CN206073779U - A kind of micro-nano compound structure surface is heat sink - Google Patents
A kind of micro-nano compound structure surface is heat sink Download PDFInfo
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- CN206073779U CN206073779U CN201621052450.6U CN201621052450U CN206073779U CN 206073779 U CN206073779 U CN 206073779U CN 201621052450 U CN201621052450 U CN 201621052450U CN 206073779 U CN206073779 U CN 206073779U
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Abstract
The utility model discloses a kind of micro-nano compound structure surface is heat sink, for great-power electronic integrated device field of heat exchange, the heat dissipation problem of high heat flux is solved.Micro-nano compound structure surface of the present utility model is heat sink including microflute group is heat sink and nano coating, in nano coating described in the heat sink Surface Creation of the microflute group, the surfacing that the microflute group is heat sink is quasiconductor, glass, ceramics or metal and its alloy, the micro-channel cross section that the microflute group is heat sink is rectangle, trapezoidal or triangle, and the nano-coating material is metal, metal-oxide, metal fluoride, semi-conducting material or organic polymer coating.This utility model strengthens the heat exchange property of microflute group's heat sink surface by the nano coating, while using the extended surface and capillary force factor of microflute group structure, lifting heat sink phase-change heat-exchange ability.
Description
Technical field
This utility model is related to Thermal Power Engineering technical field, and more particularly to a kind of great-power electronic integrated device is heat sink.
Background technology
With the development of new and high technology, including including various calculating process chips, Laser Devices, high-powered LED lamp piece etc.
Great-power electronic integrated device operation power it is increasing.Wherein, these dissipative cells have while effective power is played
Quite a few electrical power is converted into heat, and producing for heat will be along with the rising of these high power electronic device temperatures.
But, operation of the high temperature to these high-power electronic devices is very unfavorable, for example, if high-powered LED lamp is not added with any dissipating
Hot device, can burn after several seconds in energization work；The central processing unit (CPU) of computer or server, in high-power operation
When operational efficiency can be decreased obviously.At present for these highly energy-consuming equipment and device, especially for large-scale energy consumption equipment machine
Group, relatively effective solutions for refrigeration are cooled down using high-power refrigeration air-conditioning unit, and what the use of refrigeration air-conditioner brought is
The consuming of a large amount of electric energy.Turned using in the scheme of refrigeration air-conditioner, there is a large portion electric energy in the power consumption of heater members itself
Turn to useless heat energy, it is air conditioning unit and expend a large amount of electric energy to complete refrigeration.In this course, capital construction, operation,
Maintenance cost is greatly increased, and fault rate can correspondingly be improved.For list is from radiating angle, refrigeration air-conditioner cooling is that heating sets
The air of standby host group place interior volume, then heat-producing device unit is cooled down using cold air indirectly, it is directly right to fail
Pyrotoxin is cooled down, and separately has heating unit often complex structure, and cooling air often forms flowing " dead band ", in " dead band "
Air flow is not smooth, often there is larger thermograde, and heat is difficult to quickly dissipate, and this is extremely disadvantageous to radiating.Together
When, often there is serious cold and reveal in heat-producing device unit place space, this causes to waste to energy again.And it is electric
Equipment high-power, integrated development trend necessarily cause heat flow density increase of radiating, therefore, exploitation is designed more efficient
Radiator for fundamentally solving the problems, such as that these high-power heater members radiating and coolings are imperative.
Phase-change heat-exchange is heat sink to be used widely in terms of great-power electronic integrated device heat exchange.But current phase-change heat-exchange
Heat sink most employing common plane, or the optimization heat-transfer surface with expanding surfaces such as large scale fins is heat sink, minority product is adopted
The surface optimization designing technique processed with minute yardstick (includes micro- chis such as micro-channel, microcylinder, micro- shaft of rib are processed on common plane
Degree surface optimization technology).In experimentation, the research to phase-change heat-exchange also stays at the research rank of phase-change heat-exchange under minute yardstick
Section.The phase-change heat-exchange adopted by prior art takes that heat is heat sink, and fail to give full play of heat exchange surface takes heat energy power, it is difficult to solve
The heat dissipation problem of high heat flux.
The content of the invention
(1) technical problem to be solved
For disadvantages mentioned above of the prior art, this utility model is heat sink there is provided a kind of micro-nano compound structure surface, base
The ultimate principle of phase-change heat-exchange under micro/nano-scale, improves heat sink exchange capability of heat, makes to be converted into that a part of electric energy of heat
Taken away from high temperature heat source in the form of liquid working substance phase transformation rapidly, and be finally lost in the middle of air and other media, significantly
Degree reduces from thermal source to the middle thermal resistance radiated in final medium (mainly air), fundamentally solves heating function unit
The too high problem of part running temperature.
(2) technical scheme
The technical solution of the utility model is as follows：
The utility model proposes a kind of micro-nano compound structure surface is heat sink, including microflute, group is heat sink, also applies including nanometer
Layer, the nano coating is in the heat sink Surface Creation of the microflute group：The surfacing that the microflute group is heat sink is quasiconductor, glass
Glass, ceramics or metal and its alloy；The micro-channel cross section that the microflute group is heat sink is rectangle, trapezoidal or triangle；It is described to receive
Rice coating material is metal, metal-oxide, metal fluoride, semi-conducting material or organic polymer coating.
The nano coating thickness is 0～1000nm.The micro-channel width of the rectangular micro-channel is in 0.05～2mm scopes
Interior, in the range of 0.05～2mm, adjacent micro-channel spacing is in the range of 0.05～5mm for micro-channel depth.The trapezoidal micro-channel
Trapezoidal upper bottom edge length be 0.05～2mm, edge lengths of going to the bottom be 0.07～4mm, micro-channel depth be 0.05～8mm, it is adjacent
Micro-channel spacing is 0.05～5mm.The bottom land drift angle of the triangle micro-channel be 5 °～120 °, micro-channel depth be 0.05～
8mm, adjacent micro-channel spacing are 0.05～5mm.
(3) beneficial effect
1st, the micro-nano compound structure surface in this utility model is heat sink, hence it is evident that enhance the phase inversion of microflute group's heat sink surface
Heat energy power.
2nd, the micro-nano compound structure surface in this utility model is heat sink, makes the useless and damaging heat produced by thermal source with table
Face liquid working substance is carrier, departs from rapidly thermal source by phase transformation, and meeting reduces the requirement of heater element surface temperature.
Description of the drawings
Fig. 1 is according to a kind of heat sink embodiment axonometric chart in micro-nano compound structure surface of the present utility model；
Fig. 2 is according to a kind of heat sink rectangular micro-channel microcosmic knot in micro-nano compound structure surface of this utility model embodiment
Composition；
Fig. 3 is according to a kind of heat sink trapezoidal micro-channel microcosmic knot in micro-nano compound structure surface of this utility model embodiment
Composition；
Fig. 4 is according to a kind of heat sink triangle micro-channel microcosmic in micro-nano compound structure surface of this utility model embodiment
Structure chart；
Fig. 5 is a kind of real work of the heat sink horizontal positioned in micro-nano compound structure surface according to this utility model embodiment
Design sketch.
Fig. 6 is a kind of real work of the heat sink vertical placement in micro-nano compound structure surface according to this utility model embodiment
Design sketch.
Specific embodiment
To make the purpose of this utility model, technical scheme and advantage become more apparent, below in conjunction with specific embodiment, and
Referring to the drawings, the utility model is described in further detail.
For solve problem above, this utility model on the basis of the heat sink phase-change heat-exchange experimentation in existing surface, from table
Further enhanced heat exchange design is carried out to microflute group heat sink surface in the angle of face optimization.Receive in microflute group's heat sink surface application
Metrical scale materials processing technology generates nano coating, applies the special natures such as dimensional effect, the skin effect of nano material, changes
The physical characteristics such as heat sink surface roughness, wettability, surface energy are become, using the affine energy between nano coating and liquid working substance
The invigoration effect that power and nano coating are generated to steam bubble in phase-change heat-exchange, improves heat sink phase-change heat-exchange ability.Meanwhile, profit
With the multizone composite phase-change heat transfer characteristic occurred on falcate liquid film in the heat sink micro groove structure of microflute group, make heat sink to possess
The micro-scale evaporation of high intensity and the composite phase-change exchange capability of heat that seethes with excitement.On this micro-nano compound structure surface, liquid working substance
When undergoing phase transition generation steam bubble, steam bubble produces frequency to be accelerated, and disengaging, explosion size reduce.This is meant that in phase transformation generation table
Face, the dry region area at steam bubble generation reduce, and surrounding liquid working medium is due to can be with the affinity interaction on nano coating surface
More promptly be filled into the dry place for producing steam bubble, i.e., " liquid working substance takes heat --- liquid working substance phase transformation, produce steam bubble ---
Bubble departure or explosion --- new liquid refills the dry place of steam bubble generation " whole cycle greatly shortens so that heat
Useless and damaging heat produced by source rapidly departs from thermal source by phase transformation with surface liquid working medium as carrier, meets reduction
The requirement of heater element surface temperature.
This utility model nano-coating material is metal, metal-oxide, metal fluoride, semi-conducting material or organic high
Polymer paint etc., such as gold, silver, nickel, titanium dioxide, ito thin film etc..Nano coating thickness is 0～1000nm.Microflute group is heat sink
Surfacing is quasiconductor (silicon, germanium, GaAs), glass, ceramics, metal and its alloy etc..
Fig. 1 is according to a kind of heat sink embodiment axonometric chart in micro-nano compound structure surface of the present utility model.The present embodiment
In, aldehyde-titanium nano coating thin film is plated with using magnetron sputtering technique on the surface of microflute, so as to form micro-nano compound structure surface heat
It is heavy.The surfacing of microflute is silicon boron glass.Nano coating thickness is 0～1000nm.
Fig. 2 is according to a kind of heat sink rectangular micro-channel microcosmic knot in micro-nano compound structure surface of this utility model embodiment
Composition.Heat sink surface micro-channel cross section is rectangle, and, in the range of 0.05～2mm, micro-channel depth is 0.05 for micro-channel width
In the range of～2mm, adjacent micro-channel spacing is in the range of 0.05～5mm.
Fig. 3 is according to a kind of heat sink trapezoidal micro-channel microcosmic knot in micro-nano compound structure surface of this utility model embodiment
Composition.It is 0.05～2mm that heat sink surface micro-channel cross section is trapezoidal, trapezoidal upper bottom edge length, and edge lengths of going to the bottom are 0.07
～4mm, micro-channel depth are 0.05～8mm, and adjacent micro-channel spacing is 0.05～5mm.
Fig. 4 is according to a kind of heat sink triangle micro-channel microcosmic in micro-nano compound structure surface of this utility model embodiment
Structure chart.Heat sink surface micro-channel cross section is triangle, and the bottom land drift angle of triangle is 5 °～120 °, and micro-channel depth is
0.05～8mm, adjacent micro-channel spacing are 0.05～5mm.
Fig. 5 is a kind of real work of the heat sink horizontal positioned in micro-nano compound structure surface according to this utility model embodiment
Design sketch.Fig. 6 is a kind of real work of the heat sink vertical placement in micro-nano compound structure surface according to this utility model embodiment
Design sketch.When the heat sink horizontal positioned in micro-nano compound structure surface, liquid layer is sprawled using heat sink surface, by phase inversion of seething with excitement
Heat carries out cooling to thermal source part.When the heat sink vertical placement in micro-nano compound structure surface, liquid working substance is acted in capillary force
Under be inhaled in micro-channel, hydrophilic nano coating can increase the moistening height in micro-channel, reduce liquid working substance and rise resistance
Power.It is horizontally disposed and vertically arrange both application forms, for heater members in Practical Project practice arrangement condition preferentially
From can play the enhanced heat exchange characteristic that micro-nano compound structure has, it is adaptable to different occasions and condition.In this practicality
In the heat exchange application that the micro-nano compound structure of new embodiment is heat sink, integrated radiator has also been integrated into heat pipe correlation technique, micro-
The gas working medium formed by nano compound structure heat sink surface phase transformation, becomes liquid again condensing rapidly on the wall of low-temperature receiver again
Body state, returns to micro-nano compound structure surface, takes thermal element as high heat flux thermal source, complete in integrated radiator
Heat is taken in radiation processes, is the most critical link for reducing entire thermal resistance, heat and radiating are taken such that it is able to meet high heat flux
Require.In the middle of the experimental verification on the micro-nano compound structure surface to this utility model embodiment, can be found by data analysiss,
In the range of certain heat flow density, take hot surface mean temperature and there is the relatively low degree of superheat, and there is the preferable linearity.Phase
Than in microchanneled surface, when the aldehyde-titanium nano coating on surface reaches 250nm and the above, surface phase transformation steam bubble is substantially refined, steam bubble into
Cuclear density is dramatically increased, so as to greatly strengthen enhanced heat exchange effect.
Particular embodiments described above, has carried out entering one to the purpose of this utility model, technical scheme and beneficial effect
Step is described in detail, it should be understood that be the foregoing is only specific embodiment of the utility model, is not limited to this reality
With new, all within spirit of the present utility model and principle, any modification, equivalent substitution and improvements done etc. all should be included
Within protection domain of the present utility model.
Claims (5)
1. a kind of micro-nano compound structure surface is heat sink, and including microflute, group is heat sink, it is characterised in that also including nano coating, described
Nano coating is in the heat sink Surface Creation of the microflute group：
The surfacing that the microflute group is heat sink is quasiconductor, glass, ceramics or metal and its alloy；
The micro-channel cross section that the microflute group is heat sink is rectangle, trapezoidal or triangle；
The nano-coating material is metal, metal-oxide, metal fluoride, semi-conducting material or organic polymer coating.
2. micro-nano compound structure surface according to claim 1 is heat sink, it is characterised in that the nano coating thickness is 0
～1000nm.
3. micro-nano compound structure surface according to claim 1 is heat sink, it is characterised in that the microflute of the rectangular micro-channel
, in the range of 0.05～2mm, in the range of 0.05～2mm, adjacent micro-channel spacing is in 0.05～5mm for micro-channel depth for road width
In the range of.
4. micro-nano compound structure surface according to claim 1 is heat sink, it is characterised in that the trapezoidal micro-channel it is trapezoidal
Upper bottom edge length be 0.05～2mm, edge lengths of going to the bottom be 0.07～4mm, micro-channel depth be 0.05～8mm, adjacent micro-channel
Spacing is 0.05～5mm.
5. micro-nano compound structure surface according to claim 1 is heat sink, it is characterised in that the groove of the triangle micro-channel
Bottom drift angle is 5 °～120 °, and micro-channel depth is 0.05～8mm, and adjacent micro-channel spacing is 0.05～5mm.
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| CN201621052450.6U CN206073779U (en) | 2016-09-13 | 2016-09-13 | A kind of micro-nano compound structure surface is heat sink |
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| CN201621052450.6U CN206073779U (en) | 2016-09-13 | 2016-09-13 | A kind of micro-nano compound structure surface is heat sink |
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Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107816907A (en) * | 2016-09-13 | 2018-03-20 | 中国科学院工程热物理研究所 | A kind of micro-nano compound structure surface is heat sink and its method for enhanced heat exchange |
| CN108050497A (en) * | 2018-02-11 | 2018-05-18 | 中国科学院工程热物理研究所 | For the side-emitting LED lamp radiator under superelevation heat flow density |
| CN108133918A (en) * | 2018-02-11 | 2018-06-08 | 中国科学院工程热物理研究所 | Micro capillary groove evaporator |
| CN108155164A (en) * | 2018-02-11 | 2018-06-12 | 中国科学院工程热物理研究所 | Microflute group is heat sink and preparation method thereof |
| CN108168345A (en) * | 2018-02-11 | 2018-06-15 | 中国科学院工程热物理研究所 | For the heat sink and its manufacturing method under superelevation heat flow density |
| CN108167790A (en) * | 2018-02-11 | 2018-06-15 | 中国科学院工程热物理研究所 | For photo-thermal integrated device, radiator and the LED light under superelevation heat flow density |
| CN108167671A (en) * | 2018-02-11 | 2018-06-15 | 中国科学院工程热物理研究所 | Side-emitting LED lamp |
| CN108235666A (en) * | 2018-02-11 | 2018-06-29 | 中国科学院工程热物理研究所 | Surface regulation and control flexible microflute group is heat sink, radiator and method |
| CN108302347A (en) * | 2018-02-11 | 2018-07-20 | 中国科学院工程热物理研究所 | Led lamp |
| CN108346633A (en) * | 2017-11-08 | 2018-07-31 | 中电普瑞电力工程有限公司 | A kind of micro-nano structure array heat-delivery surface and preparation method thereof |
| CN109570147A (en) * | 2017-09-29 | 2019-04-05 | 中国科学院工程热物理研究所 | A method of strengthening heat sink wetting characteristics and phase-change heat-exchange performance |
| TWI674389B (en) * | 2018-01-18 | 2019-10-11 | 奇鋐科技股份有限公司 | Middle member of heat dissipation device and the heat dissipation device |
| CN111446221A (en) * | 2020-05-08 | 2020-07-24 | 西安交通大学 | Low-flow-resistance chip embedded array micro-jet radiator and manufacturing method thereof |
| US11131508B2 (en) | 2018-03-19 | 2021-09-28 | Asia Vital Components Co., Ltd. | Middle member of heat dissipation device and the heat dissipation device |
| US11976885B2 (en) | 2021-12-29 | 2024-05-07 | Industrial Technology Research Institute | Phase change thermal management device |
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- 2016-09-13 CN CN201621052450.6U patent/CN206073779U/en not_active Expired - Fee Related
Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107816907A (en) * | 2016-09-13 | 2018-03-20 | 中国科学院工程热物理研究所 | A kind of micro-nano compound structure surface is heat sink and its method for enhanced heat exchange |
| CN109570147A (en) * | 2017-09-29 | 2019-04-05 | 中国科学院工程热物理研究所 | A method of strengthening heat sink wetting characteristics and phase-change heat-exchange performance |
| CN108346633A (en) * | 2017-11-08 | 2018-07-31 | 中电普瑞电力工程有限公司 | A kind of micro-nano structure array heat-delivery surface and preparation method thereof |
| TWI674389B (en) * | 2018-01-18 | 2019-10-11 | 奇鋐科技股份有限公司 | Middle member of heat dissipation device and the heat dissipation device |
| CN108302347A (en) * | 2018-02-11 | 2018-07-20 | 中国科学院工程热物理研究所 | Led lamp |
| CN108050497A (en) * | 2018-02-11 | 2018-05-18 | 中国科学院工程热物理研究所 | For the side-emitting LED lamp radiator under superelevation heat flow density |
| CN108167671A (en) * | 2018-02-11 | 2018-06-15 | 中国科学院工程热物理研究所 | Side-emitting LED lamp |
| CN108235666A (en) * | 2018-02-11 | 2018-06-29 | 中国科学院工程热物理研究所 | Surface regulation and control flexible microflute group is heat sink, radiator and method |
| CN108168345A (en) * | 2018-02-11 | 2018-06-15 | 中国科学院工程热物理研究所 | For the heat sink and its manufacturing method under superelevation heat flow density |
| CN108155164A (en) * | 2018-02-11 | 2018-06-12 | 中国科学院工程热物理研究所 | Microflute group is heat sink and preparation method thereof |
| CN108133918A (en) * | 2018-02-11 | 2018-06-08 | 中国科学院工程热物理研究所 | Micro capillary groove evaporator |
| CN108167790A (en) * | 2018-02-11 | 2018-06-15 | 中国科学院工程热物理研究所 | For photo-thermal integrated device, radiator and the LED light under superelevation heat flow density |
| CN108302347B (en) * | 2018-02-11 | 2024-05-17 | 中国科学院工程热物理研究所 | LED lamp |
| CN108133918B (en) * | 2018-02-11 | 2024-04-26 | 中国科学院工程热物理研究所 | Micro-groove group radiator |
| CN108155164B (en) * | 2018-02-11 | 2024-01-26 | 中国科学院工程热物理研究所 | Micro-groove group heat sink and preparation method thereof |
| CN108235666B (en) * | 2018-02-11 | 2024-03-01 | 中国科学院工程热物理研究所 | Surface-regulated flexible micro-groove group heat sink, heat dissipation device and method |
| US11131508B2 (en) | 2018-03-19 | 2021-09-28 | Asia Vital Components Co., Ltd. | Middle member of heat dissipation device and the heat dissipation device |
| CN111446221A (en) * | 2020-05-08 | 2020-07-24 | 西安交通大学 | Low-flow-resistance chip embedded array micro-jet radiator and manufacturing method thereof |
| US11976885B2 (en) | 2021-12-29 | 2024-05-07 | Industrial Technology Research Institute | Phase change thermal management device |
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