CN109570147A - A method of strengthening heat sink wetting characteristics and phase-change heat-exchange performance - Google Patents

A method of strengthening heat sink wetting characteristics and phase-change heat-exchange performance Download PDF

Info

Publication number
CN109570147A
CN109570147A CN201710913716.4A CN201710913716A CN109570147A CN 109570147 A CN109570147 A CN 109570147A CN 201710913716 A CN201710913716 A CN 201710913716A CN 109570147 A CN109570147 A CN 109570147A
Authority
CN
China
Prior art keywords
heat sink
plasma
phase
heat
exchange performance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201710913716.4A
Other languages
Chinese (zh)
Other versions
CN109570147B (en
Inventor
周文斌
胡学功
王际辉
单龙
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Institute of Engineering Thermophysics of CAS
Original Assignee
Institute of Engineering Thermophysics of CAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Institute of Engineering Thermophysics of CAS filed Critical Institute of Engineering Thermophysics of CAS
Priority to CN201710913716.4A priority Critical patent/CN109570147B/en
Publication of CN109570147A publication Critical patent/CN109570147A/en
Application granted granted Critical
Publication of CN109570147B publication Critical patent/CN109570147B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention discloses a kind of methods for strengthening heat sink wetting characteristics and phase-change heat-exchange performance, comprising: generates plasma using plasma generator;Functional modification is carried out using the plasma cleaning heat sink surface and to heat sink surface;Wherein, the radio-frequency power of the plasma generator is between 0-20kW;The rf frequency of plasma generator is between 10kHz-30MHz;The processing time of plasma is between 1-60 minutes.

Description

A method of strengthening heat sink wetting characteristics and phase-change heat-exchange performance
Technical field
The present invention relates to phase-change heat-exchange technical fields, in particular to a kind of to strengthen heat sink wetting characteristics and phase-change heat-exchange performance Method, be particularly applied to the wetting characteristics of the heat dispersion heat sink of high-power, high power density electronics, electric power and opto-electronic device And the reinforcing of phase-change heat-exchange performance.
Background technique
It is contour along with microelectronics, high-performance computer, laser processing, high power density LED, aerospace and micro-system High-power, highly integrated, small size development trend is presented in the rapid development of new technical field, electronic device, these energy consumption electricity Sub- device has quite a few electrical power that can be converted into heat, therefore will lead to electronic device while playing effective power Fever heat flow density rapidly increase, more than 100W/cm2If so high intensity calorific value cannot effectively disperse, will lead to Device temperature increases rapidly, serious performance, stability and the safety for reducing device and system, if for example, high-powered LED lamp not Add any radiator, can be burnt after being powered on several seconds;The central processing unit (CPU) of computer or server, big Temperature can be sharply increased when Power operation, if not taking capable and effective cooling measure, operational efficiency can be decreased obviously.Device Part and the heat dissipation problem of system have become the critical bottleneck problem for influencing current electronics industry development.
And the various tradition such as the liquid single-phase convection cooling of stock size, forced air cooling, forced convection boiling be cooling are cooling Technology has been unable to satisfy high-intensitive cooling requirements, and current state-of-the-art radiator uses micro/nano-scale, and (micro-meter scale is received Metrical scale) phase-change heat-exchange technology, efficient heat dissipation performance can fundamentally solve these high-power, high power density electronics Device cooling problem, the most crucial thermal element that takes of these radiators is that surface has the phase-change heat-exchange of micro-nano structure heat sink.
Phase-change heat-exchange is heat sink, and especially surface has the phase-change heat-exchange of micro-nano structure heat sink, deposits in machining with daily During putting, the grease greasy dirt that surface can be remnants more, these grease greasy dirts are that have hydrophobic organic macromolecule, they It is covered on heat sink surface, heat sink wetability and phase-change heat-exchange performance can be deteriorated, is primarily due to following reason: grease oil Dirt has extremely low thermal conductivity, so that the heat sink surface being entirely covered and liquid working substance (such as water, water big, valence with latent heat of phase change Lattice are cheap, convenient for the advantages such as obtaining, therefore in many industrial circles by as common phase-change heat-exchange liquid working substance) between formed Big thermal resistance will be unable to play the original high heat-sinking capability of heat sink surface, and the reduction of effective heat exchange area will cause the coefficient of heat transfer Reduction, i.e. the decline of heat exchange efficiency;The hydrophobicity of grease greasy dirt itself can make heat sink worsened wettability, especially surface With the heat sink of micro-nano channel, blocking of the grease greasy dirt in channel will lead to liquid flowing and have some setbacks, and further decrease heat sink Wetability, the deterioration of wetability can be such that liquid complementary capabilities decline, and cause to occur inside micro-nano channel under high heat flux density Hot localised points and dry point cannot soak in time, come so that critical heat flux density advances to, will be unable to guarantee high-power, Gao Gong The safe operation of the electronic device of rate density.
Therefore phase-change heat-exchange is heat sink in order to give full play to, and especially surface has the phase-change heat-exchange of micro-nano structure heat sink excellent Heat-sinking capability, these heat sink surfaces are cleaned and are handled before use, current main method is wet cleaning, such as will Heat sink immersion is cleaned by ultrasonic in water, and in order to reach better cleaning effect, can also be added in water can be with organic greasy dirt The detergent chemically reacted, this method have stock size structure (such as grade channel, rib for Planar heat sink or surface Piece) it is heat sink have preferable cleaning effect, can preferably improve its wetting characteristics and phase-change heat-exchange ability.But have for surface There is micro-nano structure (such as microchannel, microcylinder, micro- shaft of rib, the microchannel containing nanostructure), since water has biggish surface Tension cannot be introduced into the inside of some micro-nano structures, therefore cleaning effect is undesirable, moreover, the ultrasound generallyd use Time-consuming for the method for cleaning, and operating procedure is relatively complicated (such as having cleaned will also be dried), is unfavorable for cooperation industrialization Pile line operation in production, and it is readily incorporated secondary pollution.
Summary of the invention
(1) technical problems to be solved
In view of the above problems, the purpose of the present invention is to provide a kind of heat sink wetting characteristics and phase-change heat-exchange performances strengthened Method, this method using plasma go processing heat sink surface, can quickly, efficiently, uniformly, contamination-freely realize heat sink surface High level of cleanliness and functional modification, thus strengthen it is heat sink, especially surface have micro-nano structure heat sink wetting characteristics and Phase-change heat-exchange performance.
(2) technical solution
A method of strengthening heat sink wetting characteristics and phase-change heat-exchange performance, comprising: prepare plasma;Using described etc. Gas ions clean heat sink surface and carry out functional modification to heat sink surface.
It is described using the plasma cleaning heat sink surface and to heat sink table in some exemplary embodiments of the present invention Face carries out functional modification: using plasma bombardment heat sink surface, occurring with the grease greasy dirt of heat sink surface Reaction, makes it be decomposed into small molecule;Hydrophilic polar group is grafted in heat sink surface using plasma.
In some exemplary embodiments of the present invention, the plasma for preparing is generated including the use of plasma generator Plasma;The radio-frequency power of the plasma generator is between 0-20kW;The rf frequency of plasma generator is Between 10kHz-30MHz;The processing time of plasma is between 1-60 minutes.
In some exemplary embodiments of the present invention, the radio-frequency power of the plasma generator be 100W-9kW it Between;The rf frequency of the plasma generator is between 30kHz-50kHz or 10MHz-20MHz;The plasma Handling the time is between 1-10 minutes.
In some exemplary embodiments of the present invention, it is described prepare plasma before further include: to heat sink surface into The preliminary cleaning of row, removes solid particle polluter, and heat sink after preliminary cleaning is placed in plasma processing chamber.
In some exemplary embodiments of the present invention, the volume of the plasma processing chamber is between 1-2000L;Institute Stating hierarchy number in plasma processing chamber is between 1-20 layers;The plasma processing chamber handles heat sink number simultaneously Between 1-2000.
In some exemplary embodiments of the present invention, the volume of the plasma processing chamber is between 5L-800L;Institute Stating hierarchy number in plasma processing chamber is between 1-10 layers;Heat sink is handled in the plasma processing chamber simultaneously Number is between 1-100.
It is described heat sink with plane surface or with stock size body structure surface in some exemplary embodiments of the present invention Or there is micro-nano structure surface;The micro-nano structure that the heat sink surface has include micro scale channel array structure, micrometer structure, Nanostructure or micro-nano compound structure;The channel cross-section of the heat sink micro scale channel array structure having is rectangle, ladder Shape, triangle, arc-shaped or irregular shape.
In some exemplary embodiments of the present invention, the process gas for being used to prepare the plasma is nitrogen, oxygen With one of argon gas or a variety of.
In some exemplary embodiments of the present invention, before the corona treatment heat sink surface, heat sink local environment For air or vacuum.
(3) beneficial effect
(1) plasma is the 4th kind of state of substance, and applying enough energy to gas makes its ionization, can be formed Gas ions, have it is highly reactive, can quickly occur physically or chemically to react with grease greasy dirt, pass through plasma bombardment heat Heavy surface, can destroy the chemical bond of organic greasy dirt macromolecular, it is made to resolve into small molecule, in vacuumizing environment, these points The small molecule of solution can be siphoned away rapidly, compared to the ultrasonic cleaning of water in wet cleaning or other chemical reagent, at plasma Reason has the characteristics that " all-pervasive ", the heat sink surface with micro-nano structure can uniformly and be forcefully cleaned, so that table All active steam bubble nucleation sites in face are all exposed, and are directly contacted with liquid working substance, thus during phase-change heat-exchange, More steam bubbles can be generated, the coefficient of heat transfer is improved.
(2) upper limit of phase-change heat-exchange depends on heat sink critical heat flux density, the close phase of wetability with heat sink surface It closes, it is plasma treated, due to removing with the introducing of hydrophilic oxygen-containing nitrogenous isopolarity group (such as surface hydrophobicity greasy dirt Hydroxyl, carboxyl, amino) so that heat sink wetability substantially improves, and then critical heat flux density value can be obviously improved, Ke Yishi For more high-power, i.e., the heat dissipation of the device of higher fever heat flow density.
(3) method provided by the invention has simple process, and easy to operate, processing speed is fast, effect is good, not will cause dirt It contaminates, act only on the advantages such as performance of the heat sink surface without destroying heat sink matrix.While clean dirt, also by use oxygen, Nitrogen plasma introduces hydrophilic polar group on surface, realizes material surface modifying, further increases wetting characteristics and phase transformation The strengthening effect of heat exchange property has very important engineer application meaning.
Detailed description of the invention
Fig. 1 is the heat sink wetting characteristics of reinforcing of the embodiment of the present invention and the method flow diagram of phase-change heat-exchange performance.
Fig. 2 is that the surface of the embodiment of the present invention has the heat sink structural schematic diagram and part of micro scale channel array structure The channel interior diagrammatic cross-section of amplification;
Fig. 3 is effect diagram (a and b) Ji Weitong on the corona treatment micro-channel heat sink surface of the embodiment of the present invention It is plasma treated that road is heat sink, and steam bubble generates number and increases when nucleate boiling phase-change heat-exchange, i.e. phase-change heat-exchange performance is significant The effect diagram (c and d) of promotion.
Fig. 4 is that the micro-channel heat sink of the embodiment of the present invention is plasma treated, what channel surface wetting characteristic improved Effect diagram.
Fig. 5 is that the plasma treated surface of the embodiment of the present invention has the heat sink effect diagram of nano coating.
Fig. 6 is that the plasma treated surface of the embodiment of the present invention has the effect of the heat sink signal of micro-nano compound structure Figure.
Specific embodiment
Plasma is the 4th kind of state of substance, has highly reactive and energy, as great potential New branch of science is widely used in plasma smelting, the processing of plasma machinery, collection by development in more than 30 years at present At circuit and semiconductor devices manufacture, promote the military affairs, industrial circle such as chemical reaction, raising film growth quality.For example, wait In gas ions machining, the high temperature and high speed jet stream that can use plasma torch generation is welded, is sprayed, is cut; In terms of integrated circuit, semiconductor devices, LED, plasma is used in the works such as bonding, printing, plated film, encapsulation Sequence.In addition, plasma can be utilized to etch, can produce specifically using two kinds of process gas of hydrogen and carbon tetrafluoride Plasma realizes the processing of metal solid material and semiconductor material surface micro-nano pattern and the removal of photoresist.It is exactly above The main application of plasma at present.
However plasma especially strengthens micro/nano-scale phase-change heat-exchange aspect of performance also not in reinforced transformation heat exchange property It is applied, about such report almost without the conventional selection of those skilled in the relevant arts is ultrasound cooperation corresponding chemical examination The method that agent is cleaned to strengthen heat sink wetting characteristics and phase-change heat-exchange performance, and is realized phase transformation using plasma and passed Hot property, especially reinforcing micro/nano-scale phase-change heat-exchange performance improvement be those skilled in the art be not related to simultaneously be also compared with What difficulty was expected.The present invention is for the first time by plasma application in reinforced transformation field of heat exchange, using corona treatment heat sink surface, The frequency that is occurred by setting plasma, power, the processing parameters such as time can achieve good cleaning effect and can be with Functional modification is carried out to heat sink surface, to enhance heat sink wetting characteristics and phase-change heat-exchange performance.
Plasma is formed and applying enough energy to gas ionizes it, has highly reactive, energy Quickly occur physically or chemically to react with grease greasy dirt, by plasma bombardment heat sink surface, it is big that organic greasy dirt can be destroyed The chemical bond of molecule, makes it resolve into small molecule, and in vacuumizing environment, these small molecules decomposed can be siphoned away rapidly, phase Than the ultrasonic cleaning of the water in wet cleaning or other chemical reagent, corona treatment has the characteristics that " all-pervasive ", can There is the heat sink surface of micro-nano structure with uniformly and forcefully cleaning, so that all active steam bubble nucleation site in surface is all It is exposed, is directly contacted with liquid working substance, so that more steam bubbles can be generated during phase-change heat-exchange, improve heat exchange Coefficient.On the other hand, the upper limit of phase-change heat-exchange depends on heat sink critical heat flux density, close with the wetability of heat sink surface Correlation, it is plasma treated, due to the removal of surface hydrophobicity greasy dirt and the introducing of hydrophilic oxygen-containing nitrogenous isopolarity group (such as hydroxyl, carboxyl, amino), so that heat sink wetability substantially improves, and then critical heat flux density value can be obviously improved, can be with Suitable for more high-power, i.e., the heat dissipation of the device of higher fever heat flow density.
The present invention provides a kind of method for strengthening heat sink wetting characteristics and phase-change heat-exchange performance, and this method utilizes plasma Processing heat sink surface is gone to generate the work of the plasma to realize the substantially reinforcing of wetting characteristics and phase-change heat-exchange performance Skill gas is preferably one or more of argon gas, nitrogen, oxygen, to form corresponding one pack system plasma or mixing etc. Gas ions.
Fig. 1 is the heat sink wetting characteristics of reinforcing of the embodiment of the present invention and the method flow diagram of phase-change heat-exchange performance, such as Fig. 1 institute Show, comprising the following steps:
Step S1: plasma is prepared;
Step S2: functional modification is carried out using the plasma cleaning heat sink surface and to heat sink surface.
Step S2 further comprises following sub-step: sub-step S21: plasma bombardment heat sink surface is utilized, and it is heat sink The grease greasy dirt on surface reacts, it is made to be decomposed into the small molecule not adversely affected for phase-change heat-exchange;Sub-step S2: benefit Hydrophilic polar group is grafted in heat sink surface with plasma.
The radio-frequency power of the plasma generator of plasma is generated between 0-20kW, it is preferable that generate described etc. The radio-frequency power of the plasma generator of gas ions is preferably between 100W-9kW;The plasma for generating plasma occurs The rf frequency of device is between 10kHz-30MHz, it is preferable that rf frequency is preferably in 30kHz mono- 50kHz or 10MHz-20MHz Between;The processing time of plasma is between 1-60 minutes, it is preferable that the processing time of the plasma is preferably in 1-10 Between minute;Before corona treatment heat sink surface, heat sink local environment is air or vacuum;Corona treatment is heat sink table The volume of the process chambers in face is between 1-2000L, it is preferable that the appearance of the process chambers of the corona treatment heat sink surface Product is preferably between 5L-800L, and hierarchy number is between 1-20 layers in cavity, it is preferable that hierarchy number is preferably at 1-10 layers in cavity Between, heat sink number can be handled in entire cavity simultaneously between 1-2000, it is preferable that can handle simultaneously in entire cavity Heat sink number is preferably between 1-100.
It is heat sink with plane surface or with stock size body structure surface or have micro-nano structure surface;Heat sink surface has Micro-nano structure include micro scale channel array structure, micrometer structure, nanostructure or micro-nano compound structure;It is heat sink have it is micro- The channel cross-section of meter level channel array structure is rectangle, trapezoidal, triangle, arc-shaped or irregular shape.It is handled Heat sink size range is 1mm-900mm.
To make the objectives, technical solutions, and advantages of the present invention clearer, below in conjunction with specific embodiment, and reference Attached drawing, the present invention is described in further detail.
Embodiment 1:
As shown in Fig. 2, heat sink have micro-nano structure surface, in plate heat sink upper building size (width including channel, height The spacing in degree and channel) it can be formed with micro scale channel array structure after channel array preferably between 0.01-0.9mm It is heat sink, abbreviation micro-channel heat sink 11.In the thermic load input of heating device, which can occur micro-scale phase change Heat exchange, realizes the radiation processes of the high coefficient of heat transfer and heat flow density.It is micro- logical however during machining and daily storage The remaining more grease greasy dirt of meeting inside road, as shown in the channel interior diagrammatic cross-section of Fig. 2 partial enlargement.Grease greasy dirt 12 covers Cover the inner surface in heat sink microchannel, due to itself hydrophobic property and to the blocking of microchannel, micro-channel heat sink can be made Worsened wettability, hot localised points that cannot soak inside microchannels appearance in time and dry are lauched so as to cause high heat flux density Point, cause critical heat flux density advance to come, radiator prematurely reaches the ability upper limit of phase-change heat-exchange, not can guarantee it is high-power, The safe operation of the electronic device of high power density.
Meanwhile as shown in Fig. 2 partial enlargement diagram, the vaporization small there are some sizes on heat sink microchannel inner surface Core 111.The steam bubble number that the unit time can generate when the number of the nucleus of boiling determines nucleate boiling phase-change heat-exchange, if single The bubble that heat sink surface generates in the time of position is more, and the efficiency of the coefficient of heat transfer and phase-change heat-exchange process is higher.And due to greasy dirt Presence, some nucleus of boiling can be covered, so as to cause effective heat exchange area reduction, cause the reduction of the coefficient of heat transfer.
Heat sink channel surface is tentatively cleaned, the dust or solid particle that heat sink channel inner surface may contain are removed Then heat sink after preliminary cleaning is placed in plasma processing chamber by impurity.
Preliminary cleaning mainly includes compound to micro-nano with compressed ir spray gun, nitrogen gun, large blower, hair dryer etc. Structure heat-sink surface is tentatively cleaned, and dust or solid particle polluter that heat sink surface may contain are blown away.
It is vacuumized using mechanical pump plasma process chambers, makes its internal vacuum 10-40Pa.
Process gas is filled with into plasma processing chamber, may be selected argon gas, hydrogen, nitrogen, oxygen, in carbon tetrafluoride One or more as process gas, it is preferable that one or more of using nitrogen, oxygen and argon gas.
Process gas, which is acted on, using plasma generator generates corresponding one pack system plasma or mixing plasma Body.
Using the heat sink microchannel surface of the corona treatment, oil existing for heat sink microchannel surface can be sufficiently cleaned Fatty oil is dirty and carries out functional modification to surface, using the heat sink microchannel surface of plasma bombardment, with heat sink microchannel surface Grease greasy dirt react, so that it is decomposed into small molecule, the small molecule after the decomposition is sucked away under vacuum conditions, and benefit Hydrophilic polar group is grafted in heat sink microchannel surface with plasma, strengthens wetting characteristics and phase-change heat-exchange performance.
Fig. 3 shows the effect diagram of corona treatment micro-channel heat sink, wherein (a) is before corona treatment The soil conditions of heat sink microchannel surface are (b) heat sink microchannel surface situation after corona treatment, (c) are plasma Steam bubble generates number situation when heat sink microchannel surface nucleate boiling phase-change heat-exchange before handling, and is (d) heat after corona treatment Steam bubble generates number increase situation when heavy microchannel surface nucleate boiling phase-change heat-exchange.As shown in Fig. 3 (a) and 3 (b), these etc. Gas ions 13 have highly reactive work containing cation, anion, electronics (e-), free radical molecule, UV photons (UV) etc. Property, it can quickly occur physically or chemically to react with grease greasy dirt 12 after bombarding heat sink microchannel surface, it is made to resolve into small molecule, In vacuumizing environment, small molecules of these decomposition can be siphoned away rapidly, can quickly, efficiently, uniformly, contamination-freely be realized hot The high level of cleanliness of heavy microchannel surface.It, can also be in heat while these plasmas have effectively removed grease greasy dirt in microchannel Heavy microchannel surface grafts upper some hydrophilic polar groups, such as amino (- NH2), carboxyl (- COOH), hydroxyl (- OH), real Existing material surface modifying, further increases heat sink wetting characteristics.
The radiator being assembled into using the micro-channel heat sink 11 can carry out high-intensitive heat dissipation to heating device.Such as Fig. 3 (c) With shown in 3 (d), filled with liquid working substance water in microchannel, the high hot-fluid of heating device is inputted perpendicular to channel surface, due to it is equal from Daughter processing causes the grease greasy dirt 12 of inside microchannels to be cleaned effectively, all possible nucleus of boiling position in channel surface It sets 111 to be all able to directly contact with liquid working substance water 14, can to occur to generate in the unit time when nucleate boiling phase-change heat-exchange 13 number of steam bubble greatly increase, the coefficient of heat transfer is improved, to enhance phase-change heat-exchange performance.Fig. 4 shows micro channel heat Heavy 11 plasma treated, the effect diagrams that channel surface wetting characteristic improves, as shown, due to surface hydrophobicity oil The introducing of dirty removal and hydrophilic polar group shows heat sink profit so that contact angle of the water droplet 15 on heat sink is greatly reduced It is moist to be greatly improved, become hydrophilic from hydrophobic.
Embodiment 2:
As shown in figure 4, heat sink have plane surface, using plasma processing can clean heat sink surface with mass and deposit Grease greasy dirt and functional modification carried out to surface, the extensive heat for obtaining wetting characteristics and phase-change heat-exchange is had excellent performance It is heavy, consequently facilitating realizing the industrialized production of radiator with high performance.First multiple heat sink surfaces are tentatively cleaned, are removed heat sink The dust or solid particle polluter that surface may be contained.Then multiple heat sink process chambers are placed in for what preliminary cleaning was completed It is interior, it selects one or more of argon gas, nitrogen, oxygen as process gas, generates corresponding one pack system plasma or mixed Conjunction plasma goes to handle heat sink.Layering pallet is disposed with inside plasma processing chamber, it is multiple convenient for placing in the cavity It is heat sink, it is uniformly distributed it in entire space, does not interfere with each other, and make full use of cavity space.It is intracavitary to be closed according to space size Removing the work sets one or more plasma generators, so that the plasma generated is evenly distributed in larger cavity space, thus Guarantee every layer heat sink can be cleaned well.The volume of process chambers is preferably between 5-800L, hierarchy number in cavity It is preferred that heat sink number can be handled simultaneously between 1-10 layers, in entire cavity preferably between 1-100.
Embodiment 3:
As shown in figure 5, spin coating graphene solution and being dried on 31 on copper sheet, it will increase one layer of porous graphene nanometer and apply Layer 32, coating layer thickness is preferably between 1-10000nm, and forming a kind of surface has the heat sink of nano coating, which can There can be some grease greasy dirts 33, which is tentatively cleaned, remove the ash that its surface may be contained After dirt or solid particle polluter, selects one or more of argon gas, nitrogen, oxygen as process gas, generate corresponding single Component plasma or hybrid plasma go processing nanostructure heat sink, can sufficiently clean the oil of grease existing for heat sink surface Dirt simultaneously carries out functional modification to surface, strengthens wetting characteristics and phase-change heat-exchange performance.
Embodiment 4:
As shown in fig. 6, can be on heat sink (such as aluminium sheet) 41 in basis using processing methods such as wire cutting, extruding, laser cuttings Micro scale channel array structure 411 is formed, then spray carbon nano-tube solution on its surface and is dried, will increase one layer of porous carbon Nano-tube nano coating 43, thickness ultimately form a kind of heat of the surface with micro-nano compound structure preferably between 1-10000nm Heavy, which tentatively cleans the heat sink surface there may be some grease greasy dirts 42, and removing its surface may contain After some dusts or solid particle polluter, selects one or more of argon gas, nitrogen, oxygen as process gas, generate phase The one pack system plasma or hybrid plasma answered go processing micro-nano compound structure heat sink, can sufficiently clean heat sink surface and deposit Grease greasy dirt and functional modification is carried out to surface, strengthen wetting characteristics and phase-change heat-exchange performance.
Therefore, method provided by the invention has simple process, and easy to operate, processing speed is fast, effect is good, not will cause It pollutes, act only on the advantages such as performance of the heat sink surface without destroying heat sink matrix.While clean dirt, also by using Oxygen and nitrogen plasma, introduces hydrophilic polar group on surface, realizes material surface modifying, further increase wetting characteristics and The strengthening effect of phase-change heat-exchange performance has very important engineer application meaning.
It should also be noted that, the direction term mentioned in embodiment, for example, "upper", "lower", "front", "rear", " left side ", " right side " etc. is only the direction with reference to attached drawing, the protection scope being not intended to limit the invention.Through attached drawing, identical element by Same or similar appended drawing reference indicates.When may cause the understanding of the present invention and cause to obscure, conventional structure will be omitted Or construction.
And the shape and size of each component do not reflect actual size and ratio in figure, and only illustrate the embodiment of the present invention Content.In addition, in the claims, any reference symbol between parentheses should not be configured to the limit to claim System.
It unless there are known entitled phase otherwise anticipates, the numerical parameter in this specification and appended claims is approximation, energy Characteristic changing needed for the content of enough bases through the invention is resulting.Specifically, all be used in specification and claim The middle content for indicating composition, the number of reaction condition etc., it is thus understood that repaired by the term of " about " in all situations Decorations.Under normal circumstances, the meaning expressed refers to include by specific quantity ± 10% variation in some embodiments, some ± 5% variation in embodiment, ± 1% variation in some embodiments, in some embodiments ± 0.5% variation.
Furthermore word "comprising" does not exclude the presence of element or step not listed in the claims.It is located in front of the element Word "a" or "an" does not exclude the presence of multiple such elements.
In addition, unless specifically described or the step of must sequentially occur, there is no restriction in the above institute for the sequence of above-mentioned steps Column, and can change or rearrange according to required design.And above-described embodiment can be based on the considerations of design and reliability, that This mix and match is used using or with other embodiments mix and match, i.e., the technical characteristic in different embodiments can be freely combined Form more embodiments.
Similarly, it should be understood that in order to simplify the present invention and help to understand one or more of the various inventive aspects, Above in the description of exemplary embodiment of the present invention, each feature of the invention is grouped together into single implementation sometimes In example, figure or descriptions thereof.However, the method for the invention should not be construed to reflect an intention that i.e. required guarantor Shield the present invention claims features more more than feature expressly recited in each claim.More precisely, as following Claims reflect as, inventive aspect is all features for the single embodiment invented less than front.Therefore, Thus the claims for following specific embodiment are expressly incorporated in the specific embodiment, wherein each claim itself All as a separate embodiment of the present invention.
Particular embodiments described above has carried out further in detail the purpose of the present invention, technical scheme and beneficial effects Describe in detail bright, it should be understood that the above is only a specific embodiment of the present invention, is not intended to restrict the invention, it is all Within the spirit and principles in the present invention, any modification, equivalent substitution, improvement and etc. done should be included in protection of the invention Within the scope of.

Claims (10)

1. a kind of method for strengthening heat sink wetting characteristics and phase-change heat-exchange performance, comprising:
Prepare plasma;
Functional modification is carried out using the plasma cleaning heat sink surface and to heat sink surface.
2. the method according to claim 1 for strengthening heat sink wetting characteristics and phase-change heat-exchange performance, wherein described to utilize institute It states plasma cleaning heat sink surface and functional modification is carried out to heat sink surface and further comprise:
Using plasma bombardment heat sink surface, reacts with the grease greasy dirt of heat sink surface, it is made to be decomposed into small molecule;
Hydrophilic polar group is grafted in heat sink surface using plasma.
3. the method according to claim 1 for strengthening heat sink wetting characteristics and phase-change heat-exchange performance, wherein described preparation etc. Gas ions generate plasma including the use of plasma generator;
The radio-frequency power of the plasma generator is between 0-20kW;The rf frequency of plasma generator is 10kHz- Between 30MHz;The processing time of plasma is between 1-60 minutes.
4. the method according to claim 3 for strengthening heat sink wetting characteristics and phase-change heat-exchange performance, wherein
The radio-frequency power of the plasma generator is between 100W-9kW;
The rf frequency of the plasma generator is between 30kHz-50kHz or 10MHz-20MHz;
The processing time of the plasma is between 1-10 minutes.
5. the method according to claim 1 for strengthening heat sink wetting characteristics and phase-change heat-exchange performance, wherein in the preparation Before plasma further include:
Heat sink surface is tentatively cleaned, removes solid particle polluter, and heat sink after preliminary cleaning is placed in plasma In process chambers.
6. the method according to claim 5 for strengthening heat sink wetting characteristics and phase-change heat-exchange performance, wherein
The volume of the plasma processing chamber is between 1-2000L;
Hierarchy number is between 1-20 layers in the plasma processing chamber;
It is between 1-2000 that the plasma processing chamber handles heat sink number simultaneously.
7. the method according to claim 6 for strengthening heat sink wetting characteristics and phase-change heat-exchange performance, wherein
The volume of the plasma processing chamber is between 5L-800L;
Hierarchy number is between 1-10 layers in the plasma processing chamber;
Handling heat sink number in the plasma processing chamber simultaneously is between 1-100.
8. the method according to claim 1 for strengthening heat sink wetting characteristics and phase-change heat-exchange performance, wherein
It is described heat sink with plane surface or with stock size body structure surface or with micro-nano structure surface;
The micro-nano structure that the heat sink surface has includes micro scale channel array structure, micrometer structure, nanostructure or micro-nano Composite construction;
The channel cross-section of the heat sink micro scale channel array structure having is rectangle, trapezoidal, triangle, arc-shaped or not Regular shape.
9. the method according to claim 1 for strengthening heat sink wetting characteristics and phase-change heat-exchange performance, wherein be used to prepare institute The process gas for stating plasma is one of nitrogen, oxygen and argon gas or a variety of.
10. the method according to claim 1 for strengthening heat sink wetting characteristics and phase-change heat-exchange performance, wherein it is described it is equal from Before daughter handles heat sink surface, heat sink local environment is air or vacuum.
CN201710913716.4A 2017-09-29 2017-09-29 Method for strengthening heat sink wetting characteristic and phase change heat exchange performance Active CN109570147B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710913716.4A CN109570147B (en) 2017-09-29 2017-09-29 Method for strengthening heat sink wetting characteristic and phase change heat exchange performance

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710913716.4A CN109570147B (en) 2017-09-29 2017-09-29 Method for strengthening heat sink wetting characteristic and phase change heat exchange performance

Publications (2)

Publication Number Publication Date
CN109570147A true CN109570147A (en) 2019-04-05
CN109570147B CN109570147B (en) 2021-04-02

Family

ID=65919404

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710913716.4A Active CN109570147B (en) 2017-09-29 2017-09-29 Method for strengthening heat sink wetting characteristic and phase change heat exchange performance

Country Status (1)

Country Link
CN (1) CN109570147B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111650791A (en) * 2020-06-04 2020-09-11 Tcl华星光电技术有限公司 Array substrate and preparation method thereof
CN112857118A (en) * 2021-01-08 2021-05-28 厦门大学 Method and device for regulating and controlling hydrophilicity and hydrophobicity of surface of carbon nanotube array based on external electric field/plasma for enhancing phase change heat exchange
CN114593630A (en) * 2022-03-29 2022-06-07 郑州轻工业大学 Nano magnetic particle hydrophilic and hydrophobic intelligent tube and control system thereof

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101789484A (en) * 2010-02-05 2010-07-28 江苏伯乐达光电科技有限公司 Eutectic welding method of light-emitting diode
CN101807659A (en) * 2010-02-05 2010-08-18 江苏伯乐达光电科技有限公司 Method for packaging white LED locally sprayed with fluorescent powder and fluorescent powder local coating structure
CN102414846A (en) * 2009-10-07 2012-04-11 应用材料公司 Improved multichamber split processes for LED manufacturing
CN103624035A (en) * 2012-08-23 2014-03-12 北方夜视技术股份有限公司 Method for cleaning tool for manufacturing cathode of low-light-level image intensifier
DE202015009154U1 (en) * 2015-10-21 2016-12-08 OOO Gazprom transgaz Sankt Petersburg Apparatus for arc plasma surface cleaning of metal products and a device therefor
CN206073779U (en) * 2016-09-13 2017-04-05 中国科学院工程热物理研究所 A kind of micro-nano compound structure surface is heat sink

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102414846A (en) * 2009-10-07 2012-04-11 应用材料公司 Improved multichamber split processes for LED manufacturing
CN101789484A (en) * 2010-02-05 2010-07-28 江苏伯乐达光电科技有限公司 Eutectic welding method of light-emitting diode
CN101807659A (en) * 2010-02-05 2010-08-18 江苏伯乐达光电科技有限公司 Method for packaging white LED locally sprayed with fluorescent powder and fluorescent powder local coating structure
CN103624035A (en) * 2012-08-23 2014-03-12 北方夜视技术股份有限公司 Method for cleaning tool for manufacturing cathode of low-light-level image intensifier
DE202015009154U1 (en) * 2015-10-21 2016-12-08 OOO Gazprom transgaz Sankt Petersburg Apparatus for arc plasma surface cleaning of metal products and a device therefor
CN206073779U (en) * 2016-09-13 2017-04-05 中国科学院工程热物理研究所 A kind of micro-nano compound structure surface is heat sink

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111650791A (en) * 2020-06-04 2020-09-11 Tcl华星光电技术有限公司 Array substrate and preparation method thereof
CN112857118A (en) * 2021-01-08 2021-05-28 厦门大学 Method and device for regulating and controlling hydrophilicity and hydrophobicity of surface of carbon nanotube array based on external electric field/plasma for enhancing phase change heat exchange
CN114593630A (en) * 2022-03-29 2022-06-07 郑州轻工业大学 Nano magnetic particle hydrophilic and hydrophobic intelligent tube and control system thereof
CN114593630B (en) * 2022-03-29 2023-12-22 郑州轻工业大学 Nano magnetic particle hydrophilic-hydrophobic intelligent tube and control system thereof

Also Published As

Publication number Publication date
CN109570147B (en) 2021-04-02

Similar Documents

Publication Publication Date Title
CN105722375B (en) A kind of graphene heat abstractor and preparation method thereof
CN109570147A (en) A method of strengthening heat sink wetting characteristics and phase-change heat-exchange performance
US8074706B2 (en) Heat spreader with composite micro-structure
CN103553029B (en) Method for preparing vertical graphene-based thermal material
JP5485603B2 (en) Manufacturing method of heat dissipation structure
CN106810823B (en) Graphene quantum dot/carbon nanotube/PEDOT:PSS composite film and preparation method thereof
CN101048055A (en) Advanced heat sinks and thermal spreaders
CN107343374A (en) Radiator that a kind of graphene heat conducting coating is modified and preparation method thereof
CN105803420A (en) Diamond composite wrapped by graphene and/or carbon nanotubes and preparation method and application of diamond composite wrapped by graphene and/or carbon nanotubes
CN206818050U (en) A kind of super-hydrophobic condensing surface
CN1466771A (en) An atmospheric pressure plasma assembly
CN104844066B (en) Boron nitride paper and preparation method thereof
CN107383560B (en) A kind of high efficiency composition heat sink material and preparation method thereof for semiconductor devices
CN103779292A (en) Method for preparing graphene-based chip heat-radiating material
CN108070891A (en) A kind of graphene carbon nanotube composite film and preparation method and application
CN108571913A (en) A kind of super-hydrophobic condensing surface and preparation method thereof
CN107325377B (en) High-efficient graphite alkene nano modification heat sink material and preparation method thereof
CN109181654A (en) A kind of graphene-based composite heat conduction film and preparation method thereof and its application
Gao et al. A hierarchical thermal interface material based on a double self-assembly technique enables efficient output power via solar thermoelectric conversion
US20060090885A1 (en) Thermally conductive channel between a semiconductor chip and an external thermal interface
Doğan et al. Gas‐Phase Plasma Synthesis of Free‐Standing Silicon Nanoparticles for Future Energy Applications
KR20100004399A (en) High conducting film using low-dimensional materials
CN109318564A (en) A kind of method that the spraying of self assembly ultrasound prepares graphene heat conducting film
CN113230681B (en) Composite micro-cavity porous curved surface micro-channel structure for liquid film boiling and preparation method thereof
Kim et al. Flexible heat-spreading and air-cooling films using nickel-electroplated nanotextured fibers

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant