CN110764203A - Laser fixing and packaging structure for optical device and manufacturing method thereof - Google Patents
Laser fixing and packaging structure for optical device and manufacturing method thereof Download PDFInfo
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- CN110764203A CN110764203A CN201911258222.2A CN201911258222A CN110764203A CN 110764203 A CN110764203 A CN 110764203A CN 201911258222 A CN201911258222 A CN 201911258222A CN 110764203 A CN110764203 A CN 110764203A
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 40
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 36
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- 239000000758 substrate Substances 0.000 claims abstract description 58
- 238000003466 welding Methods 0.000 claims abstract description 25
- 238000012545 processing Methods 0.000 claims abstract description 19
- 238000009434 installation Methods 0.000 claims abstract description 9
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 9
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- 229910052759 nickel Inorganic materials 0.000 claims description 6
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- 229910000679 solder Inorganic materials 0.000 claims description 5
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 claims description 4
- 230000007547 defect Effects 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
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- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 24
- 238000007789 sealing Methods 0.000 abstract description 6
- 238000004891 communication Methods 0.000 abstract description 4
- 230000010354 integration Effects 0.000 abstract description 2
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4251—Sealed packages
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4237—Welding
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/424—Mounting of the optical light guide
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4244—Mounting of the optical elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4245—Mounting of the opto-electronic elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4272—Cooling with mounting substrates of high thermal conductivity
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The invention belongs to the technical field of manufacturing of optical communication modules, and particularly relates to a laser fixing and packaging structure for an optical device and a manufacturing method thereof. The heat dissipation device comprises an airtight shell, wherein the airtight shell is provided with an installation fixing hole penetrating through the bottom of the shell, and a heat dissipation substrate is embedded in the installation fixing hole; the edge of the heat dissipation substrate is hermetically connected with the hermetic sealing shell through welding, and the laser chip assembly is arranged in the hermetic sealing shell; the laser chip assembly is attached to the upper surface of the heat dissipation substrate. The invention also provides a manufacturing method of the laser fixing and packaging structure for the optical device. The invention improves the laser fixing and packaging structure for the optical device, is used for fixing and packaging in the airtight shell structure and the manufacturing method thereof, effectively controls the material and processing cost while ensuring the high-speed heat dissipation of the laser heat source, and realizes the double-effect integration of improving the fixing and packaging performance of the laser and reducing the production and manufacturing cost.
Description
Technical Field
The invention belongs to the technical field of manufacturing of optical communication modules, and particularly relates to a laser fixing and packaging structure for an optical device and a manufacturing method thereof.
Background
The optical module is widely applied to the field of optical communication, and the TOSA and ROSA optical devices are core components in the optical module. A circuit board PCBA in the optical device supplies power to a laser (the circuit board is connected with the laser through a gold wire), the laser emits light, and the light is collimated and coupled into an optical fiber through a lens. Therefore, the position precision among the laser, the lens and the optical fiber assembly directly determines the quality of optical transmission, the heat dissipation of the optical device also directly influences the working performance of the laser, and the quality of the heat dissipation efficiency also influences the position precision related to the optical path through thermal deformation. The prior art structure adopts a kovar alloy integral airtight shell 1 to fix and package a PCBA, a laser, a lens and an optical fiber assembly to finish the fixed alignment of an optical path, the heat dissipation requirement of a laser mounting area in an optical device is very high, the heat dissipation efficiency of the mounting area directly determines the performance of an optical module, and the consideration of comprehensive cost, materials and processing difficulty, the existing optical device packaging shell on the market is mainly divided into two types, namely a tungsten copper material airtight shell product with high heat dissipation and high matching performance of thermal expansion CTE and chip materials, tungsten copper is a material with good heat conductivity and good matching degree of CTE and laser chip CTE, but the price of the tungsten copper material is much higher than that of the kovar alloy, the market price of the tungsten copper is about 1200RMB/KG, the kovar alloy is about 200RMB/KG, meanwhile, the hardness of the tungsten copper material is very high, the machining cost is high, and the laser welding performance of the tungsten copper is poorer than that of the kovar alloy, moreover, the optical module package airtight housing 1 is generally characterized by a deep cavity, and the machining amount and the material consumption are large, so that the material and the machining cost of the product are very high, and the wide popularization is difficult. The other is a kovar alloy airtight shell product, and the kovar alloy material is characterized in that the matching degree of CTE and a laser chip is good, the laser welding performance of the material and an optical fiber assembly is good, but the thermal conductivity is poor, so that the heat dissipation performance of the product is poor, the laser and the airtight shell 1 are difficult to dissipate heat quickly, and the photoelectric conversion efficiency stability of the laser is low.
Disclosure of Invention
The invention aims to provide a laser fixing and packaging structure for an optical device, which has higher thermal expansion coefficient matching degree, high heat dissipation efficiency and low cost, and a manufacturing method of the laser fixing and packaging structure for the optical device.
A laser fixing and packaging structure for an optical device comprises an airtight shell 1, wherein the airtight shell 1 is provided with a mounting and fixing hole 1a penetrating through the bottom of the shell, and a heat dissipation substrate 3 is embedded in the mounting and fixing hole 1 a; the edge of the heat dissipation substrate 3 is hermetically connected with the airtight shell 1 through welding, and the laser chip assembly 2 is arranged in the airtight shell 1; the laser chip assembly 2 is attached to the upper surface of the heat dissipating substrate 3.
Through setting up through-type installation fixed orifices 1a and radiating basal plate 3, can be so that the heat that laser chip subassembly 2 produced directly conducts to the sealed casing outside through radiating basal plate 3, reduce the heat and detain in airtight casing inside, improve laser chip's radiating efficiency by a wide margin, reduce laser chip's operating temperature, promote optical device's performance. The heat dissipation substrate 3 has small specification size within 5mmX5mmX0.5mm, simple structure, low manufacturing cost and little influence on the manufacturing cost of the whole airtight shell.
The further improvement of the laser fixing and packaging structure for the optical device further comprises that a heat dissipation groove 1e which is opposite to and communicated with the installation fixing hole 1a is arranged at the bottom of the airtight shell 1, the edge of the heat dissipation substrate 3 is adapted to the heat dissipation groove 1e, a silver-copper solder prefabricated sheet 9 which is adapted to the shape of the groove bottom is arranged in the groove bottom of the heat dissipation groove 1e, and the heat dissipation substrate 3 is embedded and welded in the heat dissipation groove 1 e; the upper surface of the heat dissipation substrate 3 is provided with a mounting groove 3a, and the size and the shape of the mounting groove 3a are matched with the lower end of the laser chip component 2; the laser chip assembly 2 is welded in the mounting groove 3a after passing through the mounting fixing hole 1 a.
The further improvement of the laser fixing and packaging structure for the optical device further comprises a first optical lens 4 and a second optical lens which are arranged in the airtight shell 1; and a circuit board 5 embedded on the airtight housing 1; the airtight shell 1 is provided with a mounting opening 1c, and the circuit board 5 is inserted from the mounting opening 1c and then fixed; the airtight shell 1 is also provided with an optical fiber hole 1d, and the second optical lens covers the optical fiber hole 1 d; the first optical lens 4 is arranged between the laser chip assembly 2 and the second optical lens; an optical fiber is arranged at the optical fiber hole 1 d; the laser chip assembly 2, the first optical lens 4 and the second optical lens are arranged in a collinear manner, so that laser light is directly incident into the optical fiber hole 1d along the first optical lens 4 and the second optical lens.
The further improvement of the laser fixing and packaging structure for the optical device further comprises a first optical lens 4 and a second optical lens which are arranged in the airtight shell 1; and a circuit board 5 embedded on the airtight housing 1; the airtight shell 1 is provided with a mounting opening 1c, and the circuit board 5 is inserted from the mounting opening 1c and then fixed; the airtight shell 1 is also provided with an optical fiber hole 1d, and the second optical lens covers the optical fiber hole 1 d; the first optical lens 4 is arranged between the laser chip assembly 2 and the second optical lens; an optical fiber is arranged at the optical fiber hole 1 d; the laser chip assembly further comprises a light path control device arranged between the laser chip assembly 2 and the first optical lens 4 and/or between the first optical lens 4 and the second optical lens;
the further improvement of the laser fixing and packaging structure for the optical device further comprises that the heat dissipation substrate 3 is made of tungsten copper; the first optical lens 4 is a coupling lens, and the second optical lens is a collimating lens; the light path control means refers to a mirror or a refractor.
The invention also provides a manufacturing method of the laser fixing and packaging structure for the optical device, which comprises the following steps:
s1, processing the airtight shell 1, wherein the allowance of the installation surface of the first optical lens 4 is 0.1-0.2 mm, and the allowance of the optical fiber hole 1d is 0.1-0.2 mm;
s2, processing the heat dissipation substrate 3, and reserving a margin of 0.1-0.2 mm on the upper surface;
s3, pre-plating nickel on the surface of the heat dissipation substrate 3 by 0.5-2 mu m;
in the foregoing steps S1 and S2, the portion of the laser chip assembly inserted into the mounting hole 1a is processed to the fitting dimension, and the processing requirement is reduced because the processing margin is retained;
s4, welding the airtight shell 1 and the heat dissipation substrate 3;
s5, finishing the upper surface of the heat dissipation substrate 3, the mounting surface of the first optical lens 4 and the mounting fixing hole 1a, removing welding slag and processing defects, and ensuring the parallelism and dimensional accuracy of the upper surface of the heat dissipation substrate 3 and the mounting surface of the first optical lens 4;
s6, carrying out nickel plating and gold plating treatment on the surface of the airtight shell assembly;
according to the method, the flowing solder can be subjected to CNC machining after the airtight shell 1 and the radiating substrate 3 are brazed, the mounting area of the chip on the surface A does not have excessive structures such as welding slag, the risk of uneven mounting caused by the solder is eliminated, the problems of high-temperature baking deformation caused by brazing and size precision ultra-difference caused by fixture fixing errors are solved, and the final product can be ensured to completely meet the drawing size requirement through subsequent CNC fine trimming. The reliability of the product is ensured, and the manufacturing method can ensure the quality stably in batches.
The further refinement of the manufacturing method of the laser fixing and packaging structure for the optical device further comprises that the parallelism between the upper surface of the heat dissipation substrate 3 and the mounting surface of the first optical lens 4 is 0.015mm, and the dimensional accuracy is +/-0.01 mm. Because when the upper surface (laser chip assembly mounting surface) of the radiating substrate 3 is finely repaired, the tungsten copper material and a small part of Kovar (Kovar) material at the periphery can be simultaneously processed by the cutter, the sealing strength of the welded tungsten copper material and Kovar material can resist the cutting force of the cutter during the fine repair, the tungsten copper block cannot be loosened or fall off, and through tests, the requirement can be better met by the thickness of a soldering lug being 0.02-0.05 mm and the allowance being 0.1-0.2 mm reserved on the upper surface of the radiating substrate 3.
The beneficial effects are that:
the invention improves the structure of the laser fixing and packaging structure (TOSA, ROSA) for the optical device for fixing and packaging the optical device in the airtight shell and the manufacturing method thereof, thereby ensuring the high-efficiency heat dissipation of the laser heat source, effectively controlling the material and processing cost, realizing the double-effect integration of improving the fixing and packaging performance of the laser and reducing the production and manufacturing cost. According to the invention, a tungsten copper material with thermal conductivity and CTE (coefficient of thermal expansion) well meeting requirements is used in a heat source area, and a through type structure design is adopted, compared with an integrated Kovar shell, only one heat dissipation substrate 3 with a sheet structure is added, instead of a deep cavity structure, so that the consumed material is little, the processing cost is increased little, but the heat dissipation performance of the original structure is effectively improved, the coordination of low cost and high precision and high performance is realized.
Drawings
FIG. 1 is an assembly view showing the internal structure of a laser mount package for an optical device according to the present invention;
(the top cover of the housing has been removed to facilitate display of the internal structure);
fig. 2 is a bottom view of the airtight housing 1 of the laser fixing and packaging structure for an optical device of the present invention.
Detailed Description
The invention is described in detail below with reference to specific embodiments.
The invention relates to a laser fixing and packaging structure for an optical device, which comprises a TOSA (transmitter optical System architecture), a ROSA (receiver optical System) and the like, wherein the laser fixing and packaging structure for the optical device is one of core hardware in industries such as optical fiber communication and the like, is mainly used for protecting the optical device and ensuring that laser is continuously and effectively coupled into structures such as an optical fiber and the like in an alignment way; the main materials and properties of the conventional laser fixing and packaging structure for the optical device are shown in table 1:
TABLE 1 Properties of materials commonly used for laser fixing and packaging structure for optical device
One conventional design of the hermetic enclosure of the optical device is made of a kovar alloy material, but as shown in table 1, the kovar alloy has poor thermal conductivity, and heat near the chip assembly is difficult to be efficiently conducted away, and meanwhile, the laser chip assembly 2 is located inside the hermetic enclosure 1, so that heat is accumulated inside the hermetic enclosure and difficult to be conducted away, and thus, although the cost is low, the heat dissipation performance of the product is poor, and the product is difficult to be applied to a product with high power heat dissipation requirement. The other conventional design adopts tungsten copper material to make the packaging shell, and the heat dissipation performance and the matching performance of the chip component mounting thermal expansion coefficient are good, but the manufacturing cost is high, and the batch practicability is not strong.
According to the invention, a traditional structural design scheme is changed, the through structure is arranged in the mounting area of the laser chip assembly 2, and the heat dissipation substrate 3 is welded in the through structure, so that the production cost of batch manufacturing can be effectively controlled and raised compared with the airtight shell 1 made of a full-structure pure tungsten-copper material, and compared with a sealing structure made of a full-structure kovar alloy material, the heat dissipation performance of a device can be greatly improved, and the photoelectric conversion efficiency and stability of the laser chip are improved.
The description is given with reference to the specific embodiments:
example one
As shown in fig. 1, the present invention provides an improved laser fixing and packaging structure for an optical device, which is characterized in that the structure comprises an airtight housing 1, wherein the airtight housing 1 is provided with a mounting and fixing hole 1a penetrating through the bottom of the housing, and a heat dissipation substrate 3 is embedded in the mounting and fixing hole 1 a; the edge of the radiating substrate 3 is hermetically connected with the airtight shell 1 by welding, and the radiating substrate 3 is made of tungsten copper; the laser chip component 2 is arranged in the airtight shell 1; the laser chip assembly 2 is attached to the upper surface of the heat dissipation substrate 3; the edge of the heat dissipation substrate 3 is hermetically connected with the edge of the mounting fixing hole 1a through welding to ensure the sealing performance of the airtight shell 1;
in the specific implementation, the airtight housing 1 is integrally sealed at a later stage for convenience of processing, and a box-shaped housing part is processed in a production line, and finally a sealing cover is fixed on the housing part (for convenience of showing an internal structure, only the housing part is included in fig. 1).
In the traditional structure, most of heat needs to be conducted out through the airtight shell 1, the heat emitted by a laser stays in the airtight shell 1 for a long time and cannot be effectively cooled, the heat dissipation substrate 3 is arranged, the laser chip is arranged on the heat dissipation substrate 3 in a welding mode instead of being directly welded at the bottom of the airtight shell 1, the laser chip assembly can directly conduct most of heat to the heat dissipation substrate 3 through the change, rapid heat dissipation is achieved through the heat dissipation substrate 3 which is directly in direct contact with cooling media such as external gas or structures, most of heat can be rapidly and directly conducted to the outside of the airtight shell 1, the heat cannot be retained in the airtight shell 1 for a long time, and therefore heat dissipation efficiency is greatly improved. Through tests, the product obtained by adopting the structure and the manufacturing method of the invention has obviously improved various performances in the working process of the laser, and the actual situation is shown in table 3:
TABLE 3 comparison of cost and Performance of the existing products with the present invention
Example two
As shown in fig. 2, further, in order to improve the positioning accuracy of the optical device laser fixing and packaging structure, reduce the processing difficulty, and improve the heat dissipation performance, in this embodiment, the bottom of the airtight housing 1 is provided with a heat dissipation groove 1e facing and communicating with the mounting fixing hole 1a, the edge of the heat dissipation substrate 3 is adapted to the heat dissipation groove 1e, a silver-copper solder preform 9 adapted to the shape of the groove bottom is provided in the groove bottom of the heat dissipation groove 1e, and the heat dissipation substrate 3 is embedded and welded in the heat dissipation groove 1 e; the upper surface of the heat dissipation substrate 3 is provided with a mounting groove 3a, and the size and the shape of the mounting groove 3a are matched with the lower end of the laser chip component 2; the laser chip assembly 2 is welded in the mounting groove 3a after passing through the mounting fixing hole 1 a.
In the specific implementation process, the laser fixing and packaging structure for the optical device further comprises a first optical lens 4 and a second optical lens which are arranged inside the airtight shell 1; and a circuit board 5 embedded on the airtight housing 1; the airtight shell 1 is provided with a mounting opening 1c, and the circuit board 5 is inserted from the mounting opening 1c and then fixed; the airtight shell 1 is also provided with an optical fiber hole 1d, and the second optical lens covers the optical fiber hole 1 d; the first optical lens 4 is arranged between the laser chip assembly 2 and the second optical lens; an optical fiber is arranged at the optical fiber hole 1 d; the laser chip assembly 2, the first optical lens 4 and the second optical lens are arranged in a collinear manner, so that laser light is directly incident into the optical fiber hole 1d along the first optical lens 4 and the second optical lens.
In a preferred embodiment, the heat dissipation substrate 3 is a tungsten copper substrate to achieve high heat dissipation performance; the first optical lens 4 is a coupling lens and the second optical lens is a collimating lens.
EXAMPLE III
To meet more functional requirements and structural solutions; in the embodiment, the laser chip assembly further comprises a light path control device arranged between the laser chip assembly 2 and the first optical lens 4 and/or between the first optical lens 4 and the second optical lens; the optical path control device refers to a reflecting mirror or a refracting mirror, and can freely control an optical propagation path, a shunt path and the like so as to meet diversified requirements.
Example four
In order to reduce the difficulty of production and manufacture and improve the product precision so as to ensure the performance of the laser fixing and packaging structure for the optical device, the invention also provides a method for manufacturing the laser fixing and packaging structure for the optical device, which comprises the following steps:
s1, processing the airtight shell 1, wherein the allowance of the installation surface of the first optical lens 4 is 0.1-0.2 mm, and the allowance of the optical fiber hole 1d is 0.1-0.2 mm;
s2, processing the heat dissipation substrate 3, and reserving a margin of 0.1-0.2 mm on the upper surface;
s3, pre-plating nickel on the surface of the heat dissipation substrate 3 by 0.5-2 mu m;
in the foregoing steps S1 and S2, the portion of the laser chip assembly inserted into the mounting hole 1a is processed to the fitting dimension, and the processing requirement is reduced because the processing margin is retained;
s4, welding the airtight shell 1 and the heat dissipation substrate 3;
s5, finishing the upper surface of the heat dissipation substrate 3, the mounting surface of the first optical lens 4 and the mounting fixing hole 1a, removing welding slag and processing defects, and ensuring the parallelism and dimensional accuracy of the upper surface of the heat dissipation substrate 3 and the mounting surface of the first optical lens 4;
s6, carrying out nickel plating and gold plating treatment on the surface of the airtight shell assembly;
in the traditional process, a common manufacturer firstly manufactures two independent parts and finally braze welds the two parts in a gas-tight manner to form a finished product. Thus, it is difficult to achieve a sufficiently high accuracy. The reason is that assembly positioning error during welding and deformation caused by high-temperature baking at 800 ℃ of silver-copper brazing exist, and welding flux is easy to exist on the upper surface of the radiating substrate 3 after welding, so that the yield of finished products is difficult to reach more than 90%, and the manufacturing cost is higher due to quality problems.
In the invention, by reserving enough allowance, the precision requirement on auxiliary equipment such as a clamp or a positioning die is greatly reduced; in the embodiment, the welding process is AgCu28 brazing, the welding temperature is 800-820 ℃, the heat preservation is carried out for 3 minutes, and the air tightness is less than 1 x 10 < -9 > Pa.m 3/s; in order to ensure the performance of the device, the parallelism of the upper surface of the heat dissipation substrate 3 and the mounting surface of the first optical lens 4 is 0.015mm, the size precision is +/-0.01 mm, and the thickness of a soldering lug during welding is 0.02-0.05 mm.
In the manufacturing method of the invention, the airtight shell 1 is provided with the mounting and fixing hole 1a, and the mounting and fixing hole 1a is used as a positioning reference between the heat dissipation substrate 3 and the laser chip assembly 2 and the airtight shell 1 in the manufacturing process, so that on one hand, an additional positioning clamp and the like in the original manufacturing method are omitted, and on the other hand, the effects of firstly performing rough positioning welding and then performing finish machining to the mounting size can be realized by reserving allowance according to the size and the position between the mounting and fixing hole 1a and the airtight shell 1 and the laser chip assembly 2 in the manufacturing process. The other important purpose of reserving allowance on the mounting surface is to completely remove surface welding slag and processing defects at one time by eliminating the allowance until the size is reached after later welding is finished; in the traditional process, welding slag is remained on the mounting surface after the end face is machined, the performance and the appearance of the laser are affected, the laser is very difficult to clean, an additional treatment flow is needed, and the production cost is increased.
It is to be noted that, in the foregoing embodiment, the heat dissipation substrate 3 is made of a material having a good thermal conductivity and a high matching degree of thermal expansion coefficient, which is generally tungsten copper or aluminum nitride in the prior art, and other materials may be used according to the development of material technology.
Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the protection scope of the present invention, although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.
Claims (8)
1. A laser fixing and packaging structure for an optical device is characterized by comprising an airtight shell (1), wherein an installation fixing hole (1a) penetrating through the bottom of the shell is formed in the airtight shell (1), and a heat dissipation substrate (3) is embedded in the installation fixing hole (1 a); the edge of the heat dissipation substrate (3) is hermetically connected with the airtight shell (1) through welding, and the laser chip assembly (2) is arranged in the airtight shell (1); the laser chip assembly (2) is attached to the upper surface of the heat dissipation substrate (3).
2. The optical device laser fixing and packaging structure according to claim 1, wherein the bottom of the hermetic case (1) is provided with a heat sink (1e) opposite to and communicating with the mounting hole (1a), the edge of the heat sink substrate (3) is adapted to the heat sink (1e), a silver-copper solder preform (9) having a shape adapted to the bottom of the heat sink (1e) is provided in the bottom of the heat sink (1e), and the heat sink substrate (3) is embedded and soldered in the heat sink (1 e); the upper surface of the heat dissipation substrate (3) is provided with a mounting groove (3a), and the size and the shape of the mounting groove (3a) are matched with the lower end of the laser chip component (2); the laser chip component (2) penetrates through the mounting fixing hole (1a) and then is welded in the mounting groove (3 a).
3. The optical device laser fixing and packaging structure according to claim 1, further comprising a first optical lens (4), a second optical lens disposed inside the hermetic case (1); and a circuit board (5) embedded in the airtight housing (1); the airtight shell (1) is provided with a mounting opening (1c), and the circuit board (5) is inserted from the mounting opening (1c) and then fixed; the airtight shell (1) is also provided with an optical fiber hole (1d), and the second optical lens covers the optical fiber hole (1 d); the first optical lens (4) is arranged between the laser chip assembly (2) and the second optical lens; an optical fiber is arranged at the optical fiber hole (1 d);
the laser chip component (2), the first optical lens (4) and the second optical lens are arranged in a collinear manner, so that light emitted by the laser chip component enters the optical fiber hole (1d) directly along the first optical lens (4) and the second optical lens.
4. The optical device laser fixing and packaging structure according to claim 1, further comprising a first optical lens (4), a second optical lens disposed inside the hermetic case (1); and a circuit board (5) embedded in the airtight housing (1); the airtight shell (1) is provided with a mounting opening (1c), and the circuit board (5) is inserted from the mounting opening (1c) and then fixed; the airtight shell (1) is also provided with an optical fiber hole (1d), and the second optical lens covers the optical fiber hole (1 d); the first optical lens (4) is arranged between the laser chip assembly (2) and the second optical lens; an optical fiber is arranged at the optical fiber hole (1 d);
the laser chip assembly further comprises a light path control device arranged between the laser chip assembly (2) and the first optical lens (4) and/or between the first optical lens (4) and the second optical lens.
5. The optical device laser fixing and packaging structure according to claim 3 or 4, wherein the heat-dissipating substrate (3) is made of tungsten copper, the first optical lens (4) is a coupling lens, and the second optical lens is a collimating lens; the light path control device refers to a reflecting mirror or a refracting mirror.
6. A method for manufacturing a laser fixing and packaging structure for an optical device is characterized by comprising the following steps:
s1, processing the airtight shell, wherein the allowance of the installation surface of the first optical lens is 0.1-0.2 mm, and the allowance of the optical fiber hole is 0.1-0.2 mm;
s2, processing the heat dissipation substrate, and reserving a margin of 0.1-0.2 mm on the upper surface;
s3, pre-plating nickel on the surface of the heat dissipation substrate by 0.5-2 mu m;
s4, welding the airtight shell and the heat dissipation substrate;
s5, fine machining the upper surface of the heat dissipation substrate, the mounting surface of the first optical lens and the mounting fixing hole, removing welding slag and machining defects, and ensuring the parallelism and dimensional accuracy of the upper surface of the heat dissipation substrate and the mounting surface of the first optical lens;
and S6, plating nickel and gold on the surface of the airtight shell.
7. The method of manufacturing a laser fixing and packaging structure for an optical device according to claim 6, wherein the parallelism between the upper surface of the heat dissipating substrate (3) and the mounting surface of the first optical lens (4) is 0.015mm, and the dimensional accuracy is ± 0.01 mm.
8. The method for manufacturing a laser fixing and packaging structure for an optical device according to claim 6, wherein the thickness of the bonding pad during bonding is 0.02 to 0.05 mm.
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| CN201911258222.2A CN110764203A (en) | 2019-12-10 | 2019-12-10 | Laser fixing and packaging structure for optical device and manufacturing method thereof |
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| CN201911258222.2A CN110764203A (en) | 2019-12-10 | 2019-12-10 | Laser fixing and packaging structure for optical device and manufacturing method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113552675A (en) * | 2020-04-24 | 2021-10-26 | 富士通光器件株式会社 | Optical module |
| CN113671638A (en) * | 2021-07-12 | 2021-11-19 | 武汉英飞光创科技有限公司 | Optical module |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002329920A (en) * | 2001-04-27 | 2002-11-15 | Kyocera Corp | Optical module |
| US20090251697A1 (en) * | 2007-12-17 | 2009-10-08 | Serge Cutillas | Laser emitter modules and methods of assembly |
| CN102570293A (en) * | 2012-02-13 | 2012-07-11 | 苏州华必大激光有限公司 | High thermal load large power semiconductor laser |
| CN106019496A (en) * | 2016-05-31 | 2016-10-12 | 武汉光迅科技股份有限公司 | Light source packaging structure, and positioning and coupling method thereof |
| CN109038208A (en) * | 2018-08-14 | 2018-12-18 | 苏州冠德能源科技有限公司 | The encapsulating structure of quantum cascade laser |
| CN210924043U (en) * | 2019-12-10 | 2020-07-03 | 武汉优信技术股份有限公司 | Laser fixing and packaging structure for optical device |
-
2019
- 2019-12-10 CN CN201911258222.2A patent/CN110764203A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002329920A (en) * | 2001-04-27 | 2002-11-15 | Kyocera Corp | Optical module |
| US20090251697A1 (en) * | 2007-12-17 | 2009-10-08 | Serge Cutillas | Laser emitter modules and methods of assembly |
| CN102570293A (en) * | 2012-02-13 | 2012-07-11 | 苏州华必大激光有限公司 | High thermal load large power semiconductor laser |
| CN106019496A (en) * | 2016-05-31 | 2016-10-12 | 武汉光迅科技股份有限公司 | Light source packaging structure, and positioning and coupling method thereof |
| CN109038208A (en) * | 2018-08-14 | 2018-12-18 | 苏州冠德能源科技有限公司 | The encapsulating structure of quantum cascade laser |
| CN210924043U (en) * | 2019-12-10 | 2020-07-03 | 武汉优信技术股份有限公司 | Laser fixing and packaging structure for optical device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113552675A (en) * | 2020-04-24 | 2021-10-26 | 富士通光器件株式会社 | Optical module |
| CN113552675B (en) * | 2020-04-24 | 2023-11-03 | 富士通光器件株式会社 | Optical module |
| CN113671638A (en) * | 2021-07-12 | 2021-11-19 | 武汉英飞光创科技有限公司 | Optical module |
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Application publication date: 20200207 |