CN209747894U

CN209747894U - A packaging structure for TO encapsulation LD laser

Info

Publication number: CN209747894U
Application number: CN201920782297.XU
Authority: CN
Inventors: 李彬亭; 梁盼; 吕敏; 刘琦
Original assignee: Shandong Huaguang Optoelectronics Co Ltd
Current assignee: Shandong Huaguang Optoelectronics Co Ltd
Priority date: 2019-05-28
Filing date: 2019-05-28
Publication date: 2019-12-06
Anticipated expiration: 2029-05-28

Abstract

The utility model discloses a packaging structure for TO encapsulation LD laser instrument, packaging structure include inside tube socket, pipe cap, be equipped with the COS that heat sink piece and laser instrument tube core are constituteed on the tube socket, COS with the pipe tongue position of tube socket is connected, the laser instrument tube core is in the entity top of heat sink piece, the P face and the heat sink piece upper surface of laser instrument tube core are connected, the N face and the pipe socket pin of tube core link TO each other, the pipe cap is equipped with the light window, the side bottom intermediate position of laser instrument tube core is equipped with laser instrument tube core light-emitting area, the leading flank upper portion intermediate position of heat sink piece is equipped with the heat sink piece fluting that extends TO heat sink piece entity upper surface one side, heat sink piece fluting corresponds with the upper and lower position of laser instrument tube core light-emitting area, be equipped with predetermined horizontal distance between the chamber of laser instrument tube core and. The utility model provides a laser cavity face send out light zone shelter from, the dirty and damaged problem of chamber surface, can improve product quality and product percent of pass, has degraded manufacturing cost and has used the maintenance cost.

Description

A packaging structure for TO encapsulation LD laser

Technical Field

The utility model relates TO a TO encapsulation technical field, in particular TO a heat sink structure for TO encapsulation LD laser belongs TO semiconductor package technical field.

Background

The semiconductor laser has the advantages of all solid state, small volume, light weight, long service life, high efficiency, high reliability, high absorption of metal to semiconductor laser and the like, is widely applied to the aspects of pumping, laser processing, laser cutting, precise detection and measurement, communication and information processing, medical treatment, cosmetology, military affairs and the like of the solid laser, causes revolutionary breakthrough in many fields, and has huge market demand and development potential.

The TO packaging LD laser in the prior art comprises a packaging structure consisting of a tube seat and a tube cap, wherein the tube seat is provided with a COS consisting of a heat sinking sheet and a tube core, the COS is adhered TO the tube tongue of the tube seat through silver paste, the P surface of the tube core is adhered TO the surface of the heat sinking sheet, the tube core and the heat sinking sheet are adhered in a mode of evaporating indium on the surface of the heat sink and pressing the tube core TO the surface of the heat sink, the alloy is continuously set for a preset time at a preset temperature TO complete adhesion, the N surface of the tube core is connected with a pin of the tube seat through a gold wire, and the.

Present TO encapsulation LD laser, the die light emitting area is in P face one side, in order TO prevent that the alloy in-process indium from climbing TO the chamber surface and sheltering from light emitting area and leading TO product failure and heat sink border TO shelter from the quick axle direction light-emitting of LD chip, adopts TO lean out certain length L of heat sink with die light emitting area one side among the prior art, and the defect of existence is: because the tube core extends out of the length L of one side of the heat sink, the COS is loaded on the tube seat, the position of the COS is adjusted by using a positioning device, or the cavity surface in the production process of the post procedure is easy to damage or dirty, and the cavity surface of the laser is easy to damage and damage in the using process of a customer, so that the quality of a product is unqualified, and customer complaints are caused.

In summary, the TO package LD laser process production in the prior art has the problems that the alloy process window is narrow, and the laser cavity surface is possibly shielded by climbing indium; there is also a problem in that the facet can be damaged or contaminated during the packaging process due to the overhang of the laser die relative to the heat sink facet.

SUMMERY OF THE UTILITY MODEL

The utility model discloses be exactly the above-mentioned not enough TO prior art exists, provide a packaging structure for TO encapsulation LD laser, the utility model provides a laser cavity face light emitting area shelter from, the dirty and damaged problem of chamber surface, can improve the product quality simultaneously, improve the product percent of pass, have degraded manufacturing cost.

The utility model provides a technical scheme that its technical problem adopted is:

The utility model provides a packaging structure for TO encapsulation LD laser, packaging structure includes inside tube socket, pipe cap, be equipped with the COS that heat sink piece and laser instrument tube core constitute on the tube socket, COS with the pipe tongue position of tube socket is connected, the laser instrument tube core is in the entity top of heat sink piece, the P face and the heat sink piece upper surface of laser instrument tube core are connected, the N face and the tube socket pin of tube core link TO each other, the pipe cap is equipped with the light window, and the side bottom intermediate position of laser instrument tube core is equipped with laser instrument tube core luminous area, the front side upper portion intermediate position of heat sink piece is equipped with the heat sink piece fluting that extends TO heat sink piece entity upper surface one side, and the upper and lower position of heat sink piece fluting and laser instrument tube core luminous area corresponds, is equipped with predetermined horizontal distance between the cavity face of laser instrument tube core and the front side of heat sink piece.

The heat sink slice etching groove is an etching groove.

The height H of the heat sink sheet is more than or equal to 0.2 mm.

The depth of the etching groove is more than or equal to 0.1 mm.

The heat sink notch is a hexahedral notch with openings on the side surface and the upper end surface, the length of the hexahedral notch is greater than that of the light emitting area of the laser die, the width of the hexahedral notch is greater than a preset horizontal distance between the cavity surface of the laser die and the front side surface of the heat sink, and the depth of the hexahedral notch is half of the height of the heat sink.

The P surface of the laser tube core is adhered to the upper surface of the heat sink sheet, and the N surface of the tube core is connected with the pin of the tube seat through a gold wire.

The light window is a circular light window.

The laser tube core and the heat sink sheet are bonded by indium evaporation on the surface of the heat sink.

And the COS is pasted to the position of the tube tongue of the tube base through silver paste.

The utility model has the advantages that:

1. The utility model provides a laser cavity face send out light zone shelter from, the dirty and damaged problem of chamber surface, can improve the product quality simultaneously, improve the product percent of pass, reduced the damaged proportion of chamber surface in the manufacturing or customer use, degraded manufacturing cost and used maintenance cost.

2. The utility model discloses an increase the etching groove on the heat sink piece, climb the indium structure as the buffering with the etching groove cell wall, widened alloy process window, the indium of avoiding the alloy time overlength to arouse climbs to the problem that the product that laser cavity face light-emitting position leads to became invalid, can guarantee production quality and product quality steadily, has avoided production extravagant, has reduced manufacturing cost.

3. because the laser tube core is retracted to the inside of the heat sink, the horizontal position adjusting tool cannot contact the laser tube core, and the adjusting tool adjusts the COS position by contacting the heat sink in the assembling process, the cavity surface pollution of the laser tube core is avoided.

4. The height H of the heat sink sheet is more than or equal to 0.2mm, so that the sufficient strength and heat dissipation requirements of the heat sink sheet are ensured, the depth of the etching groove is more than or equal to 0.1mm, and the indium layer on the surface of the heat sink is ensured not to climb to the light-emitting cavity surface of the laser in the alloying process.

Drawings

FIG. 1 is a schematic diagram of a heat sink mechanism;

Fig. 2 is a schematic view of a laser die and heat sink sheet assembly.

In the figure, 1 is a laser die, 2 is a heat sink, 3 is a light emitting region of the laser die, and 4 is a heat sink groove.

Detailed Description

In order to make the technical solutions in the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, but not all embodiments.

Referring TO fig. 1 and 2, a package structure for a TO package LD laser includes an internal stem, a cap, the tube seat is provided with a COS consisting of a heat sinking sheet 2 and a laser tube core 1, the COS is connected with the position of the tube tongue of the tube seat, the laser tube core 1 is arranged above the entity of the heat sink sheet 2, the P surface of the laser tube core 1 is connected with the upper surface of the heat sink sheet, the N surface of the tube core is connected with the pin of the tube seat, the tube cap is provided with an optical window, the middle position of the bottom of the side surface of the laser tube core 1 is provided with a light emitting area 3 of the laser tube core, the middle position of the upper part of the front side surface of the heat sink sheet 2 is provided with a heat sink slice notch 4 extending along one side of the upper surface of the heat sink sheet entity, the heat sink slice notch 4 corresponds to the upper and lower positions of the light emitting region 3 of the laser tube core, and a preset horizontal distance L1 is arranged between the cavity surface of the laser tube core 1 and the front side surface of the heat sink sheet.

The heat sink engraving groove 4 is an etching groove. The height H of the heat sink sheet is more than or equal to 0.2mm, and the depth of the etching groove is required to be more than or equal to 0.1 mm.

The heat sink notch 4 is a hexahedral notch with openings on the side surface and the upper end surface, the length L of the hexahedral notch is greater than the length of the light emitting region 3 of the laser die, the width W of the hexahedral notch is greater than a predetermined horizontal distance L1 between the cavity surface of the laser die 1 and the front side surface of the heat sink, the depth of the hexahedral notch, i.e., the depth of the etching groove, is H/2, wherein H is the height of the heat sink 2. Of course, other shapes of the open slots may be used provided that the assembly requirements are met.

The P surface of the laser tube core 1 is adhered to the upper surface of the heat sink, and the N surface of the tube core is connected with the pin of the tube seat through a gold wire.

The light window is a circular light window.

The laser tube core 1 and the heat sink sheet 2 are bonded by indium evaporation on the surface of the heat sink, and the tube core is pressed to the surface of the heat sink. And the bonding is finished at the set temperature for a preset time.

The utility model discloses a following processing preparation process obtains: preparing a heat sink, processing a heat sink sheet into a structure shown in figure 1 by using an etching process, and performing indium evaporation treatment, wherein the size of the heat sink sheet is larger than that of a chip, the size of an etching groove of the heat sink sheet requires that the width W of a hexahedral notch is larger than the preset horizontal distance L1 between the cavity surface of the laser tube core 1 and the front side surface of the heat sink sheet, the height H of the heat sink sheet is more than or equal to 0.2mm, and the width W of the etching groove is larger than the width of a light emitting area of the laser tube core; die bonding, namely, using a die bonder to attach the laser die to a preset position of a heat sink sheet according to a specified position size for alloying, and cutting the whole plate heat sink to finish the COS monomer manufacturing; and (4) installing the COS, dispensing on the surface of the tube tongue, loading the COS on the surface of the tube tongue, pushing the COS to the end face of the COS to be flush with the end face of the tube tongue by using a positioning tool, and carrying out photo-baking to finish the assembly and the fixation of the COS and the tube tongue.

The foregoing is merely exemplary and illustrative of the structure of the invention, and various modifications, additions and substitutions as described in the detailed description may be made by those skilled in the art without departing from the structure or exceeding the scope of the invention as defined in the claims.

Claims

1. a packaging structure for a TO packaged LD laser comprises an internal tube seat and a tube cap, wherein the tube seat is provided with a COS (chip operating system) consisting of a heat sink sheet and a laser tube core, the COS is connected with the position of a tube tongue of the tube seat, the laser tube core is arranged above the entity of the heat sink sheet, the P surface of the laser tube core is connected with the upper surface of the heat sink sheet, the N surface of the tube core is connected with pins of the tube seat, the tube cap is provided with an optical window, the middle position of the bottom of the side surface of the laser tube core is provided with a laser tube core light emitting area, the middle position of the upper part of the front side surface of the heat sink sheet is provided with a heat sink sheet notch extending TO one side of the upper surface of the heat sink sheet entity, the heat sink sheet notch corresponds TO the upper and lower positions of the laser tube core light emitting area, and a preset horizontal distance is arranged between.

2. The package structure for the TO package LD laser of claim 1, wherein the heat sink notch is an etching notch.

3. The package structure for the TO package LD laser as claimed in claim 2, wherein the height H of the heat sink plate is 0.2mm or more.

4. The package structure for the TO-packaged LD laser according TO claim 3, wherein the depth of the etching groove is not less than 0.1 mm.

5. The package structure for a TO package LD laser of claim 4, wherein the heat sink notch is a hexahedral notch open at a side surface and an upper end surface, the length of the hexahedral notch is greater than the length of the light emitting area of the laser die, the width of the hexahedral notch is greater than a predetermined horizontal distance provided between the cavity surface of the laser die and the front side surface of the heat sink, and the depth of the hexahedral notch is half the height of the heat sink.

6. The package structure for the TO package LD laser of claim 1, wherein the P-side of the laser die is bonded TO the top surface of the heat sink, and the N-side of the die is connected TO the lead of the stem by gold wires.

7. The package structure for a TO package LD laser of claim 1, wherein said optical window is a circular optical window.

8. The package structure for the TO package LD laser of claim 1, wherein the laser die and the heat sink sheet are bonded by evaporating indium on the surface of the heat sink.

9. The package structure for the TO package LD laser of claim 1, wherein the COS is pasted TO a tongue position of the stem by a silver paste.