CN105048281B - Cooling small channel heat sink - Google Patents
Cooling small channel heat sink Download PDFInfo
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- CN105048281B CN105048281B CN201510526353.XA CN201510526353A CN105048281B CN 105048281 B CN105048281 B CN 105048281B CN 201510526353 A CN201510526353 A CN 201510526353A CN 105048281 B CN105048281 B CN 105048281B
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Abstract
A kind of cooling small channel heat sink, including：One upper layer, the upper layer are the rectangle of indent, and intermediate side is provided with a round inlet channel above, and the other side is multilayer connection water channel；One lower layer, the lower layer are the rectangle of indent, and left and right is disengaging water channel, and the upper layer is fixed on the upper surface of lower layer.The present invention is to play the role of high efficiency and heat radiation, preparation is simple, and service life is long to high-density laser diode stack array package.
Description
Technical field
The present invention relates to a kind of cooling small channel heat sink that high power density laser diode stack array package is used,
In use, simple and convenient, durable, service life is long, and cooling effect is preferable, and the scope of application is wider；Prepare work
Skill is simple, and expense is low, and power consumption is low in application.
Background technology
In recent years, high-power semiconductor laser is because of its small, light-weight, efficient, easy adjusting and easy of integration etc. excellent
Point becomes the most promising pumping source of pumped solid-state laser (DPSSL, DPL) optical fiber laser (FL), and development will be direct
Push the technologies such as laser ranging, fuse, tracking, guidance, weapon simulation, igniting blasting, radar, night vision, target identification and confrontation
Update.Especially the high-energy application system such as solid-state laser weapon requires pumping source to have more high-density power density defeated
Go out, diode laser matrix lamination is to improve the effective way of laser output power, but power density and heat consumption become limitation
The principal element that its power further increases.The Wen Shenghui of laser diode active area reduces laser caused by heat power consumption
Electro-optical efficiency reduces output power, makes excitation wavelength red shift, laser can be made to wrack when serious.
Invention content
The purpose of the present invention is to provide a kind of cooling small channel heat sinks, are sealed to high-density laser diode stack array
Dress, plays the role of high efficiency and heat radiation, preparation is simple, and service life is long.
To achieve the above object, the present invention provides a kind of cooling small channel heat sink, including：
One upper layer, the upper layer are the rectangle of indent, and intermediate side is provided with a round inlet channel above, and the other side is more
Layer connection water channel；
One lower layer, the lower layer are the rectangle of indent, and left and right is disengaging water channel, and the upper layer is fixed on the upper surface of lower layer.
The invention has the advantages that playing the role of high efficiency and heat radiation, preparation is simple, and service life is long.
Description of the drawings
Below by way of the detailed description in conjunction with attached drawing to specific example, the structure further illustrated the present invention, feature and skill
Art content, wherein：
Fig. 1 is a kind of structural schematic diagram on the upper layer 1 of cooling small channel heat sink of the present invention；
Fig. 2 is a kind of structural schematic diagram of the lower layer 2 of cooling small channel heat sink of the present invention
Specific implementation mode
It please referring to Fig.1 with shown in Fig. 2, the present invention provides a kind of new and effective cooling small channel heat sink, including：
The material on one upper layer 1 (refering to fig. 1), the upper layer 1 is metal red copper, which is the rectangular rectangular configuration of indent,
Its size is 48mm × 24mm × 11mm, and red copper material is solid and heat conductivility is good, can reduce overall thermal resistance, quickly handle
It distributes heat to take away, ensures that device is run under normal temperature conditions.It is small logical that 14 rectangles are cut on upper layer indent rectangular channel top
Road 11 (refering to fig. 1), every sulculus size are 21mm × 0.5mm × 2mm, period 1mm, in this layer of a plurality of small slot distance of rectangle
Layer surface needs the device to be radiated close, and on the one hand since distance is close, heat conduction of velocity is dissipated than comparatively fast, being conducive to device
Heat ensures its normal work, second is that cutting a plurality of rectangular sulculus, considerably increase with cooling water contact area, accelerate heat
Diffusion velocity is measured, device heat dissipation is conducive to.Bottom surface on upper layer 1 opens the rectangular channel 12 of a depth 6mm away from left side along 9mm
(refering to fig. 1), the bed-plate dimension of rectangular channel 12 is 14mm × 2mm, and the distance away from upper lower edge is 5mm, which is up and down
The successive watercourse of two layers of radiation water channel, size want moderate, both should not be excessive, waste volume, keep overall volume excessive, increase
Cost, and destroy overall beautiful effect；Also should not volume it is too small, so that water is blocked, hinder cold water normally circulate, cause heat dissipate
Hair is not gone out, and whole heat sink forfeiture heat sinking function is made, and is eventually led to device and is failed because heat is excessive.Close to left side along 25mm
The rectangular channel 13 (refering to fig. 1) of a depth 3mm is opened, the bed-plate dimension of rectangular channel 13 is 14mm × 7mm, and the distance away from upper lower edge is
5mm, rectangular channel 13 are the water return outlets on upper layer 1, and volume is suitable, and to ensure that return water is unobstructed, not so return water accumulation is excessive, can make device
Thermal reservoir that part distributes leads to whole heat sink forfeiture heat sinking function, finally causes device because of heat mistake here, do not distribute not go out
It fails more.The big channel 14 (refering to fig. 1) of rectangle of 5 depth 3mm, every rectangle are processed between rectangular channel 12 and rectangular channel 13
Sulculus bed-plate dimension is 14mm × 1.5mm, period 2.8mm, and the big channel 14 of this rectangle is more bulky than rectangle passage aisle 11
More, main purpose is to increase the fluency of water, since air and heat sink heat exchange and the flowing of water take away heat so that
Flow to that the comparison that flows away as soon as possible as possible of this water is suitable, so volume of the total volume in the big channel of rectangle 14 than rectangle passage aisle 11
Want slightly larger suitable, nor can be excessive, also to ensure, increase heat-transfer rate as big as possible with cooling water contact area.
In the circular channel 15 (refering to fig. 1) for, along 8mm, opening a diameter 6mm away from the right, depth 6mm, centre-to-centre spacing lower edges
Distance be 12mm, this circular channel 15 is the inlet channel on upper layer 1, its cross section determines the flow into upper layer water channel
Amount, the diameter of this circular channel 15 should be designed by many factors, such as need the heat amount taken away, water velocity with
And the inlet area of upper layer water channel, size should be suitable, because of the total volume that the heat sink internal water channel structure the compact closely knit, heat sink
Smaller, the raw material needed in this way are fewer, therefore processing charges is fewer；And volume is smaller, and heat sink more small and exquisite, appearance is also more beautiful
See, and use it is also more convenient, the space occupied also just it is smaller, be conducive to the Integration Design of device.
The material of one lower layer 2 (refering to Fig. 2), the lower layer 2 is metal red copper, which is rectangular configuration, and size is
52mm × 28mm × 32mm, red copper material is solid and thermal conductivity is good, can reduce overall thermal resistance, quickly distributing heat band
It walks, ensures that device works under normal temperature conditions.In lower layer 2 a depth 11mm indent is opened among top surface (52mm × 28mm)
Rectangular channel 21 (refering to Fig. 2), bed-plate dimension be 48mm × 24mm, it is therefore an objective to upper layer 1 is put into the rectangular channel 21 of indent,
It is heat sink to make an integral heat sink, two kinds of sealing means may be implemented in such design, one is using soldering tech, upper
Weld together for two layers down, but the requirement of such technology is stringenter, if technology does not answer mark, if there is the welding of large area,
The probability for leak possibility occur is bigger；Another method is exactly that profit is screwed, and firmly equilibrium, just compares on four angles
Our purpose easy to implement, but such method occupies certain space due to the use of screw so that redesign is small logical
When road is heat sink, volume is certain to increase, and also increases process, thus increases cost, and due to spiral shell
Follow closely it is exposed outside, also affect overall beautiful.On 21 bottom surface of rectangular channel, at right edge 8mm, open one it is a diameter of
The circular channel 22 (refering to Fig. 2) of 6mm, depth 11.8mm, centre-to-centre spacing upper edge 12mm, the position and upper layer of this circular channel 22
The position of 1 circular channel 15 corresponds to, this circular channel 22 is communicated with the intake tunnel of lower layer 2, this circular channel 22 it is transversal
Area is to determine not so a key factor of inflow can influence whole effect so strictly to calculate in the design process
Fruit includes not only heat dissipation effect, also overall volume, and then influences aesthetic effect；It is concentric with circular channel 22, open a depth
1.6mm annular grooves 23 (refering to Fig. 2), inner and outer diameter are respectively 8mm and 14mm, this annular groove 23 is flexible for placing
Rubber Ou Quan, plays sealing function, it is therefore an objective to make linking together for the inlet channel positive alignment of upper layer 1 and lower layer 2, ensure water flowing
When, it prevents water from being overflowed from the contact position of upper layer 1 and lower layer 2, influences the water speed into upper layer radiation water channel, water is caused to enter
The rectangular channel 13 on upper layer 1 so that inlet channel and return water road communicate, and thus thoroughly destroy the effect of Double-layer drain heat dissipation, cause
Make whole heat sink failure；At away from left side edge 24mm, the circular channel 24 of an a diameter of 6mm, depth 11.8mm are opened (refering to figure
2) position of, centre-to-centre spacing upper edge 12mm, the circular channel 24 are corresponding with the position of rectangular channel 13 of recess in upper layer 1, this
Circular channel 24 is communicated with the return water road of lower layer 2, and flowing through the water come from the rectangular channel 15 on upper layer 1 enters circular channel 24, ability
One cycle is completed, the cross-sectional area of this circular channel 24 should be suitable with the cross-sectional area of inlet channel, just can guarantee herein not
It will appear seeping phenomenon, influence heat sink heat dissipation effect；In 24 outside of circular channel, the rectangle of a depth 1.6mm, width 6mm are opened
Annular groove 25 (refering to Fig. 2), interior rectangular dimension are 20.9mm × 14mm, and outer rectangular dimension is 26.9mm × 20mm, the outer rectangle left side
21 bottom surface left side bearing 6mm of line-spacing slot, distance of the lower sideline away from lower sideline on 21 bottom surface of slot is 2mm on outer rectangle, four, interior rectangle
Make fillet 26 (refering to Fig. 2), radius 1mm, this rectangle annular groove 25 and rectangular channel 12, rectangular channel 13 and the big channel of rectangle in angle
14 positions correspond to, this rectangle annular groove 25 is used for placing flexible rubber Ou Quan, it is therefore an objective to make the big channel of the rectangle on upper layer 1
14, rectangular channel 12 and rectangular channel 13 and the 25 intermediate space positive alignment of the rectangle annular groove of lower layer 2 links together, and ensures to be formed
Normal loop state, water flowing is smooth, prevents water from being overflowed from circuit, influences the water speed in return water road, prevent water from entering inlet channel region,
So that inlet channel and return water road communicate, the effect of Double-layer drain heat dissipation is thus thoroughly destroyed so that whole heat sink failure；
The round water outlet 28 (refering to Fig. 2) of a diameter 6mm, depth 28mm are opened on the left side of lower layer 2, this 28 center of round water outlet
It is 14mm to lower layer's 2 left and right sideline distance, the distance to 2 hemline of lower layer is 12.2mm, this round water outlet 28 and round ditch
Road 24 communicates, and makes communicating for 2 return water road of lower layer and external supply equipment, ensures that the water flowed out by inside passes back into supply equipment
Return water water pipe；In the annular groove 29 (refering to Fig. 2) of 28 outside alignment of round water outlet, one depth 1.9mm, inner and outer diameter point
Not Wei 10mm and 16.4mm, this annular groove 29 be used for be connected with the water pipe of external supply equipment, ensure heat sink water outlet and water supply
The return water water pipe of equipment closely connects so that return water does not overflow, and avoids the occurrence of unrestrained water phenomenon, causes unthinkable consequence.
The round inlet channel 210 (refering to Fig. 2) of an a diameter of 6mm, depth 10mm are opened on 2 right side of lower layer, this round inlet channel 210
Center is 14mm to lower layer 2 left and right sideline distance, and the distance to 2 hemline of lower layer is 12.2mm, this round inlet channel 210 with
Circular channel 22 is connected to, which is that inlet channel is communicated with external supply equipment, ensures that supply equipment passes through water pipe
Cooling water is sent to inlet channel；In the annular groove 211 (refering to Fig. 2) of 210 outside alignment of round inlet channel, one depth 1.9mm,
Its inner and outer diameter is respectively 10mm and 16.4mm, this annular groove 211 is used for being connected with the water inlet pipe of external supply equipment, ensures heat
The water inlet water pipe of heavy water inlet and supply equipment closely connects so that water inlet does not overflow, and avoids the occurrence of unrestrained water phenomenon, ensures heat
Heavy operation is working properly.
Open the through-hole 16 (refering to fig. 1) of a diameter 3.4mm, center to two sides edge respectively on the angle of 1 four, upper layer
Distance be 2.5mm.Open the threaded hole 27 (refering to Fig. 2) of a diameter 3mm, depth 10mm respectively on 2 four angles of lower layer, wherein
The heart is 2.5mm to the distance in 21 bottom surface sideline of slot is closed on.And upper layer 1 is with lower layer 2 center when overlapping, four on upper layer 1
Through-hole 16 and four threaded holes 27 in lower layer 2 be it is corresponding coincide together, be just screwed together, upper layer
1 with lower layer 2 being combined together tightly, ensure that the water channel of the inside is unimpeded, water does not overflow.
The course of work of the present invention is, first in the rectangle annular groove 25 and annular groove 23 on the bottom surface of the slot 21 of lower layer 2,
A Ou Quan is respectively placed, then upper layer 1 is inserted into the slot 21 of lower layer 2, makes the circle of the circular channel 15 and lower layer 2 on upper layer 1
Shape raceway groove 22 is aligned, and the threaded hole 27 on 2 four angles of through-hole 16 and lower layer on the angle of 1 four, upper layer is made to be aligned, and finally uses M3
Long spiro nail upper layer 1 and lower layer 2 are fixed together, it is heat sink in this way to be completed.
The new and effective cooling small channel heat sink of one kind, machined 14 rectangle sulculuses, often using line cutting technology
Sulculus size is 21mm × 0.5mm × 2mm, period 1mm, in this way processing, both ensure that our fine requirement, and had in turn avoided
Using fine processing technique, such as chemical attack technology etc., the difficulty of preparation process is reduced.
The new and effective cooling small channel heat sink of one kind, machined 14 squares in upper layer 1 using line cutting technology
Shape sulculus 11, and on a surface on upper layer 1,5 rectangle sulculuses 14 are milled out using machine tools milling cutter, in this way on upper layer
It machined two layers of water channel on 1.When upper layer 1 processes rectangle sulculus 11 using line cutting technology, one need to be opened respectively in left and right side
A rectangular channel could be processed using line cutting technology, finally form sealing water channel, be needed the rectangle of left and right side
A cutting is inserted into slot respectively, and is sealed using welding technique, sealing area 56mm2.In conventional machining techniques,
If necessary to process two layers of water channel, usually two layers it is independent it is heat sink it is middle process respectively, then again by two layers of independent heat sink welding
Together, it or is screwed together.If sealed using welding technique, sealing area is 1152mm2, is probably using existing
100 times of bonding area are needed in method, considerably increases the possibility of leak in this way.If be fixed together using screw, need
It to utilize Ou Quan to seal, thus need to open the sulculus for setting Ou Quan in a lower layer, but the depth 2-3mm of every layer of water channel, and
Every layer of independence is heat sink to only have 5-6mm, then opens sulculus, places Ou Quan, thickness does not allow, relatively difficult, and the possibility row of leak
Also bigger.Now we by two layers of water channel be worked into one layer it is heat sink on, avoid the welded seal of large area, or open rectangle
Slot places Ou Quan, substantially reduces the possibility of leak.
Upper layer 1 and lower layer 2 are connected to one by the new and effective cooling small channel heat sink of one kind using four long spiro nails
It rises, forms an entirety, using two diameters and the suitable Ou Quan of elasticity, avoid and gone out using large-scale welding technique
The possibility of existing leak, such method is simple and practicable, the requirement of design easy to implement.
Particular embodiments described above has carried out further in detail the purpose of the present invention, technical solution and advantageous effect
It describes in detail bright, it should be understood that the above is only a specific embodiment of the present invention, is not intended to restrict the invention, it is all
Within the spirit and principles in the present invention, any modification, equivalent substitution, improvement and etc. done should be included in the guarantor of the present invention
Within the scope of shield.
Claims (2)
1. a kind of cooling small channel heat sink comprising：
One upper layer (1), the upper layer (1) are the rectangular parallelepiped structure of indent, and intermediate right side is provided on one round ditch above the upper layer
Road (15), circular channel (15) is the inlet channel on the upper layer (1) on this, and left side of circular channel (15) is that upper rectangle is recessed on this
Slot is provided with a narrow rectangular channel (12), along the upper layer among bottom surface of rectangular recess on this on this on the left of bottom surface of rectangular recess
Long side direction have a plurality of square small channel (11), which is connected on right side with upper circular channel (15), should
Square small channel (11) is provided with a plurality of rectangular big channel (14) above, which is passing on left narrow rectangular channel
(12) it is connected with rectangular big channel (14), the right side of the rectangular big channel (14) is connected to a wide rectangular channel (13), the width square
Shape slot (13) is the interface channel for connecting upper layer and lower layer radiation water channel, and the width of the narrow rectangular channel (12) is less than wide rectangular channel (13)
Width, in upper layer (1), four corners above are provided with 4 mounting holes;
One lower layer (2), the lower layer (2) are the rectangular parallelepiped structure of indent, and intermediate right side is provided with round ditch above the lower layer
Road (22), the position of the lower circular channel (22) is corresponding with the upper position of circular channel (15), the lower circular channel (22)
It is communicated with the intake tunnel (210) positioned at the lower layer right side, the left side of the lower circular channel (22) is lower rectangular recess, under this
Rectangular recess is equal with the floor space of upper rectangular recess, and upper rectangular recess is just completely embedded into lower rectangular recess, the lower rectangle
It is provided with a circular channel (24) on the left of the bottom surface of groove, the position of the position of the circular channel (24) and the wide rectangular channel (13) on upper layer
Correspondence is set, which communicates with the exhalant canal (28) positioned at lower layer (2) left side, the circular channel (24)
Outside is provided with a rectangle annular groove (25) for being used for placing flexible rubber seal, is opened in the four corners of lower layer (2) above
There are 4 mounting holes, the position of lower layer's mounting hole corresponding with the position of upper layer mounting hole.
2. cooling small channel heat sink according to claim 1, the wherein material of the upper and lower are all homogeneously red copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510526353.XA CN105048281B (en) | 2015-08-25 | 2015-08-25 | Cooling small channel heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510526353.XA CN105048281B (en) | 2015-08-25 | 2015-08-25 | Cooling small channel heat sink |
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| Publication Number | Publication Date |
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| CN105048281A CN105048281A (en) | 2015-11-11 |
| CN105048281B true CN105048281B (en) | 2018-09-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510526353.XA Expired - Fee Related CN105048281B (en) | 2015-08-25 | 2015-08-25 | Cooling small channel heat sink |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107104359A (en) * | 2016-02-22 | 2017-08-29 | 中国科学院半导体研究所 | A kind of heat sink, preparation method and its application in semiconductor laser |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5005640A (en) * | 1989-06-05 | 1991-04-09 | Mcdonnell Douglas Corporation | Isothermal multi-passage cooler |
| JP2004186527A (en) * | 2002-12-05 | 2004-07-02 | Tecnisco Ltd | Laser diode cooling apparatus |
| CN101164163A (en) * | 2005-06-20 | 2008-04-16 | 浜松光子学株式会社 | Heat sink, laser apparatus provided with such heat sink, and laser stack apparatus |
| CN101883483A (en) * | 2009-05-06 | 2010-11-10 | 中国科学院半导体研究所 | Three-plate mini-type heat radiator |
| CN202103311U (en) * | 2011-07-01 | 2012-01-04 | 中国电子科技集团公司第十三研究所 | Micro-channel heat sink for laser |
| CN102620590A (en) * | 2012-03-30 | 2012-08-01 | 中国科学院工程热物理研究所 | Micro-channel heat sink and performance testing device thereof |
| US8264841B2 (en) * | 2007-05-31 | 2012-09-11 | Sony Corporation | Heat sink and laser diode |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005217211A (en) * | 2004-01-30 | 2005-08-11 | Tecnisco Ltd | Cooler for semiconductors and cooler stack for semiconductors |
-
2015
- 2015-08-25 CN CN201510526353.XA patent/CN105048281B/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5005640A (en) * | 1989-06-05 | 1991-04-09 | Mcdonnell Douglas Corporation | Isothermal multi-passage cooler |
| JP2004186527A (en) * | 2002-12-05 | 2004-07-02 | Tecnisco Ltd | Laser diode cooling apparatus |
| CN101164163A (en) * | 2005-06-20 | 2008-04-16 | 浜松光子学株式会社 | Heat sink, laser apparatus provided with such heat sink, and laser stack apparatus |
| US8264841B2 (en) * | 2007-05-31 | 2012-09-11 | Sony Corporation | Heat sink and laser diode |
| CN101883483A (en) * | 2009-05-06 | 2010-11-10 | 中国科学院半导体研究所 | Three-plate mini-type heat radiator |
| CN202103311U (en) * | 2011-07-01 | 2012-01-04 | 中国电子科技集团公司第十三研究所 | Micro-channel heat sink for laser |
| CN102620590A (en) * | 2012-03-30 | 2012-08-01 | 中国科学院工程热物理研究所 | Micro-channel heat sink and performance testing device thereof |
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