JP2005108544A - Led lighting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a silent LED lighting device having no cooling fan, exerting a sufficient heat radiation effect even if a plurality of LED lamps are mounted as the LED lighting device with high brightness of which the weight is sufficiently reduced for the use of stage illumination. <P>SOLUTION: The LED lighting device is formed by arranging so that an LED base plate 2 having a plurality of LED lamps 20 arranged in an array on a surface and a wiring pattern 23 of the LED lamps 20 arranged on the front and rear face, and control base plates 3 electrically connected to the wiring pattern 23 controlling the LED lamps 20 face each other in a cabinet 1 having an opening 11 with the opening 11 as an irradiation face. Through holes 101 penetrating through the LED base plate 2 are formed so as to be surrounded by the plurality of LED lamps 20. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an LED lighting device in which a plurality of LED lamps are mounted in an array.

  2. Description of the Related Art Conventionally, as a lighting device having a predetermined directivity and exhibiting high brightness, an LED lighting device including a plurality of LED (Light Emitting Diode) lamps with long power consumption and low power consumption has been proposed (for example, , See Patent Document 1).

  The technique described in Patent Document 1 is intended to solve the uneven color of illumination light caused by arranging a plurality of LED elements (LED lamps) having narrow directivity on an LED substrate. However, in such LED lighting devices using a plurality of LED elements (LED lamps), not only the color unevenness is eliminated, but also the heat generated from the LED elements themselves and the control board (peripheral circuit) for controlling the LED elements. Therefore, it is necessary to take measures against deterioration, breakage or instability of the LED element due to heat generated from the light, and further reduction in luminance. Thus, as such a countermeasure, an LED lighting device in which ventilation holes are provided in the LED substrate has been proposed. (For example, refer to Patent Document 2).

Japanese Patent Laid-Open No. 2001-266606 (paragraphs [0010]-[0016], FIG. 1) JP-A-10-293540 (paragraphs [0007]-[0013], FIG. 1)

  However, since the LED lighting device described in Patent Document 2 incorporates a device (fan) that forcibly generates cooling heat as a means for efficiently performing heat dissipation, such a device is incorporated. When the lighting device itself is heavier and is used in stage lighting where the silencer is required to illuminate the lower part by installing the lighting device on the ceiling support material due to the sound of the cooling fan. This is incompatible, and the lighting device itself has been required to be lighter.

  The present invention has been made in view of the above problems, and its purpose is to provide a sufficient heat dissipation effect even when a plurality of LED lamps are mounted as a high-luminance lighting device, and to stage lighting and the like. It is to provide a quiet LED lighting device that is sufficiently light in weight and has no cooling fan.

  In order to solve the above-mentioned problem, the LED lighting device according to the first aspect of the present invention is configured such that a plurality of LED lamps are arranged on the front surface in an array, and a wiring pattern of the LED lamps is formed on the front surface and / or the back surface. The opening is disposed as an irradiation surface in a housing having an opening so that the LED board and the control board that is electrically connected to the wiring pattern and controls the LED lamp face each other. In the LED lighting device, a through-hole penetrating the LED substrate is formed so as to be surrounded by the plurality of LED lamps.

  When the through hole is arranged as in the configuration, the cooling air entering from the opening (irradiation surface) passes through the through hole when the opening (irradiation surface) is used downward. As a result, the flow of cooling air in the housing can be activated, and at least the entire LED board and LED lamp can be cooled almost uniformly without heat flowing near the center of the LED board and LED lamp. In addition, it is possible to provide a quiet LED lighting device that is light in weight and does not have a cooling fan. In addition, this structure means that a through-hole is not formed in the outer side of the LED lamp arrange | positioned among outermost LED lamps arrange | positioned at array form. For example, it is employed for the purpose of maintaining the strength of the LED substrate when a sufficient gap is provided between the LED substrate and the inner edge of the housing.

  In order to solve the above-mentioned problem, the LED lighting device according to the second aspect of the present invention includes a plurality of LED lamps arranged in an array on the surface, and a wiring pattern of the LED lamps formed on the front surface and / or the back surface. The opening is disposed as an irradiation surface in a housing having an opening so that the LED board and the control board that is electrically connected to the wiring pattern and controls the LED lamp face each other. In the LED lighting device, a plurality of through holes penetrating the LED substrate are formed so as to surround each LED lamp.

  When the through hole is arranged as in the configuration, the cooling air entering from the opening (irradiation surface) passes through the through hole when the opening (irradiation surface) is used downward. As a result, the flow of cooling air in the housing can be activated, and at least the entire LED board and LED lamp can be cooled almost uniformly without heat flowing near the center of the LED board and LED lamp. In addition, it is possible to provide a quiet LED lighting device that is light in weight and does not have a cooling fan. In addition, this structure means that a through-hole is formed in the outer side of the LED lamp arrange | positioned among outermost LED lamps arrange | positioned at array form. For example, it is adopted for the purpose of enhancing the sufficient heat dissipation of the LED board when the LED board is fitted into the inner edge of the housing.

  In order to solve the above-mentioned problem, the LED lighting device according to claim 3 is the LED lighting device according to claim 1 or 2, wherein the LED substrate is a metal core substrate in which a metal layer is embedded. It is characterized by.

  By adopting such a configuration, the heat accumulated in the vicinity of the central portion of the LED substrate can be dispersed to the end portion, so that a higher heat dissipation effect can be obtained.

  In order to solve the above-mentioned problem, the LED lighting device according to claim 4 is the LED lighting device according to claim 3, wherein a heat dissipation member connected to the metal layer is installed on the back surface of the LED substrate. It is characterized by that.

  By setting it as the structure which concerns, since the said heat radiating member is connected with the said metal layer, the surface area of the member provided to heat radiation can increase and the heat radiating effect can be heightened.

  In order to solve the above-mentioned problem, the LED lighting device according to claim 5 is the LED lighting device according to claim 3 or 4, wherein the wiring pattern and the electricity are provided on both sides of the LED substrate. The metal thin film is formed by being electrically insulated.

  By setting it as the structure which concerns, the high thermal radiation effect by a metal thin film can be acquired in the wide area | region of the surface of the said LED substrate, and a back surface. In addition, as a metal employ | adopted for the said metal thin film, metals with high heat conductivity, such as copper (Cu) and aluminum (Al), are preferable.

  In order to solve the above problems, an LED lighting device according to a sixth aspect of the present invention is the LED lighting device according to the fifth aspect, wherein the metal thin film is connected to the metal layer.

  By adopting such a configuration, a synergistic effect of the heat dissipation effect by the metal thin film and the heat dissipation effect by the metal layer can be realized, and the heat dissipation in the housing can be efficiently performed.

  In order to solve the above-described problem, an LED lighting device according to claim 7 is the LED lighting device according to any one of claims 1 to 6, wherein the tip end portion of the LED lamp and the opening of the housing are provided. The LED substrate is installed at a predetermined interval from the surface.

  By adopting such a configuration, the cooling air that has entered from the opening portion easily flows into the vicinity of the central portion of the LED substrate and the LED lamp, so that the heat generated by the LED lamp and the control substrate is generated by the LED substrate and the LED substrate. It is possible to make the unevenness of the heat distribution due to accumulation in the vicinity of the central portion of the LED lamp as uniform as possible, and in particular, it is possible to prevent a decrease in luminance of the LED lamp near the central portion.

  In order to solve the above problems, an LED lighting device according to an eighth aspect of the present invention is the LED lighting device according to any one of the first to seventh aspects, wherein the control board is divided into two or more. Features.

  By adopting such a configuration, a separation region generated by dividing the control board becomes a passage for cooling air, so that a heat radiation effect can be enhanced.

  In order to solve the above-mentioned problem, an LED lighting device according to a ninth aspect of the present invention is the LED lighting device according to the eighth aspect, wherein the two divided control boards are parallel to the direction in which the control boards are juxtaposed. A support member for rotating the casing by a moving shaft is provided.

  Such a configuration means that, for example, when the control board is divided into two, a support member that rotates the casing by a rotation axis parallel to the juxtaposition direction of the two divided control boards is provided. To do. Thus, since the rotation direction of a housing | casing is determined according to the position of the divided | segmented two said control boards, there can exist a sufficient thermal radiation effect. Moreover, in this invention, you may determine the aspect which divides | segments a control board into two according to the rotating shaft of the supporting member installed in the housing | casing.

  In order to solve the above-mentioned problem, the LED lighting device according to the invention described in claim 10 is the LED lighting device according to claim 8, wherein the spacing between the control boards divided into three or more is different. Is provided with a support member for rotating the housing by a rotation shaft parallel to the juxtaposition direction having a large separation interval.

  For example, in the case where the control board is divided into three or more, the configuration is such that the rotation axis parallel to the juxtaposition direction of the two control boards having the largest separation interval among the control boards divided from each other. This means that a support member for rotating the housing is provided. By doing in this way, even if it is a case where the said control board is divided | segmented into 3 or more, there can exist a sufficient thermal radiation effect. Moreover, in this invention, you may determine the aspect which divides | segments a control board into three or more according to the rotating shaft of the supporting member installed in the housing | casing.

  According to the present invention, since the through hole that promotes the heat dissipation effect is formed on the LED substrate on which the plurality of LED lamps are mounted, the high heat dissipation effect is achieved while maintaining high brightness, the weight is reduced, and there is no cooling fan. LED lighting device can be provided.

  Hereinafter, an embodiment of a lighting device according to the present invention will be described with reference to the drawings.

  1 and 2 are diagrams showing an embodiment of an LED lighting device according to the present invention. FIG. 1 is a perspective view schematically showing a configuration of the LED lighting device according to the present invention. FIG. It is AA sectional drawing of 1. FIG.

  As shown in FIG. 1, the LED lighting device according to the present invention controls an LED board 2 in which a plurality of LED lamps 20 are mounted in an array in a housing 1 in which an opening 11 is formed, and the LED lamp 20. And the control board 3 to be installed are opposed to each other. And the surface (opening surface) opened by the opening part 11 serves as the irradiation surface by the LED lamp 20 which the control board 3 controls light emission. The control board 3 is electrically connected to a wiring pattern (not shown) formed on the front and back surfaces of the LED board 2. And the support member 4 which fixes the housing | casing 1 is attached to the housing | casing 1 while rotating the housing | casing 1 and changing the irradiation angle by the LED lamp 20. FIG. Note that the LED lighting device according to the present embodiment is a lighting device that is used with one end of the support member 4 fixed to a ceiling support member or the like and the irradiation surface being vertically downward, for example, as in stage lighting. Moreover, in description of this embodiment, the surface by the side of the opening part 11 of the LED board 2 and the control board 3 is made into the surface, and the surface on the opposite side is demonstrated as a back surface.

  As shown in FIG. 2, the LED substrate 2 employs a so-called metal core substrate in which a metal layer 121 is embedded. 121 is sandwiched. Here, as a metal employ | adopted for the metal layer 121, metals with high heat conductivity, such as copper (Cu) and aluminum (Al), are preferable. And the terminal of the LED element 21 which comprises the LED lamp 20 is electrically connected to the wiring pattern (not shown) formed on the front and back of the LED board 2. In the present embodiment, the LED lamp 20 is sealed by a lens 22 made of a transparent resin in order to achieve high brightness. The wiring pattern and the terminal of the LED lamp 20 and the metal layer 121 are electrically insulated. Here, in order to enhance the heat dissipation effect, the surface area where the terminal of the LED lamp 20 is exposed may be increased, or the material of the terminal may be high in thermal conductivity.

  In addition, the LED substrate 2 is preferably installed in the housing 1 such that the tip end portion of the LED lamp 20 and the opening surface of the opening portion 11 are separated by a predetermined distance d. The space obtained in this way is secured in order to make the bias as uniform as possible due to the heat generated by the LED lamp 20 and the control board 3 being accumulated near the center of the LED board 2 and the LED lamp 20. Space.

  Further, the control board 3 is divided into two, for example, a switch board and a power supply board, and the two boards are arranged side by side, and these two boards are placed so as to face the LED board 2. The direction in which the two divided control boards 3 are juxtaposed is set to be parallel to the rotation axis of the support member 4 (see FIG. 1). The reason why the direction in which the divided control boards 3 are juxtaposed and the direction of the rotation shaft is parallel is that the housing 1 that can be rotated by the support member 4 has the opening 11. When rotating vertically downward, the flow of heat flows upward, that is, in the direction from the opening 11 to the control board 3, so that the control board 3 does not block the flow and the case 1 rotates. This is to avoid the rate limiting of the heat dissipation efficiency due to the change in the separation region of the two control boards 3 in the vertical direction due to the movement.

  In addition, for the purpose of further improving the heat dissipation efficiency, a heat dissipation member 102 made of a metal having high thermal conductivity such as copper (Cu) or aluminum (Al) is connected to the metal layer 121. Specifically, the through hole 101 is used as a screw hole for fixing the heat radiating member 102, and the metal layer 121 and the heat radiating member 102 exposed on the inner wall surface of the through hole 101 are made of metal (thermally conductive). A rich metal is preferred). Further, when a plurality of heat radiation members 102 are provided, not only a heat radiation effect but also a role as a reinforcing member of the LED substrate 2 can be achieved by connecting them. Further, the heat dissipating member 102 may be provided concentrated near the central portion of the LED substrate 2 where heat is likely to accumulate.

  FIG. 3 is a top view showing the configuration of the LED substrate in one embodiment of the LED lighting device according to the present invention. FIG. 3 shows a state where a plurality of LED lamps 20 are mounted for convenience of explanation. As shown in FIG. 3, a through-hole 101 that penetrates the LED substrate 2 is formed in the LED substrate 2 so as to be surrounded by the plurality of mounted LED lamps 20. Specifically, the LED lamp 20 and the through hole 101 are formed so as not to overlap when the LED substrate 2 is viewed from the surface. Therefore, although the cross section of the LED lamp 20 and the shape of the through hole 101 are circular in FIG. 3, the shape is not limited to this shape as long as the above conditions are satisfied.

  In the present embodiment, the installation condition of the through hole 101 is determined on the assumption that a gap is provided between the inner edge of the housing 1 and the edge of the LED substrate 2. When there is no gap between the inner edge portion and the edge portion of the LED substrate 2, that is, when a configuration in which the LED substrate 2 is fitted into the inner edge portion of the housing 1 is selected, the number of through holes 101 is increased. In order to obtain a heat dissipation effect, the through hole 101 may be formed in the LED substrate 2 so that one LED lamp 20 is surrounded by a plurality of through holes 101 (in the through hole 101 shown in the rightmost column in FIG. 3). Show).

  Note that the size of each through-hole 101 is determined in consideration of the strength of the plurality of LED lamps 20 mounted and the heat dissipation effect of the LED substrate 2 itself. For example, the larger the size of the through-hole 101 is, the more the circulation of the cooling air is promoted. However, since the heat dissipation efficiency from the LED board 2 may be reduced, the heat dissipation effect by the circulation of the cooling air and the LED board 2 It is formed taking into consideration the heat dissipation effect. In addition, the heat generated by the LED lamp 20 and the control board 3 tends to accumulate near the center of the LED lamp 20 and the LED board 2, and gradually increases from the peripheral edge of the LED board 2 toward the center of the LED board 2. You may determine the magnitude | size of the through-hole 101 so that it may become.

  FIG. 4 is a plan view showing the configuration of the surface of the LED substrate in one embodiment of the LED lighting device according to the present invention. As shown in FIG. 4, a wiring pattern 23 for electrically connecting the LED lamp 20 and the control board 3 is formed on the surface of the LED board 2. The width of the wiring pattern 23 is preferably formed as large as possible in order to increase the contact area with the cooling air and increase the heat dissipation efficiency. A metal thin film 122 is formed on the surface of the LED substrate 2 so as to be insulated from the wiring pattern 23 at a predetermined interval (shown by hatching in the drawing). Although not shown, a wiring pattern for electrically connecting the LED lamp 20 and the control board 3 is formed on the back surface of the LED substrate 2 in the same manner as the front surface of the LED substrate 2. A metal thin film is formed so as to be insulated at a predetermined interval.

  Here, as a metal employ | adopted for the metal thin film 122, metals with high heat conductivity, such as copper (Cu) and aluminum (Al), are preferable. In addition, although not shown, the metal thin film 122 is also formed on the inner wall surface of the through hole 101, and the front and back surfaces of the LED substrate 2 and the metal layer 121 are connected. That is, the metal thin film 122 made of a metal having high thermal conductivity is not only formed over most of the front and back surfaces of the LED substrate, but is also thermally connected to the metal layer 121, so that the heat dissipation efficiency of the LED substrate 2 is achieved. Is significantly improved.

  FIG. 5 is a diagram for explaining the flow of heat when used as stage lighting in an embodiment of the LED lighting device according to the present invention. In this description, since the LED lighting device of the present invention is used as stage lighting, it is assumed that a filter is provided in front of the opening 11. Further, it is assumed that an opening 12 is provided on the back surface of the housing 1 in order to improve the flow of cooling air.

  As shown by an arrow in FIG. 5, when the LED lamp 20 is operated with respect to the LED illumination device in which one end of the support member 4 that rotates the housing 1 in a mode in which the opening 11 is directed vertically downward is installed on the ceiling. The cooling air that has entered the housing 1 from between the filter and the opening 11 is transmitted through the through hole 101 and the space provided between the opening surface (opening 11) and the tip of the LED lamp 20. It becomes easy to flow in the vicinity of the central portion of the substrate 2 and the LED lamp 20, and the entire LED substrate 2 and the LED lamp 20 are cooled almost uniformly. Then, the cooling air that has passed through the LED board 2 passes between the control boards 3 that are divided so as not to block the flow of the cooling air even when the casing 1 rotates, and then passes through the opening 12 to the outside of the casing 1. It will be leaked.

  Thus, the present invention pays attention to the fact that the vicinity of the central portion of the LED substrate 2 and the LED lamp 20 is extremely difficult to cool, and the through hole 101 is provided in order to activate the flow of the cooling air in the housing 1, In order to bring the LED substrate 2 and the LED lamp 20 into a substantially uniform temperature state, a metal core substrate is adopted as the LED substrate 2. And the structure which show | plays the further heat dissipation effect with respect to the LED board 2 and the LED lamp 20 by which arrangement | positioning of the through-hole 101 and adoption of the metal core board | substrate eliminated the temperature distribution was proposed.

  Next, another embodiment of the present invention will be described below with reference to FIG. For convenience of explanation, the LED substrate is omitted in FIG. As another embodiment of the present invention, when the control board 3 needs to be divided into three or more, it is necessary to consider the installation position of the support member 4 with respect to the housing 1. For example, as shown in FIG. 6, when the control board is divided into four parts 3a, 3b, 3c and 3d, the direction in which the divided control boards 3 are juxtaposed is determined by two pairs of control boards spaced apart from each other. There are two directions (the juxtaposition direction X and the juxtaposition direction Y). Among them, the juxtaposition direction X of the control board 3a and the control board 3b (or the control board 3c and the control board 3d) having a large separation interval is adopted, and in this direction A support member 4 having a rotating shaft that is parallel may be provided in the housing 1.

Here, among the constituent features of the present invention described above, the inventors have a temperature distribution in the LED lighting device when a through hole is formed in the LED substrate and a metal core substrate in which a metal layer is embedded is used as the LED substrate. The heat dissipation effect was simulated in comparison with the temperature distribution in a conventional LED lighting device that has not been processed. This simulation was performed under the conditions of “conditions related to air flow”, “conditions related to configuration”, “conditions related to heat”, and “thermal conductivity of each constituent material” as exemplified below.
・ “Conditions related to air flow”: Opening ratio of housing, etc. “Conditions related to configuration”: Number of LED lenses 20, number of through holes 101, dimensions of through holes 101, dimensions of housing 1, etc. “Conditions”: calorific value of LED lamp 20, calorific value of LED substrate 2, calorific value of control board 3, etc. “thermal conductivity of each constituent material”: LED substrate, housing, lens, filter, metal thin film, LED element Thermal conductivity of LED element terminals, etc.

(Comparison simulation when a through hole is formed in an LED substrate)
FIG. 7 is a comparative simulation when a through hole is formed in an LED substrate. FIG. 7A shows a temperature distribution in the LED lighting device of the present invention in which a through hole is formed in the LED substrate, and FIG. ) Shows a temperature distribution in a conventional LED lighting device that has not been processed. As shown in FIG. 7A, the temperature distribution in the LED lighting device in which the through holes are formed in the LED substrate is significantly lower than the temperature distribution in the conventional LED lighting device shown in FIG. 7B. Can be confirmed. In particular, compared with the conventional LED lighting device that shows a high temperature from the vicinity of the center of the LED substrate and the LED lamp, the LED lighting device in which the through holes are formed has a substantially uniform temperature of the LED substrate and the entire LED lamp. Can be confirmed.

(Comparison simulation when using a metal core substrate with a metal layer embedded as the LED substrate)
FIG. 8 is a comparison simulation when a metal core substrate in which a metal layer is embedded as an LED substrate, and FIG. The temperature distribution is shown, and FIG. 8B shows the temperature distribution in a conventional LED lighting device that has not been processed. As shown in FIG. 8 (a), the temperature distribution of the LED lighting device employing a metal core substrate as the LED substrate is higher than the temperature distribution in the conventional LED lighting device shown in FIG. 8 (b). It can be confirmed that the temperature in the vicinity is decreasing. It is considered that this is because heat accumulated in the vicinity of the central portion of the LED substrate is transmitted to the end portion of the LED substrate through the metal layer embedded in the metal core substrate. This action is also reflected in the region between the LED board and the control board, and it can be confirmed that the temperature on the surface side of the control board (the surface facing the LED board) is also lowered.

  As is clear from the above comparative simulation, by forming a through hole in the LED board, the flow of cooling air in the housing is activated, and the temperature difference between the central part and the peripheral part of the LED board and the LED lamp is activated. On the other hand, by adopting a metal core substrate for the LED substrate, the heat accumulated in the vicinity of the central portion of the LED substrate can be dispersed to the end portion, so that a high heat dissipation effect can be realized.

  Each above-mentioned embodiment is an example of the present invention, and the present invention is not limited to each embodiment. In each of the above-described embodiments, the case of an LED lighting device used for stage lighting or the like has been described. However, the lighting device whose irradiation surface is vertically downward, in other words, the heat generated in the housing is irradiated by the lighting device If it is an illuminating device of the aspect which flows to a back side from (opening surface), it can apply similarly not only to the illuminating device using an LED element, but the effect similar to the effect obtained by this invention can be acquired. In addition, various modifications can be made according to the design and the like as long as they do not depart from the technical idea of the present invention.

The perspective view which shows the structure in one Embodiment of the LED lighting apparatus which concerns on this invention. Sectional drawing which shows the structure in one Embodiment of the LED lighting apparatus which concerns on this invention. The top view which shows the structure of the LED board in one Embodiment of the LED lighting apparatus which concerns on this invention. The top view which shows the structure of the LED board in one Embodiment of the LED lighting apparatus which concerns on this invention. The figure explaining the flow of the heat | fever when using it as stage lighting in one Embodiment of the LED lighting apparatus which concerns on this invention. The perspective view which shows the structure in other embodiment of the LED lighting apparatus which concerns on this invention. The figure which shows the simulation comparison result supposing embodiment of the LED lighting apparatus which concerns on this invention. The figure which shows the simulation comparison result supposing embodiment of the LED lighting apparatus which concerns on this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Case 2 LED board 3 Control board 4 Support member 11 Opening part 20 LED lamp 21 LED element 22 Lens 23 Wiring pattern 101 Through-hole 102 Heat radiation member 121 Metal layer 122 Metal thin film

Claims (10)

A plurality of LED lamps are arranged on the front surface in an array, and the LED lamp wiring pattern is formed on the front surface and / or back surface, and the LED lamp is electrically connected to control the LED lamp. In the LED lighting device in which the opening is set as an irradiation surface in a housing having an opening so that the control board faces each other, a plurality of through holes penetrating the LED board are formed in the plurality of LED lamps. An LED lighting device characterized by being formed to be surrounded. A plurality of LED elements are arranged on the front surface in an array, and the LED lamp wiring pattern is formed on the front surface and / or back surface, and the LED lamp is electrically connected to control the LED lamp. In the LED lighting device in which the opening is set as an irradiation surface in a casing having an opening so that the control board faces each other, the through-hole penetrating the LED board has one LED lamp. A plurality of LED lighting devices formed so as to surround. The LED lighting device according to claim 1, wherein the LED substrate is a metal core substrate in which a metal layer is embedded. The LED lighting device according to claim 3, wherein a heat radiating member connected to the metal layer is installed on a back surface of the LED substrate. 5. The LED lighting device according to claim 3, wherein a metal thin film is formed on both surfaces of the LED substrate so as to be electrically insulated from the wiring pattern. 6. The LED lighting device according to claim 5, wherein the metal thin film is connected to the metal layer. The LED lighting device according to any one of claims 1 to 6, wherein the LED substrate is installed such that a tip portion of the LED lamp and an opening surface of the housing are separated from each other at a predetermined interval. . The LED lighting device according to claim 1, wherein the control board is divided into two or more. The LED lighting device according to claim 8, further comprising a support member that rotates the housing by a rotation shaft that is parallel to a direction in which the control boards divided into two are juxtaposed. A support member is provided for rotating the housing by a rotation shaft parallel to the juxtaposition direction in which the separation interval is large when the separation interval between the control boards divided into three or more is different. The LED lighting device according to claim 8.