CN105222019A - A kind of LED lamp and application thereof - Google Patents
A kind of LED lamp and application thereof Download PDFInfo
- Publication number
- CN105222019A CN105222019A CN201510732156.3A CN201510732156A CN105222019A CN 105222019 A CN105222019 A CN 105222019A CN 201510732156 A CN201510732156 A CN 201510732156A CN 105222019 A CN105222019 A CN 105222019A
- Authority
- CN
- China
- Prior art keywords
- led lamp
- upper plate
- led
- capillary structure
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
- F21W2131/10—Outdoor lighting
- F21W2131/103—Outdoor lighting of streets or roads
Abstract
The present invention relates to a kind of LED lamp and application thereof, include housing, lampshade, circuit board and LED chip; Described circuit board and described LED chip are arranged in described housing; LED chip includes LED luminescence unit, temperature-uniforming plate and radiator structure; Described LED luminescence unit is fixed on a surface of described temperature-uniforming plate; Described radiator structure is fixed on the described temperature-uniforming plate surface relative with described LED luminescence unit.This LED lamp is mainly used on street lamp.By the LED lamp of the technical program, realize improve service life while maintenance high brightness.
Description
Technical field
The invention belongs to LED lamp technical field, refer to a kind of LED lamp and application thereof especially.
Background technology
Along with the development of LED technology, the high brightness that LED illumination has replaced traditional lighting, particularly LED in multiple field obtains applying the most widely in street lamp field.The luminous efficiency of LED lamp bead and the life-span of raising LED lamp bead, the radiating effect improving LED is the key ensureing LED luminous efficiency.
In order to the radiating effect to LED lamp bead can be improved, in high-power LED lamp, a kind ofly be called that the temperature-uniforming plate of flat plate heat tube is widely applied, and because it has excellent thermal conduction characteristic, be widely used in the radiator of the electronic installations such as central processing unit, high-capacity transistor and High Power LED.
The temperature-uniforming plate now used consists essentially of the housing of hollow, is filled with fluid media (medium) as water, alcohol, gasoline etc., the base plate and cover plate of housing are provided with capillary structure in cavity.In use, base plate and electronic installation are fitted, the heat produced by heat abstractor passes to fluid media (medium) by base plate, under normal circumstances, the thermal conductivity factor of fluid media (medium) all exceedes the thermal conductivity factor of base plate material, fluid media (medium) is evaporated to gas being heated, and gas is cooled to liquid at cover plate place, and the heat of release is derived by the heat abstractor of outside.
The equal disordered state of capillary structure of existing technology, and the capillary structure that existing described average-temperature structure adopts, no matter be powder type capillary structure or netted capillary structure, all there is following problem: a kind of is because the capillary structure at the temperature-uniforming plate cover plate place of existing technology is similar plane, the effect that can be subject to gravity after fluid media (medium) cools condensation herein moves downward, and rely on capillarity slower to the speed of two lateral movements, now, the power that condensed fluid media (medium) contacts with cover plate weakens, when new gas moves to cover plate, first be that the fluid media (medium) of these condensations contacts with gas, gas can under the fluid media (medium) effect of condensation condensation release heat, and this heat can have gap due to the existence of cooling medium in advance with cover plate, heat is caused all outwards not discharged by cover plate, namely the heat meeting reverse flow of is had, although make existing temperature-uniforming plate have higher radiating effect, but still can not reach optimum state.Another problem is, when the base plate of existing temperature-uniforming plate and electronics contacts, can only be that temperature-uniforming plate is placed in a horizontal manner, if when electronic installation being sidelong or placing with other direction, temperature-uniforming plate then cannot realize good radiating effect, and in actual application, the setting direction of electronic installation cannot realize all being horizontally disposed with, this brings larger limitation with regard to giving the application of temperature-uniforming plate.
Summary of the invention
The object of the invention is to propose improvement opportunity scheme to existing temperature-uniforming plate, by the temperature-uniforming plate of the technical program, can not only radiating effect be improved, and improve the range of application of temperature-uniforming plate.
The present invention is achieved by the following technical solutions:
A kind of LED lamp, includes housing, lampshade, circuit board and LED chip; Described circuit board and described LED chip are arranged in described housing; Described lampshade is fixed with described housing; Described circuit board is connected with described LED chip and extraneous power electric;
Described LED chip includes LED luminescence unit, temperature-uniforming plate and radiator structure; Described LED luminescence unit is fixed on a surface of described temperature-uniforming plate; Described radiator structure is fixed on the described temperature-uniforming plate surface relative with described LED luminescence unit;
Described temperature-uniforming plate includes housing, and described housing includes upper plate and lower plate; Described upper plate and described lower plate are spliced sealing mutually, form the cavity of sealing between described upper plate and described lower plate; Fluid-filled medium in described cavity;
The inner surface of described upper plate is provided with one deck first capillary structure; The inner surface of described lower plate is provided with one deck second capillary structure;
Supporting construction is provided with in described cavity;
The inner surface of described upper plate is corrugated curved surface; When described upper plate thinnest part extends to adjacent described upper plate thickness, the power that described first capillary structure is applied to described fluid media (medium) points to described upper plate thickness;
One end of described supporting construction is divided and is fixed with the inner surface of described lower plate, and the inner surface in the other end and described upper plate thickness is fixed.
Described LED luminescence unit includes circuit layer, LED lamp bead, wire and reflecting layer; Described LED lamp bead is fixed on described circuit layer; Described wire connects described LED lamp bead and described circuit layer; Described reflecting layer to be arranged on described circuit layer and to surround described LED lamp bead; Described circuit layer is provided with the point be connected with described circuit board; Fit in the surface of described circuit layer and described temperature-uniforming plate.
The inner surface of described cavity sidewalls is provided with one deck the 3rd capillary structure; The curved structure in cross section of the inner surface of described cavity sidewalls.
Described 3rd capillary structure is identical with the shape of described cavity sidewalls inner surface.
Between the inner surface and described first capillary structure of described cavity, between the inner surface of described cavity and described second capillary structure, and be provided with watertight composition between the inner surface of described cavity and described 3rd capillary structure.
Described first capillary structure is not identical with the shape of described second capillary structure.
Described fluid media (medium) is water.
Described fluid media (medium) charge is exceed described cavity body over half.
Described radiator structure is made up of multiple radiating fin.
An application for LED lamp, the LED lamp of above-mentioned any one is applied on street lamp.
The invention has the beneficial effects as follows:
The chip structure of LED lamp of the present invention, by adopting equalizing plate structure, improves radiating effect, and LED lamp bead in luminescence process, can be maintained the stable of luminous efficiency, effectively reduce light decay.
The present invention is by being set to corrugated curved surface by the inner surface of upper plate, namely the upper surface of cavity is corrugated curved surface, and the first capillary structure is set to when described upper plate thinnest part extends to adjacent described upper plate thickness, the power that described first capillary structure is applied to described fluid media (medium) points to described upper plate thickness, such design, when the steam of heat is after upper plate condensation, the fluid media (medium) of condensation flows to the thickness of upper plate fast from the thinnest part of upper plate, the steam of postorder is in uphill process, because vapor movement is long more than the time moving to upper plate thickness to the time of upper plate thinnest part, now upper plate thinnest part can directly contact with steam, the heat discharged in Condensation can directly be distributed by upper plate, simultaneously, even the steam risen meets with the fluid media (medium) of condensation in other position of upper plate, because the power of fluid media (medium) is not relative with the power that steam rises, but have certain angle, now, namely can not hinder the rising of gas, and gas also can not hinder the flowing of fluid media (medium), can ensure that condensed fluid media (medium) is got back to lower plate fast and participated in absorbing heat.
On the other hand, the technical scheme of the application is by being set to arcuate structure by the side wall inner surfaces of cavity, even if temperature-uniforming plate is vertically used, because at arcuate structure, the gas of the charge of fluid media (medium) and evaporation ensures that condensed fluid media (medium) flows back to fast, ensure that the effect of heat radiation, improve the scope of application of temperature-uniforming plate.
Accompanying drawing explanation
Fig. 1 is the chip structure schematic diagram of high-power LED lamp of the present invention;
Fig. 2 is temperature-uniforming plate sectional view of the present invention;
Fig. 3 is the top view of lower plate of the present invention.
Description of reference numerals
1 upper plate, 2 lower plates, 3 cavitys, 4 first capillary structures, 5 second capillary structures, 6 the 3rd capillary structures, 7 supporting constructions, 11 upper plate thinnest parts, 12 upper plate thickness, 21 cavity sidewalls, 01 radiator structure, 02 temperature-uniforming plate, 03LED luminescence unit.
Detailed description of the invention
Describe technical scheme of the present invention in detail below by way of specific embodiment, following embodiment is only exemplary, only can be used for explaining and technical scheme of the present invention being described, and can not be interpreted as being the restriction to technical solution of the present invention.
The invention provides a kind of LED lamp, as shown in Figure 1 to Figure 3, include housing, lampshade, circuit board and LED chip; Described circuit board and described LED chip are arranged in described housing; Described lampshade is fixed with described housing; Described circuit board is connected with described LED chip and extraneous power electric.In this application, the structure of light fixture and electrical connection identical with prior art.
Wherein LED chip includes LED luminescence unit 03, temperature-uniforming plate 02 and radiator structure 01; Described LED luminescence unit is fixed on a surface of described temperature-uniforming plate; Described radiator structure is fixed on the described temperature-uniforming plate surface relative with described LED luminescence unit.
In this application, LED luminescence unit 03 includes circuit layer, LED lamp bead, wire and reflecting layer; Described LED lamp bead is fixed on described circuit layer; Described wire connects described LED lamp bead and described circuit layer; Described reflecting layer to be arranged on described circuit layer and to surround described LED lamp bead; Described circuit layer is provided with the point be connected with circuit board; Fit in the surface of described circuit layer and described temperature-uniforming plate.
In other embodiment of the application, the structure of LED luminescence unit is prior art, and the structure of such as LED lamp bead and encapsulating structure etc. are prior art, do not carry out too much explanation at this.In this application, wire uses gold thread, in other embodiment of the application, other alloy wire with high conductivity can be used as required can to realize the technical scheme of the application too.
In other embodiment of the application, LED lamp bead also comprises optical lens structure and phosphor powder layer etc.
In this application, be generally provided with certain angle between LED lamp bead and the surface in reflecting layer, this angle changes as required, gathers state in order to what regulate the transmitting of the light of LED lamp bead luminescence or light.
In this application, radiator structure is made up of multiple radiating fin, and in other embodiment of the application, radiator structure also can be designed to other shape as required, and in this application, the material of radiator structure can be the highly heat-conductive materials such as aluminium, copper, pottery.
Temperature-uniforming plate 02 includes housing, and described housing includes upper plate 1 and lower plate 2; Described upper plate 1 and described lower plate 2 are spliced sealing mutually, form the cavity 3 of sealing between described upper plate 1 and described lower plate 2; Fluid-filled medium in described cavity; In other embodiment of the application, housing can be also other structure, can the vacuum cavity of containing fluid medium but be provided with one in housing.
Material for the preparation of housing is prior art, can adopt the material of existing use to prepare, and does not affect the protection domain of the application, and concrete which kind of material that adopts is according to needing the electronic installation of heat radiation or needing to determine.
Wherein lower plate fits with the radiating surface of electronic installation, and upper plate fits with other radiator structure.
The inner surface of described upper plate 1 is provided with one deck first capillary structure 4; The inner surface of described lower plate 2 is provided with one deck second capillary structure 5; In the present embodiment, the shape of the first capillary structure is not identical with the shape of the second capillary structure.First capillary structure of the application adopts metal powder sintered forming, and the second capillary structure is sintered by wire netting or is welded.
The inner surface of described upper plate is corrugated curved surface; Refer to herein and cut upper plate open observation, the outer surface of upper plate is plane, and the inner surface of upper plate is corrugated curved surface, forms crest and trough structure like this on the inner surface of upper plate, wherein, and the close together of crest and lower plate, and trough and lower plate is distant.
When described upper plate thinnest part 11 extends to adjacent described upper plate thickness 12, namely when trough extends to crest, the power that described first capillary structure is applied to described fluid media (medium) points to the described the thickest direction of upper plate, sees shown in the arrow in Fig. 1; Namely power points to crest direction, and this structure is conducive to the backflow of fluid media (medium).
Supporting construction 7 is provided with in described cavity 3; In the embodiment of the application, the outer surface of supporting construction is also provided with capillary structure, and power points to lower plate, to improve the speed of fluid media (medium) backflow.
One end of described supporting construction is divided and is fixed with the inner surface of described lower plate, and the inner surface in the other end and described upper plate thickness is fixed.
The inner surface of described cavity sidewalls 21 is provided with one deck the 3rd capillary structure 6; The curved structure in cross section of the inner surface of described cavity sidewalls 21.
Described 3rd capillary structure is identical with the shape of described cavity sidewalls inner surface.
Between the inner surface and described first capillary structure of described cavity, between the inner surface of described cavity and described second capillary structure, and be provided with watertight composition between the inner surface of described cavity and described 3rd capillary structure.In this application, the thickness of the first capillary structure, the second capillary structure and the 3rd capillary structure is all greater than the thickness of watertight composition.
Described first capillary structure is not identical with the shape of described second capillary structure.
In this application, fluid media (medium) is water; In other embodiment of the application, fluid media (medium) can be also other medium, such as alcohol, gasoline etc., all can realize the technical scheme of the application.
Described fluid media (medium) charge is exceed described cavity body over half, and this technical scheme to ensure when samming device is vertically used, the radiating effect that also can play.
In this application, above-mentioned LED lamp is applied on street lamp.Street lamp is also provided with waterproof sealing structure and antifog structure or control device.
Although illustrate and describe embodiments of the invention, for the ordinary skill in the art, be appreciated that and can carry out multiple change, amendment, replacement and modification to these embodiments without departing from the principles and spirit of the present invention, scope of the present invention is by claims and equivalency thereof.
Claims (10)
1. a LED lamp, includes housing, lampshade, circuit board and LED chip; Described circuit board and described LED chip are arranged in described housing; Described lampshade is fixed with described housing; Described circuit board is connected with described LED chip and extraneous power electric; It is characterized in that:
Described LED chip includes LED luminescence unit, temperature-uniforming plate and radiator structure; Described LED luminescence unit is fixed on a surface of described temperature-uniforming plate; Described radiator structure is fixed on the described temperature-uniforming plate surface relative with described LED luminescence unit;
Described temperature-uniforming plate includes housing, and described housing includes upper plate and lower plate; Described upper plate and described lower plate are spliced sealing mutually, form the cavity of sealing between described upper plate and described lower plate; Fluid-filled medium in described cavity;
The inner surface of described upper plate is provided with one deck first capillary structure; The inner surface of described lower plate is provided with one deck second capillary structure;
Supporting construction is provided with in described cavity;
The inner surface of described upper plate is corrugated curved surface; When described upper plate thinnest part extends to adjacent described upper plate thickness, the power that described first capillary structure is applied to described fluid media (medium) points to described upper plate thickness;
One end of described supporting construction is divided and is fixed with the inner surface of described lower plate, and the inner surface in the other end and described upper plate thickness is fixed.
2. LED lamp according to claim 1, is characterized in that: described LED luminescence unit includes circuit layer, LED lamp bead, wire and reflecting layer; Described LED lamp bead is fixed on described circuit layer; Described wire connects described LED lamp bead and described circuit layer; Described reflecting layer to be arranged on described circuit layer and to surround described LED lamp bead; Described circuit layer is provided with the point be connected with described circuit board; Fit in the surface of described circuit layer and described temperature-uniforming plate.
3. LED lamp according to claim 1, is characterized in that: the inner surface of described cavity sidewalls is provided with one deck the 3rd capillary structure; The curved structure in cross section of the inner surface of described cavity sidewalls.
4. LED lamp according to claim 3, is characterized in that: described 3rd capillary structure is identical with the shape of described cavity sidewalls inner surface.
5. LED lamp according to claim 1, it is characterized in that: between the inner surface and described first capillary structure of described cavity, between the inner surface of described cavity and described second capillary structure, and be provided with watertight composition between the inner surface of described cavity and described 3rd capillary structure.
6. LED lamp according to claim 1, is characterized in that: described first capillary structure is not identical with the shape of described second capillary structure.
7. LED lamp according to claim 1, is characterized in that: described fluid media (medium) is water.
8. LED lamp according to claim 1, is characterized in that: described fluid media (medium) charge is exceed described cavity body over half.
9. LED lamp according to claim 1, is characterized in that: described radiator structure is made up of multiple radiating fin.
10. an application for LED lamp, is characterized in that: the LED lamp any one of the claims 1 to 9 is applied on street lamp.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510732156.3A CN105222019A (en) | 2015-11-03 | 2015-11-03 | A kind of LED lamp and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510732156.3A CN105222019A (en) | 2015-11-03 | 2015-11-03 | A kind of LED lamp and application thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105222019A true CN105222019A (en) | 2016-01-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510732156.3A Pending CN105222019A (en) | 2015-11-03 | 2015-11-03 | A kind of LED lamp and application thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN105222019A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105202492A (en) * | 2015-11-03 | 2015-12-30 | 刘树宇 | Chip architecture of high-power LED lamp |
| WO2024001278A1 (en) * | 2022-06-30 | 2024-01-04 | 中兴通讯股份有限公司 | Heat dissipation device, heat dissipation system, electronic apparatus, and manufacturing method for heat dissipation device |
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| CN101927426A (en) * | 2009-06-24 | 2010-12-29 | 富准精密工业(深圳)有限公司 | Uniform-temperature panel and manufacturing method thereof |
| CN102683334A (en) * | 2011-03-09 | 2012-09-19 | 浙江名芯半导体科技有限公司 | High-power LED packaging structure with super-heat-conducting temperature equalizing plate |
| CN102840785A (en) * | 2012-09-07 | 2012-12-26 | 浙江中博光电科技有限公司 | Temperature-uniforming plate, internal support thereof and methods for manufacturing same |
| CN202721196U (en) * | 2012-09-05 | 2013-02-06 | 黑龙江省爱普照明电器有限公司 | LED directly-conducting heat radiator |
| CN202918642U (en) * | 2012-11-16 | 2013-05-01 | 奇鋐科技股份有限公司 | Heat radiation device |
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Patent Citations (6)
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| JPS62194195A (en) * | 1986-02-19 | 1987-08-26 | Nishiyodo Kuuchiyouki Kk | Heat transfer tube equipped with internal surface fin |
| CN101927426A (en) * | 2009-06-24 | 2010-12-29 | 富准精密工业(深圳)有限公司 | Uniform-temperature panel and manufacturing method thereof |
| CN102683334A (en) * | 2011-03-09 | 2012-09-19 | 浙江名芯半导体科技有限公司 | High-power LED packaging structure with super-heat-conducting temperature equalizing plate |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105202492A (en) * | 2015-11-03 | 2015-12-30 | 刘树宇 | Chip architecture of high-power LED lamp |
| WO2024001278A1 (en) * | 2022-06-30 | 2024-01-04 | 中兴通讯股份有限公司 | Heat dissipation device, heat dissipation system, electronic apparatus, and manufacturing method for heat dissipation device |
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Application publication date: 20160106 |