CN201706932U - Vapor chamber - Google Patents
Vapor chamber Download PDFInfo
- Publication number
- CN201706932U CN201706932U CN2009202653011U CN200920265301U CN201706932U CN 201706932 U CN201706932 U CN 201706932U CN 2009202653011 U CN2009202653011 U CN 2009202653011U CN 200920265301 U CN200920265301 U CN 200920265301U CN 201706932 U CN201706932 U CN 201706932U
- Authority
- CN
- China
- Prior art keywords
- cavity
- heat
- working fluid
- water evaporation
- soaking plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
Abstract
The utility model relates to a vapor chamber, in particular to a high efficient vapor chamber, which comprises a casing. A closed hollow cavity is arranged in the casing, an evaporation strengthening capillary layer is arranged in the cavity which is filled with working fluid, and the cavity is divided into a plurality of passages for steam and the working fluid to flow through via dividers. Based on the principle of two-phase heat transfer and by means of being combined with a novel foam metal material, the vapor chamber can be designed into different shapes to meet different requirements, can adopt universal manufacturing methods, realizes batch production easily, and is the novel industrial technique with high efficiency and low cost.
Description
Technical field:
The utility model relates to a kind of heat transfer plate, refers in particular to a kind of dynamical soaking plate.
Background technology:
The fast development of electronic chip technology makes the heat dissipation problem of electronic equipment become more and more important.Several outstanding features: (1) local heat flux density is increasing, and heat focuses in the part easily, causes local temperature too high.(2) heat flow density skewness, high heat flux mostly just is confined in the very little spatial dimension.(3) in the electronic equipment start-up course, occur instantaneous power easily and " rise violently ", burn out electronic equipment.So solve the key of electronic equipment cooling is how fast heat to be derived, and it is too high to reduce local temperature, prevents focus and causes equipment fault.
In order to prevent the inner traditional means that produces focus owing to heat accumulation of electronic chip, be solid fine copper plate or the aluminium block soaking device that attaches the tool high thermal conductivity coefficient at chip surface, the inner heat that produces of electronic chip is drawn out on the radiator in heat conducting mode.Solid fine copper plate soaking device can play to a certain extent and make heat flux distribution even, eliminates the effect of focus.But, can't meet the demands in many occasions because the thermal conductivity factor of copper is limited.The price of copper is ascended to heaven in recent years, and the traditional cooling system of these problem definitions must be in performance, efficient, and aspects such as cost are improved.
The utility model content:
Technical problem to be solved in the utility model is exactly in order to overcome the deficiency of present product, a kind of soaking plate that improves heat transfer efficiency to be provided.
For solving the problems of the technologies described above, the utility model has adopted following technical scheme: this soaking plate comprises: housing, housing is provided with a hollow sealed hollow, be provided with the enhanced water evaporation capillary layer in this cavity, be filled with working fluid in the cavity, cavity is separated into the passage that several supply steam and working fluid to pass through by flow distribution plate.
Described housing comprises: heat-absorbent surface and heat delivery surface.
At least be provided with a capillary column on the described enhanced water evaporation capillary layer, the enhanced water evaporation capillary layer is arranged at the inboard of heat-absorbent surface.
Described cavity is separated into the parallel type passage that several supply steam and working fluid to pass through, passage both ends open by flow distribution plate.
Described flow distribution plate is provided with several tap holes.
Described housing adopts copper or aluminum to form.
Described enhanced water evaporation capillary layer is made by foam copper or copper sponge.
Described working fluid comprises water at least, methyl alcohol or the mixture of the two.
The utility model is to utilize working fluid to absorb a large amount of heat when endotherm section evaporates and become steam, and steam is emitted a large amount of heats when the heat release section condensation.The working fluid of condensation is carried by the enhanced water evaporation capillary layer and is got back to endotherm section.This process is carried out to circulate at a high speed, thereby allows heat with high-speed transfer.Thermal conductivity can be high doubly more a lot of than copper.Can solve the insurmountable problem of many traditional heat-dissipating devices thus.
The utility model is based on the two-phase heat transfer theory, in conjunction with the novel foam metal material, is designed to different shapes easily and goes dealing with various requirements, can adopt general manufacture method, forming a large amount of production easily, is a kind of high-effect, the infant industry technology of low price.The utility model can be applicable to conduct heat widely, in the heat radiation work.For example: be applied in the electronic wafer cooling system, can reduce the wafer operating temperature greatly, increase work efficiency, prolong the wafer life-span; Be applied on the industrial energy saving project, can improve heat transfer efficiency, reduce heat energy loss; In modern science and technology sophisticated society, environmental protection, energy-conservation, fields such as chemical industry all have wide practical use.
Description of drawings:
Fig. 1 is a cutaway view of the present utility model;
Fig. 2 is a part exploded perspective view of the present utility model.
The figure elements explanation:
Enhanced water evaporation capillary layer 3 capillary column 3-1
Runner plate 4 tap hole 4-1
The specific embodiment:
Below in conjunction with accompanying drawing the utility model is further described:
See that the utility model comprises shown in Fig. 1,2: housing 1.
Particularly:
Above-mentioned housing 1 is provided with a hollow sealed hollow 2, and this cavity 2 must keep sealings of height, thereby inside is to carry out under the vacuum condition of height when guaranteeing soaking plate work.High vacuum condition is the assurance that the evaporation and condensation process is efficiently carried out.Be provided with enhanced water evaporation capillary layer 3 in this cavity 2, be filled with working fluid in the cavity 2, cavity 2 is separated into the parallel type passage that several supply steam and working fluid to pass through by flow distribution plate 4, these parallel type passage both ends open, these parallel type passages are kept the mobile order of steam and working fluid, vapour locking is avoided in the generation of restriction bubble, improves usefulness.This flow distribution plate 4 is provided with several tap holes 4-1, the parallel type passage suitably can be communicated with by these tap holes 4-1.
Above-mentioned housing 1 adopts metal materials such as copper or aluminium, forms hollow housing 1 with welding or bonding connection and sealing.This housing 1 comprises: heat-absorbent surface 1-1 and heat delivery surface 1-2.This heat-absorbent surface 1-1 inboard is pasted with enhanced water evaporation capillary layer 3, and heat is passed to enhanced water evaporation capillary layer 3 by the outside of heat-absorbent surface 1-1 and carried out enhanced water evaporation, and steam condenses and emits heat at heat delivery surface 1-2.
Above-mentioned enhanced water evaporation capillary layer 3 is made by foam copper or copper sponge.This enhanced water evaporation capillary layer 3 has fine and closely woven hole, and the evaporation rate of working fluid 4 is improved greatly.This enhanced water evaporation capillary layer 3 also has capillary function, the working fluid that condenses can be sucked back evaporating area rapidly and evaporate, to guarantee that heat transfer process circulates continuously.This enhanced water evaporation capillary layer 3 is provided with two capillary column 3-1.
Above-mentioned working fluid is to carry out liquid liquid and that gaseous state transforms mutually under the temperature of needs.This working fluid sucks when two-phase changes and emits heat, is the carrier that heat transmits.This working fluid can be a water, methyl alcohol or the mixture of the two or other liquid.
Certainly, the above only is the utility model example, be not to limit the utility model practical range,, all should be included in the utility model claim so all equivalences of doing according to the described structure of the utility model claim, feature and principle change or modify.
Claims (7)
1. soaking plate, comprise: housing (1), it is characterized in that: described housing (1) is provided with a hollow sealed hollow (2), be provided with enhanced water evaporation capillary layer (3) in this cavity (2), cavity is filled with working fluid in (2), and cavity (2) is separated into the passage that several supply steam and working fluid to pass through by flow distribution plate (4).
2. according to the described a kind of soaking plate of claim 1, it is characterized in that: described housing (1) comprising: heat-absorbent surface (1-1) and heat delivery surface (1-2).
3. a kind of soaking plate according to claim 2 is characterized in that: be provided with a capillary column (3-1) on the described enhanced water evaporation capillary layer (3) at least, enhanced water evaporation capillary layer (3) is arranged at the inboard of heat-absorbent surface (1-1).
4. a kind of soaking plate according to claim 3 is characterized in that: described cavity (2) is separated into the parallel type passage that several supply steam and working fluid to pass through, passage both ends open by flow distribution plate (4).
5. a kind of soaking plate according to claim 4 is characterized in that: described flow distribution plate (4) is provided with several tap holes (4-1).
6. a kind of soaking plate according to claim 4 is characterized in that: described housing (1) adopts copper or aluminum to form.
7. a kind of soaking plate according to claim 4 is characterized in that: described enhanced water evaporation capillary layer (3) is made by foam copper or copper sponge.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202653011U CN201706932U (en) | 2009-12-22 | 2009-12-22 | Vapor chamber |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202653011U CN201706932U (en) | 2009-12-22 | 2009-12-22 | Vapor chamber |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201706932U true CN201706932U (en) | 2011-01-12 |
Family
ID=43444094
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009202653011U Expired - Fee Related CN201706932U (en) | 2009-12-22 | 2009-12-22 | Vapor chamber |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201706932U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103170812A (en) * | 2011-12-23 | 2013-06-26 | 国研高能（北京）稳态传热传质技术研究院有限公司 | Manufacturing method for aluminum vapor chamber |
| CN104317374A (en) * | 2014-10-28 | 2015-01-28 | 曙光信息产业(北京)有限公司 | Radiating device and method |
| CN104764350A (en) * | 2014-01-08 | 2015-07-08 | 江苏格业新材料科技有限公司 | Method for manufacturing uniform-heating plate with foam copper as liquid absorption core |
-
2009
- 2009-12-22 CN CN2009202653011U patent/CN201706932U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103170812A (en) * | 2011-12-23 | 2013-06-26 | 国研高能（北京）稳态传热传质技术研究院有限公司 | Manufacturing method for aluminum vapor chamber |
| CN103170812B (en) * | 2011-12-23 | 2016-01-20 | 国研高能（北京）稳态传热传质技术研究院有限公司 | A kind of preparation method of aluminum vapor chamber |
| CN104764350A (en) * | 2014-01-08 | 2015-07-08 | 江苏格业新材料科技有限公司 | Method for manufacturing uniform-heating plate with foam copper as liquid absorption core |
| CN104317374A (en) * | 2014-10-28 | 2015-01-28 | 曙光信息产业(北京)有限公司 | Radiating device and method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110112 Termination date: 20131222 |