CN102620590A - Micro-channel heat sink and performance testing device thereof - Google Patents
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- 229920006395 saturated elastomer Polymers 0.000 description 1
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Abstract
一种利用水力空化强化换热的微通道热沉,主要包括:一微通道平板,该微通道平板的一平面上开设有流体入口、进口压力测量端口、空化发生器、主流微通道、出口压力测量端口和流体出口;在主流微通道中沿液体流动方向间隔地设置有空化发生器,空化发生器与主流微通道之间的宽度比值为0.1~0.6;一密封盖板,设于该微通道平板的平面上,密封盖板设有流体入口、进口压力测量端口、出口压力测量端口和流体出口,分别对应微通道平板开设的流体入口、进口压力测量端口、出口压力测量端口和流体出口;一发热元件,设于微通道平板的另一平面。本发明还公开了微通道热沉的性能测试装置。
A microchannel heat sink utilizing hydrodynamic cavitation to enhance heat exchange mainly includes: a microchannel plate, a fluid inlet, an inlet pressure measurement port, a cavitation generator, a mainstream microchannel, Outlet pressure measurement port and fluid outlet; cavitation generators are arranged at intervals along the liquid flow direction in the main flow microchannel, and the width ratio between the cavitation generator and the main flow microchannel is 0.1 to 0.6; a sealing cover plate is set On the plane of the microchannel plate, the sealing cover plate is provided with a fluid inlet, an inlet pressure measurement port, an outlet pressure measurement port and a fluid outlet, respectively corresponding to the fluid inlet, inlet pressure measurement port, outlet pressure measurement port and Fluid outlet; a heating element, located on the other plane of the microchannel plate. The invention also discloses a performance testing device for the microchannel heat sink.
Description
技术领域 technical field
本发明属于高效冷却技术领域,具体地涉及一种利用水力空化强化换热的微通道热沉。The invention belongs to the technical field of high-efficiency cooling, and in particular relates to a microchannel heat sink which utilizes hydraulic cavitation to enhance heat exchange.
本发明还涉及一种测试上述微通道热沉性能的装置。The invention also relates to a device for testing the performance of the microchannel heat sink.
背景技术 Background technique
微通道热沉概念最早由美国学者Tuckerman和Pease于上世纪80年代提出。微通道热沉体积小、结构紧凑,其通道尺寸可以达到几十甚至几个微米的量级,因此可直接作用于狭小空间内的热源位置。微通道热沉以其高效的冷却能力、简单的冷却结构以及良好的兼容性,已成为微电子器件行业最具发展潜力的高效冷却方式。然而,随着高性能集成器件工作频率的迅速提高,其功率密度急剧上升。目前,高性能CPU已经接近核子反应堆的功率密度,而大功率器件(如IGBT)和激光二极管(DL)列阵等器件的功率密度也已经达到数百瓦、甚至千瓦量级。正常工作情况下,这些器件内的热耗占到总功率的50%以上,为了保证器件的性能,必须及时将这部分热量带走。面对如此高的热流密度,传统微通道热沉的冷却能力已不能适应高性能电子元器件的发展要求,在有限空间内及时消除因功率耗散转化的废热已成为制约大功率集成电路技术与激光技术发展的主要瓶颈,迫切需要研制和开发具有高密度散热能力的新型冷却技术和方法。The concept of microchannel heat sink was first proposed by American scholars Tuckerman and Pease in the 1980s. The microchannel heat sink is small in size and compact in structure, and its channel size can reach the order of tens or even several microns, so it can directly act on the position of the heat source in a small space. With its high-efficiency cooling capacity, simple cooling structure and good compatibility, micro-channel heat sink has become the most promising high-efficiency cooling method in the microelectronics industry. However, with the rapid increase in the operating frequency of high-performance integrated devices, their power density has risen sharply. At present, high-performance CPUs are close to the power density of nuclear reactors, and the power densities of high-power devices (such as IGBTs) and laser diode (DL) arrays have reached hundreds of watts, or even kilowatts. Under normal working conditions, the heat consumption in these devices accounts for more than 50% of the total power. In order to ensure the performance of the devices, this part of the heat must be taken away in time. Faced with such a high heat flux density, the cooling capacity of traditional microchannel heat sinks can no longer meet the development requirements of high-performance electronic components. Timely elimination of waste heat due to power dissipation in a limited space has become a constraint for high-power integrated circuit technology and The main bottleneck in the development of laser technology, there is an urgent need to research and develop new cooling technologies and methods with high-density heat dissipation capabilities.
空化是指当液体内部局部压力降低时,在液体中或液固界面上蒸汽或气体空穴的形成、生长及溃灭的过程。水力空化,顾名思义是通过一定的水力结构实现液体的空化,当流体流经水力结构时,由于水力结构的限流作用,其流速急剧上升,作为代价其压力急剧下降,当压力降低到工作温度下液体的饱和蒸气压时就会产生空化现象。已有研究表明,空化泡溃灭时可形成1~1018Kw/m3的高密度能量,可作为物理/化学过程的能量输入,以达到强化过程的目的。目前,水力空化技术已经在化工、饮用水消毒及废水处理等领域得到了广泛应用。Cavitation refers to the process of formation, growth and collapse of vapor or gas cavities in a liquid or on a liquid-solid interface when the local pressure inside the liquid is reduced. Hydraulic cavitation, as the name implies, realizes the cavitation of liquid through a certain hydraulic structure. When the fluid flows through the hydraulic structure, due to the flow limiting effect of the hydraulic structure, its flow rate rises sharply. As a price, its pressure drops sharply. When the pressure drops to the working Cavitation occurs when the saturated vapor pressure of the liquid is lower than the temperature. Previous studies have shown that high-density energy of 1-10 18 Kw/m 3 can be formed when cavitation bubbles collapse, which can be used as energy input for physical/chemical processes to achieve the purpose of strengthening the process. At present, hydraulic cavitation technology has been widely used in chemical industry, drinking water disinfection and wastewater treatment and other fields.
空化泡溃灭瞬间,会形成强烈冲击波和高速微射流,不但可对液体流动形成扰动,而且还能引起液体流型的转变,从而到达强化传热的目的,因此将水力空化引入微通道热沉结构,可大幅度提高微通道热沉的冷却能力,以满足大功率集成电路技术与激光技术快速发展的要求。When the cavitation bubble collapses, a strong shock wave and high-speed micro-jet will be formed, which can not only disturb the liquid flow, but also cause a change in the liquid flow pattern, thereby achieving the purpose of enhancing heat transfer. Therefore, hydraulic cavitation is introduced into the microchannel The heat sink structure can greatly improve the cooling capacity of the microchannel heat sink to meet the requirements of the rapid development of high-power integrated circuit technology and laser technology.
发明内容 Contents of the invention
本发明的目的在于提供一种利用水力空化强化换热的微通道热沉。The object of the present invention is to provide a micro-channel heat sink that utilizes hydraulic cavitation to enhance heat exchange.
本发明的又一目的在于提供一种对上述微通道热沉性能进行测试的装置。Another object of the present invention is to provide a device for testing the performance of the above-mentioned microchannel heat sink.
为实现上述目的,本发明提供的利用水力空化强化换热的微通道热沉,主要包括:In order to achieve the above purpose, the microchannel heat sink that utilizes hydraulic cavitation to enhance heat exchange provided by the present invention mainly includes:
一微通道平板,该微通道平板的一平面上开设有流体入口、进口压力测量端口、空化发生器、主流微通道、出口压力测量端口和流体出口;A microchannel plate, a plane of the microchannel plate is provided with a fluid inlet, an inlet pressure measurement port, a cavitation generator, a mainstream microchannel, an outlet pressure measurement port and a fluid outlet;
在主流微通道中沿液体流动方向间隔地(等间距或不等间距)设置有空化发生器,空化发生器与主流微通道之间的宽度比值为0.1~0.6;Cavitation generators are arranged at intervals (equal or unequal intervals) along the liquid flow direction in the main flow microchannel, and the width ratio between the cavitation generator and the main flow microchannel is 0.1 to 0.6;
一密封盖板,设于该微通道平板的平面上,密封盖板设有流体入口、进口压力测量端口、出口压力测量端口和流体出口,分别对应微通道平板开设的流体入口、进口压力测量端口、出口压力测量端口和流体出口;A sealing cover plate is arranged on the plane of the microchannel plate, and the sealing cover plate is provided with a fluid inlet, an inlet pressure measurement port, an outlet pressure measurement port and a fluid outlet, respectively corresponding to the fluid inlet and inlet pressure measurement ports opened on the microchannel plate , outlet pressure measurement port and fluid outlet;
一发热元件,设于微通道平板的另一平面。A heating element is arranged on the other plane of the microchannel plate.
所述的微通道热沉,其中,微通道平板的材料是硅、不锈钢、铜或者其它金属合金。The microchannel heat sink, wherein the material of the microchannel plate is silicon, stainless steel, copper or other metal alloys.
所述的微通道热沉,其中,密封盖板的材料是硅、不锈钢、铜或者耐温透明玻璃。The microchannel heat sink, wherein the material of the sealing cover plate is silicon, stainless steel, copper or heat-resistant transparent glass.
所述的微通道热沉,其中,微通道平板的流体入口与主流微通道之间有一流量分配腔,在主流微通道与流体出口之间有一流体汇集腔。In the microchannel heat sink, there is a flow distribution chamber between the fluid inlet of the microchannel plate and the main flow microchannel, and a fluid collection chamber between the main flow microchannel and the fluid outlet.
所述的微通道热沉,其中,微通道平板中的空化发生器与主流微通道的横截面是方形、圆形、三角形、梯形或者多边形,空化发生器与主流微通道两者的当量直径比值为0.2~0.7。Described microchannel heat sink, wherein, the cross-section of the cavitation generator in the microchannel plate and the mainstream microchannel is square, circular, triangular, trapezoidal or polygonal, the equivalent of both the cavitation generator and the mainstream microchannel The diameter ratio is 0.2-0.7.
所述的微通道热沉,其中,主流微通道的数目根据发热元件的发热面积确定。In the microchannel heat sink, the number of the main microchannels is determined according to the heating area of the heating element.
本发明提供的测量上述微通道热沉性能的装置,包括:The device for measuring the performance of the above-mentioned microchannel heat sink provided by the present invention includes:
微通道热沉的流体入口通过一动力泵连接一储液槽,微通道热沉的流体出口通过一流量计连接至冷却器,该冷却器连接储液槽,使储液槽内的液体形成循环;The fluid inlet of the micro-channel heat sink is connected to a liquid storage tank through a power pump, and the fluid outlet of the micro-channel heat sink is connected to a cooler through a flow meter, and the cooler is connected to the liquid storage tank to make the liquid in the liquid storage tank form a cycle ;
微通道热沉的流体入口和流体出口分别各连接一热电偶,分别测量微通道热沉流体入口和流体出口的液体温度;The fluid inlet and the fluid outlet of the microchannel heat sink are respectively connected with a thermocouple, and the liquid temperatures of the fluid inlet and the fluid outlet of the microchannel heat sink are respectively measured;
微通道平板的发热元件连接一热电偶,测量加热壁面温度;The heating element of the microchannel plate is connected with a thermocouple to measure the temperature of the heating wall;
微通道热沉的进口压力测量端口和出口压力测量端口分别各连接有压力传感器,测量微通道热沉的进口压力和出口压力。The inlet pressure measurement port and the outlet pressure measurement port of the microchannel heat sink are respectively connected with pressure sensors to measure the inlet pressure and outlet pressure of the microchannel heat sink.
所述的装置,其中,微通道热沉的流体入口与储液槽之间,以及微通道热沉的流体出口与流量计之间各安装有阀门,以调节微通道热沉的流体入口和流体出口的压力,达到液体空化的条件。The device, wherein a valve is installed between the fluid inlet of the microchannel heat sink and the liquid storage tank, and between the fluid outlet of the microchannel heat sink and the flowmeter, to adjust the fluid inlet and fluid flow of the microchannel heat sink. The outlet pressure reaches the condition of liquid cavitation.
所述的装置,其中,流量计、热电偶和压力传感器均连接至数据采集系统,并通过计算机进行处理和分析。Said device, wherein, the flow meter, the thermocouple and the pressure sensor are all connected to the data acquisition system, and processed and analyzed by the computer.
本发明通过将水力空化现象引入微通道热沉,在不增加其它设备的情况下可大幅提高微通道热沉的冷却能力。The invention introduces the hydraulic cavitation phenomenon into the micro-channel heat sink, and can greatly improve the cooling capacity of the micro-channel heat sink without adding other equipment.
附图说明 Description of drawings
图1是本发明实施例所采用的微通道热沉三维示意图。Fig. 1 is a three-dimensional schematic diagram of a microchannel heat sink used in an embodiment of the present invention.
图2是图1所示微通道热沉的三维封装示意图。FIG. 2 is a schematic diagram of a three-dimensional package of the microchannel heat sink shown in FIG. 1 .
图3是微通道平板三维示意图。Fig. 3 is a three-dimensional schematic diagram of a microchannel plate.
图4是本发明所述的微通道热沉性能测试装置的示意图。Fig. 4 is a schematic diagram of the microchannel heat sink performance testing device of the present invention.
具体实施方式 Detailed ways
本发明的微通道热沉包括:发热元件1、微通道平板2和密封盖板3。The microchannel heat sink of the present invention comprises: a heating element 1 , a microchannel plate 2 and a sealing cover plate 3 .
本发明的微通道热沉中,微通道平板2的材料可以是硅、不锈钢、铜或者其它金属合金。In the microchannel heat sink of the present invention, the material of the microchannel plate 2 can be silicon, stainless steel, copper or other metal alloys.
本发明的微通道热沉中,微通道平板2包括:流体入口4、进口压力测量端口5、空化发生器6、主流微通道7、出口压力测量端口8和流体出口9。In the microchannel heat sink of the present invention, the microchannel plate 2 includes: a fluid inlet 4 , an inlet pressure measurement port 5 , a cavitation generator 6 , a mainstream microchannel 7 , an outlet pressure measurement port 8 and a fluid outlet 9 .
本发明的微通道热沉中,在流体入口4与主流微通道7之间有一流量分配腔A,在主流微通道7与流体出口9之间有一流体汇集腔B。In the microchannel heat sink of the present invention, there is a flow distribution chamber A between the fluid inlet 4 and the main flow microchannel 7 , and a fluid collection chamber B between the main flow microchannel 7 and the fluid outlet 9 .
本发明的微通道热沉中,在主流微通道中沿液体流动方向间隔地设置有空化发生器6,空化发生器6之间可以是等间距的排列设置,或不等间距(即不规律)的排列设置。空化发生器6与主流微通道7之间的宽度比值(h/H)范围为0.1~0.6。In the microchannel heat sink of the present invention, cavitation generators 6 are arranged at intervals along the liquid flow direction in the main flow microchannel, and the cavitation generators 6 can be arranged at equal intervals, or at unequal intervals (that is, not at equal intervals) regularity) arrangement. The width ratio (h/H) between the cavitation generator 6 and the main microchannel 7 ranges from 0.1 to 0.6.
本发明的微通道热沉中,空化发生器6与主流微通道7的横截面可以是方形、圆形、三角形、梯形或者多边形,两者的当量直径比值范围为0.2~0.7。In the microchannel heat sink of the present invention, the cross section of the cavitation generator 6 and the mainstream microchannel 7 can be square, circular, triangular, trapezoidal or polygonal, and the equivalent diameter ratio of the two is in the range of 0.2-0.7.
本发明的微通道热沉中,密封盖板3由流体入口4、进口压力测量端口5、出口压力测量端口8和流体出口9组成,其材料可以是硅、不锈钢、铜或者耐温透明玻璃。In the microchannel heat sink of the present invention, the sealing cover plate 3 is composed of a fluid inlet 4, an inlet pressure measurement port 5, an outlet pressure measurement port 8 and a fluid outlet 9, and its material can be silicon, stainless steel, copper or heat-resistant transparent glass.
本发明的微通道热沉性能测试装置包括:微通道热沉、储液槽10、动力泵11、阀门12和18、热电偶13、15和17、压力测量传感器14和16、流量计19、冷却器20、数据采集系统21和计算机22。The microchannel heat sink performance testing device of the present invention comprises: microchannel heat sink,
本发明的测试装置中,热电偶13和17安装在微通道热沉的流体入口和流体出口,分别测量微通道热沉入口和出口处流体的温度;热电偶15安装在微通道平板2背部的加热元件表面,用来测量加热壁面温度。In the testing device of the present invention,
本发明的测试装置中,压力传感器14安装在微通道热沉的进口压力测量端口5上,压力传感器16安装在微通道热沉出口压力测量端口8上。In the test device of the present invention, the pressure sensor 14 is installed on the inlet pressure measurement port 5 of the microchannel heat sink, and the pressure sensor 16 is installed on the outlet pressure measurement port 8 of the microchannel heat sink.
本发明的测试装置中,阀门12安装在动力泵11与微通道热沉的流体入口之间,阀门18安装在微通道热沉的流体出口的下游,通过配合调节阀门12和18,可以调节微通道热沉的流体入口和出口的压力,以达到液体空化的条件。In the test device of the present invention, the
本发明的测试装置中,冷却器20安装在微通道热沉的下游,以保持进入微通道热沉的流体温度的恒定。In the test device of the present invention, the
本发明的测试装置中,所有温度信号、压力信号和流量信号均通过数据采集系统21采集到计算机22进行处理和分析。In the test device of the present invention, all temperature signals, pressure signals and flow signals are collected by the
以下结合附图对本发明作详细说明。The present invention will be described in detail below in conjunction with the accompanying drawings.
请参阅图1~图3所示,冷却液体介质通过流体入口4进入微通道平板内,并通过流量分配腔A将冷却液体平均分配到各个主流微通道7中,本发明的微通道热沉中,主流微通道7的数目可以根据发热元件1的发热面积确定,不限于图中所示的数值。Please refer to Figures 1 to 3, the cooling liquid medium enters the microchannel plate through the fluid inlet 4, and the cooling liquid is evenly distributed to each mainstream microchannel 7 through the flow distribution cavity A, in the microchannel heat sink of the present invention , the number of mainstream microchannels 7 can be determined according to the heating area of the heating element 1, and is not limited to the values shown in the figure.
在主流微通道7中沿液体流动方向每隔一段距离设置空化发生器6,由于空化发生器6的横截面比主流微通道7的横截面小得多,液体在流经空化发生器6时,其流速急剧上升,作为代价其压力急剧下降,从而产生空化气泡。当液体流出空化发生器6,重新进入主流微通道7时,液体压力开始恢复,空化气泡开始溃灭,形成高速微射流,冲击主流微通道7的底部和两侧壁面,从而起到强化传热的作用。由于在主流微通道7的流动方向上设置了多个空化发生器,因此空化气泡不断形成和溃灭,使得整个冷却壁面的传热能力得到了大幅提高。液体流经冷却通道后,在流体汇集腔B中汇集,然后通过流体出口9流出,完成发热元件的冷却。In the main flow microchannel 7, cavitation generators 6 are arranged at intervals along the liquid flow direction. Since the cross section of the cavitation generator 6 is much smaller than the cross section of the main flow microchannel 7, the liquid flows through the cavitation generators. At 6 o'clock, its flow rate rises sharply, and its pressure drops sharply as a price, thereby generating cavitation bubbles. When the liquid flows out of the cavitation generator 6 and re-enters the mainstream microchannel 7, the liquid pressure begins to recover, and the cavitation bubbles begin to collapse, forming a high-speed microjet that impacts the bottom and both sides of the mainstream microchannel 7, thereby strengthening The role of heat transfer. Since a plurality of cavitation generators are arranged in the flow direction of the mainstream microchannel 7, cavitation bubbles are continuously formed and collapsed, so that the heat transfer capability of the entire cooling wall surface is greatly improved. After the liquid flows through the cooling channel, it is collected in the fluid collection cavity B, and then flows out through the fluid outlet 9 to complete the cooling of the heating element.
如图4所示,本发明的微通道热沉性能测试装置由微通道热沉、储液槽10、动力泵11、阀门12和18、热电偶13、15和17、压力测量传感器14和16、流量计19、冷却器20、数据采集系统21和计算机22组成。冷却液体介质的循环动力由动力泵11提供,冷却液体从储液槽10出来后,经过控制阀门12,然后经流体入口4进入微通道热沉内对发热元件进行冷却,完成冷却后从流体出口9流出微通道热沉。为了准确测量微通道热沉的传热能力,必须保证微通道热沉流体入口的液体温度恒定,因此,完成冷却后的液体必须通过冷却器20对其进行冷却,然后重新进入储液槽10。通过设置在进口压力测量端口5和出口压力测量端口8上的压力传感器14和16可以测量微通道热沉入口和出口的液体压力,从而判断微通道热沉内的液体空化情况。微通道热沉入口和出口液体压力的控制可以通过配合调节阀门12和18来实现。通过设置在微通道热沉的流体入口和流体出口以及加热壁面的热电偶13、15和17,可以测量微通道热沉的液体温度以及加热壁面的温度。循环回路中冷却液体的流量由流量计19测量。所有温度信号、压力信号和流量信号均通过数据采集系统21采集到计算机22进行处理和分析。微通道热沉的平均换热系数h通过如下公式得到:As shown in Figure 4, microchannel heat sink performance testing device of the present invention is made of microchannel heat sink,
上式中,q为热流密度,Δt为平均传热温差,cp为冷却液体定压比热,ρ为冷却液体密度,Q为冷却液体循环流量,A为换热面积,tw为壁面温度,tf1为微通道热沉的流体入口液体温度,tf2为微通道热沉的流体出口液体温度。In the above formula, q is the heat flux density, Δt is the average heat transfer temperature difference, c p is the specific heat of the cooling liquid at constant pressure, ρ is the density of the cooling liquid, Q is the circulating flow rate of the cooling liquid, A is the heat transfer area, and t w is the wall temperature , t f1 is the fluid inlet liquid temperature of the microchannel heat sink, and t f2 is the fluid outlet liquid temperature of the microchannel heat sink.
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