CN108167671A - Side-emitting LED lamp - Google Patents
Side-emitting LED lamp Download PDFInfo
- Publication number
- CN108167671A CN108167671A CN201810143984.7A CN201810143984A CN108167671A CN 108167671 A CN108167671 A CN 108167671A CN 201810143984 A CN201810143984 A CN 201810143984A CN 108167671 A CN108167671 A CN 108167671A
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- Prior art keywords
- heat
- open channel
- led lamp
- dissipating cavity
- emitting led
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/69—Details of refractors forming part of the light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/56—Cooling arrangements using liquid coolants
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
- F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The disclosure provides a kind of side-emitting LED lamp, including：Hollow heat-dissipating cavity, inside hold heat radiation working medium, including：Open channel, hydrophilic coating, the hydrophilic coating Surface Creation polarized molecular radical, hydrophilic coating and polar molecule group are used to improve the fluid infusion ability of the open channel；And LED light source component.In the side-emitting LED lamp that the disclosure provides, by the polar molecule group for setting hydrophilic coating and hydrophilic coating surface, the cooperative reinforcing effect of the two can greatly improve the wetting characteristics on open channel surface, when taking hot heat sink vertical placement, the heat radiation working medium of hollow heat-dissipating cavity bottom is spontaneous under big capillary gradients driving to be flowed to upper edge open channel, moistening height of the heat radiation working medium in open channel is obviously improved, and ensure that high heat-exchanging performance heat sink under superelevation heat flow density and high reliability.
Description
Technical field
This disclosure relates to technical field of LED illumination more particularly to a kind of side-emitting LED lamp.
Background technology
Traditional side luminous lamp is mainly Metal halogen lamp, high-pressure sodium lamp, xenon lamp, and there are high energy consumption, light decay are serious, reliable for lamps and lanterns
Property poor, short life, pollution environment the shortcomings of, and side-emitting LED lamps and lanterns have the advantages such as energy conservation and environmental protection, long-life, therefore
Gradually it is applied to the fields such as landscape light in city, construction wall illumination, the illumination of remote flood lighting, light fishery.Along with
High-power LED light source micromation, integrated development trend, the power density of LED light source are higher and higher.For example, traditional array
The power density of LED lamp bead light source is about 10W/cm2, use the COB integrated LED single light source power densities of fluorescent powder for 20~
50W/cm2, and at present the state-of-the-art COB integrated LED single light sources power density using block fluorescence transition material up to 50~
500W/cm2, since electric energy of the LED chip at work there are about 70% can be converted to heat, the continuous improvement of power density can be led
LED light source fever heat flow density is caused to significantly increase.It can define 20~150W/cm2For high heat flux density；When heat flow density is more than
150W/cm2, the critical heat flux density that pool boiling phase-change heat-exchange occurs for stock size surface is alreadyd exceed, may be defined as excessive heat
Current density.If the golf calorific value that high-power LED light source generates when working cannot effectively be dispersed, it will lead to LED chip junction temperature
Raising causes spectrum change, light efficiency to reduce, the lost of life.Existing many producers are developed high-power using array LED lamp bead light source
Side-emitting LED product, LED light source component are made of the LED lamp bead of tens to hundreds of small wattage, are arranged in separately
On one larger light-emitting surface, fever heat flow density during high-power LED light source work can be reduced, alleviates heat dissipation pressure.But
It is that this array high-power LED lamp volume is big, weight weight, cost is higher, secondary optical design is difficult, and illuminating effect is owed
Good, illumination and the uniformity be not high, is susceptible to halation and glare phenomenon, therefore does not simply fail to realize to tradition in practical applications
Effective replacement of high-power side light-emitting lamp, and poor reliability.
In the prior art using Microgroove group composite phase change radiator, its take heat it is heat sink on structure size tens to hundreds of
The open micro-channel array structure of micron, when taking hot heat sink vertical placement, the capillary pressure of open micro-channel formation
Power gradient can drive liquid working substance to flow up, and form the wetting areas of certain altitude, and the three-phase line of contact area in channel
Domain promotes the formation of extension meniscus evaporation thin film, under the conditions of high heat load, it may occur that thin liquid film evaporates and thick liquid film area
The composite phase-change heat exchange of domain kernel state boiling, is a kind of typical high-performance passive minute yardstick phase-change heat-exchange technology, can be by
For realizing the heat transfer process of the high coefficient of heat transfer and high heat flux density under low thermal resistance and condition of small temperature difference, current takes hot-fluid
Density is up to 400W/cm2, it is the currently the only quilt for being likely to be suited for light-emitting LED lamps and lanterns high efficiency and heat radiation on the downside of superelevation heat flow density
Dynamic formula technology.
However during the disclosure is realized, applicants have discovered that, under the conditions of superelevation heat flow density, as hot-fluid is close
The further raising of degree, the liquid working substance in heat sink open micro-channel array will become to be easy to it is dry, once liquid pool
Dry place is not replenished in time in interior liquid working substance, then can not continuously form thin liquid film and thick liquid film region, can not just send out yet
The thin liquid film evaporation of raw high intensity and the composite phase-change heat exchange of thick liquid film nucleate boiling, heat sink heat dissipation performance and reliability are substantially
Decline, limit further improving for Microgroove group composite phase change radiator heat exchange property under the conditions of superelevation heat flow density.
Invention content
(1) technical problems to be solved
Based on above-mentioned technical problem, the disclosure provides a kind of side-emitting LED lamp, is shone with alleviating side of the prior art
Under the conditions of superelevation heat flow density, heat radiation working medium is easy to dry up LED light, can not continue occur high intensity thin liquid film evaporation and
The composite phase-change heat exchange of thick liquid film nucleate boiling, and then can not realize that the specular removal of lamps and lanterns and the technology of excellent illuminating effect are asked
Topic.
(2) technical solution
The disclosure provides a kind of side-emitting LED lamp, including：Hollow heat-dissipating cavity, inside are wrapped for holding heat radiation working medium
It includes：Open channel is arranged on the hollow heat-dissipating cavity madial wall, and the heat radiation working medium is driven along institute using capillary phenomenon
State open channel flowing；And hydrophilic coating, the surface of the open channel is arranged on, which has
Polar molecule group, the hydrophilic coating and the polar molecule group are used to improve the fluid infusion ability of the open channel；
And LED light source component, it is arranged on the lateral wall of the hollow heat-dissipating cavity, is oppositely arranged with the open channel, used
In offer side illuminating source；Wherein, the heat radiation working medium is flowed into the open channel, passes through the compound of the heat radiation working medium
The heat of the LED light source component is taken in phase transformation away, and is dissipated in environment.
In some embodiments of the present disclosure, the open channel includes N items, and open channel described in N items is set side by side
It puts；Wherein N >=10.
In some embodiments of the present disclosure, the arranging density of the open channel is not less than 5/cm.
In some embodiments of the present disclosure, the cross section of the open channel is rectangle, trapezoidal, triangle, circular arc
Shape or irregular figure.
In some embodiments of the present disclosure, wherein：The side wall of the hollow heat-dissipating cavity is pacified comprising at least one plane
Dress face, the LED light source component are connected on the Plane Installation face；M are provided on the outside of the hollow heat-dissipating cavity to dissipate
Hot fin, M circumferential arrays of the radiating fin along the hollow heat-dissipating cavity outer wall；M≥1.
In some embodiments of the present disclosure, the surface of the radiating fin is provided with ripple, for expanding the heat dissipation
The heat loss through convection area of fin.
In some embodiments of the present disclosure, further include：Fan, air-out direction is towards the radiating fin, for strong
Change the heat convection of the radiating fin.
In some embodiments of the present disclosure, the fan is arranged on the top of the radiating fin, the side-emitting LED
Lamp further includes：Cap casing is located on the outside of the fan, and with connecting at the top of the hollow heat-dissipating cavity and the radiating fin
It connects, for protecting the fan, and the side-emitting LED lamp is hung up.
In some embodiments of the present disclosure, the internal face of the hollow heat-dissipating cavity is provided with hydrophobic coating.
In some embodiments of the present disclosure, wherein：The hydrophilic coating includes：Woelm Alumina, porous oxidation niobium, oxygen
Change at least one of zinc sodium, titanium oxide, zinc oxide, tin oxide, vanadic anhydride, copper oxide, cuprous oxide, Kocide SD；
The polar molecule group includes：In carboxylic acid group, sulfonic group, phosphate, amino, quaternary ammonium group, hydroxyl, carboxylate, block polyether
At least one；The hydrophobic coating includes：Graphene or carbon nanotube；The hollow heat-dissipating cavity and the radiating fin packet
Contain：At least one of metal, alloy, semiconductor, ceramics, oxide；Wherein, hollow heat-dissipating cavity and the radiating fin
Thermal conductivity factor is not less than 20W/mK.
In some embodiments of the present disclosure, wherein：The hollow heat-dissipating cavity includes：Opening, is arranged on described hollow
On the wall surface of heat-dissipating cavity, for being packed into the heat radiation working medium into the hollow heat-dissipating cavity and changing the hollow heat dissipation
Vacuum degree in cavity；And sealing element, setting is matched with the opening, for sealing the hollow heat-dissipating cavity；It is described to dissipate
Hot working fluid includes：At least one of distilled water, deionized water, ethyl alcohol, methanol, acetone or refrigerant.
In some embodiments of the present disclosure, wherein：The width of the open channel between 100 μm to 3000 μm it
Between；The depth of the open channel is between 100 μm to 3000 μm；The spacing of the two adjacent open channels between
Between 100 μm to 3000 μm；The height of the hollow heat-dissipating cavity is between 50mm between 1000mm；The hollow heat-dissipating cavity
Diameter between 20mm between 800mm.
In some embodiments of the present disclosure, the LED light source component includes：At least a COB integrated optical sources, fitting are set
It puts on the side wall of the hollow heat-dissipating cavity, for providing light source；And an at least secondary optical lens, with the COB
The light-emitting surface of integrated optical source is correspondingly arranged, for adjusting the direction of the emergent ray of the COB integrated optical sources；Water-proof silica-gel pad
Circle, is arranged between the COB integrated optical sources and the secondary optical lens, for providing waterproof for the COB integrated optical sources
Protection；And lens gland, it is pressed on the secondary optical lens, for fixing the secondary optical lens, and compresses institute
State water-proof silica-gel washer；Wherein, the power of the COB integrated optical sources between 10W between 5000W.
(3) advantageous effect
It can be seen from the above technical proposal that the heat sink and its manufacturer being used under superelevation heat flow density that the disclosure provides
Method has the advantages that one of them or a portion：
(1) by setting the polar molecule group of hydrophilic coating and hydrophilic coating surface, the cooperative reinforcing effect of the two
The wetting characteristics on open channel surface can be greatly improved, greatly increases the capillary gradients in open channel, when taking heat
During heat sink vertical placement, the heat radiation working medium of hollow heat-dissipating cavity bottom is spontaneous under big capillary gradients driving to be opened to upper edge
The flowing of formula channel is put, moistening height of the heat radiation working medium in open channel is obviously improved, and thin liquid film can be occurred by being significantly increased
The area of the wetting zones of evaporation and the composite phase-change heat exchange of thick liquid film nucleate boiling, while but also under superelevation heat flow density
Heat sink to have timely fluid infusion ability, once dry region occur in hot localised points, under the driving of big capillary gradients, radiate work
Matter adds to rapidly dry area, soaks the surface of open channel again, and thin liquid film evaporation and thick liquid film core state boiling persistently occurs
The high-strength composite phase transformation strengthening heat transfer process risen ensure that high heat-exchanging performance heat sink under superelevation heat flow density and highly reliable
Property；
(2) it is the capillary gradients driving heat radiation working medium formed by the structure of open channel itself to take in thermal process
Flowing, without additional energy；
(3) by setting radiating fin, hollow heat-dissipating cavity and extraneous contact area is improved, improves heat exchange efficiency；
(4) by setting ripple on radiating fin, expand the heat loss through convection area of radiating fin, further improve heat exchange
Efficiency；
(5) by setting fan, the air flow rate between radiating fin can be accelerated, so as in time by radiating fin
Temperature is distributed into environment；
(6) by setting hydrophobic coating, the liquid heat radiation working medium condensed on hollow heat-dissipating cavity inner wall can be made timely
The bottom of hollow heat-dissipating cavity is dripped or flow to, cooling energy recovery is on the one hand increased, on the other hand also makes hollow heat dissipation cavity
The liquid level of the heat radiation working medium of body bottom remains unchanged substantially, and then ensures that open channel being capable of timely fluid infusion；
(7) a plurality of open channel is arranged side by side, and the width of open channel, depth and spacing are between 20 μm
To between 5000 μm, heat exchange area is not only increased, it is often more important that the interfacial effect and dimensional effect of open channel can be right
The flowing of heat radiation working medium and phase-change heat-exchange performance generate extraordinary invigoration effect, make its surface that thin liquid film evaporation and thick liquid film occur
The high-strength composite phase transformation strengthening heat transfer process of nucleate boiling, theoretical maximum take hot heat flow density to can reach 104W/cm2Number
Magnitude, phase-change heat transfer coefficient reach 106W/(m2DEG C) the order of magnitude, take hot property be much larger than stock size surface occur phase
Become heat exchange；
(8) raising of heat exchange efficiency can cause radiator to use less section bar, and volume is compacter, have structure letter
The advantages such as list, small size, lightweight, reliability height, long lifespan.
(9) by effectively solving heat dissipation of the great power LED single light source under high heat flux density especially superelevation heat flow density
Problem so that the side-emitting LED lamp that the disclosure provides using high-power COB integrated optical sources and can be at relatively low well
Operating temperature, avoid the array LED lamp bead that usage quantity is numerous, secondary optical design is simple, can realize specular removal and excellent
Illuminating effect, illumination and the uniformity are high, no halation and glare phenomenon.
Description of the drawings
Fig. 1 is the structure diagram of embodiment of the present disclosure side-emitting LED lamp.
Fig. 2 is the dimensional structure diagram of open channel in side-emitting LED lamp shown in Fig. 1.
Fig. 3 a are the close-up schematic view of open channel in side-emitting LED lamp shown in Fig. 1.
Fig. 3 b are the close-up schematic view of another structure of open channel in side-emitting LED lamp shown in Fig. 1.
Fig. 3 c are the close-up schematic view of the yet another construction of open channel in side-emitting LED lamp shown in Fig. 1.
Fig. 3 d are the close-up schematic view of the yet another construction of open channel in side-emitting LED lamp shown in Fig. 1.
Fig. 3 e are the close-up schematic view of the yet another construction of open channel in side-emitting LED lamp shown in Fig. 1.
Fig. 4 is the vertical view of side-emitting LED lamp shown in Fig. 1.
Fig. 5 is another structure diagram of embodiment of the present disclosure side-emitting LED lamp.
【Embodiment of the present disclosure main element symbol description in attached drawing】
The hollow heat-dissipating cavities of 10-；20- heat radiation working mediums；30-LED light source assemblies；
40- radiating fins：50- fans；60- Cap casings；
11- open channels；12- hydrophilic coatings；13- hydrophobic coatings；
14- is open；15- sealing element 31-COB integrated optical sources；
32- secondary optical lens；33- water-proof silica-gel washers；34- lens glands；
41- ripples；
111- Plane Installations face；121- polar molecule groups.
Specific embodiment
What the embodiment of the present disclosure provided is used in the side-emitting LED lamp under superelevation heat flow density, by setting hydrophilic coating
And the polar molecule group on hydrophilic coating surface, the cooperative reinforcing effect of the two can greatly improve the profit on open channel surface
Moisture performance greatly increases the capillary gradients in open channel, and then improves fluid infusion velocity and ability, ensure that superelevation
Heat sink high heat-exchanging performance and high reliability under heat flow density.
Purpose, technical scheme and advantage to make the disclosure are more clearly understood, below in conjunction with specific embodiment, and reference
The disclosure is further described in attached drawing.
Fig. 1 is the structure diagram of embodiment of the present disclosure side-emitting LED lamp.Fig. 2 is to be opened in side-emitting LED lamp shown in Fig. 1
Put the dimensional structure diagram of formula channel.Fig. 3 a are the partial enlargement signal of open channel in side-emitting LED lamp shown in Fig. 1
Figure.
The present embodiment provides a kind of side-emitting LED lamp, as shown in Fig. 1-Fig. 3 a, including：Hollow heat-dissipating cavity 10, inside are used
In holding heat radiation working medium 20, including：Open channel 11 is arranged on hollow 10 madial wall of heat-dissipating cavity, utilizes capillary phenomenon
Driving heat radiation working medium 20 is flowed along open channel 11；And hydrophilic coating 12, it is arranged on the surface of open channel 11, the parent
12 Surface Creation polarized molecular radical 121 of water coating, hydrophilic coating 12 and polar molecule group 121 are open logical for improving
The fluid infusion ability in road 11；And LED light source component 30, it is arranged on the lateral wall of hollow heat-dissipating cavity 10, with open channel
11 are oppositely arranged, for providing side illuminating source；Wherein, heat radiation working medium 20 is flowed into open channel 11, passes through heat radiation working medium
20 composite phase-change takes the heat of LED light source component 30 away, and is dissipated in environment, by setting hydrophilic coating 12 and hydrophilic
The polar molecule group 121 on 12 surface of coating, the cooperative reinforcing effect of the two can greatly improve the profit on 11 surface of open channel
Moisture performance greatly increases the capillary gradients in open channel 11, when taking hot heat sink vertical placement, hollow heat-dissipating cavity
The heat radiation working medium 20 of 10 bottoms is spontaneous under big capillary gradients driving to be flowed to upper edge open channel 11, heat radiation working medium
20 moistening height in open channel 11 is obviously improved, and thin liquid film evaporation and thick liquid film core state boiling can be occurred by being significantly increased
Rise composite phase-change heat exchange wetting zones area, while but also under superelevation heat flow density open channel 11 have and
When fluid infusion ability, once dry region occur in hot localised points, under the driving of big capillary gradients, heat radiation working medium 20 is mended rapidly
Dry area is charged to, soaks the surface of open channel 11 again, the height of thin liquid film evaporation and thick liquid film nucleate boiling persistently occurs
Intensity composite phase-change enhanced heat exchange process, ensure that the high heat-exchanging performance and high reliability under superelevation heat flow density, and take heat
It is the capillary gradients driving heat radiation working medium flowing formed by the structure of open channel itself in the process, without additional energy
Consumption.
In the present embodiment, open channel 11 includes N items, and N open channel 11 is set up in parallel；Wherein N >=10.
In the present embodiment, the arranging density of open channel 11 is not less than 5/cm.
Fig. 3 b are the close-up schematic view of another structure of open channel in side-emitting LED lamp shown in Fig. 1.Fig. 3 c
Close-up schematic view for the yet another construction of open channel in side-emitting LED lamp shown in Fig. 1.Fig. 3 d are side shown in Fig. 1
The close-up schematic view of the yet another construction of open channel in light emitting LED lamp.Fig. 3 e are in side-emitting LED lamp shown in Fig. 1
The close-up schematic view of the yet another construction of open channel.
In the present embodiment, as shown in Fig. 3 a- Fig. 3 e, the cross section of open channel 11 is rectangle, trapezoidal, triangle,
Arc-shaped or irregular figure.
Fig. 4 is the vertical view of side-emitting LED lamp shown in Fig. 1.
In the present embodiment, as shown in figure 4, wherein：The side wall of hollow heat-dissipating cavity 10 includes at least one Plane Installation
Face 111, LED light source component 30 are connected on Plane Installation face 111；The outside of hollow heat-dissipating cavity 10 is provided with M radiating fin
Piece 40, circumferential array of the M radiating fin 40 along hollow 10 outer wall of heat-dissipating cavity；Wherein M >=1, by setting radiating fin 40,
Hollow heat-dissipating cavity 10 and extraneous contact area are improved, improves heat exchange efficiency.
In the present embodiment, as shown in Figure 1, the surface of radiating fin 40 is provided with ripple 41, for expanding radiating fin
30 heat loss through convection area, so as to further improve heat exchange efficiency.
Fig. 5 is another structure diagram of embodiment of the present disclosure side-emitting LED lamp.
In the present embodiment, as shown in figure 5, further including：Fan 50, air-out direction is towards radiating fin 40, for strong
Change the heat convection of radiating fin 40, by setting fan, the air flow rate between radiating fin can be accelerated, so as in time
The temperature of radiating fin is distributed into environment.
In the present embodiment, as shown in figure 5, fan 50 is arranged on the top of radiating fin 40, side-emitting LED lamp also wraps
It includes：Cap casing 60 is located at 50 outside of fan, and is connect with the top of hollow heat-dissipating cavity 10 and radiating fin 40, for protecting
Fan 50 is protected, and side-emitting LED lamp is hung up.
In the present embodiment, as shown in Figure 1 and Figure 5, the internal face of hollow heat-dissipating cavity 10 is provided with hydrophobic coating 13, leads to
Setting hydrophobic coating 13 is crossed, can make to condense in the liquid heat radiation working medium 20 on hollow 10 inner wall of heat-dissipating cavity and drip or flow in time
To the bottom of hollow heat-dissipating cavity 10, cooling energy recovery is on the one hand increased, on the other hand also makes hollow 10 bottom of heat-dissipating cavity
The liquid level of the heat radiation working medium 10 in portion remains unchanged substantially, and then ensures that open channel 11 being capable of timely fluid infusion.
In the present embodiment, wherein：Hydrophilic coating 12 includes：Woelm Alumina, porous oxidation niobium, zinc oxide sodium, oxidation
At least one of titanium, zinc oxide, tin oxide, vanadic anhydride, copper oxide, cuprous oxide, Kocide SD；Polar molecule group
121 include：At least one of carboxylic acid group, sulfonic group, phosphate, amino, quaternary ammonium group, hydroxyl, carboxylate, block polyether；It dredges
Water coating 13 includes：Graphene or carbon nanotube；Hollow heat-dissipating cavity 10 and radiating fin 30 include：Metal, is partly led at alloy
At least one of body, ceramics, oxide；Wherein, the thermal conductivity factor of hollow heat-dissipating cavity 10 and radiating fin 30 is not less than
20W/m·K。
In the present embodiment, as shown in Figure 1 and Figure 5, wherein, hollow heat-dissipating cavity 10 includes：Opening 14, is arranged on hollow
On the wall surface of heat-dissipating cavity 10, for being packed into heat radiation working medium 20 into hollow heat-dissipating cavity 10 and changing hollow heat-dissipating cavity 10
Interior vacuum degree；And sealing element 15,14 setting is matched with opening, for sealing hollow heat-dissipating cavity 10, and after maintaining change
Hollow heat-dissipating cavity 10 vacuum degree；Heat radiation working medium 20 includes：Distilled water, deionized water, ethyl alcohol, methanol, acetone or refrigeration
At least one of agent.
In the present embodiment, wherein：The width of open channel 11 is between 100 μm to 3000 μm；Open channel
11 depth is between 100 μm to 3000 μm；The spacing of two adjacent open channels 11 is between 100 μm to 3000 μm；
The height of hollow heat-dissipating cavity 10 is between 50mm between 1000mm；The diameter of hollow heat-dissipating cavity 10 is between 20mm to 800mm
Between, a plurality of open channel 11 be arranged side by side, and the width of open channel 11, depth and spacing between 20m extremely
Between 5000m, heat exchange area is not only increased, it is often more important that the interfacial effect and dimensional effect of open channel 11 can be to dissipating
The flowing of hot working fluid 20 and phase-change heat-exchange performance generate extraordinary invigoration effect, make its surface that thin liquid film evaporation and thick liquid film occur
The high-strength composite phase transformation strengthening heat transfer process of nucleate boiling, theoretical maximum take hot heat flow density to can reach 104W/cm2Number
Magnitude, phase-change heat transfer coefficient reach 106W/(m2DEG C) the order of magnitude, take hot property be much larger than stock size surface occur phase transformation
Heat exchange.
In addition, the raising of heat exchange efficiency can cause radiator, using less section bar, volume is compacter, has structure
Simply, the advantages such as small size, lightweight, reliability height, long lifespan
In the present embodiment, as shown in Figure 1 and Figure 5, LED light source component 30 includes：An at least COB (Chip On
Board) integrated optical source 31, fitting is arranged on the side wall of hollow heat-dissipating cavity 10, for providing light source；And at least one two
Secondary optical lens 32, is correspondingly arranged with the light-emitting surface of COB integrated optical sources 31, for adjusting the emergent ray of COB integrated optical sources 31
Direction；Water-proof silica-gel washer 33 is arranged between COB integrated optical sources 31 and secondary optical lens 32, for for COB Integrated Lights
Source 31 provides waterproofing protection；And lens gland 34, it is pressed on secondary optical lens 32, for fixing secondary optical lens
32, and compress water-proof silica-gel washer 33；Wherein, the power of COB integrated optical sources 31 between 10W between 5000W.
It is asked by effectively solving heat dissipation of the great power LED single light source under high heat flux density especially superelevation heat flow density
Topic so that the side-emitting LED lamp that the disclosure provides using high-power COB integrated optical sources 31 and can be at relatively low well
Operating temperature, avoid the array LED lamp bead that usage quantity is numerous, secondary optical design is simple, can realize specular removal and excellent
Illuminating effect, illumination and the uniformity are high, no halation and glare phenomenon
According to above description, those skilled in the art, which should have the side-emitting LED lamp of disclosure offer, clearly to be recognized
Know.
In conclusion the side-emitting LED lamp that the disclosure provides is by setting 12 surface of hydrophilic coating 12 and hydrophilic coating
Polar molecule group 121, the cooperative reinforcing effect of the two can greatly improve the wetting characteristics on 11 surface of open channel so that
It is heat sink under superelevation heat flow density that there is timely fluid infusion ability, it ensure that high heat-exchanging performance and height heat sink under superelevation heat flow density
Reliability.
It should also be noted that, the direction term mentioned in embodiment, for example, " on ", " under ", "front", "rear", " left side ",
" right side " etc. is only the direction of refer to the attached drawing, is not used for limiting the protection domain of the disclosure.Through attached drawing, identical element by
Same or similar reference numeral represents.When understanding of this disclosure may be caused to cause to obscure, conventional structure will be omitted
Or construction.
And the shape and size of each component do not reflect actual size and ratio in figure, and only illustrate the embodiment of the present disclosure
Content.In addition, in the claims, any reference mark between bracket should not be configured to the limit to claim
System.
Similarly, it should be understood that in order to simplify the disclosure and help to understand one or more of each open aspect,
Above in the description of the exemplary embodiment of the disclosure, each feature of the disclosure is grouped together into single implementation sometimes
In example, figure or descriptions thereof.However, the method for the disclosure should be construed to reflect following intention：I.e. required guarantor
The disclosure of shield requires features more more than the feature being expressly recited in each claim.More precisely, as following
Claims reflect as, open aspect is all features less than single embodiment disclosed above.Therefore,
Thus the claims for following specific embodiment are expressly incorporated in the specific embodiment, wherein each claim is in itself
All as the separate embodiments of the disclosure.
Particular embodiments described above has carried out the purpose, technical solution and advantageous effect of the disclosure further in detail
It describes in detail bright, it should be understood that the foregoing is merely the specific embodiment of the disclosure, is not limited to the disclosure, it is all
Within the spirit and principle of the disclosure, any modification, equivalent substitution, improvement and etc. done should be included in the guarantor of the disclosure
Within the scope of shield.
Claims (13)
1. a kind of side-emitting LED lamp, including：
Hollow heat-dissipating cavity, inside are used to hold heat radiation working medium, including：
Open channel is arranged on the hollow heat-dissipating cavity madial wall, and the heat radiation working medium edge is driven using capillary phenomenon
The open channel flowing；And
Hydrophilic coating is arranged on the surface of the open channel, the hydrophilic coating Surface Creation polarized molecular radical, described
Hydrophilic coating and the polar molecule group are used to improve the fluid infusion ability of the open channel；And
LED light source component is arranged on the lateral wall of the hollow heat-dissipating cavity, is oppositely arranged with the open channel, uses
In offer side illuminating source；
Wherein, the heat radiation working medium is flowed into the open channel, is taken away by the composite phase-change of the heat radiation working medium described
The heat of LED light source component, and be dissipated in environment.
2. side-emitting LED lamp according to claim 1, the open channel includes N items, open channel described in N items
It is set up in parallel；
Wherein N >=10.
3. side-emitting LED lamp according to claim 2, the arranging density of the open channel is not less than 5/cm.
4. side-emitting LED lamp according to claim 1, the cross section of the open channel is rectangle, trapezoidal, triangle
Shape, arc-shaped or irregular figure.
5. side-emitting LED lamp according to claim 1, wherein：
The side wall of the hollow heat-dissipating cavity includes at least one Plane Installation face, and the LED light source component is connected to described flat
On the mounting surface of face；
It is provided with M radiating fin on the outside of the hollow heat-dissipating cavity, the M radiating fins are along the hollow heat-dissipating cavity
The circumferential array of outer wall；M≥1.
6. side-emitting LED lamp according to claim 5, the surface of the radiating fin is provided with ripple, for expanding
State the heat loss through convection area of radiating fin.
7. side-emitting LED lamp according to claim 5, further includes：Fan, air-out direction towards the radiating fin,
For strengthening the heat convection of the radiating fin.
8. side-emitting LED lamp according to claim 7, the fan is arranged on the top of the radiating fin, the side
Light emitting LED lamp further includes：
Cap casing is located on the outside of the fan, and is connect with the top of the hollow heat-dissipating cavity and the radiating fin, uses
It is hung up in the protection fan, and by the side-emitting LED lamp.
9. side-emitting LED lamp according to claim 5, the internal face of the hollow heat-dissipating cavity is provided with hydrophobic coating.
10. side-emitting LED lamp according to claim 9, wherein：
The hydrophilic coating includes：Woelm Alumina, porous oxidation niobium, zinc oxide sodium, titanium oxide, zinc oxide, tin oxide, five oxygen
Change at least one of two vanadium, copper oxide, cuprous oxide, Kocide SD；
The polar molecule group includes：Carboxylic acid group, sulfonic group, phosphate, amino, quaternary ammonium group, hydroxyl, carboxylate, block gather
At least one of ether；
The hydrophobic coating includes：Graphene or carbon nanotube；
The hollow heat-dissipating cavity and the radiating fin include：At least one in metal, alloy, semiconductor, ceramics, oxide
Kind；
Wherein, the thermal conductivity factor of hollow heat-dissipating cavity and the radiating fin is not less than 20W/mK.
11. side-emitting LED lamp according to any one of claim 1 to 10, wherein：
The hollow heat-dissipating cavity includes：
Opening, is arranged on the wall surface of the hollow heat-dissipating cavity, for being packed into the heat dissipation into the hollow heat-dissipating cavity
Vacuum degree in working medium and the change hollow heat-dissipating cavity；And
Sealing element matches setting, for sealing the hollow heat-dissipating cavity with the opening；
The heat radiation working medium includes：At least one of distilled water, deionized water, ethyl alcohol, methanol, acetone or refrigerant.
12. side-emitting LED lamp according to claim 1, wherein：
The width of the open channel is between 100 μm to 3000 μm；
The depth of the open channel is between 100 μm to 3000 μm；
The spacing of the two adjacent open channels is between 100 μm to 3000 μm；
The height of the hollow heat-dissipating cavity is between 50mm between 1000mm；
The diameter of the hollow heat-dissipating cavity is between 20mm between 800mm.
13. side-emitting LED lamp according to any one of claim 1 to 10, the LED light source component include：
An at least COB integrated optical sources, fitting is arranged on the side wall of the hollow heat-dissipating cavity, for providing light source；And
An at least secondary optical lens are correspondingly arranged with the light-emitting surface of the COB integrated optical sources, for adjusting the COB collection
Into the direction of the emergent ray of light source；
Water-proof silica-gel washer is arranged between the COB integrated optical sources and the secondary optical lens, for for the COB collection
Waterproofing protection is provided into light source；And
Lens gland is pressed on the secondary optical lens, for fixing the secondary optical lens, and compresses the waterproof
Silicone gasket；
Wherein, the power of the COB integrated optical sources between 10W between 5000W.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810143984.7A CN108167671A (en) | 2018-02-11 | 2018-02-11 | Side-emitting LED lamp |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810143984.7A CN108167671A (en) | 2018-02-11 | 2018-02-11 | Side-emitting LED lamp |
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| CN108167671A true CN108167671A (en) | 2018-06-15 |
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ID=62512425
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109646803A (en) * | 2019-01-10 | 2019-04-19 | 鲍玉珍 | For the non-interfering THz wave emulation physical therapy instrument of lung cancer |
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Application publication date: 20180615 |