CN111854291A - Efficient active heat exchange spectrum beam combination grating integrated module and preparation method thereof - Google Patents

Efficient active heat exchange spectrum beam combination grating integrated module and preparation method thereof Download PDF

Info

Publication number
CN111854291A
CN111854291A CN202010704210.4A CN202010704210A CN111854291A CN 111854291 A CN111854291 A CN 111854291A CN 202010704210 A CN202010704210 A CN 202010704210A CN 111854291 A CN111854291 A CN 111854291A
Authority
CN
China
Prior art keywords
layer
grating
cooling
welding
eutectic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010704210.4A
Other languages
Chinese (zh)
Inventor
晋云霞
刘畅洋
邵建达
曹红超
孔钒宇
张益彬
王勇禄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Institute of Optics and Fine Mechanics of CAS
Original Assignee
Shanghai Institute of Optics and Fine Mechanics of CAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Institute of Optics and Fine Mechanics of CAS filed Critical Shanghai Institute of Optics and Fine Mechanics of CAS
Publication of CN111854291A publication Critical patent/CN111854291A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25DREFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D17/00Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
    • F25D17/02Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating liquids, e.g. brine
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25DREFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D29/00Arrangement or mounting of control or safety devices
    • F25D29/001Arrangement or mounting of control or safety devices for cryogenic fluid systems

Abstract

A high-efficiency active heat exchange spectrum beam combination grating integrated module and a preparation method thereof are disclosed, wherein the whole module comprises a grating structure layer, a grating substrate, a micro-channel cooling layer, a flow guide layer, a sealing plate and a cooling liquid inlet and outlet part. The invention solves the problems of complex assembly, large volume, heavy weight and non-ideal cooling effect of the whole grating cooling module caused by mutual independence of the cooling module and the beam combining grating in the traditional cooling scheme, and is very beneficial to the miniaturization and light weight of a high-power spectrum beam combining system.

Description

Efficient active heat exchange spectrum beam combination grating integrated module and preparation method thereof
Technical Field
The invention relates to the field of cooling of a spectrum beam combining grating under the action of high-power continuous laser in a spectrum beam combining technology, in particular to a high-efficiency active heat exchange spectrum beam combining grating integrated module and a preparation method thereof.
Background
Based on spectral beam combining techniques (SBC) [ prior art 1: the high-energy spectrum beam-combining laser of Wirthet al, Opt.Lett, Vol.36,3118-3120 (2011) has important application value in the fields of laser processing, laser weapons and the like. The spectrum beam combination grating is a key component of the technical scheme. However, under laser irradiation, the grating temperature is raised due to light absorption of the thin film material and the base material on the surface of the beam combining grating, and the thermal stress and the temperature gradient generated thereby can cause thermal deformation of the grating surface. In this case, cooling the beam combining grating is an effective measure for improving the laser damage resistance of the beam combining grating and the output power of the beam combining system. Common cooling schemes mainly include: blowing air to the grating substrate by a fan, and cooling by air convection; the grating is assembled to the cold end of a semiconductor refrigeration (TEC) module or a microchannel heat sink, and is cooled by heat conduction. Wherein, the air cooling can cause the disturbance of airflow around the grating, which leads to the directional jitter and the wave front deterioration of the diffraction beam; the semiconductor refrigeration has the advantages of high refrigeration speed, high efficiency, low noise and the like, but the structure is complex, a water cooling treatment module is usually required to be designed at the hot end of the TEC for realizing high-efficiency refrigeration, corresponding heat preservation measures are required to be taken at the cold end, and in addition, a special TEC control module is required to be equipped for controlling the temperature; microchannel cooling heatsink [ prior art 2: CN 1158549a, (2011) has the outstanding advantages of large heat exchange coefficient, suitability for severe environments and the like, and therefore, the method is widely applied to the fields of high-power semiconductor laser lamination packaging, high-density assembled electronic equipment cooling and the like.
However, no matter the TEC cooling scheme or the microchannel heat sink cooling scheme is adopted, since the cooling module and the beam combining grating module are independent from each other, when the two modules are mechanically assembled together, the whole spectrum beam combining grating module has a complex structure and is large in size and weight, which does not meet the requirements of miniaturization and light weight of the spectrum beam combining system. What is worse, because the size of the grating used in the laser beam combination system is more than one hundred millimeters, dozens of millimeters are often needed to ensure the thickness of the surface-shaped grating substrate, and the existing experiments also show that the temperature rise of the beam combination grating is mainly in the surface area of the grating, under the condition, if the beam combination grating is directly cooled by adopting microchannel heat sink, the heat dissipation effect is not ideal due to the reasons of large thickness of the beam combination grating substrate, poor contact between the substrate and the heat sink surface, limited heat conductivity of the grating substrate and the like. Therefore, the research on an integrated and efficient active heat exchange beam combining grating structure has important application value in the field of high-power spectrum beam combining laser. To the best of our knowledge, no one has provided the high-efficiency active heat exchange spectrum beam combination grating integrated module and the preparation method thereof.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides an efficient active heat exchange spectrum beam combination grating integrated module and a preparation method thereof, which realize high integration of a beam combination grating and a micro-channel structure, and can realize better surface shape by adopting a relatively thin grating substrate due to the adoption of a re-polishing surface shape correction process in the preparation process, so that the whole cooling module is integrated, light in weight and high in heat exchange efficiency, and is very favorable for miniaturization and light weight of a high-power spectrum beam combination system.
The technical solution of the invention is as follows:
a high-efficiency active heat exchange spectrum beam combination grating integrated module and a preparation method thereof are characterized by comprising a grating structure layer, a grating substrate, a micro-channel cooling layer, an eutectic welding layer, a flow guide layer, a sealing plate, a cooling liquid inlet and a cooling liquid outlet;
the grating structure layer is prepared on the upper surface of the grating substrate through a photoetching process, the rear surface of the grating substrate and the micro-channel cooling layer are welded together through the eutectic welding layer, the micro-channel cooling layer and the sealing plate are welded together through the eutectic welding layer, and the sealing plate is provided with the cooling liquid inlet and the cooling liquid outlet.
The grating structure layer is reflective, i.e. incident light and diffracted light are on the same side of the grating structure layer.
The working mode of the grating structure layer is a reflection type.
The grating substrate is made of quartz, sapphire or silicon carbide; the microchannel cooling layer is made of silicon or silicon carbide; the eutectic welding layer is made of gold-tin eutectic solder, gold-germanium eutectic solder, gold-silicon eutectic solder or silver-copper eutectic solder with different components; the sealing plate material is silicon carbide, quartz or alumina ceramic.
The efficient active heat exchange spectrum beam combination grating integrated module and the preparation method thereof are characterized by comprising the following steps:
carrying out optical polishing processing on the grating substrate and the sealing plate, wherein the flatness of a welding surface of the grating substrate is required to be less than 1 micron, and the surface roughness is less than 1 nm; the welding surface of the high-surface type microchannel sealing component requires that the surface shape is less than lambda/10 (lambda is 0.6328 micrometers), and the surface roughness is less than 1 nm; in addition, the cooling liquid inlet and the cooling liquid outlet are processed on the sealing plate;
processing the micro-channel cooling layer on one surface of the silicon or silicon carbide substrate with two polished surfaces, wherein the width, the depth and the interval of the micro-channel are designed according to specific cooling requirements;
plating nickel and gold on the surfaces to be welded of the grating substrate, the microchannel cooling layer and the sealing plate in sequence for metallization treatment, then utilizing the eutectic welding layer to weld and integrate the components in a vacuum welding furnace and annealing the components, and releasing stress caused by high-temperature welding;
performing secondary optical polishing on the upper surface of the grating substrate after welding integration to improve the indexes of surface shape, surface smoothness, surface roughness and the like of the grating substrate so as to meet the preparation requirement of the grating structure layer;
And fifthly, preparing the grating structure layer finally by combining the grating preparation processes of coating, gluing, exposing, developing, etching and the like.
Compared with the prior art, the invention has the following beneficial technical effects:
1. the beam combination grating and the micro-channel cooling layer are directly integrated by welding and packaging, and the dual functions of grating spectrum beam combination and cooling are realized by using the same module.
2. According to the invention, the eutectic solder with high thermal conductivity, low expansion and high strength is adopted for welding and packaging, and a subsequent repolishing surface shape correction process is combined, so that the heat dissipation capability of the substrate is greatly improved while the thin grating substrate is ensured to have a good surface shape.
3. Because the microchannel cooling layer is directly welded on the back surface of the grating substrate, compared with the traditional scheme of assembling and cooling the grating by adopting an independent microchannel heat sink or TEC cooling module, the invention has the outstanding advantages of small structure volume, light weight, convenient use, high stability/reliability and the like, and is very favorable for the miniaturization and light weight of a high-power spectrum beam combination laser system.
Drawings
FIG. 1 is a schematic diagram of an integrated module of the efficient active heat exchange spectrum beam combining grating
FIG. 2 is a general schematic diagram of the integrated device of the efficient active heat exchange spectrum beam combination grating of the present invention.
FIG. 3 is a curve of the surface temperature of the integrated efficient active heat exchange spectrum beam combination grating module and the surface temperature of the common spectrum beam combination grating heat exchange module changing with the absorbed laser power under the same cooling condition.
In the figure: 1-a cold water tank; 2-a circulating water pump; 3-sealing the plate; 4-a flow guiding layer; 5-a first eutectic solder layer; 6-microchannel cooling layer; 7-a grating structure layer; 8-a grating substrate; 9-incident light; 10-diffracted light; 11-second eutectic solder layer.
Detailed Description
The following examples and drawings are further illustrative of the present invention, but should not be construed as limiting the scope of the invention.
Referring to fig. 1, fig. 1 is a schematic diagram of an integrated module of a high-efficiency active heat exchange spectrum beam combination grating according to the present invention, and as shown in the figure, the integrated module of a high-efficiency active heat exchange spectrum beam combination grating includes a sealing plate 3, a flow guiding layer 4, a first eutectic bonding layer 5, a microchannel cooling layer 6, a grating substrate 8, and a second eutectic bonding layer 11; the upper surface of the grating substrate 8 is provided with a grating structure layer 7, the rear surface of the grating substrate 8 is connected with the micro-channel cooling layer 6 through the first eutectic welding layer 5, the micro-channel cooling layer 6 is connected with the flow guide layer 4 through the second eutectic welding layer 11, the flow guide layer 4 is connected with the sealing plate 3, and the sealing plate 3 is provided with a cooling liquid inlet and a cooling liquid outlet. The grating structure layer 7 is prepared on the upper surface of the grating substrate 8 through a photoetching process, and the working mode of the grating structure layer 7 is a reflection mode, namely, the incident light 9 and the diffracted light 10 are on the same side of the grating structure layer 7.
The grating substrate 8 is made of quartz, sapphire or silicon carbide; the microchannel cooling layer 6 is made of silicon or silicon carbide; the eutectic welding layer 5 is made of gold-tin eutectic solder, gold-germanium eutectic solder, gold-silicon eutectic solder or silver-copper eutectic solder with different components; the sealing plate 3 is made of silicon carbide, quartz or alumina ceramic.
Fig. 2 is a general schematic diagram of the efficient active heat exchange spectrum beam combination grating integration device of the invention, as shown in the figure, the coolant inlet and the coolant outlet are respectively connected with the cold water tank 1 through pipelines, the cold water tank 1 and the circulating water pump 2 are installed together as a supply device of a cooling water source, cooling water enters the diversion layer 4 through the coolant inlet of the sealing plate 3 through the pipelines under the driving of the circulating water pump 2, and exchanges heat with the grating substrate 8 through the second eutectic welding layer 11, the microchannel cooling layer 6 and the first eutectic welding layer 5, and then returns to the cold water tank 1 through the coolant outlet and the pipelines.
The diversion layer 4 can be also provided with a temperature probe which is used for measuring the real-time temperature of the cooling liquid on the micro-channel cooling layer 6 and providing a feedback signal for controlling the temperature of the cooling water for the water cooler.
The grating structure layer 7 is a reflection type beam-combining grating structure with the period of 854.7nm, which is composed of three film materials of Ta2O5, HfO2 and SiO 2.
The grating substrate 8 is a silicon substrate with the thickness of 2 mm; the microchannel cooling layer 6 is directly etched on the back of the grating substrate 8, the width of the microchannel is 250 micrometers, the depth of the microchannel groove is 1 millimeter, and the period of the microchannel is 500 micrometers.
The eutectic bonding layer 5 is an Au80Sn20 eutectic bonding pad produced by Guangzhou advanced technology electronics technology limited company, the specification is 50mm (length) 25mm (width) 0.025mm (thickness), the melting point is 280 ℃, the thermal conductivity is 57W/m.K, and the thermal expansion coefficient is 16 10-6/° c, tensile strength 276 Mpa.
The sealing plate 3 is made of silicon carbide material, has the specification of 50mm 5mm, the surface shape of less than lambda/10 (lambda is 0.6328 micrometers), and the surface roughness of 0.6 nm.
The cooling liquid inlet and the cooling liquid outlet are 4 XM 5 threaded holes directly machined on the sealing plate 3, wherein 2 are used as the cooling liquid inlet, and the other 2 are used as the cooling liquid outlet.
As shown in fig. 3, the actual test results of the surface temperatures of the high-efficiency active heat exchange spectrum beam combination grating integrated module and the traditional spectrum beam combination grating heat exchange module under different absorption laser powers are shown, the cooling liquid used in the test is deionized water at ten degrees centigrade, the water chiller is an ARC300 water chiller produced by Guangzhou Olympic electronic technology development Limited, the water chiller is a CWQ800 power-adjustable 10.6-micron wavelength laser produced by Nanjing Laiwei laser technology Limited for heating the synthetic grating by irradiation, and the grating surface temperature measurement adopts an A615 fixed-installation thermal infrared imager produced by FLIR company. It can be seen from fig. 3 that the integrated efficient active heat exchange spectrum synthesis grating structure can achieve a good cooling effect.
The above-mentioned embodiments are intended to illustrate the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are only exemplary embodiments of the present invention and are not intended to limit the present invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (5)

1. A high-efficiency active heat exchange spectrum beam combination grating integrated module is characterized by comprising a sealing plate (3), a flow guide layer (4), a first eutectic welding layer (5), a microchannel cooling layer (6), a grating substrate (8) and a second eutectic welding layer (11);
the upper surface of the grating substrate (8) is provided with a grating structure layer (7), the rear surface of the grating substrate (8) is connected with the micro-channel cooling layer (6) through the first eutectic welding layer (5), the micro-channel cooling layer (6) is connected with the flow guide layer (4) through the second eutectic welding layer (11), the flow guide layer (4) is connected with the sealing plate (3), and the sealing plate (3) is provided with a cooling liquid inlet and a cooling liquid outlet.
2. The integrated high efficiency active heat exchange spectral beam combining grating module according to claim 1, wherein the grating structure layer (7) is fabricated on the upper surface of the grating substrate (8) by a photolithography process, and the grating structure layer (7) operates in a reflective manner, i.e. the incident light (9) and the diffracted light (10) are on the same side of the grating structure layer (7).
3. The integrated module of claim 1, wherein the grating substrate (8) is made of quartz, sapphire or silicon carbide; the microchannel cooling layer (6) is made of silicon or silicon carbide; the eutectic welding layer (5) is made of gold-tin eutectic solder, gold-germanium eutectic solder, gold-silicon eutectic solder or silver-copper eutectic solder with different components; the sealing plate (3) is made of silicon carbide, quartz or alumina ceramic.
4. The high-efficiency active heat exchange spectral beam combining grating integrated module according to claim 1, wherein the cooling liquid inlet and the cooling liquid outlet are respectively connected with the cold water tank (1) through pipelines, the cold water tank (1) and the circulating water pump (2) are installed together as a supply device of a cooling water source, cooling water enters the flow guide layer (4) through the cooling liquid inlet of the sealing plate (3) through the pipelines under the driving of the circulating water pump (2) and exchanges heat with the grating substrate (8) through the second eutectic welding layer (11), the microchannel cooling layer (6) and the first eutectic welding layer (5), and then returns to the cold water tank (1) through the cooling liquid outlet and the pipelines.
5. A method for preparing an integrated module of an efficient active heat exchange spectral beam combining grating as claimed in any one of claims 1 to 4, comprising the steps of:
optical polishing treatment:
carrying out optical polishing on the grating substrate (8) to ensure that the flatness of a welding surface is less than 1 micron and the surface roughness is less than 1 nm;
optically polishing the flow guide layer (4) to enable the surface shape of the welding surface to be less than lambda/10 (lambda is 0.6328 microns), and the surface roughness to be less than 1 nm;
processing a cooling liquid inlet and a cooling liquid outlet on the sealing plate (3);
thirdly, machining a micro-channel cooling layer (6) to enable the width, depth and interval of the micro-channel to meet the cooling requirement;
sequentially plating nickel and gold on the surfaces to be welded of the grating substrate (8), the microchannel cooling layer (6) and the flow guide layer (4) for metallization, welding and integrating the components in a vacuum welding furnace by using the first eutectic welding layer (5) and the second eutectic welding layer (11), annealing the components, and releasing stress caused by high-temperature welding;
fifthly, carrying out optical polishing processing again on the upper surface of the grating substrate (8) after welding integration to improve the indexes of surface shape, surface smoothness, surface roughness and the like so as to meet the preparation requirement of the grating structure layer (7);
Sixthly, finishing the preparation of the grating structure layer (7) through film coating, glue coating, exposure, development and etching.
CN202010704210.4A 2020-01-20 2020-07-21 Efficient active heat exchange spectrum beam combination grating integrated module and preparation method thereof Pending CN111854291A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202010063734X 2020-01-20
CN202010063734.XA CN111141096A (en) 2020-01-20 2020-01-20 Integrated reflective active cooling device for optical grating

Publications (1)

Publication Number Publication Date
CN111854291A true CN111854291A (en) 2020-10-30

Family

ID=70526297

Family Applications (2)

Application Number Title Priority Date Filing Date
CN202010063734.XA Pending CN111141096A (en) 2020-01-20 2020-01-20 Integrated reflective active cooling device for optical grating
CN202010704210.4A Pending CN111854291A (en) 2020-01-20 2020-07-21 Efficient active heat exchange spectrum beam combination grating integrated module and preparation method thereof

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CN202010063734.XA Pending CN111141096A (en) 2020-01-20 2020-01-20 Integrated reflective active cooling device for optical grating

Country Status (1)

Country Link
CN (2) CN111141096A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115332926A (en) * 2022-08-15 2022-11-11 中国科学院上海光学精密机械研究所 Reflection-type grating structure integrated with embedded non-uniform micro-channel

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114006141B (en) * 2021-11-03 2022-11-11 中国科学院合肥物质科学研究院 Long-pulse high-power millimeter wave three-port power distribution grating

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1158549A (en) * 1996-02-29 1997-09-03 中国科学院上海光学精密机械研究所 Microchannel cooling heat sink
EP1576320A2 (en) * 2001-09-28 2005-09-21 The Board Of Trustees Of The Leland Stanford Junior University Electroosmotic microchannel cooling system
CN101493578A (en) * 2009-02-27 2009-07-29 西北工业大学 Period-adjustable micro-mechanical grating and making technique thereof
CN104901149A (en) * 2015-05-05 2015-09-09 中国科学院上海光学精密机械研究所 Spectral beam combining system based on three diffraction gratings
CN107621672A (en) * 2016-07-14 2018-01-23 中国兵器装备研究院 A kind of integrated high power cladding light stripper
CN110672205A (en) * 2018-07-03 2020-01-10 浙江澍源智能技术有限公司 Micro spectrometer device based on array waveguide grating

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1278414C (en) * 2002-12-11 2006-10-04 中国科学院广州能源研究所 Thermally driven heat exchanger
US9972975B2 (en) * 2016-08-05 2018-05-15 TeraDiode, Inc. High-power laser systems with modular diode sources
US10615100B2 (en) * 2016-12-08 2020-04-07 Toyota Motor Engineering & Manufacturing North America, Inc. Electronics assemblies and cooling structures having metalized exterior surface

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1158549A (en) * 1996-02-29 1997-09-03 中国科学院上海光学精密机械研究所 Microchannel cooling heat sink
EP1576320A2 (en) * 2001-09-28 2005-09-21 The Board Of Trustees Of The Leland Stanford Junior University Electroosmotic microchannel cooling system
CN101493578A (en) * 2009-02-27 2009-07-29 西北工业大学 Period-adjustable micro-mechanical grating and making technique thereof
CN104901149A (en) * 2015-05-05 2015-09-09 中国科学院上海光学精密机械研究所 Spectral beam combining system based on three diffraction gratings
CN107621672A (en) * 2016-07-14 2018-01-23 中国兵器装备研究院 A kind of integrated high power cladding light stripper
CN110672205A (en) * 2018-07-03 2020-01-10 浙江澍源智能技术有限公司 Micro spectrometer device based on array waveguide grating

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
鲁加国: "《合成孔径雷达设计技术》", 31 May 2017, 国防工业出版社 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115332926A (en) * 2022-08-15 2022-11-11 中国科学院上海光学精密机械研究所 Reflection-type grating structure integrated with embedded non-uniform micro-channel

Also Published As

Publication number Publication date
CN111141096A (en) 2020-05-12

Similar Documents

Publication Publication Date Title
CA2687936C (en) Low cost manufacturing of micro-channel heatsink
CA2695746C (en) Methods for making millichannel substrate, and cooling device and apparatus using the substrate
US7660335B2 (en) Liquid cooled laser bar arrays incorporating diamond/copper expansion matched materials
US7656915B2 (en) Microchannel cooler for high efficiency laser diode heat extraction
JP5230200B2 (en) Apparatus and method for surface cooling of optical elements of a laser system
US6826916B2 (en) Laser module, Peltier module, and Peltier module integrated heat spreader
CN111854291A (en) Efficient active heat exchange spectrum beam combination grating integrated module and preparation method thereof
JP5611334B2 (en) Laser cooling module, manufacturing method, and semiconductor laser manufactured by the module
US20130228914A1 (en) Heat Sink Apparatus for Microelectronic Devices
US9762018B2 (en) System and method for cooling a laser gain medium using an ultra-thin liquid thermal optical interface
CN108922869A (en) A kind of SMD encapsulation base of band TEC- aluminium nitride-metal ternary structural
TWM541642U (en) Semiconductor and composite heat dissipation substrate structure
US20180254606A1 (en) Liquid cooled laser bar arrays incorporating thermal expansion matched materials
CN106486885B (en) Solid state laser
CN101640371A (en) High-power microchip laser
TWM546046U (en) Combination of semiconductor and high thermal conductivity heat dissipation substrate
CN110199446A (en) Radiator including diamond synthesis material
JP6445522B2 (en) Microchannel heat sink for microgap thermophotovoltaic devices
Tsunekane et al. Design and performance of compact heatsink for high-power diode edge-pumped, microchip lasers
CN115332926A (en) Reflection-type grating structure integrated with embedded non-uniform micro-channel
CN218005520U (en) Laser with wide temperature range
US6738399B1 (en) Microchannel cooled edge cladding to establish an adiabatic boundary condition in a slab laser
US20120234521A1 (en) Silicon carbide cladding slab based laser cooling device
JPS61104645A (en) Cooler and manufacture thereof
CN115533291A (en) Welding method of slab laser gain medium module

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20201030