KR101310364B1 - Optical semiconductor based illuminating apparatus - Google Patents

Abstract

An optical semiconductor based lighting apparatus is disclosed. The optical semiconductor portable lighting device includes a light emitting module having a heat dissipation base, a heat dissipation block including a plurality of heat dissipation plates spaced apart from each other, and spaced apart from the light emitting module, and positioned between the heat dissipation base and the heat dissipation block. A plurality of cooperating heat pipes, wherein the cooperating heat pipes are partially in contact with the heat dissipation block and the other part passes through the heat sink.

Description

Optical semiconductor based lighting device {OPTICAL SEMICONDUCTOR BASED ILLUMINATING APPARATUS}

The present invention relates to an optical semiconductor-based lighting device, and more particularly, to an optical semiconductor including a heat dissipation block including heat dissipating plates that function as heat dissipation fins, and a cooperative cooperative heat pipe cooperating with the heat dissipation fins. It relates to a base lighting device.

Fluorescent and incandescent lamps have been widely used as light sources for illumination. Incandescent lamps have high power consumption and are inferior in efficiency and economy, and for this reason, their demand is greatly reduced. This decline is expected to continue in the future. On the other hand, fluorescent lamps are more efficient and economical at about one-third of the power consumption of incandescent lamps. However, fluorescent lamps have a problem in that blackening occurs due to a high applied voltage, resulting in short lifespan. In addition, since the fluorescent lamp uses a vacuum glass tube in which mercury, which is a harmful heavy metal material, is injected together with argon gas, there is a disadvantage of being unfriendly to the environment.

Recently, the demand for an LED lighting device including an LED as a light source is rapidly increasing. LED lighting devices have the advantage of long lifetime and low power driving. In addition, the LED illumination device is environmentally friendly since it does not use environmentally harmful substances such as mercury.

Recently, a lighting device using a semiconductor optical element such as an LED as a light source has been widely used for lighting devices that require high light output, such as factory lamps, street lights, or security lamps. Such an illumination device involves a lot of heat during the light emission operation of the light emitting module including the semiconductor optical device.

Conventional optical semiconductor-based lighting devices, such as Patent Nos. 10-1181763 and 10-2007-0073168, provide heat by installing heat sinks in contact with a PCB or a heat dissipation base on which semiconductor optical devices are mounted. Adopt a divergent structure. However, it is known that there are many limitations in improving the heat dissipation performance of a lighting device with a conventional heat sink. On the other hand, many studies and attempts have been made in the past to apply a heat pipe heat dissipation structure using heat absorption and heat release by a fluid to an optical semiconductor-based lighting device.

Although a technique of improving heat dissipation performance by installing the heat pipe structure in contact with the rear surface of the heat dissipation base has been proposed, the heat pipe alone has a limitation in improving heat dissipation performance due to a small surface area at the heat dissipation side.

Therefore, one problem to be solved by the present invention is to install the cooperative heat pipe (s) on the heat radiation base of the light emitting module to absorb the heat of the light emitting module, the cooperative heat pipe (s) having a large surface area It is to provide an optical semiconductor-based lighting device that passes through the heat dissipation block including a plurality of heat sinks, the heat dissipation block through the heat dissipation block.

In addition, another problem to be solved by the present invention is to promote the heat dissipation of the light emitting module using the cooperative heat pipe (s) and the heat dissipation block cooperating therewith, the area or location that can not be covered by the cooperative heat pipe (s) In the present invention, an optical semiconductor-based lighting device having higher heat dissipation performance by disposing independent heat pipe (s) from a heat dissipation block is provided.

An optical semiconductor based lighting apparatus according to an aspect of the present invention includes a light emitting module including a heat dissipation base; A heat dissipation block including a plurality of heat dissipation plates spaced side by side and spaced apart from the light emitting module; A portion includes a plurality of cooperating heat pipes installed in contact with the heat dissipation base and the other through the heat sinks.

According to an embodiment, the thickness ratio of each of the heat sinks and the spacing ratio between the heat sinks may be 1: 1.5 to 1: 5.

According to an embodiment, each of the cooperative heat pipes may include a lower line portion contacting the heat dissipation base and an upper line portion penetrating the heat dissipation plates.

According to an embodiment, each of the cooperative heat pipes may further include a connection line part connecting the lower line part and the upper line part.

According to an embodiment of the present disclosure, the cooperative heat pipes may include a first cooperative heat pipe and a second cooperative heat pipe having a connection line part having a first height and a connection line part having a second height, respectively.

According to an embodiment, the first cooperative heat pipe and the second cooperative heat pipe may be alternately arranged.

According to an embodiment, the lower line portions of the cooperative heat pipes may be concentrated in one or more regions of the heat dissipation base.

According to one embodiment, the heat dissipation block may further include one or more independent heat pipes disposed on the heat dissipation base, wherein the independent heat pipes may be located outside the area where the lower line portions are concentrated.

According to one embodiment, the independent heat pipe may include an edge line portion positioned along an edge of the heat dissipation base.

According to one embodiment, each of the lower line portion and the upper line portion may be formed in a straight line.

According to one embodiment, the lighting device further comprises a pipe fixing unit for fixing the lower line portion on the base, the pipe fixing unit is a lower fixing plate defining a groove for receiving the lower line portion, and It may include an upper fixing plate which is fastened to the upper surface of the lower fixing plate while covering the groove.

According to one embodiment, the independent heat pipe and the lower line portion may be spaced apart from the heat dissipation block.

According to another aspect of the present invention, there is provided an optical semiconductor based lighting apparatus comprising: a light emitting module installed at one open area of the housing and having a heat dissipation base; A plurality of heat sinks disposed in the housing and spaced apart from each other side by side; A portion includes a plurality of cooperating heat pipes installed in contact with the heat dissipation base and the other through the heat sinks.

According to an embodiment, each of the cooperative heat pipes may include a lower line portion in contact with the heat dissipation base and an upper line portion penetrating the heat dissipation plates, and the lower line portions of the cooperative heat pipes may be formed in the heat dissipation base. It is concentrated in one or more areas. The lighting device further includes one or more independent heat pipes disposed on the heat dissipation base independent of the heat sinks, wherein the independent heat pipes are located outside the region where the lower line portions are densely located. The lighting apparatus further includes a cooling fan disposed in the housing to forcibly cool the heat sinks with air, and lower ends of the heat sinks are spaced apart from the standalone heat pipe and the lower line parts, and the top of the heat sinks is Spaced adjacent to the cooling fan.

According to embodiments of the present invention, an optical semiconductor having an improved heat dissipation performance by a heat dissipation block composed of a plurality of heat dissipation plates having a large surface area and cooperative heat pipes disposed at a heat dissipation base of the light emitting module so as to cooperate with the heat dissipation block. The base lighting device is implemented. Each of the cooperative heat pipes has a sufficient heat dissipation performance by being cooperated with a heat dissipation block even with the simplest structure of a lower horizontal line portion horizontally contacting the heat dissipation base and an upper horizontal line portion horizontally penetrating the heat dissipation block. Can be exercised. By applying a structure and an arrangement in which the cooperative heat pipes penetrate the heat dissipation block at different heights, the heat dissipation block can be uniformly heated to dissipate heat evenly. By alternately arranging heat pipes passing through the heat dissipation block at different heights, more uniform heat dissipation is possible. The lower horizontal line portions of the cooperating heatpipes are preferably concentrated in one or more regions of the base. In the case of using cooperative heatpipes having a simple shape and structure, there is a restriction that there is a region (s) on the heat dissipation base that the influence of the cooperative heatpipe (s) is not properly affected. The above limitation can be eliminated by arranging the stand-alone heat pipe (s) having a heat dissipation function without the help of a block in a desired shape. If the heat sinks constituting the heat shield block do not come into contact with any element at the top and the bottom, the gap (s) between the heat sinks are opened as a whole, whereby the air flow through the gap (s) is good, The heat dissipation performance of the lighting device can be better. In particular, it would be more advantageous in applications where the cooling fan is blown towards the heat dissipation block.

1 is a perspective view showing an optical semiconductor-based lighting device according to an embodiment of the present invention.
2 is a plan view showing the light emitting module shown in FIG. 1 with the optical cover removed;
3 is a front view partially showing the lighting device according to an embodiment of the present invention.
Figure 4 is a side view showing a partially cut in the lighting apparatus according to an embodiment of the present invention.
5 is a plan view showing the cooling fan and the heat dissipation unit shown in Figures 3 and 4 from top to bottom.
6 is a plan view showing a top surface of the heat dissipation base on which the heat pipes of the heat dissipation unit are arranged;
7 is a sectional view taken along II of FIG. 6;
8 is a perspective view illustrating the heat dissipation block together with the cooperative heat pipes of the heat dissipation unit.
9 is a view for explaining an optical semiconductor-based lighting apparatus according to another embodiment of the present invention.
10 and 11 are views for explaining an optical semiconductor-based lighting device according to another embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The following embodiments are provided by way of example so that those skilled in the art can fully understand the spirit of the present invention. Therefore, the present invention is not limited to the embodiments described below, but may be embodied in other forms. In the drawings, the width, length, thickness, and the like of the components may be exaggerated for convenience. Like numbers refer to like elements throughout. Throughout the specification, terms indicating orientation are intended to describe the position, structure, and arrangement of each component as shown in the drawings, and unless the terms are directly related to the spirit of the invention, the terms The present invention should not be limited.

1 is a perspective view showing an optical semiconductor based lighting apparatus according to an embodiment of the present invention, Figure 2 is a plan view showing the light emitting module shown in Figure 1 with the optical cover removed, Figure 3 is a present invention 4 is a front view partially cutaway the lighting apparatus according to an embodiment of the present invention, FIG. 4 is a side view of the lighting apparatus according to the exemplary embodiment of the present invention, which is partially cut away, and FIGS. 5 and 3 are FIGS. 6 is a plan view showing the cooling fan and the heat dissipation unit shown from top to bottom, and FIG. 6 is a plan view showing a top surface of the heat dissipation base on which the heat pipe of the heat dissipation unit is disposed, and FIG. 7 is a cross-sectional view taken along II of FIG. 6. 8 is a perspective view illustrating the heat dissipation block and the cooperative heat pipes of the heat dissipation unit together. In FIGS. 4 to 6, different parts are indicated outside parentheses and parentheses for some components, and the elements indicated by the part numbers shown in parentheses are defined as including components indicated by the part numbers indicated outside the parentheses. do.

As shown in FIG. 1, the lighting apparatus according to the present embodiment includes a light emitting module 10 and a housing 20. The light emitting module 10 is installed in the lower open area of the housing 20 to emit light downward.

The housing 20 includes various heat dissipation elements for quickly dissipating heat generated from the light emitting module 10 to the outside. The housing 20 includes a housing top 22 and a housing bottom 24. A circular open area is provided at a lower end of the lower housing 24, and the light emitting module 10 is installed to cover the open area. The various heat dissipation elements are disposed above the light emitting module 10 in the housing 20, that is, behind the housing 20 of the light emitting module 10.

In addition, a power supply for supplying power to the light emitting module 10 is embedded in the housing 20. In the present embodiment, a switching mode power supply (SMPS) for converting an alternating current (AC) current supplied from the outside into a direct current (DC) current and providing it to semiconductor photonic elements in the light emitting module 10 is a housing 20. Disposed in the housing top 22. A power supply such as the SMPS generates a lot of heat during driving. According to the present embodiment, a structure is provided in the housing 20 to prevent excessive temperature rise inside the housing 20.

As mentioned above, the lower region of the lower part of the housing 24 in which the light emitting module 10 is installed has a substantially circular shape corresponding to the overall shape of the light emitting module 10. If the light emitting module 10 has a geometric shape other than a circular shape, the lower region of the lower housing 24 will also have a shape corresponding thereto.

Side surfaces of the upper portion 22 of the housing are formed with a plurality of intake holes 2 through which outside air is sucked. Each of the intake openings 2 may have a slit form and may be arranged in a grill form together with the other intake openings 2.

In addition, a plurality of exhaust ports 3 are formed along the edge of the light emitting module 10 at the bottom of the housing 20 to exhaust external air. The exhaust ports 3 may include a PCB 14 having semiconductor optical elements 16 mounted thereon. The light emitting module 10 may be formed on the heat dissipation base 12 of the light emitting module 10 itself or may be formed on the bottom of the housing 20 around the light emitting module 10.

 In the present embodiment, the exhaust ports 3 are arranged at regular intervals while being formed in a substantially slit shape in the annular edge region of the heat dissipation base 12. By forming the exhaust ports 3 in the annular edge region of the heat dissipation base 12, PCB and semiconductor optical devices are installed on the heat dissipation base 12 to assemble the light emitting module 10, and then the light emitting module 10 is housed. There is an advantage that it is possible to position the above-described exhaust ports 3 in the intended place only by assembling in the lower open area of 20).

 In addition, various other effects that can be obtained by providing the exhaust ports 3 to the heat dissipation base 12 constituting a part of the light emitting module 10 will be recognized by those skilled in the art from the detailed description and the drawings.

In addition, the lighting apparatus according to the present embodiment may further include a tilt variable support unit 30. The support unit 30 includes a bracket fixed to the ceiling or the like. The bracket integrally includes a horizontal shoulder portion 322 and a pair of arm portions 324 and 324 vertically extending downward from both sides of the shoulder portion 322. The pair of arm portions 324 and 324 are hingedly connected to the shafts 342 protruding from both the lower end of the housing 20 and the lower end of the heat dissipation base 12 at the lower portion thereof.

The center of the shoulder portion 322 is provided with a fastening portion 326 fixed to the ceiling or the like, for example, by a fastening method. More preferably, the shafts 342 are integrally provided at both sides of the heat dissipation base 12. For example, when manufacturing the heat dissipation base 12 by a die casting process, if the shafts 342 are integrally provided on the heat dissipation base 12, even if there is no careful design and consideration for installing the shaft in the housing 20, In addition, damage that may be caused in the housing near the shaft 342 by the rotational behavior of the housing 20 and the lighting apparatus including the same may be prevented.

When the bracket is fixed to the ceiling by the fastening part 326, the housing 20 may be rotated about the shafts 242 and 242 by an external force. If, for example, a friction or latch mechanism is applied so that the housing 20 can be stopped at any rotated angle, the housing 20 can be stopped at that rotated angle.

Referring to FIG. 2, the light emitting module 10 includes a substantially circular PCB 14 and a plurality of semiconductor optical devices 16 mounted on the PCB 14. The semiconductor optical element 16 is preferably an LED. According to the present embodiment, the semiconductor optical elements 16 are arranged in the form of imaginary circles C, which are indicated by double-dotted lines, along the periphery of the PCB 14, and a plurality of semiconductor optical elements 16 are also inside. ) Are located over most of the area in circle (C). The central region of the PCB 14 is not mounted with the semiconductor optical devices 16 to provide components and wiring for driving the semiconductor optical devices 16.

The PCB 14 may be formed by combining a plurality of unit PCBs having a fan shape. The PCB 14 may be a metal core PCB (MCPCB) or a metal PCB (MPCB) based on a metal plate having good thermal conductivity.

For example, in a manner that the circular PCB 14 is attached or fastened on the heat dissipation base 12, the circular PCB 14 is provided on the disc-shaped heat dissipation base 12. The above-described exhaust ports 3 are formed at regular intervals in the edge region of the heat dissipation base 12 surrounding the circular PCB 14. The heat dissipation base 12 may be made of a metal material such as copper or aluminum having good thermal conductivity. An optical cover is coupled to protect the semiconductor optical device 14. An optical cover 18 is shown in FIG. 1 with a portion cut away to show the light emitting elements 16 therein.

In the present embodiment, although the PCB 14 is constructed by being bonded on the heat dissipation base 12, it is also conceivable to form a circuit pattern of the PCB directly on the heat dissipation base 12 together with the insulating material. Therefore, although the heat dissipation base and the PCB are described as being separate elements from each other, it should be noted that the PCB may also be a component belonging to the heat dissipation base.

3 to 5, the lighting apparatus according to the present embodiment includes a heat dissipation unit 40, a cooling fan 60, and an SMPS 80 inside the housing 20.

The heat dissipation unit 40 is disposed directly on the light emitting module 10 in the housing 20. The SMPS 80 described above is disposed above the housing 20. The cooling fan 60 is disposed between the SMPS 80 and the heat dissipation unit 40. The intake port 2 described above is formed on the upper side of the housing 20 above the cooling fan 60. The SMPS (80) is preferably spaced apart from the ceiling surface in the housing (20) by support means for suspending it. By providing a space between the ceiling surface in the housing 20 and the SMPS 80, the air can directly contact the upper surface of the SMPS 80, thereby helping to cool the SMPS 80. In particular, as in this embodiment, when the outside air is sucked to cool the SMPS (80), the top and bottom, and the side surface of the SMPS (80) so that the outside air can come into contact with all sides of the SMPS (80) All of them are preferably spaced apart from the inner wall surfaces of the housing 20.

In this case, the inlet port 2 is preferably formed at a position adjacent to the SMPS (80) laterally. The exhaust port 3 is formed at the lower side of the housing 20, at the edge of the light emitting module 10, or near it. As mentioned above, it is preferable that a plurality of exhaust ports 3 are formed in a row in the edge region of the row base 12.

The heat dissipation unit 40 includes heat pipe structures 42, 44a, and 44b and a heat dissipation block 46.

The heat pipe structure includes a plurality of heat pipes 42, 44a, and 44b, and the plurality of heat pipes 42, 44a, and 44b are pipes installed to contact the heat dissipation base 12 while receiving a cooling fluid. As a function, the heat is taken away from the heat radiating base 12 by the action of the cooling fluid. More preferably, the plurality of heat pipes 42, 44a, and 44b contain a liquid such as water or alcohol therein under reduced pressure, so that the liquid evaporated by the temperature rise on one side flows to the other side, and on the other side thereof. After the heat dissipation, the heat of the heat dissipation base 12 may be taken out and released in a manner of becoming a liquid.

The heat pipe structure includes independent heat pipes 42 and cooperative heat pipes 44a and 44b. The independent heat pipe 42 performs a heat dissipation function independently from the heat dissipation block 46, and the cooperative heat pipes 44a and 44 b perform a heat dissipation function together with the heat dissipation block 46.

In the present embodiment, the independent heat pipe 42 is a horizontally arranged heat pipe arranged horizontally with respect to the heat dissipation base 12 and a full contact heat pipe in which the entire length is in contact with the top surface of the heat dissipation base 12. . In addition, the cooperative heat pipes 44a and 44b are vertically arranged heat pipes disposed vertically with respect to the heat dissipation base 12, and at the same time, only a part of the lower part of the lower portion thereof contacts the upper surface of the heat dissipation base 12. Heat pipe.

As best seen in FIGS. 5 and 6, the freestanding heat pipe 42 is held in contact on the heat dissipation base 12 while being limited to two or more line portions by bending or bending.

In the present embodiment, the independent heat pipe 42 has two line portions, that is, a straight inner line portion positioned parallel to the center line H near the imaginary center line H of the heat dissipation base 12 ( 422 and a curved edge line portion 424 positioned adjacent to the edge and adjacent to the edge of the heat dissipation base 12 integrally. The edge line portion 424 has a curved shape corresponding to the arc of the circle forming the outer arrangement of the semiconductor optical device 16 described above. The edge line portion 424 of the stand-alone heat pipe 42 also participates in heat dissipation of the inner region, but increases the heat dissipation in the area between the outer edges of the heat dissipation base 12 from the region where the edge line portion 424 is located. Contribute. The edge line portion 424 may be provided in a shape and a position corresponding to the outer array 16 of the semiconductor optical devices 16 to further increase heat dissipation performance. The outer array of semiconductor optical devices 16 may include the edge line. It is preferably present between the portion 424 and the outer edge of the heat dissipation base 12.

In the present embodiment, four independent heat pipes 42 having the same shape are disposed on the heat dissipation base 12, and two independent heat pipes 42 and 42 positioned on the left side with respect to the center line H are disposed. The two inner line portions 422 and 422 face each other on the same straight line, and the two edge line portions 424 and 424 face each other while being symmetric with each other while being spaced apart from each other. The edge line portion 424 has a shape and an arrangement corresponding to the outline arrangement of the semiconductor light emitting devices 16.

Similarly, two independent heat pipes 42 and 42 positioned on the right side with respect to the center line also have two inner line portions 422 and 422 facing each other on the same straight line, and two edge line portions 424 and 424. ) Are symmetrical with each other and the two ends are opposed to each other while being spaced apart from each other. As described above, the four independent heat pipes 42 are preferably arranged in front and rear symmetrical structure on the heat dissipation base 12.

The shape and arrangement of the independent heat pipes 42 as described above is such that the linear lower horizontal line portions 442a, 442b of the cooperative heat pipes 44a and 44b are described in detail below, preferably in an area on the heat dissipation base 12. Makes it possible to arrange the heat pipes as wide as possible, in a state concentrated in the central region.

The cooperative pipe 44a or 44b has a lower horizontal line portion 442a or 442b, a vertical connecting line portion 444a or 444b and an upper horizontal line portion 446a defined by bending or bending in an approximately "c" shape. 446b) (see FIG. 8). The lower horizontal line portion 442a or 442b, the vertical connection line portion 444a or 444b, and the upper horizontal line portion 446a or 446b have a straight shape. The lower horizontal line portion 442a or 442b contacts the heat dissipation base 12 in a horizontal state similarly to the independent heat pipes 42.

The upper horizontal line portion 446a or 446b is disposed to penetrate a plurality of heat sinks 462 constituting the heat dissipation block 46, as shown in FIG. 8. In the present embodiment, the heat dissipation block 46 is provided by a plurality of heat dissipation plates 462 arranged horizontally at narrow intervals to be held in a substantially rectangular parallelepiped or a cube shape. As the plurality of upper horizontal line portions 446a and 446b penetrate the heat sinks 462 at different positions, the heat sinks 462 may be maintained in a block form.

Referring back to FIG. 6, two inner line portions 422 and 422 of the pair of independent heat pipes 42 and 42 face each other on the same straight line on the left side of the top surface of the heat dissipation base 12. The two edge line portions 424, 424 of the pair of independent heat pipes 42, 42 are spaced apart from each other. The lower horizontal line portions 442a and 442b of the plurality of cooperating heatpipes 44a and 44b (see FIG. 8) are disposed side by side between the pair of independent heat pipes 42. Upper horizontal line portions 446a and 446b of the cooperative heat pipes 44a and 44b extend from the left side to the right side of the left heat dissipation block 46 to penetrate the left heat dissipation block 46. )

On the upper right side of the heat dissipation base 12, two inner line portions 422 and 422 of the other pair of independent heat pipes 42 and 42 face each other on the same straight line and the pair of independent heat pipes The two edge line portions 424 and 424 of 42 and 42 are spaced apart from each other. The lower horizontal line portions 442a and 442b of the plurality of cooperating heat pipes 44a and 44b are arranged side by side between the pair of independent heat pipes 42. The upper horizontal line portions 446a and 446b of the other cooperative heat pipes 44a and 44b extend from the right side to the left side of the right heat dissipation block 46 to penetrate the right heat dissipation block 46.

At this time, each of the plurality of lower horizontal line portions 442a and 442b extends linearly toward the center with ends between the two edge line portions 424 and 424 of the independent heat pipes 42 and 42.

According to one embodiment of the present invention, the cooperative heat pipes 44 may cooperate with the light emitting module 10 to cool the light emitting module 10 with high heat dissipation performance. The lower horizontal line portions 442a and 442b of the cooperative pipes 44 are disposed on the heat dissipation base 12 on the upper surface or the rear surface of the light emitting module 10 in a wide and high density, and the lower horizontal line portions 442a and 442b. In the difficult region, particularly, the edge region and the central region of the heat dissipation base 12, the independent heat pipes 42 are in contact with the whole to perform the heat dissipation function independently. Such a structure allows the heat pipes 42 and 44 to be widely and densely arranged in almost the entire area of the heat dissipation base 12 on the rear surface of the light emitting module 10 without complicating the heat pipe piping design.

As shown in FIG. 8, the cooperative heat pipes 44a and 44b may be formed of a first cooperative heat pipe (3) depending on the height of the heat dissipation block 46 or the length of the vertical connection line portions 444a and 444b. 44a) and the second cooperative heat pipe 44b. The first cooperative heat pipe 44a has a vertical line portion 444a having a vertical length longer than that of the vertical line portion 444b of the second cooperative heat pipe 44b. Accordingly, the height at which the upper horizontal line portion 446a of the first cooperative heat pipe 44a penetrates the heat dissipation block 46 is lower than the lower horizontal line portion 446b of the second cooperative heat pipe 44b. It is larger than the height penetrating through the heat radiating block 46.

Therefore, it is preferable that the first cooperative type heat pipe 44a and the second cooperative type heat pipe 44b are alternately arranged. By arranging the first cooperative type heat pipes 44a and the second cooperative type heat pipes 44b having different heights, it is possible to prevent the heat conduction from being concentrated in one region of the heat dissipation block 46. The heat dissipation performance of the heat dissipation unit 40 for the light emitting module 10 may be further improved.

Referring to FIG. 7, the lower horizontal line portions 442 of the independent heat pipes 42 and the cooperative heat pipes 44a or 44b are formed on the top surface of the heat dissipation base 10 by the pipe fixing unit 120. It is fixed. The pipe fixing unit 120 includes a lower fixing plate defining grooves 121a in which the independent heat pipes 42 and the lower horizontal line portion 442 of the cooperative heat pipe 44a or 44b are at least partially received. 121 and an upper fixing plate 122 fastened to the upper surfaces of the lower fixing plates 121 while covering the grooves 121a.

Referring back to FIG. 6, the pipe fixing unit 120 includes a central pipe fixing unit 120a and an outer pipe fixing unit 120b. The center pipe fixing unit 120a may be formed at opposite ends of the lower horizontal line portions 442a and 442b and the inner line portions 422 of the independent heat pipes 42 in the central region of the heat dissipation base 12. All are arranged to be fixed. The outer pipe fixing unit 120b is disposed at the outer portion to fix the middle portions of the lower horizontal line portions 442a and 442b and the ends of the edge line portions 424 of the independent heat pipes 42.

Referring again to FIG. 3, the lower ends of the heat dissipation block 46 and the heat sinks 462 included therein are spaced apart from the lower horizontal line portions of the independent heat pipe 42 and the cooperative heat pipes 44a and 44b disposed thereunder. It is. Therefore, the gaps between the heat sinks 462 of the heat dissipation block 46 are also opened at the lower ends of the heat sinks 462, so that the air blown from the cooling fan 60 is filled with gaps between the heat sinks 462. Through the heat dissipation block 46 may pass through the bottom, and further, may be electrolyte onto the heat dissipation base (12).

A pair of cooling fans 60 are positioned directly above the left and right pair of heat dissipation blocks 46 and 46. The cooling fan 60 is located between the heat dissipation block 46 and the SMPS 80. The SMPS 80 is provided with components that generate a lot of heat in the lower region adjacent to the cooling fan 60.

As mentioned above, in the lighting apparatus according to the present embodiment, a plurality of intake holes 2 are formed on the side of the housing 20 adjacent to the SMPS 80. In addition, the intake ports 2 are positioned higher than the cooling fan 60. The distance between the cooling fan 60 and the upper end of the housing 20, that is, the thickness of the rear space of the cooling fan 60 is set larger than the thickness of the cooling fan 60. If the thickness of the cooling fan 60 is larger than the thickness of the rear space, since the cool air sucked through the inlet port 2 does not sufficiently cool the SMPS 80 and is blown down, effectively cooling the SMPS 80. it's difficult.

According to the present embodiment, the cooling fan 60 located below the SMPS 80 cools the cold outside air sucked through the intake port 2 from the SMPS 80 and draws down the heat rising upward by convection. In addition, the air further goes down to help the heat dissipation unit 40 to cool the light emitting module 10, and is then exhausted to the outside through an exhaust port 3 provided near the bottom of the housing 20. If heat from the SMPS 80 rises to the top of the interior of the housing and is retarded, it can cause serious malfunction or failure of the lighting device.

The cooling fan 60 may be configured to be capable of forward and reverse rotation, and in the reverse rotation of the cooling fan 60, the above-described exhaust port 3 functions as an intake port to allow intake of outside air, and the intake port 2 described above. ) Serves as an exhaust port to exhaust the air absorbing heat in the housing to the outside.

According to the embodiment of the present invention, the ratio of the heat sink thickness t and the heat sink spacing g is considered as one of the important factors for determining the heat radiation performance of the lighting apparatus according to the present embodiment. When the thickness of the heat sinks 462 has a predetermined thickness, even if the number of heat sinks 462 is increased by a predetermined number and a predetermined interval, the heat dissipation performance is improved substantially linearly.

However, when the spacing of the heat sinks 462 is reduced to less than a predetermined value, thermal interference occurs between neighboring heat sinks 462, and a lag phenomenon occurs in which heat is delayed between the heat sinks 462. Rather, the heat dissipation performance of the lighting device can be reduced. In addition, as in the present embodiment, when the cooling fan 60 is used, if the interval between the heat sink 462 is too narrow, the blowing by the cooling fan 60 is not smoothly supplied between the heat sink 462. This may be a problem in improving heat dissipation performance. Heat dissipation performance is particularly good when the ratio of heat sink spacing to heat sink thickness is 1: 1.5 to 1: 5.

The lighting apparatus according to the embodiment of the present invention described above includes a cooling fan 20 that assists the heat dissipation unit 40 to participate in the heat dissipation of the light emitting module 10 and also participates in the cooling of the SMPS 20.

Hereinafter, another embodiment of the present invention is described an illumination device. In the following embodiments, content overlapping with the previous embodiment may be omitted. In addition, it should be noted that the lighting apparatus of the foregoing embodiment may include the same or similar configuration described in other embodiments below, even if not described above.

Referring to FIG. 9, the SMPS 80 is spaced apart from the ceiling surface of the upper end of the housing 20 by the suspension support 29. In addition, according to the present embodiment, in addition to the intake openings 2 formed on the upper side surfaces of the housing 20, the intake openings 2 ′ are further formed on the ceiling surface of the upper end of the housing 20. When the cooling fan 60 is operated, external air is sucked into the housing 20 through the inlets 2 ′ of the upper ceiling surface of the housing 20 as well as the inlets 2 of the side of the housing 20. Therefore, according to the present embodiment, since the upper portion of the SMPS 80, which was relatively thermally delayed, is cooled by the outside air introduced through the intake holes 2 'of the ceiling surface, the SMPS 80 can be cooled more effectively. have.

FIG. 10 is a cross-sectional conceptual view showing the overall structure of an optical semiconductor based lighting apparatus according to another embodiment of the present invention, and FIGS. 11A and 11B are viewed from a point A from line B-B 'of FIG. 10. As figures, the air venting operation shows two different modes, respectively.

Referring to FIG. 10, as in the previous embodiment, the lighting apparatus according to the present embodiment includes a light emitting module 10 having a plurality of semiconductor optical devices 16 in an open area at the bottom of the housing 20. The heat dissipation base 12 is mounted to cover the open area of the lower side of the housing 20, and the PCB 14 is coupled to the bottom of the heat dissipation base 12. In addition, the semiconductor optical devices 16 are mounted on the PCB 14, and the optical cover 18 is mounted on the heat dissipation base 12.

The optical cover 18 covers and protects the optical elements 16 while positioned directly below the PCB 14. The SMPS 80 is disposed in the upper inner space of the housing 20. Note that other parts may be placed together with the SMPS 80 in that space.

As in the previous embodiment, a plurality of exhaust ports 3 are formed around the optical cover 18 on the lower side of the housing 20. The exhaust openings 3 are arranged along the edge of the optical cover 18. In addition, an antifouling structure 70 is provided which directs the flow of air discharged through the exhaust ports 3 toward the periphery of the exhaust ports 3 toward the surface of the optical cover 18. In addition, at least one cooling fan 60 is provided in the housing 20 for forcibly drawing outside air from the intake port 2 on the upper side of the housing 20 and forcing it through the exhaust ports 3 described above.

Air is forcibly sucked and discharged in the direction of the arrow indicated by the dotted line by the cooling fan 60, while relieving the internal heat generation of the housing 20, and also to block the inflow or adsorption of foreign matter with the antifouling structure (70). Will be. The antifouling structure 70 guides the air discharged through the exhaust port 3 in a direction covering the open area of the lower end of the housing 20 and the optical cover 18 installed therein to block foreign matter or contaminants in an air curtain manner. In addition, the air may serve to blow off foreign matter or contaminants on the optical covers 18.

As described in the description of the foregoing embodiment, the cooling fan 60 serves to cool the heating element such as the semiconductor optical device 16 and the SMPS 80 by forcibly sucking external cold air. The inlets 2 are formed in an elongated slit form along the side of the housing 20 corresponding to the SMPS 80 embedded in the upper portion of the housing 20, and the air sucked through the inlets 2 is first SMPS. Participate in the cooling action of 80.

 Although not shown, a foreign matter blocking filter covering the intake ports 3 may be further provided to block foreign substances such as dust and to suck only clean air. As the foreign material blocking filter, a special filter such as a HEPA filter or a SEPA filter may be applied to block various harmful substances such as bacteria as well as simple dust.

As described in the foregoing embodiment, a heat dissipation unit 40 including a heat dissipation block 46 and a heat pipe 44 is provided directly below the cooling fan 60. Although not shown in detail in the drawings of the present embodiment, the heat dissipation unit 40 may include the type, structure and arrangement of heat pipes identical or similar to those described in the previous embodiment.

On the other hand, the antifouling structure 70 is configured to prevent the inflow or adsorption of foreign matter by inducing air discharged through the exhaust port 3 located around the optical cover 18 toward the center side of the optical cover 18. . In the present embodiment, the antifouling structure 70 has a bent guide structure for inducing the discharged air in the direction toward the center of the optical cover 18 by having a shape inclined toward the center side of the optical cover 18.

In the present embodiment, the plurality of exhaust ports 3 are arranged in an annular shape along the annular edge region 12a of the heat dissipation base 12 around the PCB 14. A ring-shaped exhaust vent adjusting member 80 as shown by a hidden line in FIG. 11 may be installed behind the annular edge region of the heat dissipation base 12a. The exhaust outlet adjustment member 80 is configured to be capable of forward and backward rotation behind the annular edge region 12a, including slots 82 of the number and size corresponding to the exhaust ports 3. Therefore, it is possible to arbitrarily adjust the area where the slot 82 and the exhaust port 3 overlap, and by this adjustment, the speed and amount of air discharged can be adjusted.

As described above, the present invention is to provide an optical semiconductor-based lighting device that can prevent the deterioration of the amount of light in advance by blocking the inflow and adsorption of foreign matters, and to solve the internal heat generation as a basic technical idea. Can be.

It will be apparent to those skilled in the art that many other modifications and applications are possible within the scope of the basic technical idea of the present invention.

Claims (16)

Light emitting module including a heat dissipation base;
A heat dissipation block including a plurality of heat dissipation plates spaced side by side and spaced apart from the light emitting module; And
A part of the plurality of cooperative heat pipes installed in contact with the heat dissipation base and the other through the heat sinks,
The cooperative heat pipes may include a first cooperative heat pipe and a second cooperative heat pipe, each having a first height connection line part and a second height connection line part. The method according to claim 1,
The thickness ratio of each of the heat sinks and the interval ratio between the heat sinks is an optical semiconductor-based lighting device, characterized in that 1: 1.5 to 1: 5. The method according to claim 1, wherein each of the cooperative heat pipe,
A lower line portion in contact with the heat dissipation base;
And an upper line portion penetrating the heat sinks. The method according to claim 3,
Each of the cooperative heat pipes further comprises a connection line portion connecting the lower line portion and the upper line portion. The method of claim 4,
The cooperative heat pipes may include a first cooperative heat pipe and a second cooperative heat pipe, each having a first height connection line part and a second height connection line part. The optical semiconductor based illuminating device according to claim 1, wherein the first cooperative heat pipe and the second cooperative heat pipe are alternately disposed. The optical semiconductor based illuminating device according to claim 3, wherein the lower line portions of the cooperative heat pipes are concentrated in one or more regions of the heat dissipation base. The method of claim 7,
And at least one independent heat pipe disposed on the heat dissipation base independent of the heat dissipation block, wherein the independent heat pipe is located outside the area where the lower line portions are concentrated. The method according to claim 8,
The independent heat pipe includes an optical semiconductor based illumination device, characterized in that it comprises an edge line portion located along the edge of the heat dissipation base. The method according to claim 3,
And the lower line portion and the upper line portion are each linear. The method according to claim 3,
And a pipe fixing unit for fixing the lower line portion on the heat dissipation base, wherein the pipe fixing unit includes a lower fixing plate defining a groove accommodating the lower line portion, and covering the groove. Optical semiconductor based lighting device comprising an upper fixing plate fastened to the upper surface. The optical semiconductor based lighting apparatus of claim 8, wherein the independent heat pipe and the lower line portion are spaced apart from the heat dissipation block. housing;
A light emitting module installed in one open area of the housing and having a heat dissipation base;
A plurality of heat sinks disposed in the housing and spaced apart from each other side by side;
A part of the plurality of cooperative heat pipes installed in contact with the heat dissipation base and the other through the heat sinks,
Each of the cooperative heat pipes includes a lower line portion in contact with the heat dissipation base and an upper line portion penetrating the heat dissipation plates, and the lower line portions of the cooperative heat pipes are concentrated in one or more regions of the heat dissipation base. There is,
And at least one independent heat pipe disposed on the heat dissipation base, independent of the heat sinks, wherein the independent heat pipe is located outside the area where the lower line portions are concentrated. delete delete The method according to claim 13,
A cooling fan disposed in the housing to forcibly cool the heat sinks with air, wherein a lower end of the heat sinks is spaced apart from the standalone heat pipe and the lower line parts, and an upper end of the heat sinks is adjacent to the cooling fan. Optical semiconductor-based lighting device, characterized in that spaced apart.

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