JPS6242261U - - Google Patents
Info
- Publication number
- JPS6242261U JPS6242261U JP13326885U JP13326885U JPS6242261U JP S6242261 U JPS6242261 U JP S6242261U JP 13326885 U JP13326885 U JP 13326885U JP 13326885 U JP13326885 U JP 13326885U JP S6242261 U JPS6242261 U JP S6242261U
- Authority
- JP
- Japan
- Prior art keywords
- lamp body
- light
- emitting diode
- lamp
- reflecting surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Description
第１図は本考案の発光ダイオードランプの一実
施例の断面図、第２図はその底面図、第３図は発
光ダイオードランプの従来例の断面図である。
１……発光ダイオードランプ、２……ランプ本
体、４……発光ダイオード、１０……側面、１１
……底面、１２……光反射面。
FIG. 1 is a sectional view of an embodiment of the light emitting diode lamp of the present invention, FIG. 2 is a bottom view thereof, and FIG. 3 is a sectional view of a conventional example of the light emitting diode lamp. 1... Light emitting diode lamp, 2... Lamp body, 4... Light emitting diode, 10... Side, 11
...Bottom surface, 12...Light reflecting surface.
Claims (1)
ランプであつて、ランプ本体の下部が光反射面で
覆われていることを特徴とする発光ダイオードラ
ンプ。 (2) 光反射面で覆われているランプ本体の下部
が、ランプ本体の底面より発光ダイオードの高さ
迄のランプ本体の側面とランプ本体の底面全体と
であることを特徴とする実用新案登録請求の範囲
第１項記載の発光ダイオードランプ。 (3) 光反射面で覆われているランプ本体の下部
が、少なくともランプ本体の底面全体であること
を特徴とする実用新案登録請求の範囲第１項記載
の発光ダイオードランプ。[Claims for Utility Model Registration] (1) A light-emitting diode lamp containing a built-in light-emitting diode, characterized in that the lower part of the lamp body is covered with a light-reflecting surface. (2) Registration of a utility model characterized in that the lower part of the lamp body covered with a light reflecting surface is the side of the lamp body from the bottom of the lamp body to the height of the light emitting diode and the entire bottom of the lamp body. A light emitting diode lamp according to claim 1. (3) The light emitting diode lamp according to claim 1, wherein the lower part of the lamp body covered with the light reflecting surface is at least the entire bottom surface of the lamp body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13326885U JPS6242261U (en) | 1985-08-30 | 1985-08-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13326885U JPS6242261U (en) | 1985-08-30 | 1985-08-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6242261U true JPS6242261U (en) | 1987-03-13 |
Family
ID=31033424
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13326885U Pending JPS6242261U (en) | 1985-08-30 | 1985-08-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6242261U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS587364B2 (en) * | 1976-12-10 | 1983-02-09 | 住友金属工業株式会社 | Plate thickness control method for continuous rolling mill |
| JPS5839063B2 (en) * | 1978-03-08 | 1983-08-27 | アントン・ヘツゲンスタラ− | Extruder filling station closing device |
-
1985
- 1985-08-30 JP JP13326885U patent/JPS6242261U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS587364B2 (en) * | 1976-12-10 | 1983-02-09 | 住友金属工業株式会社 | Plate thickness control method for continuous rolling mill |
| JPS5839063B2 (en) * | 1978-03-08 | 1983-08-27 | アントン・ヘツゲンスタラ− | Extruder filling station closing device |