JPH0459168U - - Google Patents
Info
- Publication number
- JPH0459168U JPH0459168U JP10171490U JP10171490U JPH0459168U JP H0459168 U JPH0459168 U JP H0459168U JP 10171490 U JP10171490 U JP 10171490U JP 10171490 U JP10171490 U JP 10171490U JP H0459168 U JPH0459168 U JP H0459168U
- Authority
- JP
- Japan
- Prior art keywords
- emitting diode
- light
- stem
- translucent resin
- diode lamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 238000000465 moulding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Description
第１図は本考案の発光ダイオードランプの側面
断面図、第２図はその正面図、第３図は樹脂成形
を説明する要部説明図である。
１……ステム、２Ｒ，２Ｇ，２Ｂ……発光ダイ
オード、３……透光性樹脂。
FIG. 1 is a side cross-sectional view of the light emitting diode lamp of the present invention, FIG. 2 is a front view thereof, and FIG. 3 is an explanatory view of the main parts for explaining resin molding. 1...Stem, 2R, 2G, 2B...Light emitting diode, 3...Transparent resin.
Claims (1)
された発光ダイオードと、発光ダイオードを覆う
透光性樹脂とを具備した発光ダイオードランプに
於て、前記透光性樹脂はステムの裏面をも覆つて
いることを特徴とする発光ダイオードランプ。 In a light-emitting diode lamp comprising a stem, a light-emitting diode placed approximately in the center of the stem and provided with wiring, and a translucent resin covering the light-emitting diode, the translucent resin also covers the back surface of the stem. A light emitting diode lamp characterized by a light-emitting diode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10171490U JP2583809Y2 (en) | 1990-09-27 | 1990-09-27 | Light emitting diode lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10171490U JP2583809Y2 (en) | 1990-09-27 | 1990-09-27 | Light emitting diode lamp |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0459168U true JPH0459168U (en) | 1992-05-21 |
| JP2583809Y2 JP2583809Y2 (en) | 1998-10-27 |
Family
ID=31845407
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10171490U Expired - Lifetime JP2583809Y2 (en) | 1990-09-27 | 1990-09-27 | Light emitting diode lamp |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2583809Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005074044A1 (en) * | 2004-01-30 | 2005-08-11 | Ccs Inc. | Led and led mounting structure |
-
1990
- 1990-09-27 JP JP10171490U patent/JP2583809Y2/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005074044A1 (en) * | 2004-01-30 | 2005-08-11 | Ccs Inc. | Led and led mounting structure |
| CN100454589C (en) * | 2004-01-30 | 2009-01-21 | Ccs株式会社 | LED and LED mounting structure |
| US7589356B2 (en) | 2004-01-30 | 2009-09-15 | Ccs Inc. | LED and attachment structure of LED |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2583809Y2 (en) | 1998-10-27 |