CN110867424A - Micro-channel heat sink system with built-in micro-rotor for strengthening heat exchange of nanofluid - Google Patents

Micro-channel heat sink system with built-in micro-rotor for strengthening heat exchange of nanofluid Download PDF

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CN110867424A
CN110867424A CN201911148592.0A CN201911148592A CN110867424A CN 110867424 A CN110867424 A CN 110867424A CN 201911148592 A CN201911148592 A CN 201911148592A CN 110867424 A CN110867424 A CN 110867424A
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micro
nano
heat sink
fluid
channel
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CN110867424B (en
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吴慧英
程潇
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Shanghai Jiaotong University
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3675Cooling facilitated by shape of device characterised by the shape of the housing
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F5/00Elements specially adapted for movement
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4068Heatconductors between device and heatsink, e.g. compliant heat-spreaders, heat-conducting bands

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mixers With Rotating Receptacles And Mixers With Vibration Mechanisms (AREA)
  • Micromachines (AREA)

Abstract

The invention discloses a micro-channel heat sink system with a built-in micro-rotor for strengthening heat exchange of nano-fluid, which comprises a micro-channel heat sink, a magnetic stirrer and a ferromagnetic micro-rotor, wherein the ferromagnetic micro-rotor is arranged in the micro-channel heat sink and driven by the magnetic stirrer to rotate, so that the nano-fluid in the micro-channel heat sink is stirred, and deposition of nano-particles in the micro-channel heat sink is inhibited. According to the invention, the magnetic stirrer is used for stirring the nano fluid flowing in the microchannel heat sink in a rotating manner, so that the increase of heat transfer resistance caused by the deposition of nano particles in the microchannel heat sink can be inhibited, a speed boundary layer and a heat boundary layer are damaged, and the purpose of enhancing heat exchange is achieved.

Description

Micro-channel heat sink system with built-in micro-rotor for strengthening heat exchange of nanofluid
Technical Field
The application relates to the field of microelectronic chip heat dissipation, in particular to a microchannel heat sink system with a built-in micro rotor for strengthening heat exchange of nanofluid.
Background
Temperature is the first leading cause of reliability failure in electronic devices. The existing literature shows that the heating heat flux density of the existing electronic chip exceeds 1000W/cm2. In the field of microelectronic chips, the operating performance of the microelectronic chips is sharply reduced along with the increase of the temperature, and the microelectronic chips are at risk of failure or even burning. Since the wiring of existing chips is almost approaching their physical limits, researchers have proposed stacking chipsIt is contemplated to continue moore's law. As a result of the stacked chips, it is not hard to imagine that they only heat up more and more. Therefore, the heat generated by the chip needs to be taken away quickly and efficiently in time to ensure safe, reliable and efficient operation.
Compared with the traditional millimeter-level channel heat dissipation technology, the micro-channel liquid cooling technology has the heat transfer coefficient 1-2 orders higher. But because the fluid flow in the microchannel is laminar, the mass transfer rate is slow, which limits the further improvement of the heat transfer performance. The nano fluid is a heat exchange medium formed by adding metal or nonmetal powder into liquid, has higher heat conductivity coefficient compared with the pure fluid, and can further improve the heat dissipation capacity of the micro channel by adding the nano fluid into the micro channel. Wherein, the uniform and stable distribution of the nano particles in the fluid is crucial to the high-efficiency heat exchange capability of the nano fluid. The existing experimental research shows that under the condition of long-time operation, nano particles are easy to deposit on the wall surface of the channel, so that the heat transfer resistance of the wall surface is increased, the power consumption of a pump is further increased, and the heat transfer is deteriorated; more seriously, even the nanoparticles block the channel, so that the cooling mode fails and the reliable guarantee cannot be provided for the operation of the microelectronic chip.
Disclosure of Invention
Aiming at the problems in the prior art, the invention provides a method for enhancing the convection heat transfer by arranging a micro rotor in a micro channel and driving the rotor to rotate under the action of a magnetic stirrer to destroy the thermal boundary layer and the velocity boundary layer of the nano fluid; meanwhile, the magnetic stirring speed is changed to regulate and control the real-time deposition of the nano particles, so that the increase of heat transfer resistance caused by the deposition of the nano particles is inhibited, the uniformity of the temperature of the chip can be obviously improved, the heat dissipation heat flow density is improved, and the method can be applied to the fields of heat dissipation of microelectronic chips and the like.
In order to solve the above problems, the present invention provides a microchannel heat sink system with built-in micro-rotors for enhancing heat exchange of nanofluid, comprising: the magnetic micro-rotor is arranged in the micro-channel heat sink and driven by the magnetic stirrer to rotate, so that nano-fluid in the micro-channel heat sink is stirred, and nano-particles are inhibited from depositing in the micro-channel heat sink.
Preferably, the microchannel heat sink comprises: a microchannel heat sink substrate, wherein a first plane of the microchannel heat sink substrate is provided with a micro-cavity for accommodating the ferromagnetic micro-rotor, a nano-fluid inflow channel, a nano-fluid outflow channel, a first nano-fluid inlet hole and a first nano-fluid outlet hole, and the first nano-fluid inlet hole and the first nano-fluid outlet hole are communicated with each other through the nano-fluid inflow channel, the micro-cavity and the nano-fluid outflow channel in sequence; and the microchannel heat sink cover plate is provided with a second nano fluid inlet hole and a second nano fluid outlet hole which respectively correspond to the first nano fluid inlet hole and the first nano fluid outlet hole formed in the microchannel heat sink base.
Preferably, a micro cylinder is arranged in the micro chamber, and the ferromagnetic micro rotor can be sleeved on the micro cylinder.
Preferably, the microchannel heat sink base has a size of 10mm x 30mm x 0.5mm, the first nanofluid inlet hole has a diameter of 2mm, the first nanofluid outlet hole has a diameter of 2mm, the microchamber has a diameter of 5mm, the microcylinder has a diameter of 0.8mm, the nanofluid inlet channel has a width of 0.8mm, and the nanofluid outlet channel has a width of 0.8 mm.
Preferably, the microchannel heat sink cover plate has a size of 10mm x 30mm x 0.5mm, the second nanofluid inlet hole has a diameter of 2mm, and the second nanofluid outlet hole has a diameter of 2 mm.
Preferably, the microchannel heat sink substrate is silicon-based, copper-based or aluminum-based.
Preferably, the nanofluid is Al2O3Nanofluid or TiO2A nanofluid.
Preferably, the ferromagnetic micro-rotor is wound by galvanized iron wires.
Preferably, the magnetic stirrer provides a rotation speed of 0-6000 rpm.
Preferably, the microchannel heat sink cover plate is a glass cover plate.
Preferably, the micro-channel heat sink substrate further comprises a simulated heat source disposed on the second plane of the micro-channel heat sink substrate, and the simulated heat source is corresponding in size and position to the micro-chamber.
Compared with the prior art, the invention has the following technical effects:
1. according to the embodiment of the invention, the micro rotor is arranged in the micro channel, and the rotor is driven to rotate under the action of the magnetic stirrer, so that a thermal boundary layer and a speed boundary layer of the nano fluid are damaged, and the convection heat exchange is enhanced; meanwhile, the real-time deposition of the nano particles is regulated and controlled by changing the magnetic stirring speed, the increase of heat transfer resistance caused by the deposition of the nano particles is inhibited, the uniformity of the temperature of the chip can be obviously improved, and the heat dissipation heat flow density is improved.
2. The microchannel heat sink can be widely applied to the fields of heat dissipation of microelectronic chips and the like.
Of course, it is not necessary for any product in which the invention is practiced to achieve all of the above-described advantages at the same time.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below. It is obvious that the drawings in the following description are only some embodiments of the invention, and that for a person skilled in the art, other drawings can be derived from them without inventive effort. In the drawings:
FIG. 1 is a schematic three-dimensional explosion diagram of a microchannel heat sink system with built-in micro-rotors to enhance heat exchange of nanofluids in accordance with an embodiment of the present invention;
FIG. 2 is a schematic plan view of a micro-rotor built in a micro-channel according to an embodiment of the present invention;
FIG. 3 is a schematic plan view of a microchamber in a microchannel according to an embodiment of the invention;
FIG. 4 is a schematic diagram of a simulated heat source on the backside of a microchannel heat sink substrate in accordance with an embodiment of the present invention.
Detailed Description
The microchannel heat sink system with built-in micro-rotors for enhancing heat exchange of nanofluid provided by the invention will be described in detail with reference to the accompanying drawings. The embodiment is implemented on the premise of the technical scheme of the invention, and a detailed implementation mode and a specific operation process are given. The scope of the present invention is not limited to the following examples, and those skilled in the art can modify and decorate the present invention without departing from the spirit and scope of the present invention.
In the embodiment of the invention, the ferromagnetic micro-rotor is arranged in the microchannel heat sink and is driven by the magnetic stirrer to rotate, so that a thermal boundary layer and a speed boundary layer of the nano fluid are damaged, and the convection heat transfer is enhanced; meanwhile, the magnetic stirring speed is changed to regulate and control the real-time deposition of the nano particles, so that the increase of heat transfer resistance caused by the deposition of the nano particles is inhibited, the uniformity of the temperature of the chip can be obviously improved, the heat dissipation heat flow density is improved, and the method can be applied to the fields of heat dissipation of microelectronic chips and the like.
Referring to fig. 1-3, a microchannel heat sink system with built-in micro-rotors for enhancing heat exchange of nano-fluid includes a microchannel heat sink, a magnetic stirrer 4 and a ferromagnetic micro-rotor 3, wherein the ferromagnetic micro-rotor 3 is disposed in the microchannel heat sink and driven by the magnetic stirrer 4 to rotate, so as to stir the nano-fluid in the microchannel heat sink and inhibit deposition of nano-particles in the microchannel heat sink.
Specifically, the microchannel heat sink comprises a microchannel heat sink substrate 1, wherein a micro chamber 13 for accommodating the ferromagnetic micro rotor 3, a nanofluid inflow channel 15, a nanofluid outflow channel 16, a first nanofluid inlet hole 11 and a first nanofluid outlet hole 12 are formed in a first plane of the microchannel heat sink substrate 1, and the first nanofluid inlet hole 11 and the first nanofluid outlet hole 12 are sequentially communicated through the nanofluid inflow channel 15, the micro chamber 13 and the nanofluid outflow channel 16;
a microchannel heat sink cover plate 2, wherein the microchannel heat sink cover plate 2 is provided with a second nanofluid inlet hole 21 and a second nanofluid outlet hole 22 respectively corresponding to a first nanofluid inlet hole 11 and a first nanofluid outlet hole 12 formed on the microchannel heat sink base 1;
the magnetic stirrer 4 is disposed on a second plane of the microchannel heat sink substrate 1, and in this embodiment, the first plane and the second plane are two opposite planes on the microchannel heat sink substrate 1.
The ferromagnetic micro rotor 3 is driven by the magnetic stirrer 4 to rotate, and the nano fluid in the micro chamber 13 is stirred.
The microchannel heat sink of the embodiment of the invention is formed by packaging a microchannel heat sink substrate 1 and a microchannel heat sink cover plate 2, wherein the microchannel heat sink cover plate 2 is arranged on a first plane of the microchannel heat sink substrate 1, and a second nano-fluid inlet hole 21 corresponds to a first nano-fluid inlet hole 11, and a second nano-fluid outlet hole 22 corresponds to a first nano-fluid outlet hole 12.
In a preferred embodiment, a micro-cylinder 14 is disposed in the micro-chamber 13, and the ferromagnetic micro-rotor 3 can be sleeved on the micro-cylinder 14.
Specifically, in order to ensure that the ferromagnetic micro-rotor 3 can reliably operate, the ferromagnetic micro-rotor 3 in this embodiment is made of galvanized iron wire with a diameter of 0.2mm, the structure of the ferromagnetic micro-rotor 3 includes a circular structure, and the ferromagnetic micro-rotor 3 is sleeved on the micro-cylinder 14 through the circular structure; the purpose of the galvanization is to prevent the bare wire from being oxidized by dissolved oxygen in the nanofluid under operating conditions. It is understood that the ferromagnetic micro-rotor 3 can be made of iron wire or other ferromagnetic materials, and the shape is not limited as long as it is rotatably hung on the micro-cylinder 14 of the micro-chamber 13. Meanwhile, it should be noted that the equivalent diameter of the rotation of the ferromagnetic micro-rotor 3 needs to be smaller than the diameter of the micro-chamber 13, and the height of the ferromagnetic micro-rotor 3 needs to be smaller than the depth of the micro-chamber 13, so that the ferromagnetic micro-rotor 3 can be accommodated in the micro-chamber 13.
Further, to ensure that the ferromagnetic micro-rotor 3 operates reliably, it is necessary to ensure that the inner diameter of the circle on the micro-rotor structure is at least 20 μm larger than the diameter of the micro-cylinder 14. Meanwhile, the equivalent diameter of the rotation of the ferromagnetic micro-rotor 3 should be at least 20 micrometers smaller than the diameter of the micro-chamber 13, and the height of the ferromagnetic micro-rotor 3 needs to be at least 20 micrometers smaller than the depth of the micro-chamber 13.
Before the microchannel is subjected to heat sink bonding and packaging, the ferromagnetic micro-rotor 3 is sleeved on the micro-cylinder 14 in the micro-cavity 13, and the ferromagnetic micro-rotor 3 can be ensured to reliably rotate.
In this embodiment, the microchannel heat sink substrate 1 is made of a silicon-based material, but in the actual application process, materials such as a copper-based material and an aluminum-based material may be used, and the size of the materials is 10mm by 30mm by 0.5 mm. A microchannel with the depth of 0.22mm is etched on the microchannel heat sink substrate 1 by a deep silicon etching technique, wherein the diameter of the first nanofluid inlet hole 11 is 2mm, the diameter of the first nanofluid outlet hole 12 is 2mm, the diameter of the micro-chamber 13 is 5mm, the diameter of the micro-cylinder 14 is 0.8mm, and the height is 0.22 mm. The width of the nanofluid inflow channel 15 on the left side of the micro-chamber 13 is 0.8mm, and the width of the nanofluid outflow channel 16 on the right side of the micro-chamber 13 is 0.8 mm;
the microchannel heat sink cover plate 2 has dimensions of 10mm x 30mm x 0.5mm, and the second nanofluid inlet port 21 and the second nanofluid outlet port 22 are machined by a laser drilling technique, the diameter of the second nanofluid inlet port 21 being 2mm, and the diameter of the second nanofluid outlet port 22 being 2 mm.
In this embodiment, the magnetic stirrer 4 is provided at a rotation speed of 0 to 6000 rpm.
As a preferred embodiment, the micro-channel heat sink system with built-in micro-rotors for enhancing heat exchange of nano-fluid in the embodiment of the present invention is applicable to all nano-fluids, i.e. the material type, the nanoparticle particle size, the viscosity, etc. of the nano-fluid are not limited, and may be Al2O3Nanofluid, TiO2Nanofluids, and the like. The embodiment of the invention adopts Al with the grain diameter of 30nm and prepared by taking deionized water as base liquid2O3A nanofluid.
As a preferred embodiment, the microchannel heat sink cover plate 2 is a glass cover plate.
As a preferred embodiment, referring to fig. 4, a simulated heat source 5 is further integrated on the back of the microchannel heat sink substrate 1, the simulated heat source 5 is circular, has a diameter of 5mm, and has a size and a position corresponding to the micro-chamber 13 on the front surface of the microchannel heat sink substrate 1, and can be used for simulating the heating process of a real electronic chip. The silicon material has a high thermal conductivity 148 w/(m.k), can rapidly transmit heat, and the current chip manufacturing material is also silicon, so the microchannel heat sink substrate 1 can be well integrated with a real electronic chip device at a later stage.
When the device is used, the nanofluid flows in from the nanofluid inlet hole 21, after the nanofluid flows into the microchannel for heat sinking, the deposition condition of nanoparticles in the microchannel is observed through the microchannel heat sinking cover plate 1 at the top, and whether the magnetic stirrer 4 is started or not is judged according to the actual deposition condition. During the short time that the nanofluid is flowing into the microchannel, it is possible that not much nanoparticles are deposited, and at this time, the magnetic stirrer 4 may be selectively turned on or off. If the magnetic stirrer 4 is turned on at this time, the velocity boundary layer and the thermal boundary layer of the wall fluid can be destroyed, and the convective heat transfer can be enhanced, although the deposition of the nanoparticles is not inhibited. When a large amount of nanoparticles are observed to be deposited, the magnetic stirrer 4 may be turned on to drive the ferromagnetic micro-rotor 3, and the ferromagnetic micro-rotor 3 may rotate to drive away the deposited nanoparticles. Finally, the nanofluid carries away the heat emitted from the electronic chip and flows out through the nanofluid outlet hole 22.
The disclosure above is only one specific embodiment of the present application, but the present application is not limited thereto, and any variations that can be made by those skilled in the art are intended to fall within the scope of the present application.

Claims (11)

1. The built-in little rotor strengthens microchannel heat sink system of nanometer fluid heat transfer, its characterized in that includes: the magnetic micro-rotor is arranged in the micro-channel heat sink and driven by the magnetic stirrer to rotate, so that nano-fluid in the micro-channel heat sink is stirred, and nano-particles are inhibited from depositing in the micro-channel heat sink.
2. The micro-channel heat sink system with built-in micro-rotors for enhancing heat exchange of nano-fluids according to claim 1, wherein the micro-channel heat sink comprises:
a microchannel heat sink substrate, wherein a first plane of the microchannel heat sink substrate is provided with a micro-cavity for accommodating the ferromagnetic micro-rotor, a nano-fluid inflow channel, a nano-fluid outflow channel, a first nano-fluid inlet hole and a first nano-fluid outlet hole, and the first nano-fluid inlet hole and the first nano-fluid outlet hole are communicated with each other through the nano-fluid inflow channel, the micro-cavity and the nano-fluid outflow channel in sequence;
and the microchannel heat sink cover plate is provided with a second nano fluid inlet hole and a second nano fluid outlet hole which respectively correspond to the first nano fluid inlet hole and the first nano fluid outlet hole formed in the microchannel heat sink base.
3. The microchannel heat sink system with built-in micro-rotors for enhancing heat exchange of nanofluids as claimed in claim 2, wherein a micro-cylinder is disposed in the micro-chamber, and the ferromagnetic micro-rotor can be sleeved on the micro-cylinder.
4. The micro-channel heat sink system with built-in micro-rotor for enhancing heat exchange of nano-fluid according to claim 2, wherein the micro-channel heat sink substrate has a size of 10mm x 30mm x 0.5mm, the first nano-fluid inlet hole has a diameter of 2mm, the first nano-fluid outlet hole has a diameter of 2mm, the micro-chamber has a diameter of 5mm, the micro-cylinder has a diameter of 0.8mm, the nano-fluid inflow channel has a width of 0.8mm, and the nano-fluid outflow channel has a width of 0.8 mm.
5. The micro-channel heat sink system with built-in micro-rotor for enhancing heat exchange of nano-fluid according to claim 2 or 4, wherein the size of the micro-channel heat sink cover plate is 10mm x 30mm x 0.5mm, the diameter of the second nano-fluid inlet hole is 2mm, and the diameter of the second nano-fluid outlet hole is 2 mm.
6. The micro-channel heat sink system with built-in micro-rotors for enhancing heat exchange of nano-fluid according to claim 2, wherein the micro-channel heat sink substrate is silicon-based, copper-based or aluminum-based.
7. Root of herbaceous plantThe micro-channel heat sink system with built-in micro-rotor for enhancing heat exchange of nano-fluid according to claim 1 or 2, wherein the nano-fluid is Al2O3Nanofluid or TiO2A nanofluid.
8. The micro-channel heat sink system with built-in micro-rotors for enhancing heat exchange of nano-fluid as claimed in claim 1 or 2, wherein the ferromagnetic micro-rotors are wound by galvanized iron wires.
9. The micro-channel heat sink system with built-in micro-rotor for enhancing heat exchange of nano-fluid according to claim 1 or 2, wherein the magnetic stirrer provides a rotation speed of 0-6000 rpm.
10. The micro-channel heat sink system with built-in micro-rotors for enhancing heat exchange of nano-fluid according to claim 2, wherein the micro-channel heat sink cover plate is a glass cover plate.
11. The micro-channel heat sink system with built-in micro-rotors for enhancing heat exchange of nano-fluid as claimed in claim 2, further comprising a simulated heat source disposed on the second plane of the micro-channel heat sink substrate and corresponding in size and position to the micro-chamber.
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CN114001585A (en) * 2020-07-28 2022-02-01 浙江高晟光热发电技术研究院有限公司 Magnetic stirring type heat exchanger
CN116314084A (en) * 2023-05-24 2023-06-23 中国人民解放军国防科技大学 Micro-particle flow heat exchange device based on jet flow exciter

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CN104956487A (en) * 2012-08-20 2015-09-30 贺利氏特种光源美国有限责任公司 Micro-channel-cooled high heat load light emitting device

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CN2837916Y (en) * 2005-07-19 2006-11-15 讯凯国际股份有限公司 Water-cooled heat radiation mechanism
CN1967823A (en) * 2005-11-16 2007-05-23 富准精密工业(深圳)有限公司 Integrated liquid cooling heat radiator
CN1967822A (en) * 2005-11-17 2007-05-23 富准精密工业(深圳)有限公司 Integrated liquid cooling heat radiator
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Publication number Priority date Publication date Assignee Title
CN114001585A (en) * 2020-07-28 2022-02-01 浙江高晟光热发电技术研究院有限公司 Magnetic stirring type heat exchanger
CN116314084A (en) * 2023-05-24 2023-06-23 中国人民解放军国防科技大学 Micro-particle flow heat exchange device based on jet flow exciter
CN116314084B (en) * 2023-05-24 2023-08-04 中国人民解放军国防科技大学 Micro-particle flow heat exchange device based on jet flow exciter

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