JPS6418766U - - Google Patents

Info

Publication number
JPS6418766U
JPS6418766U JP1987114016U JP11401687U JPS6418766U JP S6418766 U JPS6418766 U JP S6418766U JP 1987114016 U JP1987114016 U JP 1987114016U JP 11401687 U JP11401687 U JP 11401687U JP S6418766 U JPS6418766 U JP S6418766U
Authority
JP
Japan
Prior art keywords
light
light emitting
emitting element
element chip
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987114016U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987114016U priority Critical patent/JPS6418766U/ja
Publication of JPS6418766U publication Critical patent/JPS6418766U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/32257—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic the layer connector connecting to a bonding area disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案に係る発光半導体装置の一実施
例の断面図、第２図は同実施例で用いる発光ダイ
オードチツプの上面図、第３図は同実施例の指向
特性を示す図、第４図は同実施例で用いる絞りの
上面図、第５図ａ，ｂは夫々本考案で用いる注型
用抜き型の断面図及び上面図、第６図ａ，ｂは夫
々第５図の注型用抜き型に絞りを装着させた様子
を示す断面図及び上面図、第７図は第６図におけ
る樹脂封止時の様子を示す断面図、第８図は従来
の発光半導体装置の一例の断面図、第９図は同従
来例の指向特性を示す図である。 ８……発光ダイオードチツプ、１１……絞り、
１２……レンズ部、１３……透明樹脂、１４……
注型用抜き型。 FIG. 1 is a sectional view of an embodiment of a light emitting semiconductor device according to the present invention, FIG. 2 is a top view of a light emitting diode chip used in the embodiment, and FIG. 3 is a diagram showing the directivity characteristics of the embodiment. Figure 4 is a top view of the diaphragm used in the same embodiment, Figures 5a and b are sectional views and top views of the casting die used in the present invention, and Figures 6a and b are notes from Figure 5. A cross-sectional view and a top view showing the state in which the aperture is attached to the mold cutting die, FIG. 7 is a cross-sectional view showing the state in resin sealing in FIG. 6, and FIG. 8 is a cross-sectional view showing an example of a conventional light emitting semiconductor device. A cross-sectional view, FIG. 9, is a diagram showing the directional characteristics of the conventional example. 8...Light emitting diode chip, 11...Aperture,
12...Lens part, 13...Transparent resin, 14...
Cutting die for casting.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 発光素子チツプを該チツプの前方にレンズ部を
設けて透光性の樹脂で封止してなる発光半導体装
置において、前記発光素子チツプよりの放射光が
前記レンズ部に至る光路にあつて、前記発光素子
チツプと前記レンズ部との間に遮光性の絞りを設
けたことを特徴とする発光半導体装置。 In a light emitting semiconductor device comprising a light emitting element chip, a lens part provided in front of the chip and sealed with a translucent resin, the emitted light from the light emitting element chip is on an optical path leading to the lens part, A light-emitting semiconductor device characterized in that a light-shielding aperture is provided between a light-emitting element chip and the lens portion.
JP1987114016U 1987-07-24 1987-07-24 Pending JPS6418766U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987114016U JPS6418766U (en) 1987-07-24 1987-07-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987114016U JPS6418766U (en) 1987-07-24 1987-07-24

Publications (1)

Publication Number Publication Date
JPS6418766U true JPS6418766U (en) 1989-01-30

Family

ID=31354378

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987114016U Pending JPS6418766U (en) 1987-07-24 1987-07-24

Country Status (1)

Country Link
JP (1) JPS6418766U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0680124U (en) * 1993-04-27 1994-11-08 矢崎総業株式会社 Lighting structure of dial
JP2020088083A (en) * 2018-11-21 2020-06-04 日亜化学工業株式会社 Light-emitting device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0680124U (en) * 1993-04-27 1994-11-08 矢崎総業株式会社 Lighting structure of dial
JP2020088083A (en) * 2018-11-21 2020-06-04 日亜化学工業株式会社 Light-emitting device

Similar Documents

Publication Publication Date Title
JPS6418766U (en)
JPH01167065U (en)
JPS6320464U (en)
JPH0367461U (en)
JPH0286154U (en)
JPS5977249U (en) Lateral output light emitting diode device
JPH0163140U (en)
JPH0385669U (en)
JPS6413741U (en)
JPS6413163U (en)
JPS6411558U (en)
JPS6448058U (en)
JPH0178056U (en)
JPH0351856U (en)
JPH02113356U (en)
JPH0178057U (en)
JPH0367460U (en)
JPS58166679U (en) display device
JPH0367459U (en)
JPS5993159U (en) light emitting diode device
JPH02132202U (en)
JPS6375056U (en)
JPH0339228U (en)
JPS6214756U (en)
JPH0235458U (en)