CN101666433B - High power LED source for heat conduction by using room temperature liquid metal - Google Patents
High power LED source for heat conduction by using room temperature liquid metal Download PDFInfo
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- CN101666433B CN101666433B CN2009101018181A CN200910101818A CN101666433B CN 101666433 B CN101666433 B CN 101666433B CN 2009101018181 A CN2009101018181 A CN 2009101018181A CN 200910101818 A CN200910101818 A CN 200910101818A CN 101666433 B CN101666433 B CN 101666433B
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Abstract
The invention discloses a high power LED source for heat conduction by using a room temperature liquid metal, which comprises an LED chip, a concave package substrate, a room temperature liquid metal layer, a sealing layer, a radiator and a fluorescent adhesive layer. The LED chip is mounted on the concave package substrate, and an optical reflection surface is arranged on the concave package substrate. The fluorescent adhesive layer is covered on the LED chip and the concave package substrate is mounted on the radiator. A gap is arranged between the concave package substrate and the radiator and is sealed by the sealing layer, and the gap is filled with the room temperature liquid metal layer. The method effectively solves the problem of the thermal contact resistance between the high power LED package substrate and the radiator by using the high heat conductivity of the room temperature liquid metal, thereby achieving a better heat conduction effect; and the heat generated by the LED chip is transferred, and the junction temperature of the LED chip is kept at a low level, thereby improving the operation reliability of the high power LED and prolonging the service life thereof.
Description
Technical field
The present invention relates to lighting source, relate in particular to a kind of high-power LED light source that utilizes room temperature liquid metal heat conduction.
Background technology
Led light source is the new generation of green lighting source, and its power consumption has only 1/10th of ordinary incandescent lamp, and the life-span is long more than ten times.In addition, led light source also has advantages such as volume is little, sturdy and durable, rich color.In order to satisfy the requirement of higher light intensity, led light source by improving single chip power output or adopt the mode of led array to realize.In ideal conditions, the optical material of coupling and suitable encapsulating structure can be given full play to LED luminescent properties efficiently, and most electric energy is converted into light.But because the led chip area is very little, therefore a large amount of heats can't in time leave, and temperature is too high when therefore causing LED work.The too high PN junction long-term work that the output intensity and the colour temperature performance of high-power LED light source are had very large influence, particularly led chip of temperature is in the condition of high temperature, and its optical property can very fast decay, has a strong impact on the service life of LED.This is to need the key issue that solves in the LED encapsulation.
From the analysis of led light source heat generation characteristic as can be known, thermal contact resistance between LED base plate for packaging and the radiator has a strong impact on the heat dispersion of LED, special when the surface irregularity between base plate for packaging and the radiator, solution to this problem is to utilize heat conductive silica gel or other Heat Conduction Materials to be filled between two surfaces.But these material thermal conductivities are very little and easy wearing out, and influence the heat radiation and the long-time stability of device.How under prerequisite cheaply, adopt the better type of cooling, led light source is operated on the lower temperature works, obtain higher luminous efficiency, in the longer life-span, higher reliability is the key issue that the present invention will solve.
Liquid metals is that a kind of (below 100) at normal temperatures is rendered as liquid metal, it is big that this material has a thermal conductivity factor, have flowability under the normal temperature, porous can be used for reducing two kinds of thermal contact resistances between different materials in very trickle space.200510108394.3 disclose a kind of method of utilizing liquid metal cooling integrated chip, this method is primarily aimed at the integrated chip heat radiation, reduces thermal resistance by add liquid metal between two hot interfaces.What the led chip heat dissipation problem that the present invention will solve was different with the integrated chip heat radiation is, led chip must be installed on the base plate for packaging of ad hoc structure, base plate for packaging is provided with the erecting device of drawing lead, optical reflection unit and fluorescence glue-line of led chip, and the thermal contact resistance between base plate for packaging and the radiator is the subject matter that needs solution.The present invention makes full use of the characteristic of LED base plate for packaging, change the form of contact-making surface between base plate for packaging and the radiator, make two contact-making surfaces form the convex-concave surface of mutual interlock, increased contact area between the two greatly, utilize the permeability and the flowability of liquid metal that the space between two contact-making surfaces is full of liquid metal simultaneously, utilize the high-termal conductivity of liquid metal to improve between base plate for packaging and the radiator and dispel the heat, this method can fundamentally solve the excessive problem of thermal contact resistance between base plate for packaging and the radiator.
Summary of the invention
The objective of the invention is to overcome the deficiencies in the prior art, a kind of high-power LED light source that utilizes room temperature liquid metal heat conduction is provided.
A kind of high-power LED light source of room temperature liquid metal heat conduction that utilizes comprises led chip, spill base plate for packaging, room temperature liquid metal layer, sealant, radiator, fluorescence glue-line; Led chip is installed on the spill base plate for packaging, the spill base plate for packaging is provided with the optical reflection face, be coated with the fluorescence glue-line on the led chip, the spill base plate for packaging is installed on the radiator, has the space between spill base plate for packaging and the radiator, and, be full of by the room temperature liquid metal layer in the space by the sealant sealing.
A kind of high-power LED light source of room temperature liquid metal heat conduction that utilizes comprises led chip, plate shape base plate for packaging, room temperature liquid metal layer, sealant, radiator, fluorescence glue-line; Led chip is installed on the plate shape base plate for packaging, be coated with the fluorescence glue-line on the led chip, plate shape base plate for packaging is installed on the radiator, has the space between plate shape base plate for packaging and the radiator, and seal by sealant, be full of by the room temperature liquid metal layer in the space, be provided with concaveconvex structure between plate shape base plate for packaging and the radiator.
A kind of high-power LED light source of room temperature liquid metal heat conduction that utilizes comprises led chip, bowl-type base plate for packaging, room temperature liquid metal layer, sealant, radiator, fluorescence glue-line; Led chip is installed on the bowl-type base plate for packaging, the bowl-type base plate for packaging is provided with the optical reflection face, be coated with the fluorescence glue-line on the led chip, the bowl-type base plate for packaging is installed on the radiator, has the space between bowl-type base plate for packaging and the radiator, and by the sealant sealing, be full of by the room temperature liquid metal layer in the space, be provided with concaveconvex structure between bowl-type base plate for packaging and the radiator.
Described concaveconvex structure is that the cross section is square, trapezoidal, triangle, circular strip or point-like protrusion or concave face.
Described room temperature liquid metal layer is a kind of liquid metal or alloy that just is rendered as below 100, comprises at least a of following element: gallium, indium, zinc, tin, magnesium, copper or gold.
Described radiator is fin shape radiator or heat-pipe radiator.
Described sealant is the thin layer that is made of silica gel or epoxide resin material.
The present invention makes full use of the characteristic of LED base plate for packaging, change the form of contact-making surface between base plate for packaging and the radiator, make two contact-making surfaces form the convex-concave surface of mutual interlock, increased contact area between the two greatly, utilize the permeability and the flowability of liquid metal that the space between two contact-making surfaces is full of liquid metal simultaneously, utilize the high-termal conductivity of liquid metal to improve between base plate for packaging and the radiator and dispel the heat, this method can fundamentally solve the excessive problem of thermal contact resistance between base plate for packaging and the radiator.The advantage of this method is: the room temperature liquid metal is a kind of liquid metal that just is rendered as below 100, gallium etc. for example, these metals have very large thermal conductivity factor, tens times that are common silica gel thermal conductivity factor to hundreds of times, this material is filled between base plate for packaging and the radiator, the heat that led chip produces falls greatly to the thermal resistance of radiator conduction through base plate for packaging and reduces, in addition liquid metal also can produce convection heat transfer' heat-transfer by convection in the space, has further strengthened radiating effect.The effect that this method played is equivalent to base plate for packaging and radiator are merged fully.This fusion is different from welding between base plate for packaging and the radiator or elargol binding, can effectively avoid between the two because of the stress and the problem on deformation of welding and binding brings.In order further to increase the area of dissipation between base plate for packaging and the radiator, two surfaces that join at base plate for packaging and radiator are provided with many concaveconvex structures, these structures are interlocked mutually, middle space is full of the room temperature liquid metal, can realize better heat-transfer effect, a large amount of heats that led chip is produced transmit out, ensure that the junction temperature of led chip remains on reduced levels, thereby have improved the operational reliability and the service life of great power LED.
Description of drawings
Fig. 1 is the high-power LED light source I type structural representation that utilizes room temperature liquid metal heat conduction;
Fig. 2 is the high-power LED light source II type structural representation that utilizes room temperature liquid metal heat conduction;
Fig. 3 is the high-power LED light source III type structural representation that utilizes room temperature liquid metal heat conduction;
Fig. 4 is that the high-power LED light source of multiple chips array shows the structure intention.
Fig. 5 is the base plate for packaging schematic diagram with truncated cone-shaped projection;
Among the figure: led chip 1, spill base plate for packaging 2, room temperature liquid metal layer 3, sealant 4, radiator 5, fluorescence glue-line 6, concaveconvex structure 7, optical reflection face 8, plate shape base plate for packaging 9, bowl-type base plate for packaging 10, first led chip 11, second led chip 12, the 3rd led chip 13, the 4th led chip 14, truncated cone-shaped projection 15.
The specific embodiment
Describe the specific embodiment of the present invention in detail below in conjunction with accompanying drawing.
As shown in Figure 1, utilize the high-power LED light source of room temperature liquid metal heat conduction to comprise led chip 1, spill base plate for packaging 2, room temperature liquid metal layer 3, sealant 4, radiator 5, fluorescence glue-line 6; Led chip 1 is installed on the spill base plate for packaging 2, spill base plate for packaging 2 is provided with optical reflection face 8, be coated with fluorescence glue-line 6 on the led chip 1, spill base plate for packaging 2 is installed on the radiator 5, has the space between spill base plate for packaging 2 and the radiator 5, and, be full of by room temperature liquid metal layer 3 in the space by sealant 4 sealings.Room temperature liquid metal layer 3 is a kind of liquid metal or alloy that just are rendered as below 100, comprises at least a of following element: gallium, indium, zinc, tin, magnesium, copper or gold.Radiator 5 is fin shape radiator or heat-pipe radiator.Sealant 4 is the thin layers that are made of silica gel or epoxide resin material.
The light that led chip 1 produces sends by fluorescence glue-line 6, and most heats that led chip 1 produces conduct to radiator 5 through spill base plate for packaging 2.Spill base plate for packaging 2 and the radiator 5 general metal materials that adopt, thermal conductivity factor is higher.But rely on transmission of heat by contact between spill base plate for packaging 2 and the radiator 5, because machining accuracy be difficult to accomplish to contact well between two faces, so the thermal contact resistance between spill base plate for packaging 2 and the radiator 5 is very big.In order to reduce thermal contact resistance, between spill base plate for packaging 2 and radiator 5, add one deck liquid metals layer 3.This liquid metal is a kind of liquid metal or alloy that just is rendered as below 100, comprises at least a of following element: gallium, indium, zinc, tin, magnesium, copper or gold.For example gallium is a kind ofly can become the metal of liquid at 30 degree Celsius, and this liquid metal has very big thermal conductivity factor and well flowability and wellability, can penetrate into fully in the space between spill base plate for packaging 2 and the radiator 5.The spill base plate for packaging 2 conduction heat of coming is transmitted to radiator 5 by liquid-metal layer 3 like this.This liquid metal has very large thermal conductivity factor, tens times that are common silica gel thermal conductivity factor to hundreds of times, this material is filled between spill base plate for packaging 2 and the radiator 5, the heat that led chip 1 produces falls greatly to the thermal resistance of radiator 5 conduction through spill base plate for packaging 2 and reduces, in addition liquid metal also can produce convection heat transfer' heat-transfer by convection in the space, has further strengthened radiating effect.The effect that this method played is equivalent to spill base plate for packaging 2 and radiator 5 are merged fully.This fusion is different from welding between spill base plate for packaging 2 and the radiator 5 or elargol binding, can effectively avoid between the two because of the stress and the problem on deformation of welding and binding brings.Last oxidation and loss in order to prevent liquid metals is provided with the sealant 4 that is made of silica gel or epoxide resin material around the liquid metals layer.
As shown in Figure 2, utilize the high-power LED light source of room temperature liquid metal heat conduction to comprise led chip 1, plate shape base plate for packaging 9, room temperature liquid metal layer 3, sealant 4, radiator 5, fluorescence glue-line 6; Led chip 1 is installed on the plate shape base plate for packaging 9, be coated with fluorescence glue-line 6 on the led chip 1, plate shape base plate for packaging 9 is installed on the radiator 5, has the space between plate shape base plate for packaging 9 and the radiator 5, and by sealant 4 sealings, be full of by room temperature liquid metal layer 3 in the space, be provided with concaveconvex structure 7 between plate shape base plate for packaging 9 and the radiator 5.Concaveconvex structure 7 is that the cross section is square, trapezoidal, triangle, circular strip or point-like protrusion or concave face.Room temperature liquid metal layer 3 is a kind of liquid metal or alloy that just are rendered as below 100, comprises at least a of following element: gallium, indium, zinc, tin, magnesium, copper or gold.Radiator 5 is fin shape radiator or heat-pipe radiator.Sealant 4 is the thin layers that are made of silica gel or epoxide resin material.
On the plate shape base plate for packaging 9 that this structure adopts optical reflection face 8 is not set.Different with the design that a kind of spill base plate for packaging 2 projections in front are embedded in the radiator 5, this design directly is installed in plate shape base plate for packaging 9 above the radiator 5.In order further to increase the heat-conducting area between plate shape base plate for packaging 9 and the radiator 5, two surfaces that join at plate shape base plate for packaging 9 and radiator 5 are provided with concaveconvex structure 7, and these structures are interlocked mutually and make plate shape base plate for packaging 9 and radiator 5 have bigger heat-conducting area.Identical concaveconvex structure 7 is set on radiator 5 mates,, realize heat conduction, reach better heat-conducting effect by liquid metals then by the space between the filling concaveconvex structure 7 of liquid metals layer with the shape interlock of plate shape base plate for packaging 9.A large amount of heats that led chip is produced transmit out, ensure that the junction temperature of led chip remains on reduced levels, thereby have improved the operational reliability and the service life of great power LED.
As shown in Figure 3, utilize the high-power LED light source of room temperature liquid metal heat conduction to comprise led chip 1, bowl-type base plate for packaging 10, room temperature liquid metal layer 3, sealant 4, radiator 5, fluorescence glue-line 6; Led chip 1 is installed on the bowl-type base plate for packaging 10, bowl-type base plate for packaging 2 is provided with optical reflection face 8, be coated with fluorescence glue-line 6 on the led chip 1, bowl-type base plate for packaging 10 is installed on the radiator 5, has the space between bowl-type base plate for packaging 10 and the radiator 5, and by sealant 4 sealings, be full of by room temperature liquid metal layer 3 in the space, be provided with concaveconvex structure 7 between bowl-type base plate for packaging 10 and the radiator 5.Concaveconvex structure 7 is that the cross section is square, trapezoidal, triangle, circular strip or point-like protrusion or concave face.Room temperature liquid metal layer 3 is a kind of liquid metal or alloy that just are rendered as below 100, comprises at least a of following element: gallium, indium, zinc, tin, magnesium, copper or gold.Radiator 5 is fin shape radiator or heat-pipe radiator.Sealant 4 is the thin layers that are made of silica gel or epoxide resin material.
Fig. 4 has provided a kind of high-power LED light source of the room temperature liquid metal heat conduction that is made of the led chip array.Because single led chip power is not high, therefore to realize more high-power LED light source, a plurality of led chips need be arranged in array and realize illumination.This array is arranged at certain intervals according to triangle, square or circular, fashion by led chip and is formed.And spill base plate for packaging 2 has formed the array of convex according to the structure that chip is installed that is disposed with of led chip at spill base plate for packaging 2 back sides, and radiator 5 is provided with the spill array of mutual interlock.Between the contact-making surface of whole spill base plate for packaging 2 and radiator 5, all fill by liquid metals layer 3.Demonstrate first led chip 11, second led chip 12, the 3rd led chip 13, the 4th led chip 14 among the figure and be installed on the same base plate for packaging, and liquid metals layer 3 is filled between spill base plate for packaging 2 and the radiator 5.What Fig. 4 showed is the led chip array high-power LED light source that utilizes Fig. 1 structure to realize, utilizes Fig. 2 and Fig. 3 structure also can realize the led chip array high-power LED light source of said function.
Fig. 5 has provided a kind of base plate for packaging with truncated cone-shaped projection.This base plate for packaging is exactly a spill base plate for packaging 2 employed in figure 4, many truncated cone-shaped projectioies 15 is arranged below the spill base plate for packaging 2.
Claims (8)
1. a high-power LED light source that utilizes room temperature liquid metal heat conduction is characterized in that comprising led chip (1), spill base plate for packaging (2), room temperature liquid metal layer (3), sealant (4), radiator (5), fluorescence glue-line (6); Led chip (1) is installed on the spill base plate for packaging (2), spill base plate for packaging (2) is provided with optical reflection face (8), be coated with fluorescence glue-line (6) on the led chip (1), spill base plate for packaging (2) is installed on the radiator (5), has the space between spill base plate for packaging (2) and the radiator (5), and, be full of by room temperature liquid metal layer (3) in the space by sealant (4) sealing.
2. a high-power LED light source that utilizes room temperature liquid metal heat conduction is characterized in that comprising led chip (1), plate shape base plate for packaging (9), room temperature liquid metal layer (3), sealant (4), radiator (5), fluorescence glue-line (6); Led chip (1) is installed on the plate shape base plate for packaging (9), be coated with fluorescence glue-line (6) on the led chip (1), plate shape base plate for packaging (9) is installed on the radiator (5), has the space between plate shape base plate for packaging (9) and the radiator (5), and, be full of by room temperature liquid metal layer (3) in the space by sealant (4) sealing.
3. a kind of high-power LED light source that utilizes room temperature liquid metal heat conduction according to claim 2 is characterized in that being provided with concaveconvex structure (7) between described plate shape base plate for packaging (9) and the radiator (5).
4. a high-power LED light source that utilizes room temperature liquid metal heat conduction is characterized in that comprising led chip (1), bowl-type base plate for packaging (10), room temperature liquid metal layer (3), sealant (4), radiator (5), fluorescence glue-line (6); Led chip (1) is installed on the bowl-type base plate for packaging (10), bowl-type base plate for packaging (2) is provided with optical reflection face (8), be coated with fluorescence glue-line (6) on the led chip (1), bowl-type base plate for packaging (10) is installed on the radiator (5), has the space between bowl-type base plate for packaging (10) and the radiator (5), and, be full of by room temperature liquid metal layer (3) in the space by sealant (4) sealing.
5. a kind of high-power LED light source that utilizes room temperature liquid metal heat conduction according to claim 4 is characterized in that being provided with concaveconvex structure (7) between described bowl-type base plate for packaging (10) and the radiator (5).
6. according to claim 2 or 4 described a kind of high-power LED light sources that utilize room temperature liquid metal heat conduction, it is characterized in that described concaveconvex structure (7) is that the cross section is square, trapezoidal, triangle, circular strip or point-like protrusion or concave face.
7. according to claim 1,2 or 4 described a kind of high-power LED light sources that utilize room temperature liquid metal heat conduction, it is characterized in that described radiator (5) is fin shape radiator or heat-pipe radiator.
8. according to claim 1,2 or 4 described a kind of high-power LED light sources that utilize room temperature liquid metal heat conduction, it is characterized in that described sealant (4) is the thin layer that is made of silica gel or epoxide resin material.
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| CN2009101018181A CN101666433B (en) | 2009-08-27 | 2009-08-27 | High power LED source for heat conduction by using room temperature liquid metal |
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| CN2009101018181A CN101666433B (en) | 2009-08-27 | 2009-08-27 | High power LED source for heat conduction by using room temperature liquid metal |
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| CN101666433B true CN101666433B (en) | 2011-01-19 |
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| CN104534421A (en) * | 2014-12-24 | 2015-04-22 | 中国科学院半导体研究所 | LED light source module with highlight power density |
| CN104966704B (en) * | 2015-07-23 | 2019-01-25 | 国网智能电网研究院 | A kind of compression joint type power device package of low thermal resistance |
| CN105570733B (en) * | 2015-09-30 | 2018-04-03 | 浙江三磊科技有限公司 | A kind of LED module and LED point light source light fixture |
| NL2015982B1 (en) * | 2015-12-17 | 2017-07-05 | Cati B V | An electro-optical assembly. |
| JP6967917B2 (en) * | 2017-09-05 | 2021-11-17 | 株式会社小糸製作所 | Lamp unit and vehicle lamp |
| CN108150978A (en) * | 2017-11-27 | 2018-06-12 | 安徽西马新能源技术有限公司 | A kind of vehicle LED radiating subassembly |
| CN109882810B (en) * | 2017-12-06 | 2024-03-19 | 中国科学院工程热物理研究所 | Radiator device of full-angle LED projection lamp |
| TWI658612B (en) * | 2018-05-02 | 2019-05-01 | 態金材料科技股份有限公司 | Light-emitting diode structure capable of gaining light output performance |
| CN109413938A (en) * | 2018-10-24 | 2019-03-01 | 航天材料及工艺研究所 | A kind of efficient cooling means of composite material light and device |
| CN110471219B (en) * | 2019-07-31 | 2022-07-01 | 厦门天马微电子有限公司 | LED substrate and display device |
| CN114400278A (en) * | 2021-12-27 | 2022-04-26 | 江苏国中芯半导体科技有限公司 | LED packaging substrate and LED packaging equipment using same |
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