JPH0425260U - - Google Patents
Info
- Publication number
- JPH0425260U JPH0425260U JP6576090U JP6576090U JPH0425260U JP H0425260 U JPH0425260 U JP H0425260U JP 6576090 U JP6576090 U JP 6576090U JP 6576090 U JP6576090 U JP 6576090U JP H0425260 U JPH0425260 U JP H0425260U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting diode
- island
- lead frame
- led chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Description
第１図は本考案の一実施例に係る発光ダイオー
ド素子の概略的断面図、第２図は他の実施例に係
る発光ダイオード素子の概略的断面図、第３図は
従来の発光ダイオード素子の概略的断面図である
。
１０……リードフレーム、１１……アイランド
、２０……ＬＥＤチツプ、３０……反射体、３１
……内側底部。
FIG. 1 is a schematic sectional view of a light emitting diode device according to one embodiment of the present invention, FIG. 2 is a schematic sectional view of a light emitting diode device according to another embodiment, and FIG. 3 is a schematic sectional view of a conventional light emitting diode device. It is a schematic cross-sectional view. 10...Lead frame, 11...Island, 20...LED chip, 30...Reflector, 31
...Inner bottom.
Claims (1)
ツプが、リードフレームに一体に成形された略擂
鉢状の反射体の内側底部の中央に位置することを
特徴とする発光ダイオード素子。 A light emitting diode element characterized in that an LED chip die-bonded onto an island is located at the center of the inner bottom of a substantially mortar-shaped reflector integrally formed with a lead frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6576090U JPH0425260U (en) | 1990-06-21 | 1990-06-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6576090U JPH0425260U (en) | 1990-06-21 | 1990-06-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0425260U true JPH0425260U (en) | 1992-02-28 |
Family
ID=31597877
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6576090U Pending JPH0425260U (en) | 1990-06-21 | 1990-06-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0425260U (en) |
-
1990
- 1990-06-21 JP JP6576090U patent/JPH0425260U/ja active Pending