JPS6236312Y2 - - Google Patents
Info
- Publication number
- JPS6236312Y2 JPS6236312Y2 JP1981182468U JP18246881U JPS6236312Y2 JP S6236312 Y2 JPS6236312 Y2 JP S6236312Y2 JP 1981182468 U JP1981182468 U JP 1981182468U JP 18246881 U JP18246881 U JP 18246881U JP S6236312 Y2 JPS6236312 Y2 JP S6236312Y2
- Authority
- JP
- Japan
- Prior art keywords
- light
- light emitting
- lead frame
- pellet
- ohmic metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 claims description 24
- 239000008188 pellet Substances 0.000 claims description 16
- 239000011347 resin Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 238000007789 sealing Methods 0.000 claims description 6
- 230000003287 optical effect Effects 0.000 claims 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 235000013339 cereals Nutrition 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Description
【考案の詳細な説明】
本考案は、軸上光度の増大を図つた発光ダイオ
ードによる。DETAILED DESCRIPTION OF THE INVENTION The present invention is based on a light emitting diode that aims to increase the axial luminous intensity.
米粒大の小径樹脂封止部を有する発光ダイオー
ドは、それに使用するリードフレームの板厚も必
然的に薄くせざるを得ず、板厚寸法だけの端面を
利用して発光ペレツトを搭載するのは作業性が非
常に悪い。 Light-emitting diodes that have a small-diameter resin sealing part that is the size of a grain of rice must necessarily have a thin lead frame, and it is difficult to mount light-emitting pellets using the end face of the board. Workability is very poor.
そこで、第１図に示すように一方のリードフレ
ーム１に発光ペレツト２の大きさに比較して十分
広い面積を有する頭部１ａを形成し、この頭部１
ａの表面に前記ペレツト２を固定した後、他方の
リードフレーム３の頭部３ａとを金属細線４にて
ワイヤボンデイングする。 Therefore, as shown in FIG. 1, a head 1a having a sufficiently large area compared to the size of the light emitting pellet 2 is formed on one lead frame 1.
After the pellet 2 is fixed on the surface of the lead frame 3, it is wire-bonded to the head 3a of the other lead frame 3 using a thin metal wire 4.
この場合、従来では、発光ペレツト２の主面中
央にオーミツクメタル５を付着させ、このオーミ
ツクメタル５の部分とリードフレーム３の頭部３
ａとを金属細線で連結するのが一般的である。 In this case, conventionally, the ohmic metal 5 is attached to the center of the main surface of the light emitting pellet 2, and the ohmic metal 5 and the head 3 of the lead frame 3 are connected to each other.
It is common to connect a with a thin metal wire.
上記の構造において、Ｐ−Ｎ接合部からの光を
効率良く外部に取り出すためにレンズ面６を形成
して光透過樹脂にて樹脂封止７するが、発光ペレ
ツト２の主面中央に電極となるオーミツクメタル
５が付着しているために、このメタル５によつて
Ｐ−Ｎ接合部から発光される光の一部がさえぎら
れ、未だ十分に軸上光度を向上させることができ
ないという欠点がある。 In the above structure, in order to efficiently take out the light from the P-N junction to the outside, a lens surface 6 is formed and resin-sealed 7 with a light-transmitting resin. Since the ohmic metal 5 is attached, a part of the light emitted from the P-N junction is blocked by the metal 5, and the axial luminous intensity cannot be sufficiently improved. There is.
本考案は、上記の事情に基づきなされたもので
発光ペレツトの主面に電極となるオーミツクメタ
ルを形成するに当り、その中央部から位置をずら
し、樹脂封止部のレンズ面とは反対側となる部分
にオーミツクメタルを形成し、軸上光度を向上さ
せた発光ダイオードを提供することを目的とす
る。 The present invention was developed based on the above-mentioned circumstances, and when forming an ohmic metal to serve as an electrode on the main surface of a light emitting pellet, the position is shifted from the center of the ohmic metal, and the ohmic metal is placed on the opposite side of the resin-sealed part from the lens surface. The object of the present invention is to provide a light emitting diode in which axial luminous intensity is improved by forming ohmic metal on the portion where the axial light intensity is increased.
以下に、本考案の一実施例につき、図面を参照
して説明する。 An embodiment of the present invention will be described below with reference to the drawings.
第２図は角形発光ペレツトの拡大図を示し、こ
のペレツト１２の主面隅角部にオーミツクメタル
１５を付着させる。このメタル１５の付着面積は
金属細線をワイヤボンデイングするのに必要にし
て十分な大きさとする。 FIG. 2 shows an enlarged view of a rectangular light emitting pellet, and an ohmic metal 15 is attached to the corner portions of the main surface of the pellet 12. The area to which the metal 15 is attached is made large enough to be necessary for wire bonding the thin metal wire.
上記の構成により、Ｐ−Ｎ接合部から発光され
る光のうち、従来では、矢印ａ又はｂで示す方向
成分の光が、オーミツクメタル５によつてさえぎ
られていたが、これらの障害物がなくなり、その
まま、レンズ面に直進することとなる。 With the above configuration, among the light emitted from the P-N junction, the light in the direction indicated by the arrow a or b was conventionally blocked by the ohmic metal 5, but these obstacles disappears and goes straight to the lens surface.
第３図は、第２図の発光ペレツトを用いて発光
ダイオードを組み立てた場合の正面図である。 FIG. 3 is a front view of a light emitting diode assembled using the light emitting pellets of FIG. 2.
すなわち、一方のリードフレーム１１の頭部１
１ａの表面に発光ペレツト１２を固定する。 That is, the head 1 of one lead frame 11
A luminescent pellet 12 is fixed on the surface of 1a.
この場合、オーミツクメタル１５が付着してい
る隅角部を鉛直方向下方に位置させる。しかる
後、他方のリードフレーム１３の頭部１３ａと前
記メタル１５とを金属細線１４を用いてワイヤボ
ンデングする。 In this case, the corner portion to which the ohmic metal 15 is attached is located vertically downward. Thereafter, the head 13a of the other lead frame 13 and the metal 15 are wire-bonded using a thin metal wire 14.
その後、樹脂成形用型（図示せず）に挿入し、
レンズ面１６を有する樹脂封止部１７を形成す
る。 After that, it is inserted into a resin molding mold (not shown),
A resin sealing portion 17 having a lens surface 16 is formed.
上記の構成によれば、発光ペレツト１２のＰ−
Ｎ接合部からの光が樹脂封止部１７のレンズ面１
６に集光され、かつオーミツクメタル１５によつ
て光の進行が妨げられることがないので軸上光度
を向上させることができる。 According to the above configuration, the P-
The light from the N junction reaches the lens surface 1 of the resin sealing part 17.
Since the light is focused on the light beam 6 and the progress of the light is not obstructed by the ohmic metal 15, the axial luminous intensity can be improved.
なお、本考案の実施例では、角形発光ペレツト
を用いる場合について説明したが、角形形状に限
定されるものではなく、丸形その他の形状のもの
を用いることができ、それらペレツトの周縁にオ
ーミツクメタルを付着させ、かつそのメタル部分
を樹脂封止部のレンズ面と反対側に位置するよう
に配置すれば良いことは上記の説明から明らかで
あろう。 In the embodiments of the present invention, the case where square light emitting pellets are used has been explained, but the shape is not limited to the square shape, and round or other shapes can be used. It will be clear from the above description that it is sufficient to attach metal and place the metal portion on the side opposite to the lens surface of the resin sealing portion.
第１図は、従来の発光ダイオードの構造例を示
し、同図Ａは、その正面図、同図Ｂは、その側面
図、第２図は、本考案に用いる発光ペレツトを示
し、同図Ａは、その平面図、同図Ｂは、その側面
図、第３図は、上記ペレツトを用いた本考案に係
る発光ダイオードの正面図である。
１１，１３……リードフレーム、１１ａ，１３
ａ……頭部、１２……発光ペレツト、１４……金
属細線、１５……オーミツクメタル、１６……レ
ンズ面、１７……樹脂封止部、１８……Ｐ−Ｎ接
合部。
Fig. 1 shows an example of the structure of a conventional light emitting diode, Fig. A shows its front view, Fig. B shows its side view, and Fig. 2 shows a light emitting pellet used in the present invention. 1 is a plan view thereof, FIG. 3B is a side view thereof, and FIG. 3 is a front view of a light emitting diode according to the present invention using the above pellets. 11, 13...Lead frame, 11a, 13
a...Head, 12...Light emitting pellet, 14...Metal thin wire, 15...Ohmic metal, 16...Lens surface, 17...Resin sealing part, 18...P-N junction part.
Claims (1)
定された発光ダイオードにおいて、該リードフレ
ームのリード軸方向と樹脂封止部のレンズ光軸が
同一方向かつ、前記発光ペレツト主表面周縁の一
部に電極となるオーミツクメタルを形成し、該オ
ーミツクメタル部分を樹脂封止部のレンズ面と反
対側になるように発光ペレツトをリードフレーム
上に配置したことを特徴とする発光ダイオード。 In a light emitting diode in which a light emitting pellet is fixed to the head surface of a lead frame, the lead axis direction of the lead frame and the lens optical axis of the resin sealing part are in the same direction, and an electrode is provided on a part of the periphery of the main surface of the light emitting pellet. 1. A light-emitting diode characterized in that an ohmic metal is formed, and a light-emitting pellet is placed on a lead frame so that the ohmic metal portion is on the side opposite to the lens surface of the resin-sealed part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18246881U JPS5887368U (en) | 1981-12-08 | 1981-12-08 | light emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18246881U JPS5887368U (en) | 1981-12-08 | 1981-12-08 | light emitting diode |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5887368U JPS5887368U (en) | 1983-06-14 |
| JPS6236312Y2 true JPS6236312Y2 (en) | 1987-09-16 |
Family
ID=29980855
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18246881U Granted JPS5887368U (en) | 1981-12-08 | 1981-12-08 | light emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5887368U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5271179A (en) * | 1975-12-11 | 1977-06-14 | Toshiba Corp | Semiconductor device |
| JPS5610983A (en) * | 1979-07-06 | 1981-02-03 | Mitsubishi Electric Corp | Composite semiconductor device |
-
1981
- 1981-12-08 JP JP18246881U patent/JPS5887368U/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5271179A (en) * | 1975-12-11 | 1977-06-14 | Toshiba Corp | Semiconductor device |
| JPS5610983A (en) * | 1979-07-06 | 1981-02-03 | Mitsubishi Electric Corp | Composite semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5887368U (en) | 1983-06-14 |
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