JPS61109153U - - Google Patents

Info

Publication number
JPS61109153U
JPS61109153U JP19391684U JP19391684U JPS61109153U JP S61109153 U JPS61109153 U JP S61109153U JP 19391684 U JP19391684 U JP 19391684U JP 19391684 U JP19391684 U JP 19391684U JP S61109153 U JPS61109153 U JP S61109153U
Authority
JP
Japan
Prior art keywords
package
cavity
semiconductor light
fixed
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19391684U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP19391684U priority Critical patent/JPS61109153U/ja
Publication of JPS61109153U publication Critical patent/JPS61109153U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の半導体受光装置の一実施例に
用いるパツケージの平面図、第2図及び第3図は
本考案装置の断面図、及びその要部拡大断面図で
ある。 1……パツケージ、2……固体撮像素子チツプ
、4……接着剤、11……キヤビテイ一底面、1
2……円形凹部。
FIG. 1 is a plan view of a package used in an embodiment of the semiconductor light-receiving device of the present invention, and FIGS. 2 and 3 are sectional views of the device of the present invention and enlarged sectional views of essential parts thereof. 1... Package cage, 2... Solid-state image sensor chip, 4... Adhesive, 11... Bottom surface of cavity, 1
2...Circular recess.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体受光素子チツプをパツケージの主面に平
行なパツケージのキヤビテイ底面に接着固定して
なる半導体受光装置に於いて、該パツケージのキ
ヤビテイ一底面に接着剤留めとなる多数の凹部を
設けた事を特徴とする半導体受光装置。
A semiconductor light-receiving device in which a semiconductor light-receiving element chip is adhesively fixed to the bottom surface of a cavity of a package parallel to the main surface of the package is characterized in that a number of recesses are provided on the bottom surface of the cavity of the package to be fixed with adhesive. A semiconductor photodetector device.
JP19391684U 1984-12-20 1984-12-20 Pending JPS61109153U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19391684U JPS61109153U (en) 1984-12-20 1984-12-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19391684U JPS61109153U (en) 1984-12-20 1984-12-20

Publications (1)

Publication Number Publication Date
JPS61109153U true JPS61109153U (en) 1986-07-10

Family

ID=30751348

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19391684U Pending JPS61109153U (en) 1984-12-20 1984-12-20

Country Status (1)

Country Link
JP (1) JPS61109153U (en)

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