WO2024001278A1 - Heat dissipation device, heat dissipation system, electronic apparatus, and manufacturing method for heat dissipation device - Google Patents

Abstract

Provided in the present disclosure are a heat dissipation device, a heat dissipation system, an electronic apparatus, and a manufacturing method for a heat dissipation device. The heat dissipation device comprises: a substrate, provided with a first surface and a second surface which are oppositely arranged; a vapor chamber, at least arranged close to a heat source, the vapor chamber covering the side of the first surface facing away from the second surface so as to form a first chamber, in which a heat conduction piece is arranged; and a cooling cover plate, covering the side of the second surface facing away from the first surface so as to form a second chamber, in which a heat dissipation part is arranged.

Description

Heat dissipation device, heat dissipation system, electronic equipment and preparation method of heat dissipation device

Cross-references to related applications

This disclosure claims priority to Chinese patent application CN202210771738.2 titled "Heat dissipation device, heat dissipation system, electronic equipment and preparation method of heat dissipation device" submitted on June 30, 2022, the entire content of which is incorporated into this disclosure by reference. middle.

Technical field

The present disclosure relates to the field of semiconductor heat dissipation technology, and in particular, to a heat dissipation device, a heat dissipation system, electronic equipment, and a method for preparing a heat dissipation device.

Background technique

With the development of the electronics industry, especially the development and application of bare die packaging, 2.5D packaging and 3D packaging, the power consumption of a single chip continues to increase, Dennard's law has expired, and the chip heat flow density has doubled.

As chip power consumption increases and application scenario requirements change, VC temperature equalization cover is the most typical heat dissipation technology with the widest application scenarios. At the same time, liquid cooling technology is a heat dissipation method that uses the high thermal conductivity and high heat capacity characteristics of liquid to replace air as the heat dissipation medium, and has received more and more attention and application.

However, the heat dissipation device that uses a temperature equalizing cover plate and a liquid cooling plate welded has technical problems of low strength and reliability.

Contents of the invention

The main purpose of the present disclosure is to provide a heat dissipation device, a heat dissipation system, an electronic device and a preparation method of the heat dissipation device, aiming to solve the technical problem of low strength and low reliability of the heat dissipation device.

According to a first aspect of the present disclosure, a heat dissipation device is provided, including: a substrate having a first surface and a second surface arranged oppositely; a temperature equalizing cover plate, which is arranged at least adjacent to the heat source, and the temperature equalizing cover plate covers A first cavity is formed on the side of the first surface facing away from the second surface, and a heat conductive member is disposed in the first cavity; the cooling cover is covered on the side of the second surface facing away from the first surface to form a second cavity. cavity, a heat sink is provided in the second cavity.

According to a second aspect of the present disclosure, a heat dissipation system is provided, including at least two heat dissipation devices as described in any one of the first aspects, the inlets of each heat dissipation device being connected in series or in parallel through pipelines, and/or each The outlets of the heat dissipation device are connected in series or in parallel through pipelines.

According to a third aspect of the present disclosure, an electronic device is provided, including the heat dissipation device according to any one of the first aspects or the heat dissipation system according to the second aspect.

According to a fourth aspect of the present disclosure, a method for preparing a heat dissipation device is provided, including: preparing a temperature equalizing cover plate, a cooling cover plate and a base plate, wherein the base plate has a first surface and a second surface arranged oppositely; in the first Install a thermal conductive component on the side of one surface facing away from the second surface, and install a heat dissipation component on the side of the second surface facing away from the first surface; cover the temperature equalizing cover on the side of the base plate where the thermal conductive component is mounted, and cover the cooling cover Install the heat sink on the base plate.

Description of drawings

The accompanying drawings, which are incorporated in and constitute a part of this disclosure, illustrate embodiments consistent with the disclosure and together with the description, serve to explain the principles of the disclosure.

In order to more clearly illustrate the technical solutions in the present disclosure or the prior art, the drawings needed to be used in the embodiments or description of the prior art will be briefly introduced below. It is obvious that for those of ordinary skill in the art, Other drawings can also be obtained based on these drawings without incurring any creative effort.

Figure 1 shows a perspective view of a heat dissipation device provided by a first embodiment of the present disclosure;

Figure 2 shows a top view of the heat dissipation device provided by the first embodiment of the present disclosure;

Figure 3 is a cross-sectional view based on the A-A direction in Figure 2;

Figure 4 shows a front view of the heat dissipation device provided by the first embodiment of the present disclosure;

Figure 5 shows a design flow chart of a heat dissipation device provided by the first embodiment of the present disclosure;

Figure 6 shows a schematic structural diagram of a heat dissipation system provided by a second embodiment of the present disclosure;

Figure 7 shows a flow chart of a method for manufacturing a heat dissipation device provided by a third embodiment of the present disclosure;

Figure 8 is a flow chart based on the first implementation of Figure 7;

Figure 9 is a flow chart based on the second implementation of Figure 7;

Figure 10 is a flow chart based on the third implementation of Figure 7;

Figure 11 shows a flow chart of another preparation method of a heat dissipation device provided by a third embodiment of the present disclosure;

FIG. 12 shows a flow chart of yet another method of manufacturing a heat dissipation device provided by the third embodiment of the present disclosure.

The reference symbols are explained as follows:
100. Heat dissipation device; 1. Substrate; 11. First surface; 12. Second surface; 2. Temperature equalization cover; 21. First cavity; 22. Capillary structure; 23. Support member; 3. Cooling cover ; 31. Second cavity; 32. Cooling fins; 33. Inlet; 331. Water inlet pipe; 34. Exit; 341. Water outlet pipe; 4. Interface material layer; 5. Heat source.

Detailed ways

In order to make the purpose, technical solutions and advantages of the present disclosure clearer, the technical solutions in the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings in the present disclosure. Obviously, the described embodiments are part of the implementation of the present disclosure. examples, not all examples. Based on the embodiments in this disclosure, all other embodiments obtained by those of ordinary skill in the art without any creative efforts fall within the scope of protection of this disclosure.

With the development of the electronics industry, especially the development and application of bare die packaging, 2.5D packaging and 3D packaging, the power consumption of a single chip continues to increase, Dennard's law has expired, and the chip heat flow density has doubled. The heat flow density of chips in the industry continues to rise and will reach 150W/cm ² by 2024.

With the increase in chip power consumption and changes in application scenario requirements, VC temperature equalization cover radiator and floating radiator technologies have gradually developed. Current heat dissipation technology has evolved into high power consumption, high heat flow density heat dissipation technology, high heat flow density VC, 3DVC, Products such as TS emerged as the times require and have become the current mainstream technology. Among all two-phase heat dissipation technologies, VC temperature equalization cover is the most typical and widely used heat dissipation technology. At the same time, liquid cooling technology uses the high thermal conductivity and high heat capacity characteristics of liquids to replace air as a heat dissipation medium. Compared with traditional forced air cooling, liquid cooling technology has a stronger heat dissipation effect and a shorter heat dissipation path. It has received more and more attention and application.

For heat dissipation of high-power, high-heat-flux-density chips or devices, the industry generally adopts the following technologies: the vapor chamber plate and the liquid cooling plate are welded together, or the vapor chamber plate and the liquid cooling plate are fastened together by bolts. A sealing layer is provided at the joint between the vapor cooling plate and the liquid cooling plate. However, the vapor cooling plate and the liquid cooling plate are connected together by welding, which not only introduces the thermal resistance of the welding interface, but the vapor cooling plate and the liquid cooling plate are made separately. In order to ensure their respective The strength and performance are high, and its own thermal resistance is also large; in addition, there is a risk of welding failure and reduced reliability.

The chip heat dissipation device in some cases mainly has the following solutions. The first option is to use VC equalizing plate technology. The purpose of this technology is to equalize temperature, but it does not have the ability to dissipate heat. It is generally used by manufacturers in combination with fins (or heat dissipation teeth). The heat dissipation of chips or devices belongs to forced air cooling technology; its heat dissipation capacity is related to the matching fins (or heat dissipation teeth), fans and the air duct design of the system; Option 2 uses cold plate heat dissipation technology, and its heat dissipation capacity is affected by the cold plate Its own structural limitations; the micro-channel cold plate heat dissipation technology commonly used in the industry, under certain boundary conditions, has a maximum heat dissipation capacity of less than 100W/cm2; the third option is to use a uniform temperature plate and a cold plate to be cross-connected, so that the cooling part can not only It can dissipate heat for chips or devices that are in direct contact, and can also dissipate heat for the vapor chamber connected to it. The vapor chamber is used to further dissipate heat from the chip or device, effectively increasing the heat dissipation area of the chip device, thereby improving cooling performance. This solution mainly provides temperature uniformity for heat dissipation, but its maximum heat dissipation capacity is limited. Solution 4 is a new type of uniform temperature cold plate, which achieves free temperature control through the organic combination of uniform temperature plate technology and cold plate technology. In this solution The vapor chamber and the cold plate are welded together, or the vapor chamber is fastened to the cold plate cavity through bolts, and a seal is placed on the joint surface of the two. The vapor chamber plate and the cold plate are connected together by welding, which not only introduces the thermal resistance of the welding interface, but the cold plate and the vapor chamber plate are made separately. In order to ensure their respective strength and performance, their own thermal resistance is also large; in addition, there is failure in the welding risk and reduced reliability.

In view of the above technical problems, the present disclosure provides a heat dissipation device, a heat dissipation system, an electronic device and a preparation method of the heat dissipation device, which are specifically described with reference to the accompanying drawings.

First embodiment

As shown in Figures 1 to 4, the first embodiment of the present disclosure provides a heat dissipation device 100, which includes: a substrate 1 with a first surface 11 and a second surface 12 arranged oppositely; a temperature equalizing cover 2, and The heat source 5 is at least disposed nearby, and the temperature equalizing cover plate 2 covers the side of the first surface 11 away from the second surface 12 to form a first cavity 21 , and a heat conductive member is provided in the first cavity 21 ; the cooling cover plate 3 , covering the side of the second surface 12 away from the first surface 11 (specifically, it can be covered on the shovel teeth of the second surface 12) to form the second cavity 31, and a heat dissipation component is provided in the second cavity 31. .

According to the heat dissipation device 100 provided in the first embodiment of the present disclosure, the substrate 1 is provided with a first surface 11 and a second surface 12 that are away from each other. The substrate 1 is an integrated structure, and the temperature equalizing cover 2 and the cooling cover 3 are They are installed on the first surface 11 and the second surface 12 respectively. When in use, the heat source 5 and the temperature equalizing cover 2 are at least placed close to each other. The heat from the heat source 5 enters the first cavity 21 and is transferred to the second cavity 31 through the heat conduction member. , the heat dissipation process is performed by the heat sink in the second cavity 31. The difference between the present disclosure and the prior art is that the base plate 1 in the present disclosure replaces the contact surface formed by welding or bolting of the vapor chamber and the liquid cooling plate. , on the one hand, no additional sealing structure is required to achieve better sealing performance, on the other hand, the interface thermal resistance caused by welding is reduced, and the heat dissipation performance and reliability of the heat dissipation device 100 are improved.

In addition, the heat source 5 is a chip or device, which adopts indirect liquid cooling technology and is processed by the heat dissipation device of the present disclosure. It has both the temperature equalization characteristics of the temperature equalizing cover 2 and the high heat dissipation performance of the cooling cover 3. It can be either a single-phase liquid cooling solution or a phase change liquid cooling solution. The chip or device can be the same The types can also be different types. For example, liquid cooling can be used for CPU and GPU at the same time. This technology can be used in pure liquid cooling systems or air-liquid hybrid cooling systems, and can be applied to ICT liquid cooling equipment. It can also be used in the power industry, battery cooling industry, etc.

Alternatively, the temperature equalizing cover plate 2 in the present disclosure can also be a thermal conductive plate with ultra-high thermal conductivity, where thermal conductivity, also known as thermal conductivity coefficient or thermal conductivity, is a physical quantity indicating the thermal conductivity of a material. The thermal conductivity of materials changes with the composition, physical structure, material state, temperature, pressure, etc. Ultra-high thermal conductivity refers to a thermal rate exceeding 2000W/m/K.

For thermal conductive parts, the thermal conductive parts include: working fluid flow carrier and cooling working fluid. The uniform temperature cover plate 2 absorbs the heat from the heat source 5 and distributes the heat on the uniform temperature cover plate 2. The cooling working fluid is moved by the working fluid flow carrier. Driven to flow in the first cavity 21, after the liquid cooling medium absorbs the dispersed heat, the cooling medium changes phase and vaporizes. The phase-change vaporized cooling medium is transferred to the substrate 1, and the vaporized cooling medium is transferred to the substrate 1. The working fluid liquefies when it is cooled and dissipates heat, and drips on the temperature equalizing cover 2. Among them, the working fluid flow carrier is a capillary structure 22 . In an exemplary embodiment, the capillary structure 22 is provided on a side of the temperature equalizing cover plate 2 facing the first surface 11 , and/or the capillary structure 22 is provided on a side of the first surface 11 facing the temperature equalizing cover plate 2 .

In an exemplary embodiment, the working fluid flow carrier can be a capillary structure 22. The uniform temperature cover plate 2 absorbs heat from the heat source 5 and distributes the heat on the uniform temperature cover plate 2. At the same time, the liquid cooling medium The flow is driven by the capillary force of the capillary structure 22 to further spread the heat on the uniform temperature cover plate 2. At the same time, the cooling medium absorbs heat and vaporizes, flows to the substrate 1, transfers the heat to the first surface, and dissipates the heat through the substrate 1 The heat is conducted to the heat sink, and finally the heat is taken away through the flowing cooling fluid.

Therefore, the capillary structure 22 serves as a flow carrier of the working fluid, and the cooling fluid is filled in the first cavity 21. The capillary structure 22 and the cooling fluid also play a role in distributing heat on the uniform temperature cover plate 2. At the same time, the heat encounters When the liquid cooling medium is reached, the cooling medium absorbs heat and evaporates, then changes phase and vaporizes. The vaporized cooling medium is transferred to the substrate 1 from the first surface 11 .

Among them, the capillary structure 22 is a porous capillary structure 22. The porous capillary structure 22 is mostly made by using copper powder. The porous structure is formed by sintering the copper powder. The particle size and particle size distribution of the copper powder, the sintering furnace temperature and time , will affect the porosity of the sintered layer. Currently, a common method is to use a hole-forming agent mixed with copper powder to increase the porosity of the capillary structure 22. The production is relatively complicated, and the porosity is not easy to control. Furthermore, taking the micro heat pipe capillary structure 22 of sintered copper powder as an example, a central rod is placed in the center of the copper pipe body, copper powder is poured into the copper pipe body, and then high-temperature sintering is performed. After the sintering is completed, After cooling, the copper pipe body is pulled out to form a capillary structure 22 on the wall of the copper pipe body.

When diffusion welding is used to connect the temperature equalizing cover plate 2 and the substrate 1, in order to ensure the welding pressure, the first cavity 21 It is also provided with: at least one support member 23, each support member 23 is spaced apart, one end of the support member 23 is at least adjacent to the side of the temperature equalizing cover plate 2 facing the first surface 11, and the other end of the supporting member 23 faces the first surface 11 facing the temperature equalizing cover. At least one side of the plate 2 is disposed adjacent to it. In an exemplary embodiment, in order to improve the heat dissipation capacity of the temperature equalizing cover plate 2 , the outer periphery of the support member 23 can be sintered with a capillary structure 22 .

In order to improve the heat dissipation effect of the first cavity 21, the first cavity 21 is also provided with: at least one heat exchange tube, each heat exchange tube is spaced apart from the support member 23, and the heat exchange tube is filled with a cooling medium. The fluid can be a gaseous cooling fluid or a liquid cooling fluid, so that the first cavity 21 can not only have a heat conduction effect, but also a heat dissipation effect, further improving the heat dissipation effect of the chip or device. In an exemplary embodiment, in order to improve the average To improve the heat dissipation capability of the temperature cover plate 2, the heat exchange tube extends along the direction of the temperature uniform cover plate 2 toward the substrate 1, and the capillary structure 22 can be sintered around the outer periphery of the heat exchange tube.

For the heat sink, the heat sink includes: at least one cooling fin 32 , and each cooling fin 32 is connected to a side of the second surface 12 away from the first surface 11 . It should be noted that the second surface 12 and the cold plate fins can be processed integrally or separately. The cooling fins 32 can be milled channels, micro-channels or other suitable flow channel structures.

In order to enable the heat of the heat source 5 to be better absorbed, an interface material layer 4 is also included. The interface material layer 4 is provided between the heat source 5 and the temperature equalizing cover 2. The interface material layer 4 is used to conduct the heat of the heat source 5 to The temperature equalizing cover plate 2 and the interface material layer 4 are made of interface materials. The interface material is used to be coated between the side of the temperature equalizing cover plate 2 away from the substrate 1 and the heat source 5 to reduce the contact thermal resistance between the two. The general name of the materials used.

In one embodiment of the present disclosure, the cooling cover 3 is also provided with inlets 33 and outlets 34 distributed at intervals, and both the inlets 33 and the outlets 34 are connected to the cooling system. The cooling working fluid flowing in the second cavity 31 may be aqueous working fluid (such as deionized water, water glycol solution, etc.) or non-aqueous working fluid (such as electronic fluoride liquid, hydrocarbon substances, etc.) Or refrigerant (for example, R134a, R22, R134-yf, etc.). The water inlet pipe 331 and the water outlet pipe 341 may be metal pipes or non-metal pipes. The new composite uniform temperature liquid cooling plate and pipelines can be connected in the form of welding, crimping, threaded joints, etc.

In some embodiments, the side of the temperature equalizing cover plate 2 facing the heat source 5 can be designed in a planar form according to the heat source 5, or in the form of a boss or a groove to adapt to the height and shape of the heat source 5, and uniform temperature. The side of the cover 2 facing the heat source 5 can be placed adjacent to the heat source 5 or directly in contact with the heat source 5 to achieve better heat dissipation effect. The fixation of the temperature equalizing cover 2 and the heat source 5 is not limited here. The fixing position can be on the side of the temperature equalizing cover 2 away from the base plate 1, or it can be fixed to the heat source 5 through an external design bracket or lining plate. The fixing method can be It is a spring screw or a set screw. wait.

Regarding the material of the heat sink 100, the materials of the temperature equalizing cover plate 2, the base plate 1 and the cooling cover plate 3 in the heat sink 100 can be all copper, all aluminum, part of it copper, part of it aluminum, or other high-quality materials. Thermal conductivity of metals. The cooling cover plate 3 may be made of non-metallic material, and the cooling cover plate 3 and the substrate 1 are sealedly connected through a sealing ring or glue.

As shown in FIG. 5 , the design method of the heat dissipation device 100 in this embodiment includes the following steps 1 to 8.

Step 1) From the perspective of thermal resistance, decompose the thermal resistance according to its internal structure, as follows: The total thermal resistance of the heat sink 100 can be decomposed into: the thermal resistance R _hs of the heat source 5 itself, and the thermal resistance R hs between the heat source 5 and the heat sink 100. The thermal resistance R _TIM of the interface material layer 4, the thermal resistance R _vc of the uniform temperature cover plate 2 and the thermal resistance R _cp of the cooling cover plate 3, the total thermal resistance R _total ; the calculation expression of the total thermal resistance is as follows:

R _total =R _cp + R _vc + RTIM + R _hs .

Step 2) Design each part of the component based on the thermal resistance of each part after decomposition, and finally ensure that its thermal resistance can meet the design requirements.

Step 3) Use the uniform temperature cover plate 2 to conduct simulation evaluation or theoretical evaluation on the designed structure to ensure that its thermal resistance meets the requirements, as follows:

As shown in Figure 3, the specific steps are as follows: ① Use the uniform temperature cover plate 2 to conduct simulation evaluation or theoretical evaluation on the designed structure to ensure that its thermal resistance meets the requirements. The uniform temperature cover plate takes the VC uniform temperature plate type as an example. The theoretical calculation of the temperature of the plate is shown in Table 1.

Table 1

where δ represents thickness, K thermal conductivity, A area, Φ heat transfer, R thermal resistance, R _g gas constant of steam, L latent heat of vaporization, P _v steam pressure, ΔP _ve steam pressure in evaporation section, T _v is the thermodynamic temperature of steam , T _c is the steam temperature in the condensation section.

Step 4) Carry out simulation evaluation on the designed cooling cover plate 3 to ensure that it meets the thermal resistance requirements; one of the key points in the design of the cooling cover plate 3 is the design of its flow channel, and the design of the flow channel can use topology optimization methods.

Step 5) Conduct an overall simulation evaluation or theoretical calculation based on the newly designed heat dissipation device 100 to make its thermal resistance meet the requirements; if not, modify the structure of the temperature equalizing cover 2 or the cooling cover 3 and re-evaluate until the design is met. Require.

Step 6) Proof and test the designed structure; if the design requirements are not met, optimize the design and re-prototype and test.

Step 7) Perform regression analysis and revise optimization methods.

Step 8) Complete.

Second embodiment

As shown in Figure 6, based on the first embodiment, this embodiment provides a heat dissipation system, including at least two heat dissipation devices 100 as described in any one of the first embodiment. The inlet of each heat dissipation device 100 33 are connected in series or in parallel through pipelines, and/or the outlets 34 of each heat dissipation device 100 are connected in series or in parallel through pipelines.

In an exemplary embodiment, the inlet 33 and the outlet 34 are respectively provided on the cooling cover 3 . The two inlets 33 of the two heat dissipation devices 100 are respectively connected to the cooling device through the water inlet pipe 331 . Each outlet 34 is connected to a cooling device through a water outlet pipe 341, and the cooling device contains a cooling medium, thereby forming a circulation heat dissipation.

It should be noted that the single board contains one or more liquid-cooled heat dissipation chips (or heating devices), which are connected through pipelines to form a series/parallel fluid circuit. The inlet and outlet of the pipeline are connected to the outside world to form a closed circuit. ;Cooling work in the circuit The fluid can be fluorinated liquid, water or water-ethylene glycol single-phase cooling fluid, etc., or it can be a phase change fluid (refrigerant) such as R134a, etc.

Third embodiment

Based on the first embodiment and the second embodiment, this embodiment provides an electronic device, including the heat dissipation device of the first embodiment or the heat dissipation system of the second embodiment.

It should be pointed out that the above-mentioned electronic equipment includes routers, switches, servers, BBUs, base stations, etc.

Fourth embodiment

As shown in FIG. 7 , based on the first embodiment, this embodiment provides a method for manufacturing a heat dissipation device 100 , including: step S1 to step S3.

S1. Prepare the temperature equalizing cover plate 2, the cooling cover plate 3 and the substrate 1, wherein the substrate 1 has a first surface 11 and a second surface 12 arranged oppositely.

S2. Install a heat conductive component on the side of the first surface 11 facing away from the second surface 12 , and install a heat dissipation component on the side of the second surface 12 facing away from the first surface 11 .

S3. Cover the temperature equalizing cover 2 on the side of the base plate 1 where the heat conductive parts are installed, and cover the cooling cover 3 on the side of the base plate 1 where the heat dissipation parts are installed.

In step S2, installing a heat sink on the side of the second surface 12 away from the first surface 11 includes: installing a heat sink on the second surface 12 of the substrate 1. The heat sink is a cooling fin 32. The surface 12 and the cooling fins 32 (or the heat dissipation teeth) can be processed integrally or separately; if processed separately, the second surface 12 and the cooling fins 32 (or the heat dissipation teeth) are connected by welding.

In step S3, it includes: As shown in Figure 8, the temperature equalizing cover plate 2 and the first surface 11 of the substrate 1 can be processed by welding first, and then connected as a whole to the cooling cover plate 3 by brazing. Forming; the temperature equalizing cover plate 2 and the first surface 11 of the substrate 1 can be formed by any one of diffusion welding, soldering, and laser welding.

The specific steps are: apply solder paste on the first surface 11 of the substrate 1 and the temperature equalizing cover plate 2 respectively, connect the first surface 11 and the temperature equalizing cover plate 2 using diffusion welding, and then apply solder paste on the second surface 12 of the substrate 1 and cool it. The cover 3 is coated with solder paste respectively, and the second surface 12 is connected to the cooling cover 3 using a soldering process. At this time, the heat sink 100 has completed structural processing and is finally processed. Fill the temperature equalizing cover plate 2 and conduct performance and reliability testing and verification.

or,

As shown in Figure 9, the temperature equalizing cover plate 2, the cooling cover plate 3 and the first surface 11 and the second surface 12 of the substrate 1 can be processed and formed by welding. Specifically, either diffusion welding or brazing can be used. .

The specific steps are: apply solder paste on the first surface 11, the second surface 12, the temperature equalizing cover plate 2 and the cooling cover plate 3 of the substrate 1 respectively. The cooling cover 3 is welded together by diffusion welding or brazing, and then the temperature equalizing cover 2 is filled, and finally the heat dissipation device 100 is tested for systematic performance and reliability.

or,

As shown in Figure 10, solder paste is coated on the first surface 11 of the substrate 1 and the temperature equalizing cover plate 2 respectively. The first surface 11 and the temperature equalizing cover plate 2 are connected using diffusion welding, and then they are connected with the cooling cover plate 3 (cooling The cover plate 3 can be made of metal or non-metallic material) and connected using a sealed connection method (using a sealing ring non-welded sealed connection method). At this time, the heat sink 100 has completed structural processing, and finally the temperature equalizing cover plate 2 is Charge, perform performance and reliability testing and verification.

After S3, please continue to refer to Figure 6. The cooling cover 3 is also provided with an inlet 33 and an outlet 34 distributed at intervals. The inlet 33 and the outlet 34 are connected to the liquid supply device through the water inlet pipe 331 and the water outlet pipe 341 respectively. connect.

In addition, as shown in Figure 11, in another embodiment, the vapor chamber and liquid cooling plate are designed, processed and tested for performance and reliability respectively, and then connected by soldering, and finally the relevant performance and reliability of the whole are tested. test.

Or, as shown in Figure 12, in yet another embodiment, the vapor chamber and the liquid cooling plate are designed separately, and then connected by soldering, and finally the relevant performance and reliability tests are performed on the whole.

The heat dissipation device, heat dissipation system, electronic equipment and heat dissipation device preparation method provided by the present disclosure improve the strength and reliability of the heat dissipation device. According to the heat dissipation device, heat dissipation system, electronic equipment and heat dissipation device preparation method provided by the present disclosure, the substrate is provided with a first surface and a second surface that are away from each other. The substrate is an integrated structure, and then the temperature equalizing cover plate and the cooling cover are The plates are installed on the first surface and the second surface respectively. When in use, the heat source and the temperature equalizing cover plate are placed at least close to each other. The heat from the heat source enters the first cavity and is transferred to the second cavity through the heat conductive member. The heat dissipation parts are used for heat dissipation treatment. The difference between this disclosure and the prior art is that the base plate in this disclosure replaces the welding connection or bolt connection between the vapor chamber plate and the liquid cooling plate to form a contact surface. On the one hand, no additional sealing structure is required. Able to achieve better sealing performance, on the other hand reduce the welding tape The resulting interface thermal resistance improves the heat dissipation performance and reliability of the heat dissipation device. Compared with the general process of processing the vapor chamber and the liquid cooling plate separately and then welding them, the present disclosure reduces the interface thermal resistance caused by soldering and improves the heat dissipation performance and reliability of the heat dissipation device.

It should be noted that in this article, relational terms such as “first” and “second” are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply these There is no such actual relationship or sequence between entities or operations. Furthermore, the terms "comprises," "comprises," or any other variations thereof are intended to cover a non-exclusive inclusion such that a process, method, article, or apparatus that includes a list of elements includes not only those elements, but also those not expressly listed other elements, or elements inherent to the process, method, article or equipment. Without further limitation, an element defined by the statement "comprises a..." does not exclude the presence of additional identical elements in a process, method, article, or apparatus that includes the stated element.

The above descriptions are only specific embodiments of the present disclosure, enabling those skilled in the art to understand or implement the present disclosure. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be practiced in other embodiments without departing from the spirit or scope of the disclosure. Therefore, the present disclosure is not to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims (12)

1. A heat dissipation device including:

   a substrate having a first surface and a second surface disposed oppositely;

   A temperature equalizing cover plate is disposed at least adjacent to the heat source. The temperature equalizing cover plate covers the side of the first surface away from the second surface to form a first cavity. A first cavity is provided in the first cavity. Thermal conductive parts;

   The cooling cover is closed on the side of the second surface away from the first surface to form a second cavity, and a heat dissipation component is disposed in the second cavity.
2. The heat dissipation device according to claim 1, wherein the heat conductive member includes: a working fluid flow carrier and a cooling working fluid, and the uniform temperature cover absorbs heat from the heat source and distributes the heat on the uniform temperature cover. , the cooling working fluid is driven by the working fluid flow carrier to flow in the first cavity. After the cooling working fluid absorbs the distributed heat, the cooling working fluid vaporizes, and the vaporized cooling working fluid is transferred to the substrate.
3. The heat dissipation device according to claim 2, wherein the working fluid flow carrier is a capillary structure.
4. The heat dissipation device according to claim 3, wherein the wick structure is provided on a side of the temperature equalizing cover facing the first surface, and/or the wick structure is provided on a side of the first surface facing One side of the temperature equalizing cover plate.
5. The heat dissipation device according to claim 3, wherein the first cavity is further provided with: at least one support member, each of the support members is spaced apart, and one end of the support member and the temperature equalizing cover plate face the One side of the first surface is at least disposed adjacent to the first surface, and the other end is at least disposed adjacent to the side of the first surface facing the temperature equalizing cover plate.
6. The heat dissipation device according to claim 5, wherein the capillary structure is provided on an outer periphery of the support member.
7. The heat dissipation device according to claim 1, wherein the heat dissipation member includes at least one cooling fin, and each cooling fin is connected to a side of the second surface away from the first surface.
8. The heat dissipation device according to claim 1, further comprising an interface material layer disposed between the heat source and the temperature equalizing cover plate, the interface material layer being used to convert the heat source into The heat is conducted to the uniform temperature cover plate.
9. The heat dissipation device according to claim 1, wherein the cooling cover is further provided with an inlet and an outlet distributed at intervals, and both the inlet and the outlet are connected to a cooling system.
10. A heat dissipation system, including at least two heat dissipation devices according to any one of claims 1 to 9, the inlets of each of the heat dissipation devices are connected in series or in parallel through pipelines, and/or the outlets of each of the heat dissipation devices are connected through Pipes are connected in series or parallel.
11. An electronic device, including the heat dissipation device according to any one of claims 1-9 or the heat dissipation system according to claim 10.
12. A method of preparing a heat dissipation device, including:

    Prepare a uniform temperature cover plate, a cooling cover plate and a base plate, wherein the base plate has a first surface and a second surface arranged oppositely;

    Install a heat conductive component on the side of the first surface facing away from the second surface, and install a heat dissipating component on the side of the second surface facing away from the first surface;

    Cover the temperature equalizing cover on the side of the base plate where the heat conductive parts are installed, and cover the cooling cover on the side of the base plate where the heat dissipation parts are installed.