JP2553342Y2 - Light emitting diode lamp - Google Patents

Light emitting diode lamp

Info

Publication number
JP2553342Y2
JP2553342Y2 JP1989142390U JP14239089U JP2553342Y2 JP 2553342 Y2 JP2553342 Y2 JP 2553342Y2 JP 1989142390 U JP1989142390 U JP 1989142390U JP 14239089 U JP14239089 U JP 14239089U JP 2553342 Y2 JP2553342 Y2 JP 2553342Y2
Authority
JP
Japan
Prior art keywords
emitting diode
light emitting
lead frame
light
mold resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989142390U
Other languages
Japanese (ja)
Other versions
JPH0381652U (en
Inventor
和幸 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP1989142390U priority Critical patent/JP2553342Y2/en
Publication of JPH0381652U publication Critical patent/JPH0381652U/ja
Application granted granted Critical
Publication of JP2553342Y2 publication Critical patent/JP2553342Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Description

【考案の詳細な説明】 〈産業上の利用分野〉 本考案は、散乱タイプの発光ダイオードランプに関す
る。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a scattering type light emitting diode lamp.

〈従来の技術〉 発光ダイオードランプの一種として着色散乱タイプの
ランプがある。第５図は従来のこの種発光ダイオードラ
ンプを着色散乱モールド樹脂を省略して示す斜視図、第
６図はその断面図、第７図は着色散乱モールド樹脂も含
めた全体構造を示す断面図である。<Prior Art> A type of light emitting diode lamp is a colored scattering type lamp. FIG. 5 is a perspective view showing this type of conventional light emitting diode lamp without the colored scattering mold resin, FIG. 6 is a sectional view thereof, and FIG. 7 is a sectional view showing the entire structure including the colored scattering mold resin. is there.

発光ダイオードチップ81は反射カップ82に収容されて
第１リードフレーム83上に搭載されており、発光ダイオ
ードチップ81と第２リードフレーム84の先端との間はボ
ンディングワイヤである金線85で接続されている。第１
リードフレーム83及び第２リードフレーム84の両先端部
には、発光ダイオードランプ81、反射カップ82及び金線
85を包容するようにして、砲弾形の着色散乱モールド樹
脂86が保持されている。The light emitting diode chip 81 is accommodated in the reflection cup 82 and mounted on the first lead frame 83, and the light emitting diode chip 81 and the tip of the second lead frame 84 are connected by a gold wire 85 as a bonding wire. ing. First
At both ends of the lead frame 83 and the second lead frame 84, a light emitting diode lamp 81, a reflection cup 82 and a gold wire are provided.
A bullet-shaped colored scattering mold resin 86 is held so as to enclose 85.

〈考案が解決しようとする課題〉 このような散乱タイプの発光ダイオードランプでは、
発光ダイオードチップ81から側方へ照射された光が反射
カップ82によって前方へ反射される。そして、発光ダイ
オードチップ81から照射された光は、反射カップ82から
の反射光を含めて着色散乱モールド樹脂86を通過する
が、その通過中に一部が後方へ散乱して着色散乱モール
ド樹脂86の後方へ逸散してしまう。その結果、発光効率
が低下し、一定以上に輝度が上がらないという問題を生
じている。<Problem to be solved by the invention> In such a scattering type light emitting diode lamp,
Light emitted from the light emitting diode chip 81 to the side is reflected forward by the reflection cup 82. Then, the light emitted from the light emitting diode chip 81 passes through the colored scattering mold resin 86 including the reflected light from the reflective cup 82. Escapes behind. As a result, there arises a problem that the luminous efficiency decreases and the luminance does not increase more than a certain level.

例えば、ランプ外径が3mmの場合、その輝度は赤色で
〜17mcd,黄色で〜15mcd,レモンイエローで〜18mcd,緑色
で〜4mcdというレベルである。For example, when the lamp outer diameter is 3 mm, the brightness is at a level of 1717 mcd for red, 1515 mcd for yellow, 1818 mcd for lemon yellow, and 44 mcd for green.

本考案はかかる事情に鑑みて創案されたもので、散乱
光の逸散が少ない高発光効率の発光ダイオードランプを
提供することを目的とする。The present invention has been made in view of such circumstances, and an object of the present invention is to provide a light emitting diode lamp having high luminous efficiency with little scattering light scattering.

〈課題を解決するための手段〉 本考案に係る発光ダイオードランプは、発光ダイオー
ドチップと、一端部に反射カップを備え該反射カップの
中心部に前記発光ダイオードチップが搭載される第１リ
ードフレームと、前記発光ダイオードチップとボンディ
ングワイヤで接続される第２リードフレームと、前記リ
ードフレーム上の搭載物を包容する着色散乱モールド樹
脂とを備えてなる発光ダイオードランプにおいて、前記
反射カップの外周部に該反射カップに対して同心状に配
設される略ドーナツ状の反射板を設け、該反射板はその
外周側半径が発光ダイオードチップが搭載された部分と
第２リードフレームとの間の間隔よりも大きく、かつ反
射板の外周部が着色散乱モールド樹脂の外周より若干内
側とされるとともに、反射板の外周部の第２リードフレ
ームに対応する位置近傍に切り込みを備えてなるもので
ある。<Means for Solving the Problems> A light-emitting diode lamp according to the present invention includes a light-emitting diode chip, a first lead frame having a reflection cup at one end and having the light-emitting diode chip mounted at the center of the reflection cup. A light emitting diode lamp comprising: a second lead frame connected to the light emitting diode chip by bonding wires; and a colored scattering mold resin enclosing a load on the lead frame. A substantially donut-shaped reflector is provided concentrically with respect to the reflector cup, and the radius of the reflector is smaller than the distance between the portion on which the light emitting diode chip is mounted and the second lead frame. The outer periphery of the reflector is slightly larger than the outer periphery of the colored scattering mold resin, and the outer periphery of the reflector is second. A cut is provided near a position corresponding to the lead frame.

〈作用〉 発光ダイオードチップから照射された光は、着色散乱
モールド樹脂を通過する際に一部が後方へ散乱するが、
後方へ散乱した散乱光は、第１リードフレームの反射カ
ップ外周側に配設され、外周側半径が発光ダイオードチ
ップが搭載された部分と第２リードフレームとの間の間
隔よりも大きく、かつ反射板の外周部が着色散乱モール
ド樹脂の外周より若干内側とされた略ドーナツ状の反射
板によって、その大部分が前方へ反射される。その結
果、着色散乱モールド樹脂の後方へ逸散する散乱光が著
しく減少し、発光ダイオードランプの発光効率が向上す
る。<Function> Light emitted from the light emitting diode chip is partially scattered when passing through the colored scattering mold resin,
The scattered light scattered backward is disposed on the outer peripheral side of the reflection cup of the first lead frame, the outer peripheral radius is larger than the interval between the portion on which the light emitting diode chip is mounted and the second lead frame, and the reflected light is reflected. Most of the plate is reflected forward by a substantially donut-shaped reflecting plate whose outer peripheral portion is slightly inside the outer periphery of the colored scattering mold resin. As a result, scattered light escaping to the rear of the colored scattering mold resin is significantly reduced, and the luminous efficiency of the light emitting diode lamp is improved.

また、前記反射板の外周部の第２リードフレームに対
応する位置近傍には切り込みが設けられているので、該
反射板と第２リードフレームとの干渉を避けることがで
きる。In addition, since the notch is provided near the position corresponding to the second lead frame on the outer peripheral portion of the reflector, it is possible to avoid interference between the reflector and the second lead frame.

〈実施例〉 以下、図面を参照して本考案の実施例を説明する。<Example> Hereinafter, an example of the present invention will be described with reference to the drawings.

第１図は本考案に係る発光ダイオードランプの一例を
着色散乱モールド樹脂を省略して示す斜視図、第２図は
その断面図、第３図は着色散乱モールド樹脂も含めた全
体構造を示す断面図である。FIG. 1 is a perspective view showing an example of a light emitting diode lamp according to the present invention without a colored scattering mold resin, FIG. 2 is a sectional view thereof, and FIG. 3 is a sectional view showing the entire structure including the colored scattering mold resin. FIG.

発光ダイオードランプの発光ダイオードチップ10は、
反射カップ20の中心部に収容されて第１リードフレーム
30のヘッド部31に搭載されている。第１リードフレーム
30のヘッド部31上縁には、反射カップ20を嵌め込むため
に逆台形状の凹み32が設けられている。反射カップ20内
の発光ダイオードチップ10は、第１リードフレーム30に
平行する第２リードフレーム40の先端にボンディングワ
イヤである金線50にて接続されている。そして、反射カ
ップ20の外周側には、金属よりなる略ドーナツ状の反射
板60が反射カップ20に対して同心状に設けられている。The light emitting diode chip 10 of the light emitting diode lamp
The first lead frame accommodated in the center of the reflection cup 20
It is mounted on 30 head units 31. 1st lead frame
An inverted trapezoidal recess 32 is provided on the upper edge of the head portion 31 of the 30 to fit the reflection cup 20 therein. The light emitting diode chip 10 in the reflection cup 20 is connected to a tip of a second lead frame 40 parallel to the first lead frame 30 by a gold wire 50 as a bonding wire. On the outer peripheral side of the reflection cup 20, a substantially donut-shaped reflection plate 60 made of metal is provided concentrically with the reflection cup 20.

該反射板60は、第１リードフレーム30のヘッド部31上
縁に接合されており、その内縁は反射カップ20に続いて
いる。反射板60の外周側半径は、発光ダイオードチップ
10が搭載された部分、すなわち反射カップ20の中心部と
第２リードフレーム40との間の間隔より若干大きく設定
されており、外周部には、第２リードフレーム40及び金
線50との干渉を避けるために切り込み61が設けられてい
る。また、前記反射板60の外周部は、後述する着色散乱
モールド樹脂70の外周より若干内側とされている。そし
て、発光ダイオードチップ10、反射カップ20、金線50及
び反射板60は、第１リードフレーム30及び第２リードフ
レーム40の両先端部に跨がって成形された砲弾形の着色
散乱モールド樹脂にて完全に包容されている。The reflection plate 60 is joined to the upper edge of the head portion 31 of the first lead frame 30, and the inner edge thereof continues to the reflection cup 20. The outer radius of the reflector 60 is the light emitting diode chip
The interval between the second lead frame 40 and the gold wire 50 is set slightly larger than the portion where the 10 is mounted, that is, the interval between the center of the reflection cup 20 and the second lead frame 40. Notches 61 are provided in order to avoid this. The outer peripheral portion of the reflection plate 60 is slightly inside the outer periphery of the colored scattering mold resin 70 described later. The light emitting diode chip 10, the reflection cup 20, the gold wire 50, and the reflection plate 60 are made of a shell-shaped colored scattering mold resin formed over both ends of the first lead frame 30 and the second lead frame 40. It is completely covered by.

すなわち、上述したように、反射板60の外周部は着色
散乱モールド樹脂70の外周より若干内側とされている。That is, as described above, the outer peripheral portion of the reflection plate 60 is slightly inside the outer periphery of the colored scattering mold resin 70.

上記構成の発光ダイオードランプにおいて、発光ダイ
オードチップ10が発光すると、発光ダイオードチップ10
の前方へ照射された光は直接着色散乱モールド樹脂70に
進入する。発光ダイオードチップ10の側方へ照射された
光は反射カップ20によって前方に反射される。着色散乱
モールド樹脂70を通過する光は、反射カップ20からの反
射光も含めてその通過中に散乱を起こし、一部は後方へ
散乱するが、後方へ向かった散乱光は、その大部分が反
射板60によって前方へ反射される。そのため、着色散乱
モールド樹脂70の後方へ逸散する光は殆どなく、発光ダ
イオードチップ10から照射された光の大部分が着色散乱
モールド樹脂70の前方へ出て行く。従って、発光ダイオ
ードランプの発光効率が大幅に改善される。ランプ外径
（着色散乱モールド樹脂70の外径）をr1、反射カップ20
の外径をr2とした場合の発光効率の改善効果、すなわち
輝度改善効果は以下のようになる。In the light emitting diode lamp having the above configuration, when the light emitting diode chip 10 emits light, the light emitting diode chip 10
The light irradiated in front of is directly entered into the colored scattering mold resin 70. Light emitted to the side of the light emitting diode chip 10 is reflected forward by the reflection cup 20. The light passing through the colored scattering mold resin 70 scatters during the passage thereof, including the reflected light from the reflection cup 20, and a part of the light is scattered backward. The light is reflected forward by the reflector 60. Therefore, almost no light is scattered to the rear of the colored scattering mold resin 70, and most of the light emitted from the light emitting diode chip 10 goes out of the colored scattering mold resin 70. Therefore, the luminous efficiency of the light emitting diode lamp is greatly improved. The lamp outer diameter (the outer diameter of the colored scattering mold resin 70) is r 1 , the reflection cup 20
The effect of improving the luminous efficiency when the outer diameter is r 2 , that is, the effect of improving the luminance, is as follows.

着色散乱モールド樹脂70を通過する光は、発光ダイオ
ードチップ10から着色散乱モールド樹脂70先端までの距
離のほぼ1/2で散乱を終え、それより先では着色散乱モ
ールド樹脂70への吸収が大になる。そこで、発光ダイオ
ードチップ10から着色散乱モールド樹脂70先端までの距
離の1/2で散乱が終わるとしてこの間での散乱光を平均
化して考えると、後方への散乱光は前方への散乱光の約
1/3となる。ランプ外周面の間際まで反射板60を形成す
ると、着色散乱モールド樹脂70が受ける応力及び歪みが
大きくなるので、ランプ外周面よりある程度内側に反射
板60の外径を設定する。その場合に散乱光が反射板60で
前方に反射される割合は、ランプ外周面の間際まで反射
板60を形成した場合に対し(r2／r1)2となる。従って、
外径が3mmのランプに対して外径が2.6mmの反射板60を用
いた場合は約25％の輝度改善が図られる。The light passing through the colored scattering mold resin 70 finishes scattering at almost half of the distance from the light emitting diode chip 10 to the tip of the colored scattering mold resin 70, and after that, absorption into the colored scattering mold resin 70 becomes large. Become. Therefore, assuming that the scattering ends at 1/2 of the distance from the light emitting diode chip 10 to the tip of the colored scattering mold resin 70 and averages the scattered light during this period, the scattered light backward is about the same as the scattered light forward.
It becomes 1/3. If the reflector 60 is formed just before the outer peripheral surface of the lamp, the stress and strain applied to the colored scattering mold resin 70 will increase. Therefore, the outer diameter of the reflector 60 is set to some extent inside the outer peripheral surface of the lamp. In this case, the ratio of the scattered light reflected by the reflecting plate 60 forward is (r 2 / r 1 ) 2 compared to the case where the reflecting plate 60 is formed just before the outer peripheral surface of the lamp. Therefore,
When a reflector 60 having an outer diameter of 2.6 mm is used for a lamp having an outer diameter of 3 mm, the luminance is improved by about 25%.

第４図は本考案にかかる発光ダイオードランプの他の
例を示す断面図である。FIG. 4 is a sectional view showing another example of the light emitting diode lamp according to the present invention.

反射板60の外周側に位置する着色散乱モールド樹脂70
外周面を前方のキャップ部より拡径して、キャップ部外
径と同一かそれより大きい外径の反射板60を使用してい
る。こうすることにより、輝度改善率は約1/3に上昇
し、しかもキャップ部外径が従来どおりに維持されるの
で、キャップ部外径で設計された表示装置に当該発光ダ
イオードランプをそのまま用いることができる。また、
ランプ外周面より内側に反射板60の外径が設定されてい
るので、着色散乱モールド樹脂70が受ける応力及び歪み
は抑制される。The colored scattering mold resin 70 located on the outer peripheral side of the reflection plate 60
The outer peripheral surface is larger in diameter than the front cap portion, and a reflector 60 having an outer diameter equal to or larger than the outer diameter of the cap portion is used. By doing so, the luminance improvement rate increases to about 1/3, and the outer diameter of the cap is maintained as before, so that the light emitting diode lamp can be used as it is in a display device designed with the outer diameter of the cap. Can be. Also,
Since the outer diameter of the reflecting plate 60 is set inside the outer peripheral surface of the lamp, the stress and distortion applied to the colored scattering mold resin 70 are suppressed.

〈考案の効果〉 本考案に係る発光ダイオードランプは、発光ダイオー
ドチップと、一端部に反射カップを備え該反射カップの
中心部に前記発光ダイオードチップが搭載される第１リ
ードフレームと、前記発光ダイオードチップとボンディ
ングワイヤで接続される第２リードフレームと、前記リ
ードフレーム上の搭載物を包容する着色散乱モールド樹
脂とを備えてなる発光ダイオードランプにおいて、前記
反射カップの外周部に該反射カップに対して同心状に配
設される略ドーナツ状の反射板を設け、該反射板はその
外周側半径が発光ダイオードチップが搭載された部分と
第２リードフレームとの間の間隔よりも大きく、かつ反
射板の外周部が着色散乱モールド樹脂の外周より若干内
側とされるとともに、反射板の外周部の第２リードフレ
ームに対応する位置近傍に切り込みを備えてなる。従っ
て、発光ダイオードチップから照射された光は、着色散
乱モールド樹脂を通過する際に一部が後方へ散乱する
が、後方へ散乱した散乱光は、第１リードフレームの反
射カップ外周側に配設され、外周側半径が発光ダイオー
ドチップが搭載された部分と第２リードフレームとの間
の間隔よりも大きく、かつ反射板の外周部が着色散乱モ
ールド樹脂の外周より若干内側とされた略ドーナツ状の
反射板によって、その大部分が前方へ反射される。その
結果、着色散乱モールド樹脂の後方へ逸散する散乱光が
著しく減少し、発光ダイオードランプの発光効率を大幅
に向上させる。また、反射板の外周部は、着色散乱モー
ルド樹脂の外周部より若干内側になるよう設定されてい
るため、発光効率の低下等の原因となる応力及び歪を低
減させることができ、発光効率を低下させたり、集光性
を悪化させたりすることがない。さらに、反射板は反射
カップに対して同心状に配設されているので、バランス
のとれた出射光を得ることができる。<Effects of the Invention> A light emitting diode lamp according to the present invention includes a light emitting diode chip, a first lead frame having a reflective cup at one end and having the light emitting diode chip mounted at the center of the reflective cup, and the light emitting diode. In a light-emitting diode lamp comprising a second lead frame connected to a chip and a bonding wire, and a colored scattering mold resin enclosing a load on the lead frame, an outer peripheral portion of the reflection cup is provided on the outer periphery of the reflection cup with respect to the reflection cup. A substantially donut-shaped reflecting plate is provided concentrically and has a radius on the outer peripheral side larger than the distance between the portion on which the light emitting diode chip is mounted and the second lead frame, and The outer peripheral portion of the plate is slightly inside the outer periphery of the colored scattering mold resin, and the second lead frame on the outer peripheral portion of the reflector is provided. Is provided in the vicinity of the position corresponding to. Therefore, the light emitted from the light emitting diode chip is partially scattered backward when passing through the colored scattering mold resin, but the scattered light scattered backward is disposed on the outer peripheral side of the reflection cup of the first lead frame. A substantially donut shape in which the outer radius is larger than the distance between the portion on which the light emitting diode chip is mounted and the second lead frame, and the outer periphery of the reflector is slightly inside the outer periphery of the colored scattering mold resin. Most of the light is reflected forward by the reflector. As a result, scattered light escaping to the rear of the colored scattering mold resin is significantly reduced, and the luminous efficiency of the light emitting diode lamp is greatly improved. Further, since the outer peripheral portion of the reflecting plate is set to be slightly inside from the outer peripheral portion of the colored scattering mold resin, stress and strain which cause a decrease in luminous efficiency can be reduced, and the luminous efficiency can be reduced. There is no reduction or deterioration of light collection. Further, since the reflection plate is arranged concentrically with respect to the reflection cup, it is possible to obtain a balanced emission light.

即ち、本考案の発光ダイオードランプによれば、発光
効率の低下等の原因となる応力及び歪を発生させること
なく後方へ散乱する散乱光を出来る限り前方へ反射させ
て発光効率が向上されるとともに、バランスのとれた出
射光が得られる。That is, according to the light-emitting diode lamp of the present invention, the scattered light scattered backward is reflected as far forward as possible without generating stress and strain that cause a decrease in luminous efficiency, and the luminous efficiency is improved. , And balanced outgoing light is obtained.

【図面の簡単な説明】[Brief description of the drawings]

第１図は本考案に係る発光ダイオードランプの一例を着
色散乱モールド樹脂を省略して示す斜視図、第２図はそ
の断面図、第３図は着色散乱モールド樹脂も含めた全体
構造を示す断面図、第４図は本考案に係る発光ダイオー
ドランプの他の例を示す断面図、第５図は従来の発光ダ
イオードランプを着色散乱モールド樹脂を省略して示す
斜視図、第６図はその断面図、第７図は着色散乱モール
ド樹脂も含めた全体構造を示す断面図である。 10……発光ダイオードチップ 20……反射カップ 30……リードフレーム 60……反射板 70……着色散乱モールド樹脂FIG. 1 is a perspective view showing an example of a light emitting diode lamp according to the present invention without a colored scattering mold resin, FIG. 2 is a sectional view thereof, and FIG. 3 is a sectional view showing the entire structure including the colored scattering mold resin. FIG. 4 is a cross-sectional view showing another example of the light-emitting diode lamp according to the present invention. FIG. 5 is a perspective view showing a conventional light-emitting diode lamp with the colored scattering molding resin omitted, and FIG. FIG. 7 is a sectional view showing the entire structure including the colored scattering mold resin. 10: Light-emitting diode chip 20: Reflective cup 30: Lead frame 60: Reflector 70: Colored scattering mold resin

Claims (1)

(57)【実用新案登録請求の範囲】(57) [Scope of request for utility model registration] 【請求項１】発光ダイオードチップと、一端部に反射カ
ップを備え該反射カップの中心部に前記発光ダイオード
チップが搭載される第１リードフレームと、前記発光ダ
イオードチップとボンディングワイヤで接続される第２
リードフレームと、前記リードフレーム上の搭載物を包
容する着色散乱モールド樹脂とを備えてなる発光ダイオ
ードランプにおいて、 前記反射カップの外周部に該反射カップに対して同心状
に配設される略ドーナツ状の反射板を設け、該反射板は
その外周側半径が発光ダイオードチップが搭載された部
分と第２リードフレームとの間の間隔よりも大きく、か
つ反射板の外周部が着色散乱モールド樹脂の外周より若
干内側とされるとともに、反射板の外周部の第２リード
フレームに対応する位置近傍に切り込みを備えてなるこ
とを特徴とする発光ダイオードランプ。1. A light emitting diode chip, a first lead frame having a reflective cup at one end and having the light emitting diode chip mounted at the center of the reflective cup, and a first lead frame connected to the light emitting diode chip by bonding wires. 2
A light emitting diode lamp comprising a lead frame and a colored scattering mold resin enclosing a load on the lead frame, wherein a substantially donut disposed concentrically with respect to the reflection cup on an outer peripheral portion of the reflection cup. The reflector has an outer radius larger than the distance between the portion on which the light emitting diode chip is mounted and the second lead frame, and the outer periphery of the reflector is made of a colored scattering mold resin. A light-emitting diode lamp characterized by being provided slightly inward from the outer periphery and having a cut near the position corresponding to the second lead frame on the outer periphery of the reflector.
JP1989142390U 1989-12-08 1989-12-08 Light emitting diode lamp Expired - Lifetime JP2553342Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989142390U JP2553342Y2 (en) 1989-12-08 1989-12-08 Light emitting diode lamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989142390U JP2553342Y2 (en) 1989-12-08 1989-12-08 Light emitting diode lamp

Publications (2)

Publication Number Publication Date
JPH0381652U JPH0381652U (en) 1991-08-21
JP2553342Y2 true JP2553342Y2 (en) 1997-11-05

Family

ID=31689220

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989142390U Expired - Lifetime JP2553342Y2 (en) 1989-12-08 1989-12-08 Light emitting diode lamp

Country Status (1)

Country Link
JP (1) JP2553342Y2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3614776B2 (en) * 2000-12-19 2005-01-26 シャープ株式会社 Chip component type LED and its manufacturing method
JP3724498B2 (en) * 2004-09-27 2005-12-07 日亜化学工業株式会社 Light emitting diode

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5855652Y2 (en) * 1977-03-14 1983-12-20 株式会社東芝 Optical semiconductor device
JPS53151376U (en) * 1977-05-04 1978-11-29
JPS59767Y2 (en) * 1978-04-27 1984-01-10 サンケン電気株式会社 Light emitting element lead frame
JPS61156779A (en) * 1984-12-28 1986-07-16 Toshiba Corp Manufacture of electrode member for luminescence display device

Also Published As

Publication number Publication date
JPH0381652U (en) 1991-08-21

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