CN101883483B - Three-plate mini-type heat radiator - Google Patents
Three-plate mini-type heat radiator Download PDFInfo
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- CN101883483B CN101883483B CN2009100834924A CN200910083492A CN101883483B CN 101883483 B CN101883483 B CN 101883483B CN 2009100834924 A CN2009100834924 A CN 2009100834924A CN 200910083492 A CN200910083492 A CN 200910083492A CN 101883483 B CN101883483 B CN 101883483B
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- water flowing
- loam cake
- flowing layer
- rectangular recess
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Abstract
The invention discloses a three-plate mini-type heat radiator. The heat radiator comprises an upper cover, a water passing layer and a sealing layer, wherein the upper cover is rectangle and is transversely provided with an upper apopore and an upper inhalant pore up and down; one side of the longitudinal lower face of the upper cover is fixed with a heat-dissipation layer uprightly arranged; the water passing layer is rectangular and corresponding to the upper cover, and is transversely provided with a middle apopore and a middle inhalant pore up and down; one side of the longitudinal upper face of the water passing layer is provided with a rectangular groove; the rectangular groove contains a heat dissipation layer below the upper cover, a strip-shaped groove is arranged between the rectangular groove and one side end of the middle inhalant pore; the position on the bottom of the rectangular groove, which is adjacent to the to end of the water passing layer, is provided with a slit penetrating up and down; a back groove is arranged at the same side of the rectangular groove and on the back of the water passing layer, the back groove is communicated with the slit, and a strip-type concave ditch is arranged between the back groove and one side end of the back of the middle inhalant pore; the sealing layer is corresponding to the upper cover, and is transversely provided with a lower apopore and a lower inhalant pore; and the upper cover is buckled on the water passing layer, the heat-dissipation layer at the lower face of the upper cover is positioned in the rectangular groove of the water passing layer, and the sealing layer is covered on the lower face of the water passing layer.
Description
Technical field
Three-plate mini-type heat radiator of the present invention belongs to optoelectronic areas, relates to the heat radiation refrigeration of power-type photoelectron and microelectronic component, is mainly used in the heat dissipation problem that solves high power semiconductor lasers single tube and array device.
Background technology
Heat dissipation technology is the thorny problem that photoelectron and microelectronic component are often faced; Especially for semiconductor device; Because temperature has material impact to the physical characteristics such as energy gap, band edge absorption and emission band of semi-conducting material, is embodied on the macroscopic view, promptly the basic photoelectric characteristic of device such as power-current characteristic, the curve of spectrum etc. can have greatly changed along with temperature; As for the high power semiconductor lasers array device; Along with the rising of device temperature, slope efficiency reduces, power output reduces, centre wavelength produces red shift, and the variation of these characteristics is totally unfavorable for practical application.So how the used heat that produces in the device work being dissipated is one of direction important in semi-conductor photoelectronic and the microelectronic component research.
Summary of the invention
The objective of the invention is to, proposed a kind of three-plate mini-type heat radiator, be used for the active refrigeration of high power semiconductor lasers single tube or array device mainly as heat dispersion heat sink, have rational in infrastructure, make easily and the advantage of excellent in heat dissipation effect.
The present invention provides a kind of three-plate mini-type heat radiator, comprising:
One loam cake is rectangle, covers on this transversely to have two upper water-out holes and last blasthole down, and the side below loam cake is vertical is fixed with the upright heat dissipating layer of arranging of one deck;
One water flowing layer is rectangle, and is corresponding with loam cake; Apopore and middle blasthole in transversely having down on this water flowing layer; The water flowing layer vertically above a side have a rectangular recess, this rectangular recess can hold the heat dissipating layer below the loam cake, between a side of this rectangular recess and middle apopore, a strip groove is arranged; Bottom surface at this rectangular recess has a slit near water flowing layer top end, this slit up/down perforation;
At the back side of this water flowing layer, have a back of the body groove with the rectangular recess homonymy, this back of the body groove is communicated with slit, between a side at the back of the body groove and the back side, middle inlet opening, a bar shaped chase is arranged;
One sealant, the sealing layer is corresponding with loam cake, transversely has down apopore and following blasthole down;
This loam cake is fastened on the water flowing layer, and the heat dissipating layer below the loam cake is positioned at the rectangular recess of water flowing layer, and the sealing layer covers below the water flowing layer.
Wherein loam cake, water flowing layer and sealant are the metal material with high thermal conductivity, are red copper or oxygen-free copper.
Wherein the precalculated position of loam cake, water flowing layer and sealant vertically has two location holes respectively, and said each location hole is concentric.
The wherein rectangular recess above the water flowing layer, strip groove, the back of the body groove at the back side and bar shaped chase adopt Digit Control Machine Tool machining to process, and the degree of depth of groove is less than 1/2 of the water flowing layer thickness.
Wherein loam cake, water flowing layer and sealant are welding, and welding is to adopt silver-bearing copper Diffusion Welding method.
Wherein heat dissipating layer is made up of some rhombus column thermal columns, adopts line cutting technology to process.
Wherein the area of heat dissipating layer is 9.5mm * 3mm.
Wherein water (flow) direction is opposite with the array device light direction, can carry out good heat radiation to position the hottest in the device course of work-emitting cavity face better.
It is in the opposite direction that direction that fluid flows in the radiator that the present invention proposes and laser are exported, and reduced heat radiation road warp, improved heat-sinking capability.
Description of drawings
Below reach the detailed description of embodiment in conjunction with the drawings, further specify structure of the present invention and characteristics, wherein:
Fig. 1 is the perspective view of the three-plate mini-type heat radiator that proposes of the present invention;
Fig. 2 is the perspective view of the water flowing layer 2 among Fig. 1.
Fig. 3 is the course of work sketch map of three-plate mini-type heat radiator.
Embodiment
See also Fig. 1 and shown in Figure 2, a kind of three-plate mini-type heat radiator of the present invention comprises:
One loam cake 1 (is consulted Fig. 1 a), is rectangle, transversely have two upper water-out holes 11 and last blasthole 12 on this loam cake 1 down; Be fixed with the heat dissipating layer 13 of the upright arrangement of one deck in loam cake 1 side below vertically; The gross area is 9.5mm * 3mm, wherein comprises some rhombus column thermal columns, and the distance between relative two rhombus limits is 200 microns; Distance is 300 microns between adjacent two rhombuses, and the fin height is 600 microns;
One water flowing layer 2 (consulting Fig. 1 b) is rectangle, and is corresponding with loam cake 1; Apopore 21 in transversely having down on this water flowing layer 2; Water flowing layer 2 vertically above a side have a rectangular recess 24, this rectangular recess 24 can hold the following heat dissipating layer 13 of loam cake 1, and a strip groove 25 is arranged between a side of this rectangular recess 24 and middle apopore 21; Bottom surface at this rectangular recess 24 has a slit 23 near water flowing layer 2 top end, these slit 23 up/down perforations;
At the back side of this water flowing layer 2 (consulting Fig. 2), have a back of the body groove 24 ' with rectangular recess 24 homonymies, this back of the body groove 24 ' is communicated with slit 23, between a side at the back of the body groove 24 ' and middle water inlet 22 back sides, a bar shaped chase 25 ' is arranged; Described rectangular recess 24, strip groove 25, back of the body groove 24 ' and bar shaped chase 25 ' adopt Digit Control Machine Tool machining to process, and the degree of depth of groove is less than 1/2 of water flowing layer 2 thickness;
One sealant 3 (consulting Fig. 1 c), sealing layer 3 is corresponding with loam cake 1, transversely has down apopore 31 and following blasthole 32 down;
This loam cake 1 is fastened on the water flowing layer 2, and loam cake 1 following heat dissipating layer 13 is positioned at the rectangular recess 25 of water flowing layer 2, and sealing layer 3 covers below water flowing layer 2.
Wherein the precalculated position of loam cake 1, water flowing layer 2 and sealant 3 vertically has two location holes 10 respectively, and said each location hole 10 is concentric; This loam cake 1, water flowing layer 2 and sealant 3 are welding, and welding is to adopt silver-bearing copper Diffusion Welding method.
The course of work of the present invention is:
Please consult Fig. 1 again; Three layers of minitype radiator of the present invention by loam cake 1 (consult Fig. 1 a), water flowing layer 2 (consulting Fig. 1 b) and sealant 3 (consulting Fig. 1 c) form; The mutual alignment is that loam cake 1 is fastened on the water flowing layer 2; Heat dissipating layer 13 below the loam cake 1 is positioned at the rectangular recess 25 of water flowing layer 2, and sealant 3 covers below water flowing layer 2.Location hole 10 in three layers is aimed at each other; The following apopore 31 of the upper water-out hole 11 of loam cake 1, the middle apopore 21 of water flowing layer 2 and sealant 3 is aimed at each other; The following blasthole 32 of the last blasthole 12 of loam cake 1, the middle blasthole 22 of water flowing layer 2, sealant 3 is aimed at each other; Be 800 ℃ in temperature then, under the nitrogen protection environment, adopt silver-bearing copper Diffusion Welding technology that three layers are welded together.
The present invention can be used to the power-type active device is freezed, especially to the high-power diode laser array device.The concrete course of work is as shown in Figure 3; Array device 4 (10mm * 2mm * 0.14mm) be welded on loam cake 1 of the present invention with standard with above the heat dissipating layer 13 corresponding ends; Light direction is along the x direction, and in the course of the work, device emitting cavity face is the highest position of temperature.With cooling cooling liquid with high-pressure hydraulic pump from following blasthole 32 (consulting Fig. 1 c), blasthole 22 squeeze into; Cooling liquid will flow to along the bar shaped chase 25 ' (consulting Fig. 2) in the water flowing layer 2 in the back of the body groove 24 '; Be ejected on the heat dissipating layer 13 in the loam cake 1 through slit 23; Cooling liquid will flow along heat dissipating layer 13 along the x direction then, and cooling liquid will carry out sufficient convective heat exchange with heat dissipating layer 13, and the cooling liquid strip groove above water flowing layer 2 25 again flows to apopore 21 (consulting Fig. 1 b); Upper water-out hole 11 on loam cake 1 is flowed out and (is consulted Fig. 1 a), the heat that the array device on the loam cake 14 dissipates is taken away fast.The direction that cooling liquid flows is opposite with the device light direction, has improved the radiating effect to the chamber face, and the flow velocity of cooling liquid is fast more, and refrigeration is good more.
Though the present invention discloses as above with preferred embodiment; Right its is not in order to limit the present invention; Has common knowledge the knowledgeable in the technical field under any; Do not breaking away from the spirit and scope of the present invention, when can doing a little change and retouching, so protection scope of the present invention is when looking being as the criterion that the claim scope defined.
Claims (8)
1. three-plate mini-type heat radiator comprises:
One loam cake is rectangle, covers on this transversely to have a upper water-out hole and a last blasthole down, and the side below loam cake is vertical is fixed with the upright heat dissipating layer of arranging of one deck;
One water flowing layer is rectangle, and is corresponding with loam cake; Transversely have a middle apopore and a middle blasthole on this water flowing layer down; Side in vertical front of water flowing layer has a rectangular recess, and this rectangular recess can hold the heat dissipating layer of loam cake below vertically, has a slit on the horizontal left side of this rectangular recess near the horizontal left side of water flowing layer top end; This slit up/down perforation has a strip groove between a side of this rectangular recess and middle apopore;
At the back side of this water flowing layer, have a back of the body groove with the rectangular recess homonymy, this back of the body groove is communicated with through slit and is communicated with rectangular recess, between a side at the back of the body groove and the middle blasthole back side, a bar shaped chase is arranged;
One sealant, the sealing layer is corresponding with loam cake, transversely has a following apopore and a following blasthole down;
This loam cake is fastened on above the water flowing layer, and the heat dissipating layer below the loam cake is positioned at the rectangular recess of water flowing layer, and the sealing layer covers below the water flowing layer;
The rectangular recess and the strip groove that comprise above the said water flowing layer, following back of the body groove and bar shaped chase, the degree of depth of these grooves is all less than 1/2 of water flowing layer thickness.
2. three-plate mini-type heat radiator according to claim 1, wherein loam cake, water flowing layer and sealant are the metal material with high thermal conductivity.
3. three-plate mini-type heat radiator according to claim 2, wherein the metal material of high thermal conductivity is red copper or oxygen-free copper.
4. three-plate mini-type heat radiator according to claim 1, wherein the precalculated position of loam cake, water flowing layer and sealant vertically has two location holes respectively, and said each location hole is concentric.
5. three-plate mini-type heat radiator according to claim 1, the wherein rectangular recess above the water flowing layer, strip groove, the back of the body groove at the back side and bar shaped chase adopt Digit Control Machine Tool machining to process.
6. three-plate mini-type heat radiator according to claim 1, wherein loam cake, water flowing layer and sealant are welding, welding is to adopt silver-bearing copper Diffusion Welding method.
7. three-plate mini-type heat radiator according to claim 1, wherein heat dissipating layer is made up of some rhombus column thermal columns, adopts line cutting technology to process.
8. three-plate mini-type heat radiator according to claim 1, wherein water (flow) direction is opposite with the array device light direction, can carry out good heat radiation to position emitting cavity face the hottest in the device course of work better.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100834924A CN101883483B (en) | 2009-05-06 | 2009-05-06 | Three-plate mini-type heat radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100834924A CN101883483B (en) | 2009-05-06 | 2009-05-06 | Three-plate mini-type heat radiator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101883483A CN101883483A (en) | 2010-11-10 |
| CN101883483B true CN101883483B (en) | 2012-03-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009100834924A Expired - Fee Related CN101883483B (en) | 2009-05-06 | 2009-05-06 | Three-plate mini-type heat radiator |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102734770A (en) * | 2011-04-08 | 2012-10-17 | 苏州浩华光电科技有限公司 | Heat dissipation assembly for rhombic LED (light emitting diode) road lamp |
| CN102734771A (en) * | 2011-04-08 | 2012-10-17 | 苏州浩华光电科技有限公司 | Heat radiation assembly for LED (Light-Emitting Diode) street lamp |
| CN104682189B (en) * | 2015-02-12 | 2017-10-24 | 中国科学院半导体研究所 | A kind of high power density semiconductor laser thermal sediment |
| CN105048281B (en) * | 2015-08-25 | 2018-09-04 | 中国科学院半导体研究所 | Cooling small channel heat sink |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1158549A (en) * | 1996-02-29 | 1997-09-03 | 中国科学院上海光学精密机械研究所 | micro-channel cooling heat sink |
| CN1471159A (en) * | 2003-07-11 | 2004-01-28 | 北京工业大学 | Microjet array cooling heat sink |
-
2009
- 2009-05-06 CN CN2009100834924A patent/CN101883483B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1158549A (en) * | 1996-02-29 | 1997-09-03 | 中国科学院上海光学精密机械研究所 | micro-channel cooling heat sink |
| CN1471159A (en) * | 2003-07-11 | 2004-01-28 | 北京工业大学 | Microjet array cooling heat sink |
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| CN101883483A (en) | 2010-11-10 |
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Granted publication date: 20120321 Termination date: 20130506 |