる場合は
、基板を陽極酸化して陽極酸化層を形成し、金属基板１
が鉄などからなる場合は、基板を燐酸塩被膜処理して燐
酸塩被膜層を形成するようにする。In the printed wiring board shown in FIG. 3, a chemical conversion coating layer 13 is provided between the metal substrate 1 and the first insulating resin layer 2. The rest is the same as in the previous embodiment. The chemical conversion coating layer 13 is formed by performing a chemical conversion treatment on the surface of the metal substrate 1. Chemical conversion treatments include anodic oxidation, phosphate coating, etc., but when the metal substrate 1 is made of aluminum, titanium, aluminum alloy, titanium alloy, etc., the substrate is anodized to form an anodized layer and the metal Board 1
When the substrate is made of iron or the like, the substrate is treated with a phosphate coating to form a phosphate coating layer.
このように、金属基板ｌと第１絶縁樹脂層２との間に化
成処理被膜層１３を設けるようにすると、化成処理波１
１Ｍ１１３の表面が微細な粗面となっているため、第１
絶縁樹脂層との密着面積が大きくなり、金属基板１と第
１絶縁樹脂層２との密着力を高めることができる。化成
処理被膜層１３を設ける場合、化成処理被膜層１３と第
１絶縁樹脂層２との厚みは、合計で１００μｍ以下にす
ることが好ましい。In this way, when the chemical conversion coating layer 13 is provided between the metal substrate l and the first insulating resin layer 2, the chemical conversion treatment wave 1
Since the surface of 1M113 is a finely rough surface, the first
The area of contact with the insulating resin layer becomes larger, and the adhesion between the metal substrate 1 and the first insulating resin layer 2 can be increased. When providing the chemical conversion coating layer 13, the total thickness of the chemical conversion coating layer 13 and the first insulating resin layer 2 is preferably 100 μm or less.
第４図にみるプリント配線板は、化成処理被膜層１３と
第１絶縁樹脂層２との間に電着塗料層１４が設けられて
いる。その他は、前記実施例と同じである。電着塗料層
１４は、化成処理被膜層１３表面に電着塗装を施すこと
により形成される。In the printed wiring board shown in FIG. 4, an electrodeposition paint layer 14 is provided between a chemical conversion coating layer 13 and a first insulating resin layer 2. The rest is the same as in the previous embodiment. The electrodeposition paint layer 14 is formed by applying electrodeposition coating to the surface of the chemical conversion coating layer 13.
このように、化成処理被膜層１３と第１絶縁樹脂層２と
の間に電着塗料層１４を設けるようにすると、多孔質で
ある化成処理被膜層１３が封孔されるため、耐電圧特性
が向上する。電着塗料としては、アクリルメラミン、エ
ポキシ系電着塗料などを用いる。電着塗料層１４を設け
る場合、化成処理被膜層１３と電着塗料層１４との厚み
は、合計で１００μｍ以下にすることが好ましい。In this way, when the electrodeposition coating layer 14 is provided between the chemical conversion coating layer 13 and the first insulating resin layer 2, the porous chemical conversion coating layer 13 is sealed, so that the withstand voltage characteristics are improved. will improve. As the electrodeposition paint, acrylic melamine, epoxy electrodeposition paint, etc. are used. When the electrodeposition paint layer 14 is provided, the total thickness of the chemical conversion coating layer 13 and the electrodeposition paint layer 14 is preferably 100 μm or less.
第５図にみるプリント配線板は、金属基板１の全面に化
成処理被膜層１３および電着塗料層１４が設けられてい
る。その他は、前記実施例と同じである。このようにな
っていると、金属基板１が電着塗料層１４で保護される
ため、耐薬品性が高く、無電解めっき工程や電気めっき
工程において処理液に金属基板中の金属が？′８解しな
くなる。In the printed wiring board shown in FIG. 5, a chemical conversion coating layer 13 and an electrodeposition paint layer 14 are provided on the entire surface of a metal substrate 1. The rest is the same as in the previous embodiment. In this case, since the metal substrate 1 is protected by the electrodeposited paint layer 14, the chemical resistance is high, and the metal in the metal substrate is not included in the processing solution during the electroless plating process or the electroplating process. '8 will no longer be understood.
第６図にみるプリント配線板は、金属基板１の厚み方向
と直交する方向に冷却媒体の流通孔１５が貫通されてい
る。この冷却媒体の流通孔１５には、水、フロンガスな
どの冷却媒体が流され、この冷却°媒体によって金属基
板の熱が奪われるようになっている。放熱構造は、この
ような放熱構造であってもよい。前記放熱用フィンと併
用するようにすれば、放熱性をさらに高めることができ
る。この放熱構造のものにおいても、前述のごとく化成
処理被膜層や電着塗料層を形成することができる。In the printed wiring board shown in FIG. 6, cooling medium circulation holes 15 are penetrated in a direction perpendicular to the thickness direction of the metal substrate 1. A cooling medium such as water or fluorocarbon gas is flowed through the cooling medium circulation hole 15, and heat is removed from the metal substrate by this cooling medium. The heat dissipation structure may be such a heat dissipation structure. If used together with the heat dissipation fins, the heat dissipation performance can be further improved. Even in this heat dissipation structure, a chemical conversion coating layer or an electrodeposition coating layer can be formed as described above.
放熱構造は上述のものに限定されない。The heat dissipation structure is not limited to that described above.
以下に、実施例について詳しく説明する。Examples will be described in detail below.
（実施例）
裏面に放熱用フィンが形成されたアルミニウム基板を１
５％希硫酸中で処理し、全面に厚み１０μｍのアルマイ
ト層（陽極酸化層）を形成した。(Example) An aluminum substrate with heat dissipation fins formed on the back side was
It was treated in 5% dilute sulfuric acid to form an alumite layer (anodized layer) with a thickness of 10 μm on the entire surface.
電着塗料としてアクリルメラミン電着塗料（関西ペイン
ト社製ニレクロンＮＯ３５００Ｒ，固形分濃度８％）を
用い、アルマイト層上に直流１８０Ｖ、 ５分間、液
温２１℃の条件で電着塗装を施してアルマイト層全面に
厚み１０μｍのアクリルメラミン電着塗料層を形成した
。アルミニウム基板表面のアクリルメラミン電着塗料層
上に下記のような組成の接着剤を厚み４０μｍとなるよ
うに塗布し、第１絶縁樹脂層を形成した。液体ホーニン
グで絶縁樹脂層表面を粗面化した後、センシタイジング
ーアクチベーションを行い、Ｐｄ触媒を付与した。これ
を無電解銅めっき浴に浸漬して、第１絶縁樹脂層上に無
電解銅めっき層（厚み１μｍ）を形成した。無電解消め
っき層上の第１電路となる部分を除いてめっきレジスト
膜を印刷した。Using acrylic melamine electrodeposition paint (Nileclone NO3500R manufactured by Kansai Paint Co., Ltd., solid content concentration 8%) as the electrodeposition paint, electrodeposit it on the alumite layer at 180V DC for 5 minutes at a liquid temperature of 21℃ to form alumite. An acrylic melamine electrodeposition paint layer with a thickness of 10 μm was formed on the entire surface of the layer. An adhesive having the following composition was applied to a thickness of 40 μm on the acrylic melamine electrodeposition paint layer on the surface of the aluminum substrate to form a first insulating resin layer. After roughening the surface of the insulating resin layer by liquid honing, sensitizing-activation was performed to apply a Pd catalyst. This was immersed in an electroless copper plating bath to form an electroless copper plating layer (1 μm thick) on the first insulating resin layer. A plating resist film was printed on the electroless plating layer except for the portion that would become the first electric path.
これを電気銅めっき浴に浸漬して、めっきレジスト膜に
覆われていない部分に電気銅めっき層（厚み３０μｍ）
を形成した。この後、めっきレジスト膜を除去し、全面
にライトエツチングを施して、厚み３０μｍの第１電路
を形成した。第１電路の一部を除いて接着剤を塗布し、
厚み４０μｍの第２絶縁樹脂層を形成した。液体ホーニ
ングで第２絶縁樹脂層の表面を粗面化したのち、センシ
タイジングーアクチベーションを行い、Ｐｄ触媒を付与
した。これを無電解銅めっき浴に浸漬して、第１電路の
一部および第２絶縁樹脂層上に無電解銅めっき層（厚み
１μｍ）を形成した。第２電路となる部分を除いて無電
解銅めっき層上にめっきレジスト膜を印刷した。これを
電気銅めっき浴に浸漬して、めっきレジスト膜に覆われ
ていない部分に電気銅めっき層（厚み３０μｍ）を形成
した。この後、めっきレジスト膜を除去し、全面にライ
トエツチングを施して、厚み３０μｍの第２電路を形成
し、プリント配線板を得た。This was immersed in an electrolytic copper plating bath, and an electrolytic copper plating layer (30 μm thick) was applied to the areas not covered by the plating resist film.
was formed. Thereafter, the plating resist film was removed and light etching was performed on the entire surface to form a first electrical path with a thickness of 30 μm. Apply adhesive except for a part of the first electric circuit,
A second insulating resin layer having a thickness of 40 μm was formed. After roughening the surface of the second insulating resin layer by liquid honing, sensitizing-activation was performed to apply a Pd catalyst. This was immersed in an electroless copper plating bath to form an electroless copper plating layer (thickness: 1 μm) on a portion of the first electric circuit and the second insulating resin layer. A plating resist film was printed on the electroless copper plating layer except for the portion that would become the second electric path. This was immersed in an electrolytic copper plating bath to form an electrolytic copper plating layer (thickness: 30 μm) on the portions not covered with the plating resist film. Thereafter, the plating resist film was removed, and the entire surface was subjected to light etching to form a second electrical path with a thickness of 30 μm, thereby obtaining a printed wiring board.
■シリコーン変性エポキシ樹脂 １００重量部◎ＮＢＲ
（日本ゼオン株式会社製ＮＩＰＯＬ１０７２）１００重
量部
◎アルミナ微粉末 １００重景１◎硬化剤
（ＤＤＳ＋ＢＦ３ピペリジン）適量
◎溶剤（アセトン、トルエン、ブチルセロソルブ）
適量上記プリント配線板
にＬＥＤ、）ランジスタなどの発熱の大きい電子部品を
高密度に実装し、それら電子部品を長時間使用したが、
各電子部品に異常はなかった。■Silicone modified epoxy resin 100 parts by weight◎NBR
(NIPOL1072 manufactured by Nippon Zeon Co., Ltd.) 100 parts by weight ◎ Alumina fine powder 100 images 1 ◎ Hardening agent (DDS + BF3 piperidine) appropriate amount ◎ Solvent (acetone, toluene, butyl cellosolve)
Appropriate amounts of electronic components that generate a lot of heat, such as LEDs and transistors, are densely mounted on the above printed wiring board, and these electronic components are used for a long time.
There were no abnormalities in any electronic components.
この発明にかかるプリント配線板は、前記実施例に限定
されない。アディティブ法による電路形成と部分絶縁を
重ねることにより、さらに、多層化されていてもよい。The printed wiring board according to the present invention is not limited to the above embodiments. It may be further multilayered by overlapping electric circuit formation and partial insulation using an additive method.
以上にみてきたように、この発明にかかるプリント配線
板は、表面に絶縁樹脂層を有する金属基板上の所望部分
に２層以上の電路がそれぞれ絶縁、樹脂層を介して積み
重ねられ、前記各電路がアディティブ法により形成され
、かつ、前記金属基板に放熱構造を備えているため、放
熱性が良く、高密度実装に適している。As described above, in the printed wiring board according to the present invention, two or more layers of electric circuits are stacked on a desired part of a metal substrate having an insulating resin layer on the surface thereof with insulation and resin layers interposed therebetween, and each of the electric circuits is formed by an additive method, and the metal substrate has a heat dissipation structure, so it has good heat dissipation and is suitable for high-density packaging.
第１図はこの発明にかかるプリント配線板の一実施例を
あられす断面図、第２図（ａ）〜（ｈ）は前記実施例の
製法の１例をあられす説明図、第３図、第４図、第５図
および第６図はそれぞれ別の実施例をあられす断面図で
ある。
１・・・金属基板 ２・・・第１絶縁樹脂層 ３・・・
第１電路 ４・・・第２電路 ５・・・第２絶縁樹脂層
６・・・放熱用フィン １３・・・化成処理被膜層
１４・・・電着塗料層 １５・・・冷却媒体の流通孔代
理人 弁理士 松 本 武 彦
第１図
第２図
（ａ）
（ｂ）
第２図
（ｄ）
第３図
第４図
ム
第５図
第６図FIG. 1 is a cross-sectional view of an embodiment of a printed wiring board according to the present invention, FIGS. 2(a) to (h) are explanatory diagrams of an example of the manufacturing method of the embodiment, FIGS. 4, 5 and 6 are cross-sectional views of different embodiments, respectively. 1... Metal substrate 2... First insulating resin layer 3...
First electric circuit 4... Second electric circuit 5... Second insulating resin layer 6... Heat dissipation fin 13... Chemical conversion coating layer
14...Electrodeposition paint layer 15...Cooling medium distribution hole agent Patent attorney Takehiko Matsumoto Figure 1 Figure 2 (a) (b) Figure 2 (d) Figure 3 Figure 4 Figure 5 Figure 6
Claims (5)
に２層以上の電路がそれぞれ絶縁樹脂層を介して積み重
ねられ、前記各電路がアディティブ法により形成され、
かつ、前記金属基板に放熱構造を備えているプリント配
線板。(1) Two or more layers of electric circuits are stacked on a desired portion of a metal substrate having an insulating resin layer on the surface thereof, each with an insulating resin layer interposed therebetween, and each of the electric circuits is formed by an additive method,
The printed wiring board further includes a heat dissipation structure on the metal substrate.
ィンである特許請求の範囲第１項記載のプリント配線板
。(2) The printed wiring board according to claim 1, wherein the heat dissipation structure is a heat dissipation fin formed on the back surface of the metal substrate.
孔である特許請求の範囲第１項記載のプリント配線板。(3) The printed wiring board according to claim 1, wherein the heat dissipation structure is a cooling medium circulation hole penetrating the metal substrate.
理被膜層が設けられている特許請求の範囲第１項ないし
第３項のいずれかに記載のプリント配線板。(4) The printed wiring board according to any one of claims 1 to 3, wherein a chemical conversion coating layer is provided between the metal substrate and the insulating resin layer on the surface thereof.
間に電着塗料層が設けられている特許請求の範囲第４項
記載のプリント配線板。(5) The printed wiring board according to claim 4, wherein an electrodeposition paint layer is provided between the insulating resin layer and the chemical conversion coating layer on the surface of the metal substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5735786A JPS62214696A (en) | 1986-03-15 | 1986-03-15 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5735786A JPS62214696A (en) | 1986-03-15 | 1986-03-15 | Printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62214696A true JPS62214696A (en) | 1987-09-21 |
| JPH0455558B2 JPH0455558B2 (en) | 1992-09-03 |
Family
ID=13053324
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5735786A Granted JPS62214696A (en) | 1986-03-15 | 1986-03-15 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62214696A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0258385U (en) * | 1988-10-19 | 1990-04-26 | ||
| JP2005108544A (en) * | 2003-09-29 | 2005-04-21 | Matsumura Denki Seisakusho:Kk | Led lighting device |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5229451U (en) * | 1975-08-22 | 1977-03-01 | ||
| JPS5262661A (en) * | 1975-11-19 | 1977-05-24 | Nippon Telegraph & Telephone | Method of producing metallic core organic coating printed circuit wiring board |
| JPS5626977U (en) * | 1979-08-08 | 1981-03-12 | ||
| JPS589393A (en) * | 1981-07-08 | 1983-01-19 | 住友電気工業株式会社 | Metal core printed circuit board |
| JPS5878493A (en) * | 1981-11-05 | 1983-05-12 | 塩尻工業株式会社 | Printed circuit board |
| JPS59138259U (en) * | 1982-10-25 | 1984-09-14 | 株式会社リヨ−サン | Manufacturing method of printed circuit board with heatsink |
| JPS59168696A (en) * | 1983-03-15 | 1984-09-22 | 松下電工株式会社 | Method of producing metal base printed circuit board |
| JPS60133690U (en) * | 1984-02-15 | 1985-09-06 | 三菱電線工業株式会社 | Substrate for electronic components |
| JPS60247992A (en) * | 1984-05-23 | 1985-12-07 | 株式会社日立製作所 | Integrated circuit chip mounting substrate |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5229451B2 (en) * | 1972-12-12 | 1977-08-02 | ||
| US4142107A (en) * | 1977-06-30 | 1979-02-27 | International Business Machines Corporation | Resist development control system |
-
1986
- 1986-03-15 JP JP5735786A patent/JPS62214696A/en active Granted
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5229451U (en) * | 1975-08-22 | 1977-03-01 | ||
| JPS5262661A (en) * | 1975-11-19 | 1977-05-24 | Nippon Telegraph & Telephone | Method of producing metallic core organic coating printed circuit wiring board |
| JPS5626977U (en) * | 1979-08-08 | 1981-03-12 | ||
| JPS589393A (en) * | 1981-07-08 | 1983-01-19 | 住友電気工業株式会社 | Metal core printed circuit board |
| JPS5878493A (en) * | 1981-11-05 | 1983-05-12 | 塩尻工業株式会社 | Printed circuit board |
| JPS59138259U (en) * | 1982-10-25 | 1984-09-14 | 株式会社リヨ−サン | Manufacturing method of printed circuit board with heatsink |
| JPS59168696A (en) * | 1983-03-15 | 1984-09-22 | 松下電工株式会社 | Method of producing metal base printed circuit board |
| JPS60133690U (en) * | 1984-02-15 | 1985-09-06 | 三菱電線工業株式会社 | Substrate for electronic components |
| JPS60247992A (en) * | 1984-05-23 | 1985-12-07 | 株式会社日立製作所 | Integrated circuit chip mounting substrate |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0258385U (en) * | 1988-10-19 | 1990-04-26 | ||
| JP2005108544A (en) * | 2003-09-29 | 2005-04-21 | Matsumura Denki Seisakusho:Kk | Led lighting device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0455558B2 (en) | 1992-09-03 |
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