JPS6236311Y2 - - Google Patents
Info
- Publication number
- JPS6236311Y2 JPS6236311Y2 JP1981182466U JP18246681U JPS6236311Y2 JP S6236311 Y2 JPS6236311 Y2 JP S6236311Y2 JP 1981182466 U JP1981182466 U JP 1981182466U JP 18246681 U JP18246681 U JP 18246681U JP S6236311 Y2 JPS6236311 Y2 JP S6236311Y2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- lead frame
- pellet
- emitting diode
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000008188 pellet Substances 0.000 claims description 15
- 239000011347 resin Substances 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 10
- 230000003287 optical effect Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Description
【考案の詳細な説明】
本考案は、発光ペレツトからの光出力、すなわ
ち、レンズ面の軸上光度を向上させた発光ダイオ
ードに係る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a light emitting diode with improved light output from a light emitting pellet, ie, axial luminous intensity of a lens surface.
リードフレームの端面に発光ペレツトを搭載す
る構造の発光ダイオードは、端面面積の狭いこと
等で作業性に劣ることから第１図に示す構造の発
光ダイオードが考案されている。 A light emitting diode having a structure in which light emitting pellets are mounted on the end face of a lead frame has poor workability due to a narrow end face area, etc., so a light emitting diode having the structure shown in FIG. 1 has been devised.
この構造の発光ダイオードは、一方のカソード
リードフレーム１の先端部１ａの一方主の表面に
発光ペレツト２を固定し、他方のアノードリード
フレーム３の先端部３ａとを金属細線４にてワイ
ヤボンデングした後、レンズ面５を形成するよう
に光透過性樹脂にて樹脂封止６する。 In the light emitting diode with this structure, a light emitting pellet 2 is fixed to one main surface of the tip 1a of one cathode lead frame 1, and wire bonded to the tip 3a of the other anode lead frame 3 using a thin metal wire 4. After that, resin sealing 6 is performed with a light-transmitting resin so as to form a lens surface 5.
上記の構造の場合、作業性は改善される反面、
樹脂封止６のレンズ面５で得られる光出力は、発
光ペレツト２のＰ−Ｎ接合部からが主となり、前
記ペレツト２の主面からの光は、レンズ面５の軸
上光度に寄与する成分が少ない欠点がある。 In the case of the above structure, although workability is improved,
The light output obtained at the lens surface 5 of the resin seal 6 mainly comes from the P-N junction of the light emitting pellet 2, and the light from the main surface of the pellet 2 contributes to the axial luminous intensity of the lens surface 5. It has the disadvantage of having few ingredients.
本考案は、上記の事情に基づきなされたもの
で、発光ペレツトをリードフレームの先端部の一
方の主表面に搭載し、作業性を改善するとともに
発光ペレツトの主面からの光出力もＰ−Ｎ接合部
からの光出力に合せてレンズ面の軸上光度として
寄与するようにした発光ダイオードを提供するこ
とを目的とする。 The present invention was developed based on the above circumstances, and it improves workability by mounting a light emitting pellet on one main surface of the tip of a lead frame, and also improves the light output from the main surface of the light emitting pellet. It is an object of the present invention to provide a light emitting diode that contributes to the axial luminous intensity of a lens surface in accordance with the light output from a junction.
以下、本考案の一実施例につき図面を参照して
説明する。 Hereinafter, one embodiment of the present invention will be described with reference to the drawings.
第２図は、本考案に係る発光ダイオードの側面
図である。 FIG. 2 is a side view of the light emitting diode according to the present invention.
同図において、カソードリードフレーム１１及
びアノードリードフレーム１３は、樹脂封止１６
内で一定の傾斜角θを有し、この傾斜角θは、レ
ンズ面１５との位置関係で最も発光ペレツト１２
からの光出力が大きくなるように実験値により定
める。 In the same figure, the cathode lead frame 11 and the anode lead frame 13 are sealed with resin 16.
The light emitting pellet 12 has a constant inclination angle θ in the positional relationship with the lens surface 15.
Determine based on experimental values so that the light output from the
上記構造の発光ダイオードを製造するには、た
とえば、第３図に示すように凹部１７を有する樹
脂成形用型１８を用い、前記凹部１７に一定の傾
斜角θを有するようにホルダ１９によつて保持
し、樹脂成形後に、ホルダ１９で保持していた脚
部を鉛直方向に折り曲げ、第２図のような構造と
する。 In order to manufacture the light emitting diode having the above structure, for example, as shown in FIG. After holding and resin molding, the legs held by the holder 19 are bent in the vertical direction to form a structure as shown in FIG.
上記の構造によれば、発光ペレツトのリードフ
レームの先端部の一方の主表面に搭載することに
より、ダイボンデング、ワイヤボンデング等の作
業性が向上するとともに樹脂封止内の発光ペレツ
トを一定角度傾斜させるとにより、本実施例で
は、θ＝70゜にしたとき、軸上光度が約20％向上
することができた。 According to the above structure, by mounting the light emitting pellet on one main surface of the tip of the lead frame, the workability of die bonding, wire bonding, etc. is improved, and the light emitting pellet inside the resin seal can be tilted at a certain angle. By doing so, in this example, when θ=70°, the on-axis luminous intensity could be improved by about 20%.
発光ペレツト主面からの光出力もレンズ軸上に
おいて取り出すことが可能となり、軸上光度を向
上させることができた。 The light output from the main surface of the light emitting pellet can also be taken out on the lens axis, making it possible to improve the axial luminous intensity.
第１図は、従来の発光ダイオードの構造例を示
し、同図Ａは、その側面図、同図Ｂは、その正面
図、第２図は本考案に係る発光ダイオードの一実
施例を示す側面図、第３図は、上記ダイオードの
製造方法の一例を示す部分断面図である。
１１……カソードリードフレーム、１２……発
光ペレツト、１３……アノードリードフレーム、
１５……レンズ面、１６……樹脂封止、１７……
凹部、１８……樹脂成形用型、１９……ホルダ。
Fig. 1 shows an example of the structure of a conventional light emitting diode, Fig. A is a side view thereof, Fig. B is a front view thereof, and Fig. 2 is a side view showing an embodiment of the light emitting diode according to the present invention. 3 are partial cross-sectional views showing an example of a method for manufacturing the diode. 11... Cathode lead frame, 12... Luminescent pellet, 13... Anode lead frame,
15... Lens surface, 16... Resin sealing, 17...
Recessed portion, 18...Resin molding mold, 19...Holder.
Claims (1)
レツトが搭載され、該リードフレームの発光ペレ
ツトを含む先端部が樹脂封止された発光ダイオー
ドにおいて、発光ペレツトが搭載された部分のリ
ードフレームが樹脂封止のレンズの光軸に対して
一定の傾斜角を有するように前記リードフレーム
が折曲されたことを特徴とする発光ダイオード。 In a light emitting diode in which a light emitting pellet is mounted on one main surface of the leading end of a lead frame, and the leading end of the lead frame containing the light emitting pellet is sealed with resin, the portion of the lead frame on which the light emitting pellet is mounted is sealed with resin. A light emitting diode, wherein the lead frame is bent so as to have a constant inclination angle with respect to the optical axis of the lens.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18246681U JPS5887366U (en) | 1981-12-08 | 1981-12-08 | light emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18246681U JPS5887366U (en) | 1981-12-08 | 1981-12-08 | light emitting diode |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5887366U JPS5887366U (en) | 1983-06-14 |
| JPS6236311Y2 true JPS6236311Y2 (en) | 1987-09-16 |
Family
ID=29980851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18246681U Granted JPS5887366U (en) | 1981-12-08 | 1981-12-08 | light emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5887366U (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI401788B (en) * | 2008-12-24 | 2013-07-11 | Ind Tech Res Inst | Led packaging module and method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5327769B2 (en) * | 1974-08-06 | 1978-08-10 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5327769U (en) * | 1976-08-18 | 1978-03-09 |
-
1981
- 1981-12-08 JP JP18246681U patent/JPS5887366U/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5327769B2 (en) * | 1974-08-06 | 1978-08-10 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5887366U (en) | 1983-06-14 |
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