CN1158549A - micro-channel cooling heat sink - Google Patents
micro-channel cooling heat sink Download PDFInfo
- Publication number
- CN1158549A CN1158549A CN 96116264 CN96116264A CN1158549A CN 1158549 A CN1158549 A CN 1158549A CN 96116264 CN96116264 CN 96116264 CN 96116264 A CN96116264 A CN 96116264A CN 1158549 A CN1158549 A CN 1158549A
- Authority
- CN
- China
- Prior art keywords
- heat sink
- cooling
- circular hole
- flow
- channel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 41
- 238000012546 transfer Methods 0.000 claims abstract description 14
- 229910052751 metal Inorganic materials 0.000 claims abstract description 7
- 239000002184 metal Substances 0.000 claims abstract description 6
- 239000000428 dust Substances 0.000 claims description 19
- 239000012809 cooling fluid Substances 0.000 claims description 16
- 239000007788 liquid Substances 0.000 claims description 13
- 239000012530 fluid Substances 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 239000012141 concentrate Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 6
- 239000004065 semiconductor Substances 0.000 abstract description 4
- 230000008901 benefit Effects 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 239000013078 crystal Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000010276 construction Methods 0.000 description 3
- 239000002826 coolant Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 235000019628 coolness Nutrition 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000002689 soil Substances 0.000 description 2
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 230000035800 maturation Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to a micro-channel cooling heat sink of a semiconductor laser and radiating cooling devices such as an array device, a large-scale integrated circuit and the like thereof. It is formed by overlapping and enclosing N (N is more than or equal to 4) heat sink sheets of thin metal sheets with uniform thickness. The heat sink is divided into heat transfer sheet, channel sheet, flow guide sheet with flow guide holes and round holes or flow guide slits and flow through sheet with round holes. A plurality of dense thin slits are distributed on the channel piece to form a cooling micro-channel, and wide slits communicated with the round holes are uniformly distributed on the channel piece to form a main channel. It has the advantages of good cooling effect, wide and flexible use and simple structure and manufacturing process.
Description
The present invention relates to the cooling-part of heat radiation such as semiconductor laser and array device, large scale integrated circuit, also can be applied to other and require quick heat radiating and, as the crystal heat radiation etc. by many-sided occasion that realizes integral heat sink.
Micro-channel heat sink is proposed in Stanford Univ USA (Stanford) by soil gram graceful (D.B.Tuckerman) the earliest.The structure of the microchannel cooling heat sink of describing in graceful " high-performance of large scale integrated circuit is heat sink (High-Performance Heat Sinking for the VISI) " literary composition delivered in the 2nd the 5th phase of volume of in May, 1981 electronic device communication (IEEE ELECTRONDEVICE LETTER) of soil gram is: at the silicon substrate back side of integrated circuit (IC) chip with chemical method corrosion hard work rectangle groove, constitute the cooling fluid microchannel with the cover plate coupling, sealing forms coolant circuit with extraneous the connection.The heat that device produces is transmitted to heat sink by binder course, taken away by the cooling fluid that flows in the microchannel and reach purpose to heat dissipation of integrated circuit chip.This technology has obtained positive effect, however this heat sink large scale integrated circuit and the laser diode array and the planar-type semiconductor device that can only be used for plane, and it can only be by a contact-making surface heat radiation.And, because the thermal resistance of conduction and the thermal conductivity of material are inversely proportional to the equivalent thermal resistance of cooling fluid heat absorption and the structural parameters of microchannel in the microchannel
(the width and the degree of depth that W and H are respectively the microchannel) is inversely proportional to, it is fast that the depth-to-width ratio that is to say the microchannel is greatly then taken away heat, but the thermal conductivity of silicon materials is not very very good, particularly make the microchannel and be difficult for the depth-to-width ratio (groove depth is difficult to above 300 microns) that reaches big, so limited radiating effect with chemical corrosion method.
For this reason, the present invention aims to provide a kind of micro-channel heat sink of new construction, so that overcomes the scarce limit of the heat sink existence of above-mentioned prior art, improves heat sink cooling effectiveness, makes it easy to use, and range of application is widened.
Microchannel cooling heat sink of the present invention is to enclose formation by heat sink superimposed envelope of uniformly good heat-conducting metal (or alloy) thin slice of N piece (N 〉=4).These are heat sink slice is divided into heat transfer sheet 1, dust piece 2, flow deflector 3 successively and crosses flow 4 by superimposed order.Cross and have circular hole 41,45 in the flow 4 and be respectively inlet opening and fluid hole, in order to being connected with external pipe by the round section joint ring sealing, mistake flow 4 directly contacts with mount pad.Heat transfer sheet is directly to contact with the object that is cooled, atresia or also to have circular hole in case of necessity be liquid inlet/outlet.Parallel many intensive thin slits 23 are arranged on the dust piece 2,30～100 microns of the common values of width of thin slit, the density of thin slit is distributed in the middle part or concentrated being distributed in circle, ring-band shape or the bar-shaped zone of dust piece 2 greater than 10/millimeter thin slit 23 large formats.Relevant position at liquid inlet/outlet also has circular hole 21 and 25, and circular is evenly distributed with wide seam 22,24 and communicates with circular hole 21,25.Between dust piece 2 and mistake flow 4, flow deflector 3 is arranged, the individual strip pod apertures 32,34 of M (M 〉=2) is arranged on the flow deflector 3, circular hole 31,35 is also arranged.The pod apertures 32,34 of the strip on the flow deflector is in order that thin slit 23 of cross-over connection and wide seam 22,24 communicate.After the superimposed bonding of these heat sink thin slices, envelope is enclosed mutually, wherein wide seam forms the main channel of cooling fluid circulation, thin slit forms the microchannel, pod apertures then forms flow-guiding channel, and liquid pass hole has formed crosses liquid passage, the heat sink superimposed integral body that becomes, become the thin-wall construction of a high compressive strength, and have circular liquid inlet/outlet.
Above-mentioned formation is heat sink heat sink all select good and the metal or alloy material that physico-chemical property is stable of heat conductivility for use, for example oxygen-free copper, silver-plated red copper, silver or the like, heat sink can be square, rectangle, circle or ring-band shape.
Compared with the prior art, microchannel cooling heat sink of the present invention has following advantage:
1. cooling effect is better.
Theoretical and experiment points out already that all the cooling fluid turbosphere has been the major part of heat-absorbing action, and the depth-to-width ratio of its thermal resistance and passage is inversely proportional to.Scribe the restriction of the anti-soak time of the protected glue in microchannel or the like condition in the prior art with chemical corrosion method, the groove depth of tens microns width of silicon chip etching is difficult to above 300 microns; And the bottom land plane is difficult to guarantee that this also directly influences radiating effect.The present invention adopts the thin slice superimposed then envelope of cracking to enclose the microchannel that is constituted, and depth-to-width ratio is not restricted, can improve the heat absorption capacity of turbosphere greatly.Groove depth channel cross-section just increase, the total flow of cooling fluid increases thereupon, also helps improving the speed of taking away heat.Good heat-conducting metal and absolute flat heat transfer layer have reduced the object that is cooled to greatest extent to the thermal resistance of cooling fluid, and for example the thermal conductivity of copper or silver is nearly 3 times of silicon chip, so cooling effect of the present invention is better than above-mentioned prior art far away.
2. applicable situation is widely arranged.
Because liquid inlet/outlet of the present invention all is a circular port, adopt round section joint ring to be connected with extraneous, this connected mode is more reliable than the sealing of rubber tissue, and it is easy to assembly, be easy to realize the module splicing, therefore can be applied to any device that requires quick heat radiating, the device that is suitable for that particularly suitable thickness is arranged and requires to realize by multiaspect integral heat sink is as the operation material of solid state laser, light functional crystal device, high-power electric components and parts or the like.
3. it is convenient to be electrically connected.
Good with the heat sink electric conductivity that the metal heat sink sheet is overlapped into, just in time serve as the bottom electrode of chip when being used for big current semiconductor device such as cooling high power laser diode, be fixed on the metal base of connecting external pipe, can realize reliable electrical connection.
4. heat sink simple in structure is convenient to processing, the rate of finished products height.
Silicon chip etching process conditions harshness in the prior art, speed is extremely slow, the fastest potassium hydroxide (KOH) etch process can only reach per hour 4 microns, and groove more zanjon baseplane shape cannot say for sure more the card, directly influence radiating effect.And heat sink any advanced person's the way that can adopt of the present invention is carved thin slit or wide seam, such as with the way of laser processing etc., and this laser cutting parameter maturation, easy to operate, speed is fast, and rate of finished products is also high.
The present invention is further illustrated below in conjunction with accompanying drawing.
Fig. 1 is the STRUCTURE DECOMPOSITION figure of the microchannel cooling heat sink of large tracts of land cooling usefulness.
Fig. 2 is heat sink A-A cutaway view and a partial enlarged drawing thereof of Fig. 1.
Fig. 3 is the heat sink B-B cutaway view of Fig. 1.
Fig. 4 is the structure exploded view of the microchannel cooling heat sink of end face bar shaped cooling.
Fig. 5 is the microchannel cooling heat sink by the heat sink combination of Fig. 1 that uses for the high power laser light frequency-doubling crystal.
Embodiment 1:
As shown in Figure 1, heat sink quantity N=4, heat sink is rectangle or square, is use microchannel cooling heat sink as large tracts of land cooling, is aligned in sequence with heat transfer sheet 1, dust piece 2, flow deflector 3 and mistake flow 4 superimposed envelopes and encloses and form.Fig. 2 is that its A-A analyses and observe and partial enlarged drawing, and Fig. 3 is its B-B cutaway view.Atresia on the heat transfer sheet 1.Wide seam 22 and 24 are arranged, thin slit 23 and circular hole 21 and 25 on the dust piece 2.The pod apertures 32 and 34 of M=2 strip is arranged on the flow deflector 3, circular hole 31 and 35 are arranged.Cross circular hole 41 and 45 are arranged in the flow 4.Dust piece 2 and flow deflector 3 are clipped in heat transfer sheet 1 and cross between the flow 4, form the thin-wall construction of high compressive strength, superimposed envelope is enclosed the main channel that down wide seam 22,24 forms the cooling fluid trickling, thin slit 23 forms the microchannel, circular hole 21 on the dust piece, the circular hole on the flow deflector 31 are aimed at respectively with last 41 and the circular hole 25,35 and 45 of crossing flow and are formed feed liquor and fluid hole.During use, liquid inlet/outlet is connected (not drawing among the figure) with coolant duct with round section joint ring, cooling fluid enters microchannel 23 by inlet opening 41,31,21 by main channel 22 and flow-guiding channel 32, be pooled to fluid hole 25,35,45 outflows through flow-guiding channel 34 and main channel 24 again, heat is constantly taken away by the cooling fluid that flows in the microchannel 23 in this process, realizes cooling purpose.
Cracking is not limited to straight line trend certainly, not merely is the rectangular area so this micro-channel heat sink can the large tracts of land cooling, and it can be according to actual needs, to such as circle, ring-band shape or the like the zone of various given shapes carry out cooling.
Embodiment 2:
The microchannel cooling heat sink of this large tracts of land cooling also is not difficult to be used in combination the cooling object in different.Fig. 5 is exactly the half sectional view for the microchannel cooling heat sink of the two-sided cooling of high power laser light frequency-doubling crystal use.Its structure is that the liquid inlet and outlet hole of the micro-channel heat sink of two large tracts of land coolings is tightly connected by interface channel 7 and round section joint ring, by clamping plate 10 and 11 clampings and fastening with screw 9.12 is transfusion mouths that cooling fluid is advanced or gone out among the figure, so as with liquid coolant sources in succession.Heat sink liquid inlet/outlet near the transfusion mouth serves as cooling fluid simultaneously again towards another heat sink passageway, so this heat sink middle heat transfer sheet 1 that adopts the band circular hole.Need the laser frequency doubling crystal of cooling to be placed between the microchannel cooling heat sink of two large tracts of land coolings, in the drawings 13 be frequency-doubling crystal.Self-evident, the object that other need cool off also can be placed in this position.
Can draw inferences about other cases from one instance thus, be not difficult to be combined into the microchannel cooling heat sink that can cool off from multiaspects such as three, four sides as required.
Embodiment 3:
Fig. 4 is the structure exploded view of the microchannel cooling heat sink of end face bar shaped cooling, can be for uses such as laser diode arrays.Heat sink is strip, and heat sink quantity N=6 comprises heat transfer sheet 1,2,3 flow deflectors 3,5 and 6 of dust piece, and 1 is crossed flow 4 compositions.Wherein the thin slit 23 on the dust piece 2 gathers at the bar-shaped zone that is positioned at the one end, and a side of the other end has circular hole 21, and has and be distributed at least 3 wide seams 22 that communicate with circular hole 21 around the circular hole 21; One end of flow deflector 6 is carved with many water conservancy diversion seam 63, and the other end has circular hole 61,65, and has and be distributed at least 3 wide water conservancy diversion seams 64 that communicate with circular hole 65 around the circular hole 65; Flow deflector 3 and flow deflector 5 all are carved with the pod apertures (being respectively 36 and 56) of strip on it aims at the position on top of thin slit 23, and the pod apertures 32 and 54 of strip is arranged on the interstitial site between corresponding to 22 and 23 and 64 and 63 respectively, also correspondingly have circular hole 31 and 51; Atresia on the heat transfer sheet 1, crossing in the flow 4 has circular hole 41 and 45.When heat transfer sheet 1, dust piece 2, flow deflector 3, flow deflector 5, flow deflector 6 with cross flow 4 and coincide successively after envelope is enclosed mutually, circular hole 41,61,51,31 and 21 is aimed at and is also constituted inlet opening, and circular hole 65 and 45 is aimed at and constituted fluid holes; Wide seam 22 forms the main channel, and thin slit 23 forms the microchannel, and pod apertures 32 forms cross-over connection flow-guiding channel therebetween; Water conservancy diversion seam 63 forms flow-guiding channel, and wide seam 64 forms the main channel of refluxing, and liquid pass hole 54 forms cross-over connection flow channels therebetween; Liquid pass hole 36 is aimed at 56, forms the flow channels between microchannel and the flow-guiding channel.During work, cooling fluid is imported from inlet opening, enters the microchannel through main channel and flow channels, and the cooling fluid by the microchannel arrives flow-guiding channel by the flow channels on top, after converge to fluid hole flow channels there and main channel flows out.
Claims (6)
- One kind be used to cool off have a microchannel cooling heat sink for the minim channel of cooling fluid circulation, it is characterized in that basic structure is:1) enclosed by heat sink superimposed envelope of the even sheet metal of N (N 〉=4) piece thickness and constitute, heat sink is divided into: heat transfer sheet (1), dust piece (2), flow deflector (3) and cross flow (4);2) wide seam (22) and (24) that many intensive thin slits (23), circular port (21), (25) arranged on the dust piece (2) and be evenly distributed on circular and communicate with circular hole;3) strip pod apertures (32) and (34) that the thin slit on the dust piece (2) and wide seam can be connected, circular hole (31) and (35) are arranged on the flow deflector (3);4) in the flow (4) circular hole (41) and (45) are arranged excessively;5) heat transfer sheet (1) one side contacts the object that is cooled, another side is dust piece (2), between dust piece (2) and the mistake liquid sheet (4) is flow deflector (3), all are heat sink slice encloses down in superimposed envelope that wide seam (22) and (24) form the main channel that cooling fluid circulates, thin slit (23) forms the microchannel, pod apertures (32) and (34) form respectively wide seam (22) and (24) flow-guiding channel with thin slit (23) connection, circular hole (21) and (31), (41), circular hole (25) are aimed at respectively with (35), (45) and are formed inlet opening and fluid hole.
- 2. cooling heat sink according to claim 1 is characterized in that upward atresia of heat transfer sheet (1), perhaps has with dust piece (2) and goes up circular hole (21) and (25) corresponding circular port.
- 3. cooling heat sink according to claim 1 is characterized in that heat sink is rectangle, square, circle or ring-band shape.
- 4. cooling heat sink according to claim 1 is distributed in the middle part of dust piece (2) with it is characterized in that thin slit (23) large format or concentrates and is distributed in circle, ring-band shape or the bar-shaped zone.
- 5. according to claim 1 or 4 described cooling heat sinks, the density that it is characterized in that being distributed in the thin slit (23) on the dust piece (2) is greater than 10/millimeter.
- 6. cooling heat sink according to claim 1, it is characterized in that having on the flow deflector (3) pod apertures (32), (34), (36), (54) and (56) and circular hole (31), (51), (61) and (65) of the individual strip of M (M 〉=2), perhaps also have water conservancy diversion seam (63) and (64).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN96116264A CN1057424C (en) | 1996-02-29 | 1996-02-29 | micro-channel cooling heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN96116264A CN1057424C (en) | 1996-02-29 | 1996-02-29 | micro-channel cooling heat sink |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1158549A true CN1158549A (en) | 1997-09-03 |
| CN1057424C CN1057424C (en) | 2000-10-11 |
Family
ID=5123385
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN96116264A Expired - Fee Related CN1057424C (en) | 1996-02-29 | 1996-02-29 | micro-channel cooling heat sink |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1057424C (en) |
Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1301897C (en) * | 2004-03-17 | 2007-02-28 | 升达科技股份有限公司 | Method for making minisize flow passage by lead frame technology |
| CN1301896C (en) * | 2004-03-17 | 2007-02-28 | 升达科技股份有限公司 | Minisize circulating flow passage device made by lead frame |
| CN100423243C (en) * | 2003-10-20 | 2008-10-01 | 中国科学院广州能源研究所 | Miniature efficient self-circulating electronic cooler |
| CN100568491C (en) * | 2004-07-01 | 2009-12-09 | 国际商业机器公司 | The equipment and the method that are used for the microchannel cooling of semiconductor integrated circuit package |
| CN101005747B (en) * | 2006-01-21 | 2010-05-26 | 富准精密工业(深圳)有限公司 | Liquid cooling heat sink and heat exchanger for said liquid cooling heat sink |
| CN1875238B (en) * | 2003-10-27 | 2010-06-16 | 丹佛斯西利康动力股份有限公司 | Flow distributing unit and cooling unit |
| CN101883483B (en) * | 2009-05-06 | 2012-03-21 | 中国科学院半导体研究所 | Three-plate mini-type heat radiator |
| CN101283450B (en) * | 2005-10-13 | 2012-05-02 | 英特尔公司 | Integrated micro-channel of 3D through silicon system structure |
| CN101576359B (en) * | 2008-12-23 | 2012-08-22 | 中国航天科技集团公司第五研究院第五一○研究所 | Dual-medium (liquid nitrogen and alcohol) compatible heat sink system for space environment simulation test equipment |
| CN104347429A (en) * | 2013-07-25 | 2015-02-11 | 常州鼎悦电子科技有限公司 | Micro channel heat sink manufacturing method |
| CN105436504A (en) * | 2016-01-12 | 2016-03-30 | 中国电子科技集团公司第二十九研究所 | Thin-wall sealing liquid cooling channel based on metal quick forming technology |
| WO2017184635A1 (en) * | 2016-04-18 | 2017-10-26 | Oregon State University | Laminated microchannel heat exchangers |
| CN109216291A (en) * | 2017-06-29 | 2019-01-15 | 比亚迪股份有限公司 | Radiator for power module and the vehicle with it |
| CN110729259A (en) * | 2019-09-23 | 2020-01-24 | 清华大学 | Micro-channel heat sink and manufacturing method thereof |
| CN111141096A (en) * | 2020-01-20 | 2020-05-12 | 中国科学院上海光学精密机械研究所 | Integrated reflective active cooling device for optical grating |
| CN113629484A (en) * | 2021-07-01 | 2021-11-09 | 佛山华智新材料有限公司 | Porous heat sink and manufacturing method thereof |
| CN113903717A (en) * | 2021-12-09 | 2022-01-07 | 中国科学院西安光学精密机械研究所 | Miniaturized heat dissipation device applied to power chip and semiconductor device |
| CN115332926A (en) * | 2022-08-15 | 2022-11-11 | 中国科学院上海光学精密机械研究所 | Reflection-type grating structure integrated with embedded non-uniform micro-channel |
| US11732978B2 (en) | 2016-04-18 | 2023-08-22 | Qcip Holdings, Llc | Laminated microchannel heat exchangers |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7427566B2 (en) * | 2005-12-09 | 2008-09-23 | General Electric Company | Method of making an electronic device cooling system |
| CN102620590B (en) * | 2012-03-30 | 2014-02-12 | 中国科学院工程热物理研究所 | Micro-channel heat sink and performance testing device thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3001587B2 (en) * | 1989-05-15 | 2000-01-24 | 松下電子工業株式会社 | Manufacturing method of semiconductor integrated circuit |
-
1996
- 1996-02-29 CN CN96116264A patent/CN1057424C/en not_active Expired - Fee Related
Cited By (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100423243C (en) * | 2003-10-20 | 2008-10-01 | 中国科学院广州能源研究所 | Miniature efficient self-circulating electronic cooler |
| CN1875238B (en) * | 2003-10-27 | 2010-06-16 | 丹佛斯西利康动力股份有限公司 | Flow distributing unit and cooling unit |
| CN1301896C (en) * | 2004-03-17 | 2007-02-28 | 升达科技股份有限公司 | Minisize circulating flow passage device made by lead frame |
| CN1301897C (en) * | 2004-03-17 | 2007-02-28 | 升达科技股份有限公司 | Method for making minisize flow passage by lead frame technology |
| CN100568491C (en) * | 2004-07-01 | 2009-12-09 | 国际商业机器公司 | The equipment and the method that are used for the microchannel cooling of semiconductor integrated circuit package |
| CN101283450B (en) * | 2005-10-13 | 2012-05-02 | 英特尔公司 | Integrated micro-channel of 3D through silicon system structure |
| CN101005747B (en) * | 2006-01-21 | 2010-05-26 | 富准精密工业(深圳)有限公司 | Liquid cooling heat sink and heat exchanger for said liquid cooling heat sink |
| CN101576359B (en) * | 2008-12-23 | 2012-08-22 | 中国航天科技集团公司第五研究院第五一○研究所 | Dual-medium (liquid nitrogen and alcohol) compatible heat sink system for space environment simulation test equipment |
| CN101883483B (en) * | 2009-05-06 | 2012-03-21 | 中国科学院半导体研究所 | Three-plate mini-type heat radiator |
| CN104347429A (en) * | 2013-07-25 | 2015-02-11 | 常州鼎悦电子科技有限公司 | Micro channel heat sink manufacturing method |
| CN104347429B (en) * | 2013-07-25 | 2017-05-17 | 常州鼎悦电子科技有限公司 | Micro channel heat sink manufacturing method |
| CN105436504A (en) * | 2016-01-12 | 2016-03-30 | 中国电子科技集团公司第二十九研究所 | Thin-wall sealing liquid cooling channel based on metal quick forming technology |
| CN105436504B (en) * | 2016-01-12 | 2018-04-03 | 中国电子科技集团公司第二十九研究所 | A kind of thin-walled sealing fluid cold passage based on metal quick shaping process |
| WO2017184635A1 (en) * | 2016-04-18 | 2017-10-26 | Oregon State University | Laminated microchannel heat exchangers |
| US11732978B2 (en) | 2016-04-18 | 2023-08-22 | Qcip Holdings, Llc | Laminated microchannel heat exchangers |
| CN109216291A (en) * | 2017-06-29 | 2019-01-15 | 比亚迪股份有限公司 | Radiator for power module and the vehicle with it |
| CN109216291B (en) * | 2017-06-29 | 2022-06-21 | 比亚迪半导体股份有限公司 | Radiator for power module and vehicle with radiator |
| CN110729259A (en) * | 2019-09-23 | 2020-01-24 | 清华大学 | Micro-channel heat sink and manufacturing method thereof |
| CN111141096A (en) * | 2020-01-20 | 2020-05-12 | 中国科学院上海光学精密机械研究所 | Integrated reflective active cooling device for optical grating |
| CN111854291A (en) * | 2020-01-20 | 2020-10-30 | 中国科学院上海光学精密机械研究所 | Efficient active heat exchange spectrum beam combination grating integrated module and preparation method thereof |
| CN113629484A (en) * | 2021-07-01 | 2021-11-09 | 佛山华智新材料有限公司 | Porous heat sink and manufacturing method thereof |
| CN113629484B (en) * | 2021-07-01 | 2022-09-16 | 佛山华智新材料有限公司 | Porous heat sink and manufacturing method thereof |
| CN113903717A (en) * | 2021-12-09 | 2022-01-07 | 中国科学院西安光学精密机械研究所 | Miniaturized heat dissipation device applied to power chip and semiconductor device |
| CN115332926A (en) * | 2022-08-15 | 2022-11-11 | 中国科学院上海光学精密机械研究所 | Reflection-type grating structure integrated with embedded non-uniform micro-channel |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1057424C (en) | 2000-10-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1057424C (en) | micro-channel cooling heat sink | |
| US7435623B2 (en) | Integrated micro channels and manifold/plenum using separate silicon or low-cost polycrystalline silicon | |
| EP1825730B1 (en) | Heat sink with microchannel cooling for power devices | |
| EP1622199B1 (en) | Power semiconductor package having integral fluid cooling | |
| US10224265B2 (en) | Power electronics assemblies having a semiconductor cooling chip and an integrated fluid channel system | |
| EP2034521B1 (en) | Fluid cooled semiconductor power module having double-sided cooling | |
| US20120235162A1 (en) | Power converter | |
| CN105188260A (en) | Printed circuit board embedded runner liquid cooling heat exchange device | |
| CN115084058A (en) | Power semiconductor device packaging structure | |
| JP2001284513A (en) | Power semiconductor device | |
| CN2253100Y (en) | Micro-channel cooling heat sink | |
| CN112687676B (en) | Crimping IGBT sub-module and crimping IGBT module | |
| EP3276658A1 (en) | Cooler, power semiconductor module arrangement with a cooler and methods for producing the same | |
| CN116741724A (en) | Cooling integrated silicon carbide module, preparation method thereof and chip transformation method | |
| US11121061B2 (en) | Cooling chip structures having a jet impingement system and assembly having the same | |
| CN115000802A (en) | Semiconductor laser based on micro-channel secondary substrate | |
| CN205082054U (en) | Embedded runner liquid cooling heat transfer device of printed circuit board | |
| CN114256178A (en) | High-power chip heat dissipation structure and preparation method thereof | |
| CN114664769B (en) | Silicon-based micro-channel radiator | |
| CN111933600A (en) | DBC substrate, DBC substrate manufacturing method and power module | |
| US20240186218A1 (en) | Molded power modules with fluidic-channel cooled substrates | |
| US20240194564A1 (en) | Fluidic-channel cooled substrates | |
| CN217035624U (en) | Integrated working chip/thermoelectric refrigeration chip heat dissipation temperature control structure | |
| CN209843692U (en) | Chip radiator structure that can communicate | |
| CN113517242B (en) | Thermoelectric integrated heat radiation module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |