CN210957266U - TO tube seat packaging structure - Google Patents
TO tube seat packaging structure Download PDFInfo
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- CN210957266U CN210957266U CN201922207289.5U CN201922207289U CN210957266U CN 210957266 U CN210957266 U CN 210957266U CN 201922207289 U CN201922207289 U CN 201922207289U CN 210957266 U CN210957266 U CN 210957266U
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- mounting
- lead
- heat sink
- seat
- tube
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Abstract
The utility model belongs TO the technical field of optical communication device design and manufacture, especially, relate TO a TO tube socket packaging structure. The TO tube seat packaging structure comprises a TO tube seat, wherein the TO tube seat comprises a mounting seat made of kovar alloy materials and a heat sink arranged on the mounting seat; the mounting base is provided with a plurality of lead holes, and leads are arranged in the lead holes respectively; still be provided with the mounting hole on the mount pad, the mount pad is worn to the mounting hole, and the heat sink inserts and brazes sealing connection through silver-copper from the mounting hole. The utility model discloses still relate TO a TO tube socket packaging structure manufacturing method, including following step: processing the mounting seat 1 and welding a lead 3; processing is step such as heat sink 2, the utility model discloses a TO tube socket structure, the thermal efficiency is high, and is longe-lived, and the electro-optic conversion is efficient, based on the utility model discloses a structure and manufacturing method have the positioning accuracy and guarantee easily, and characteristics such as installation effectiveness height realize simplifying the structure, reduce the production degree of difficulty and cost, improve the effect of producing the performance.
Description
Technical Field
The utility model belongs TO the technical field of optical communication device design and manufacture, especially, relate TO a TO tube socket packaging structure.
Background
The TO package contains two elements: a tube socket and a tube cap. The socket ensures the supply of the electrical signal to the package element, while the cap ensures the smooth transmission of the optical signal. The TO header (also known as a submount) provides a mechanical basis for mounting electronic and optical components such as semiconductors, laser diodes, or simple circuits, while providing electrical signals TO the packaged components through leads. In optoelectronic applications, TO sockets can be used in all conventional applications (also transmitter side (TOSA) and receiver side (ROSA) of transceivers), as well as in high-speed data transmission, infrared applications, etc. The laser chip and each lens and other structures installed inside the TO tube seat have extremely high precision requirements, but in the actual use process, the laser chip generates a large amount of heat, the original position precision cannot be maintained due TO different thermal expansion coefficients of materials of all parts in the TO tube seat, meanwhile, the sealing performance requirement inside the TO tube seat is high, the sealing treatment is generally carried out in a welding mode, but the heat generated in the welding process can also cause different thermal deformations of the materials, so that the materials are not matched during welding, the welding process requirement is very high, the problems cause that the existing TO tube seat product is difficult TO obtain good coordination among precision, service life and cost, and the technical level and the application range of the TO tube seat are limited.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is TO provide a simple structure, the lower TO tube socket packaging structure who nevertheless the radiating effect is good of manufacturing cost TO a manufacturing approach that is favorable TO improving TO tube manufacturing accuracy, improves the laser instrument performance is provided.
In order to realize the purpose, the utility model adopts the following technical scheme.
A TO tube seat packaging structure comprises a TO tube seat, wherein the TO tube seat comprises a mounting seat 1 made of kovar alloy materials and a heat sink 2 arranged on the mounting seat 1; the mounting seat 1 is provided with a plurality of lead holes 1a, and leads 3 are respectively arranged in the lead holes 1 a; the mounting seat 1 is further provided with a mounting hole 1c, the mounting hole 1c penetrates through the mounting seat 1, and the heat sink 2 is inserted into the mounting hole 1c and is in sealing connection through silver-copper brazing.
The further improvement and optimization of the TO tube seat packaging structure further comprises that the lead 3 is sealed in the lead hole 1a through glass welding; the lead is made of kovar alloy, and further comprises a glass seal 4 arranged between the lead 3 and the mounting seat 1, wherein the glass seal 4 is formed by inserting the lead 3 into the lead hole 1a and then sealing the lead by glass welding.
The further improvement and optimization of the TO tube seat packaging structure further comprises that the lower end face of the heat sink 2 and the mounting seat 1 are smooth planes and are arranged in a coplanar mode.
The TO tube seat packaging structure further improves and optimizes and also comprises that the mounting seat 1 comprises two smooth end surfaces positioned at the upper part and the lower part, and the lead hole 1a and the mounting hole 1c are dug out from the two end surfaces perpendicular TO each other and penetrate through the mounting seat 1;
the heat sink 2 is inserted from the upper end of the mounting hole 1c until the lower end face of the heat sink 2 is flush with the large end face of the lower end of the mounting seat 1; the lead 3 extends into the lower part of the lead hole 1a and extends out of the upper end face of the mounting seat 1 to form a wiring part 3a, the end face of the heat sink 2 facing the lead 3 is a mounting face, and a laser chip 9 or a laser module is arranged on the mounting face; the perpendicularity between the mounting surface and the upper end surface of the mounting seat 1 is within 0.01mm, and the flatness of the mounting surface is within 0.01 mm.
The TO tube seat packaging structure further comprises a TO tube cap 5 buckled on the upper end face of the TO tube seat; the TO pipe cap is made of kovar alloy or stainless steel; the heat sink 2 is made of tungsten copper material; the TO tube cap 5 is connected with the TO tube seat, the TO tube seat is connected with the lead 3, and the TO tube seat is connected with the heat sink 2 in an airtight mode.
The beneficial effects are that:
the utility model discloses a TO tube socket structure can conduct out the heat on the chip subassembly fast, and the radiating efficiency is high, improves laser chip output's stability, reduces output and should rise for operating temperature and lead TO the light power decay, the utility model discloses a TO tube socket structure lasts ageing 2000 hours, and output does not have the decay phenomenon TO effectively reduce the inside temperature of confined cavity, compare in traditional TO tube socket, electro-optical conversion efficiency promotes 10 ~ 15%. Based on the utility model discloses a structure, heat sink 2 leans on the mounting hole location with the encapsulation of mount pad, and positioning accuracy guarantees easily, and the installation effectiveness is higher, need not fix a position with extra frock clamp or coupling equipment, reduces the production degree of difficulty and cost, has avoided the product surface defect and the repetitive processing scheduling problem that use anchor clamps or equipment clamping in-process to arouse simultaneously, has realized simplifying the structure, when reducing the production degree of difficulty and cost, improves the effect of producing the product performance.
Drawings
FIG. 1 is a schematic structural view (partially cut away) of a TO header package structure;
FIG. 2 is a cut-away schematic view of a TO header package structure.
Detailed Description
The following detailed description of the present invention will be given with reference to specific examples.
The utility model relates TO a TO tube socket packaging structure, TO pipe are all kinds of laser's basic hardware, guarantee that the laser lasts steady operation, accomplish all kinds of photoelectric conversion's basis. Several types of materials commonly used in the laser industry include the ones in table 1 below;
TABLE 1 Properties of materials commonly used for lasers
In general, the TO stem is composed of a mounting seat for supporting the whole structure and connecting leads and other structures, and a heat sink 2 fixedly arranged on the mounting seat, wherein the mounting seat is used for mounting or connecting the leads, a sealing cover and other structures, and the heat sink 2 is used for mounting a laser chip 9; as can be seen from table 1, in order to improve the laser precision, the heat sink 2 is generally made of kovar alloy, copper and tungsten copper, but the kovar alloy has a poor thermal conductivity, is not suitable for directly mounting the laser chip 9, generally adopts copper or tungsten copper, has a better matching degree with the laser chip 9, has an excellent heat dissipation capability, and the mounting base is made of kovar alloy or ceramic material. Depending on the material properties and laser performance requirements, several types of products are available on the market, as shown in table 2:
TABLE 2 major structures, materials and their advantages and disadvantages of the existing products
Although the A-type products in the existing products have better processing precision, the material selection is difficult to consider both the heat conductivity and the thermal expansion coefficient to meet the design requirements of the products. For example, the thermal expansion coefficient of the lead can be well met if the mounting seat material is KOVAR, but the thermal dissipation requirement of the laser chip can not be well met. If the mounting seat material is selected from oxygen-free copper with excellent heat dissipation, the heat dissipation requirement can be well met, but the thermal expansion coefficient matching performance of the lead and the chip material cannot be well met. If the installation component selects the tungsten copper material which can better meet the requirements of heat dissipation and thermal expansion coefficient, the tungsten copper material has relatively high cost and high part processing cost, and the parallel seam welding (resistance welding) performance of the tungsten copper and the kovar material of the pipe cap is poor.
The B-type product mounting seat and the heat sink are separated and do not penetrate through for mounting, although the requirements on heat dissipation and thermal expansion coefficient matching can be better met, the processing cost is not high. Because the heat sink and the mounting seat have errors during mounting, and errors also exist during processing of two parts, the processing errors and the assembly errors of a single part are accumulated together, so that the precision of the whole tube seat is not high, the collimation precision of a light path is not high, and the subsequent coupling efficiency is reduced. The heat sink 2 is arranged in the sealed shell, the heat conduction efficiency between the aluminum nitride ceramic heat sink 2 and the kovar alloy mounting seat is low (the heat conductivity of the kovar alloy is low), so that heat is easily gathered in the shell with high sealing performance, the heat dissipation performance is poor, the working temperature of a device is increased, the electro-optic conversion efficiency of a chip is easily reduced, and the service life is shortened.
Therefore, the utility model provides an improved TO tube seat packaging structure, as shown in fig. 1, the TO tube seat comprises a mounting seat 1 made of kovar alloy material and a heat sink 2 arranged on the mounting seat 1; wherein, the mounting seat 1 is provided with a plurality of lead holes 1a, and each lead hole 1a is internally provided with a lead 3; the mounting seat 1 is further provided with a mounting hole 1c, the mounting hole 1c penetrates through the mounting seat 1, and the heat sink 2 is inserted into the mounting hole 1c and is in sealing connection through silver-copper brazing.
What is different with current product, the utility model discloses a heat sink 2 is not the welding in the up end A or the groove of mount pad, but run through the mount pad and parallel or stretch out with the mount pad lower extreme, based on this structure for heat sink 2 can be directly and external contact, and the heat on the laser instrument chip 9 can directly loss to the outside, avoids the heat to be difficult to conduct between heat sink 2 and the mount pad of different materials and the heat only loss to the casing inside, does not reach actual radiating effect's drawback. The actual effects can be found in table 3:
TABLE 3 present product and the cost and performance comparison of the present invention
In this embodiment, the lead 3 is sealed in the lead hole 1a by glass welding; the lead is made of kovar alloy, and further comprises a glass seal 4 arranged between the lead 3 and the mounting seat 1, wherein the glass seal 4 is formed by inserting the lead 3 into the lead hole 1a and then sealing the lead by glass welding.
Based on aforementioned structure, kovar alloy's mount pad and lead wire and glass solder have good matching nature, make to have fabulous leakproofness after the welding is accomplished, simultaneously compare in product A and descend by a wide margin welding process's requirement, manufacturing cost and material cost have effectively been reduced, the lower extreme is direct can conduct heat fast with outside gas or cooling medium or structural connection's heat sink 2, guarantee that laser instrument chip 9 is in suitable operating temperature all the time, high photoelectric conversion efficiency has all the time, and can install more powerful laser instrument, and then realized greatly improving the performance of laser instrument and application scope's purpose under the prerequisite of limited cost.
The utility model discloses a TO tube socket structure can conduct out the heat on the chip subassembly fast, and the radiating efficiency is high, effectively reduces the inside temperature of confined cavity, compares in traditional TO tube socket, and inside average temperature reduces 4 ~ 6 ℃, has promoted the stability of performance of device. Based on the utility model discloses a structure and manufacturing method, heat sink 2 leans on the mounting hole location with the encapsulation of mount pad, and positioning accuracy guarantees easily, and the installation effectiveness is higher, need not fix a position with extra frock clamp or coupling equipment, reduces the production degree of difficulty and cost, has avoided using product surface defect and the repeated processing scheduling problem that anchor clamps or equipment clamping in-process arouse simultaneously, has realized simplifying the structure, has reduced the production degree of difficulty and cost the time, improves the effect of producing the performance.
In this embodiment, the lower end surface of the heat sink 2 and the mounting base 1 are smooth planes and arranged in a coplanar manner. The mounting seat 1 comprises two smooth end surfaces positioned at the upper part and the lower part, and the lead hole 1a and the mounting hole 1c are vertically dug out of the two end surfaces and penetrate through the mounting seat 1;
the heat sink 2 is inserted from the upper end of the mounting hole 1c until the lower end face of the heat sink 2 is flush with the large end face of the lower end of the mounting seat 1; the lead 3 extends into the lower part of the lead hole 1a and extends out of the upper end face of the mounting seat 1 to form a wiring part 3a, the end face of the heat sink 2 facing the lead 3 is a mounting face, and a laser chip 9 or a laser module is arranged on the mounting face; the perpendicularity between the mounting surface and the upper end surface of the mounting seat 1 is more than 0.01mm, and the flatness of the mounting surface is more than 0.01 mm.
In practical use, the device further comprises a TO pipe cap 5 buckled on the upper end face of the TO pipe seat, the TO pipe cap is made of kovar alloy or stainless steel, the heat sink 2 is made of tungsten copper material, the TO pipe cap 5 and the TO pipe seat, the TO pipe seat and the lead 3, and the TO pipe seat and the heat sink 2 are hermetically connected, the airtightness is less than 1 × 10-9Pa × m3/s, and in the specific implementation process, in the step ④, the flatness is guaranteed TO be 0.01mm, the verticality is 0.01mm, and the size precision is 0.015 mm.
Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the protection scope of the present invention, and although the present invention is described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the technical solutions of the present invention can be modified or replaced with equivalents without departing from the spirit and scope of the technical solutions of the present invention.
Claims (5)
1. A TO tube seat packaging structure comprises a TO tube seat and is characterized in that the TO tube seat comprises a mounting seat (1) made of kovar alloy and a heat sink (2) arranged on the mounting seat (1);
the mounting seat (1) is provided with a plurality of lead holes (1a), and leads (3) are respectively arranged in the lead holes (1 a);
still be provided with mounting hole (1c) on mount pad (1), mount pad (1) is worn in mounting hole (1c), heat sink (2) insert and through silver-copper brazing sealing connection from mounting hole (1 c).
2. The TO header package structure of claim 1, wherein the lead (3) is sealed in the lead hole (1a) by a glass solder; the lead is made of kovar alloy, and further comprises a glass sealing element (4) arranged between the lead (3) and the mounting seat (1), wherein the glass sealing element (4) is formed by inserting the lead (3) into the lead hole (1a) and then sealing the lead through glass welding.
3. The TO header package of claim 1, wherein the lower end of the heat sink (2) is smooth planar and coplanar with the mounting base (1).
4. The TO header package structure of claim 1, wherein the upper and lower end faces of the mounting base (1) are smooth planes, and the lead holes (1a) and the mounting holes (1c) are hollowed out perpendicularly TO the two upper and lower end faces and penetrate through the mounting base (1);
the heat sink (2) is arranged in the mounting hole (1c), and the heat sink (2) and the lower end surface of the mounting seat (1) are arranged; the lead (3) extends into the lead hole (1a) from the lower part of the lead hole and extends out of the upper end face of the mounting seat (1) to form a wiring part (3a), the end face of the heat sink (2) facing the lead (3) is a mounting face, and a laser chip or a laser module is arranged on the mounting face; the perpendicularity between the mounting surface and the upper end surface of the mounting seat (1) is within 0.01mm, and the flatness of the mounting surface is within 0.01 mm.
5. The TO header package structure of claim 1, further comprising a TO header cap (5) fastened TO an upper end surface of the TO header; the TO pipe cap is made of kovar alloy or stainless steel; the heat sink (2) is made of tungsten-copper material; the TO tube cap (5) is connected with the TO tube seat, the TO tube seat is connected with the lead (3), and the TO tube seat is connected with the heat sink (2) in an airtight mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922207289.5U CN210957266U (en) | 2019-12-10 | 2019-12-10 | TO tube seat packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922207289.5U CN210957266U (en) | 2019-12-10 | 2019-12-10 | TO tube seat packaging structure |
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| Publication Number | Publication Date |
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| CN210957266U true CN210957266U (en) | 2020-07-07 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201922207289.5U Active CN210957266U (en) | 2019-12-10 | 2019-12-10 | TO tube seat packaging structure |
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| CN (1) | CN210957266U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110854669A (en) * | 2019-12-10 | 2020-02-28 | 武汉优信技术股份有限公司 | TO tube seat packaging structure and manufacturing method thereof |
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- 2019-12-10 CN CN201922207289.5U patent/CN210957266U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110854669A (en) * | 2019-12-10 | 2020-02-28 | 武汉优信技术股份有限公司 | TO tube seat packaging structure and manufacturing method thereof |
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