CN207893719U - For photo-thermal integrated device, radiator and the LED light under superelevation heat flow density - Google Patents
For photo-thermal integrated device, radiator and the LED light under superelevation heat flow density Download PDFInfo
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- CN207893719U CN207893719U CN201820248570.6U CN201820248570U CN207893719U CN 207893719 U CN207893719 U CN 207893719U CN 201820248570 U CN201820248570 U CN 201820248570U CN 207893719 U CN207893719 U CN 207893719U
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Abstract
The disclosure provides a kind of photo-thermal integrated device, radiator and LED light under superelevation heat flow density, including：Heat sink substrate is used to radiate for luminescent device, including：Open channel；Hydrophilic coating, the hydrophilic coating Surface Creation polarized molecular radical；And articulamentum.The photo-thermal integrated device being used under superelevation heat flow density that the disclosure provides, radiator and LED light pass through setting hydrophilic coating and the polar molecule group on hydrophilic coating surface, the cooperative reinforcing effect of the two can greatly improve the wetting characteristics on open channel surface, greatly increase the capillary gradients in open channel, so that heat sink under superelevation heat flow density being capable of timely fluid infusion, high-strength composite phase-change heat-exchange persistently occurs, and luminescent device and heat sink substrate are formed by integral structure by articulamentum, eliminate the interface resistance between luminescent device and heat sink substrate, it further increases and heat sink takes thermal energy power, it ensure that high heat-exchanging performance heat sink under superelevation heat flow density and high reliability.
Description
Technical field
This disclosure relates to phase-change heat-exchange technical field more particularly to a kind of photo-thermal integrator under superelevation heat flow density
Part, radiator and LED light.
Background technology
Along with high-power LED light source micromation, integrated development trend, the power density of LED light source is higher and higher.
For example, the power density of traditional array LED lamp bead light source is about 10W/cm2, using the COB integrated LED single light source work(of fluorescent powder
Rate density is 20~50W/cm2, and the state-of-the-art COB integrated LED monochromatic light source power using block fluorescence transition material at present
Density is up to 50~500W/cm2, since there are about 70% electric energy can be converted to heat at work for LED chip, power density
Continuous improvement can cause LED light source fever heat flow density to significantly increase.It can define 20~150W/cm2For high heat flux density；Work as heat
Current density is more than 150W/cm2, the critical heat flux density that pool boiling phase-change heat-exchange occurs for stock size surface is alreadyd exceed, can be determined
Justice is superelevation heat flow density.If the golf calorific value that high-power LED light source generates when working cannot effectively be dispersed, it will cause
LED chip junction temperature increases, and causes spectrum change, light efficiency to reduce, the lost of life.Therefore, heat dissipation is that high-power LED lamp application must
The critical issue that must be solved.
Microgroove group composite phase change radiator is utilized in the prior art, takes the heat sink upper structure size of heat tens to hundreds of at it
The open micro-channel array structure of micron, the capillary gradients formed can drive liquid working substance to flow, and logical
Three-phase line of contact region promotes the formation of extension meniscus evaporation thin film in road, under the conditions of high heat load, it may occur that thin liquid
Film evaporates and the composite phase-change heat exchange of thick liquid film region kernel state boiling, is a kind of typical high-performance passive minute yardstick phase transformation
Heat transfer technology can be utilized to implement the heat exchange of the high coefficient of heat transfer and high heat flux density under low thermal resistance and condition of small temperature difference
Journey, current takes hot heat flow density up to 400W/cm2, it is that currently the only to be likely to be suited under superelevation heat flow density LED lamp high
Imitate the passive type technology of heat dissipation.
However during realizing the disclosure, applicants have discovered that, under the conditions of superelevation heat flow density, as hot-fluid is close
The further raising of degree, the liquid working substance in heat sink open micro-channel array will become to be easy to it is dry, once liquid pool
Dry place is not replenished in time in interior liquid working substance, then can not continuously form thin liquid film and thick liquid film region, can not just send out yet
The thin liquid film evaporation of raw high intensity and the composite phase-change heat exchange of thick liquid film nucleate boiling, heat sink heat dissipation performance and reliability are substantially
Decline, limits further increasing for Microgroove group composite phase change radiator heat exchange property under the conditions of superelevation heat flow density.
Utility model content
(1) technical problems to be solved
Based on above-mentioned technical problem, the disclosure provides a kind of photo-thermal integrated device under superelevation heat flow density, heat dissipation
Device and LED light, it is close in superelevation hot-fluid to alleviate the heat radiation working medium in the heat sink middle open channel in LED light in the prior art
It is easy to dry up under the conditions of degree, dry place can not be replenished in time, to the thin liquid film evaporation that high intensity can not occur and thick liquid
The composite phase-change of film nucleate boiling exchanges heat, and limits further increasing for radiator heat exchange property under the conditions of superelevation heat flow density
Technical problem.
(2) technical solution
According to one aspect of the disclosure, a kind of photo-thermal integrated device under superelevation heat flow density is provided, including：Heat
Heavy substrate, radiates for luminescent device, including：Open channel is arranged in any plate face of the heat sink substrate, utilizes hair
Thin phenomenon driving heat radiation working medium is flowed along the open channel；And hydrophilic coating, the table in the open channel is set
Face, the hydrophilic coating Surface Creation polarized molecular radical, the hydrophilic coating and the polar molecule group are opened described in improving
Put the fluid infusion ability in formula channel；And articulamentum, it is arranged at the back side of plate face where the open channel, connects heat sink base
Plate and the luminescent device.
In some embodiments of the present disclosure, fluted, the company is arranged in the back side of plate face where the open channel
Layer is connect to be embedded in the heat sink substrate by the groove.
In some embodiments of the present disclosure, the open channel includes N items, and open channel is set side by side described in N items
It sets；Wherein N >=10.
In some embodiments of the present disclosure, the arranging density of the open channel is not less than 5/cm.
In some embodiments of the present disclosure, wherein：The width of the open channel is between 20 μm to 5000 μm；
The depth of the open channel is between 20 μm to 5000 μm；The spacing of the two adjacent open channels between 20 μm extremely
Between 5000 μm；The thickness of the hydrophilic coating is between 20nm to 50 μm；The thickness of the articulamentum is between 1 μm to 1400
Between μm.
In some embodiments of the present disclosure, the cross section of the open channel is rectangle, trapezoidal, triangle, circular arc
Shape or irregular figure.
In some embodiments of the present disclosure, wherein：The hydrophilic coating includes：Woelm Alumina, porous oxidation niobium, oxygen
Change at least one of zinc sodium, titanium oxide, zinc oxide, tin oxide, vanadic anhydride, copper oxide, cuprous oxide, Kocide SD；
The polar molecule group includes：In carboxylic acid group, sulfonic group, phosphate, amino, quaternary ammonium group, hydroxyl, carboxylate, block polyether
At least one；The articulamentum includes：Tin solder；The heat sink substrate includes：Metal, alloy, semiconductor, ceramics, oxygen
At least one of compound；The thermal coefficient of the wherein described heat sink substrate is not less than 20W/mK.
In some embodiments of the present disclosure, wherein：The articulamentum by physical vapour deposition (PVD), chemical vapor deposition or
Surface Creation of the electric plating method in the heat sink substrate；Or the articulamentum passes through metal promoted layer and the heat sink substrate
Surface connects；Wherein, the metal promoted layer includes：At least one of gold, silver, nickel, lead, organic solderability preservative.
According to another aspect of the disclosure, a kind of radiator is also provided, including：Hollow heat-dissipating cavity is scattered for holding
Hot working fluid is provided with connection opening on any wall surface；And the photo-thermal collection being used under superelevation heat flow density that the disclosure provides
It at device, is entrenched in the connection opening, and the open channel is towards on the inside of the hollow heat-dissipating cavity, using described
The composite phase-change of heat radiation working medium takes the heat of the luminescent device away, and is dissipated in environment.
In some embodiments of the present disclosure, M radiating fin, M institute are provided on the outside of the hollow heat-dissipating cavity
State circumferential array of the radiating fin along the hollow heat-dissipating cavity outer wall；Wherein M >=1.
In some embodiments of the present disclosure, the surface of the radiating fin is provided with ripple, expands the radiating fin
The heat loss through convection area of piece.
In some embodiments of the present disclosure, wherein：The hollow heat-dissipating cavity includes：Opening is arranged described hollow
On the wall surface of heat-dissipating cavity, the heat radiation working medium is packed into the hollow heat-dissipating cavity, and change the hollow heat dissipation cavity
Internal vacuum degree；And sealing element, setting is matched with the opening, seals the hollow heat-dissipating cavity；The heat dissipation work
Matter includes：At least one of distilled water, deionized water, ethyl alcohol, methanol, acetone or refrigerant.
In some embodiments of the present disclosure, the hollow heat-dissipating cavity includes：Metal, alloy, semiconductor, ceramics, oxygen
At least one of compound, wherein the thermal coefficient of the hollow heat-dissipating cavity is not less than 20W/mK.
According to another aspect of the disclosure, a kind of LED light is also provided, including：The radiator that the disclosure provides, is institute
State LED light source heat-dissipating；And LED light source, it is connect with the articulamentum.
(3) advantageous effect
It can be seen from the above technical proposal that the photo-thermal integrated device of disclosure offer being used under superelevation heat flow density,
Radiator and LED light have the advantages that one of them or in which a part：
(1) by the way that the polar molecule group of hydrophilic coating and hydrophilic coating surface, the cooperative reinforcing effect of the two is arranged
The wetting characteristics that open channel surface can be greatly improved greatly increases the capillary gradients in open channel so that
It is heat sink under superelevation heat flow density that there is timely fluid infusion ability, once there is region of drying up in hot localised points, in big capillary gradients
Driving under, heat radiation working medium adds to rapidly dry area, again soak open channel surface, persistently occur thin liquid film evaporation
With the high-strength composite phase transformation strengthening heat transfer process of thick liquid film nucleate boiling, high heat exchange heat sink under superelevation heat flow density ensure that
Performance and high reliability；
(2) luminescent device and heat sink substrate are formed by integral structure by articulamentum, eliminate luminescent device with it is heat sink
Interface resistance between substrate further improves and heat sink takes thermal energy power；
(3) by the way that groove is arranged, articulamentum and luminescent device are sunk in heat sink substrate so that articulamentum and luminescent device
Fixation is more secured；
(4) a plurality of open channel is arranged side by side, and the width of open channel, depth and spacing are between 20 μm
To between 5000 μm, heat exchange area is not only increased, it is often more important that the interfacial effect and dimensional effect of open channel can be right
The flowing of heat radiation working medium and phase-change heat-exchange performance generate extraordinary invigoration effect, make its surface that thin liquid film evaporation and thick liquid film occur
The high-strength composite phase transformation strengthening heat transfer process of nucleate boiling, theoretical maximum take hot heat flow density to can reach 104W/cm2Number
Magnitude, phase-change heat transfer coefficient reach 106W/(m2DEG C) the order of magnitude, take thermal energy power be much larger than with stock size surface heat
It is heavy；
(5) by the way that radiating fin is arranged, hollow heat-dissipating cavity and extraneous contact area is improved, heat exchange efficiency is improved；
(6) by the way that ripple is arranged on radiating fin, expand the heat loss through convection area of radiating fin, further increase heat exchange
Efficiency.
Description of the drawings
Fig. 1 is stereochemical structure of the embodiment of the present disclosure for heat sink substrate in the photo-thermal integrated device under superelevation heat flow density
Schematic diagram.
Fig. 2 is schematic front view of the embodiment of the present disclosure for the photo-thermal integrated device under superelevation heat flow density.
Fig. 3 is that main view of the embodiment of the present disclosure for another structure of the photo-thermal integrated device under superelevation heat flow density is shown
It is intended to.
Fig. 4 a are the close-up schematic view of photo-thermal integrated device shown in Fig. 2 or Fig. 3.
Fig. 4 b are the close-up schematic view of another structure of photo-thermal integrated device shown in Fig. 2 or Fig. 3.
Fig. 4 c are the close-up schematic view of the yet another construction of photo-thermal integrated device shown in Fig. 2 or Fig. 3.
Fig. 4 d are the close-up schematic view of the yet another construction of photo-thermal integrated device shown in Fig. 2 or Fig. 3.
Fig. 4 e are the close-up schematic view of the yet another construction of photo-thermal integrated device shown in Fig. 2 or Fig. 3.
Fig. 5 is the structural schematic diagram of embodiment of the present disclosure radiator.
Fig. 6 is another structural schematic diagram of embodiment of the present disclosure radiator.
Fig. 7 is the structural schematic diagram of embodiment of the present disclosure LED light.
Fig. 8 is another structural schematic diagram of embodiment of the present disclosure LED light.
【Embodiment of the present disclosure main element symbol description in attached drawing】
10- heat sink substrates；20- articulamentums；The hollow heat-dissipating cavities of 30-；
40- heat radiation working mediums；50-LED light sources；
11- open channels；12- hydrophilic coatings；13- grooves；
31- radiating fins；32- is open；33- sealing elements；
121- polar molecule groups；311- ripples.
Specific implementation mode
What the embodiment of the present disclosure provided is used in the photo-thermal integrated device under superelevation heat flow density, radiator and LED light, leads to
Opening can be greatly improved by crossing setting hydrophilic coating and the polar molecule group on hydrophilic coating surface, the cooperative reinforcing effect of the two
The wetting characteristics on formula channel surface, greatly increases the capillary gradients in open channel, so improve fluid infusion velocity and
Ability ensure that high heat-exchanging performance heat sink under superelevation heat flow density and high reliability.
To make the purpose, technical scheme and advantage of the disclosure be more clearly understood, below in conjunction with specific embodiment, and reference
The disclosure is further described in attached drawing.
Fig. 1 is stereochemical structure of the embodiment of the present disclosure for heat sink substrate in the photo-thermal integrated device under superelevation heat flow density
Schematic diagram.Fig. 2 is schematic front view of the embodiment of the present disclosure for the photo-thermal integrated device under superelevation heat flow density.Fig. 3 is this
The schematic front view of another structure of the open embodiment for the photo-thermal integrated device under superelevation heat flow density.Fig. 4 a are Fig. 2
Or the close-up schematic view of photo-thermal integrated device shown in Fig. 3.
According to one aspect of the disclosure, as shown in Fig. 1-Fig. 4 a, a kind of photo-thermal under superelevation heat flow density is provided
Integrated device, including：Heat sink substrate 10 radiates for luminescent device, including：Open channel 11 is arranged in heat sink substrate 10
Any plate face on, using capillary phenomenon driving heat radiation working medium 50 along open channel 11 flow；And hydrophilic coating 12, setting
On the surface of open channel 11, the 12 Surface Creation polarized molecular radical 121 of hydrophilic coating, hydrophilic coating 12 and polarity are divided
Subbase group 121 improves the fluid infusion ability of open channel 11；And articulamentum 20, it is arranged in 11 place plate face of open channel
The back side；It connects heat sink substrate 10 and luminescent device, by the polarity point that hydrophilic coating 12 and 12 surface of hydrophilic coating is arranged
Subbase group 121, the cooperative reinforcing effect of the two can greatly improve the wetting characteristics on 11 surface of open channel, greatly increase opening
Capillary gradients in formula channel 11 so that it is heat sink under superelevation heat flow density that there is timely fluid infusion ability, once localized heat
There is region of drying up in point, and under the driving of big capillary gradients, heat radiation working medium 50 adds to rapidly dry area, and wetting again is opened
The surface in formula channel 11 is put, the high-strength composite phase transformation strengthening that thin liquid film evaporation and thick liquid film nucleate boiling persistently occurs exchanged heat
Journey ensure that high heat-exchanging performance heat sink under superelevation heat flow density and high reliability.
In addition, luminescent device and heat sink substrate 10 are formed integral structure by articulamentum 20, luminescent device is eliminated
With the interface resistance between heat sink substrate 10, further improves and heat sink take thermal energy power.
In some embodiments of the present disclosure, as shown in figure 3, the back side setting of 11 place plate face of open channel is fluted
13, articulamentum 20 is embedded in by groove 13 in heat sink substrate 10, and by the way that groove 13 is arranged, articulamentum 20 and luminescent device are sunk to
In heat sink substrate 10 so that articulamentum and luminescent device fixation are more secured.
In some embodiments of the present disclosure, open channel 11 includes N items, and N open channel 11 is set up in parallel；Its
Middle N >=10.
In some embodiments of the present disclosure, the arranging density of open channel 11 is not less than 5/cm, i.e., is opened along a plurality of
Put the orientation in formula channel 11, the item number of open channel 11 is no less than 5 in length per cm.
In some embodiments of the present disclosure, wherein：The width of open channel 11 is between 20 μm to 5000 μm；It opens
The depth in formula channel 11 is put between 20 μm to 5000 μm；The spacing of two adjacent open channels 11 is between 20 μm to 5000 μm
Between；The thickness of hydrophilic coating 12 is between 20nm to 50 μm；The thickness of articulamentum 20 is more between 1 μm to 1400 μm
Open channel 11 is arranged side by side, and the width of open channel 11, depth and spacing are between 20 μm to 5000 μm
Between, not only increase heat exchange area, it is often more important that the interfacial effect and dimensional effect of open channel 11 can be to the works that radiates
The flowing of matter 50 and phase-change heat-exchange performance generate extraordinary invigoration effect, make its surface that thin liquid film evaporation and thick liquid film core state occur
The high-strength composite phase transformation strengthening heat transfer process of boiling, theoretical maximum take hot heat flow density to can reach 104W/cm2The order of magnitude,
Phase-change heat transfer coefficient reaches 106W/(m2DEG C) the order of magnitude, take thermal energy power to be much larger than heat sink with stock size surface.
Fig. 4 b are the close-up schematic view of another structure of photo-thermal integrated device shown in Fig. 2 or Fig. 3.Fig. 4 c are Fig. 2
Or the close-up schematic view of the yet another construction of photo-thermal integrated device shown in Fig. 3.Fig. 4 d are that photo-thermal shown in Fig. 2 or Fig. 3 is integrated
The close-up schematic view of the yet another construction of device.Fig. 4 e are the yet another construction of photo-thermal integrated device shown in Fig. 2 or Fig. 3
Close-up schematic view.
In some embodiments of the present disclosure, as shown in Fig. 4 a- Fig. 4 e, the cross section of open channel 11 is rectangle, ladder
Shape, triangle, arc-shaped or irregular figure.
In some embodiments of the present disclosure, wherein：Hydrophilic coating 12 includes：Woelm Alumina, porous oxidation niobium, oxidation
At least one of zinc sodium, titanium oxide, zinc oxide, tin oxide, vanadic anhydride, copper oxide, cuprous oxide, Kocide SD；Pole
Property molecular radical 121 includes：In carboxylic acid group, sulfonic group, phosphate, amino, quaternary ammonium group, hydroxyl, carboxylate, block polyether extremely
Few one kind；Articulamentum 20 includes：Tin solder；Heat sink substrate 10 includes：In metal, alloy, semiconductor, ceramics, oxide
It is at least one；Wherein the thermal coefficient of heat sink substrate 10 is not less than 20W/mK.
In some embodiments of the present disclosure, wherein：Articulamentum 20 passes through physical vapour deposition (PVD), chemical vapor deposition or electricity
Surface Creation of the method for plating in heat sink substrate 10；Or articulamentum 20 is connected by the surface of metal promoted layer and heat sink substrate 10
It connects；Wherein, metal promoted layer includes：At least one of gold, silver, nickel, lead, organic solderability preservative.
Fig. 5 is the structural schematic diagram of embodiment of the present disclosure radiator.Fig. 6 is another knot of embodiment of the present disclosure radiator
Structure schematic diagram.
According to another aspect of the disclosure, as shown in Fig. 5-Fig. 6, a kind of radiator is also provided, including：Hollow heat dissipation cavity
Body 30 is provided with connection opening for holding heat radiation working medium 50 on any wall surface；And the disclosure provide be used for excessive heat
Photo-thermal integrated device under current density is entrenched in connection opening, and open channel 11 is towards the inside of hollow heat-dissipating cavity 30,
It takes the heat of luminescent device away using the composite phase-change of heat radiation working medium 50, and is dissipated in environment.
In some embodiments of the present disclosure, as shown in Fig. 5-Fig. 6, the outside of hollow heat-dissipating cavity 30 is provided with M and dissipates
Hot fin 31, circumferential array of the M radiating fin 31 along 30 outer wall of hollow heat-dissipating cavity；Wherein M >=1, by the way that radiating fin is arranged
Piece 31 improves hollow heat-dissipating cavity 30 and extraneous contact area, improves heat exchange efficiency.
In some embodiments of the present disclosure, as shown in Fig. 5-Fig. 6, the surface of radiating fin 31 is provided with ripple 311,
The heat loss through convection area for expanding radiating fin 31 expands pair of radiating fin 31 by the way that ripple 311 is arranged on radiating fin 31
Flow heat dissipation area, further increases heat exchange efficiency.
In some embodiments of the present disclosure, as shown in Fig. 5-Fig. 6,
Wherein：Hollow heat-dissipating cavity 30 includes：Opening 32, is arranged on the wall surface of hollow heat-dissipating cavity 30, to hollow
It is packed into heat radiation working medium 40 in heat-dissipating cavity 30, and changes the vacuum degree in hollow heat-dissipating cavity 30；And sealing element 33, with opening
32 matching settings, seal hollow heat-dissipating cavity 30；Heat radiation working medium 40 includes：Distilled water, deionized water, ethyl alcohol, methanol, acetone
Or at least one of refrigerant.
In some embodiments of the present disclosure, hollow heat-dissipating cavity 30 includes：Metal, alloy, semiconductor, ceramics, oxidation
At least one of object, wherein the thermal coefficient of hollow heat-dissipating cavity 30 is not less than 20W/mK.
Fig. 7 is the structural schematic diagram of embodiment of the present disclosure LED light.Fig. 8 is another structure of embodiment of the present disclosure LED light
Schematic diagram.
According to another aspect of the disclosure, a kind of LED light is also provided, as shown in Figs. 7-8, including：The disclosure provides
Radiator, for LED light source 40 radiate；And LED light source 40, it is connect with articulamentum 20.
According to above description, those skilled in the art should be to disclosure offer for the photo-thermal under superelevation heat flow density
Integrated device, radiator and LED light have clear understanding.
In conclusion the photo-thermal integrated device being used under superelevation heat flow density, radiator and the LED light that the disclosure provides are logical
Setting hydrophilic coating 12 and the polar molecule group 121 on 12 surface of hydrophilic coating are crossed, the cooperative reinforcing effect of the two can be substantially
Improve the wetting characteristics on 11 surface of open channel so that it is heat sink under superelevation heat flow density that there is timely fluid infusion ability, ensure
The high heat-exchanging performance and high reliability of photo-thermal integrated device under superelevation heat flow density.
It should also be noted that, the direction term mentioned in embodiment, for example, "upper", "lower", "front", "rear", " left side ",
" right side " etc. is only the direction of refer to the attached drawing, not is used for limiting the protection domain of the disclosure.Through attached drawing, identical element by
Same or similar reference numeral indicates.When that understanding of this disclosure may be caused to cause to obscure, conventional structure will be omitted
Or construction.
And the shape and size of each component do not reflect actual size and ratio in figure, and only illustrate the embodiment of the present disclosure
Content.In addition, in the claims, any reference mark between bracket should not be configured to the limit to claim
System.
Similarly, it should be understood that in order to simplify the disclosure and help to understand one or more of each open aspect,
Above in the description of the exemplary embodiment of the disclosure, each feature of the disclosure is grouped together into single implementation sometimes
In example, figure or descriptions thereof.However, the method for the disclosure should be construed to reflect following intention：It is i.e. required to protect
The disclosure of shield requires features more more than the feature being expressly recited in each claim.More precisely, as following
Claims reflect as, open aspect is all features less than single embodiment disclosed above.Therefore,
Thus the claims for following specific implementation mode are expressly incorporated in the specific implementation mode, wherein each claim itself
All as the separate embodiments of the disclosure.
Particular embodiments described above has carried out further in detail the purpose, technical solution and advantageous effect of the disclosure
It describes in detail bright, it should be understood that the foregoing is merely the specific embodiment of the disclosure, is not limited to the disclosure, it is all
Within the spirit and principle of the disclosure, any modification, equivalent substitution, improvement and etc. done should be included in the guarantor of the disclosure
Within the scope of shield.
Claims (14)
1. a kind of photo-thermal integrated device under superelevation heat flow density, which is characterized in that including：
Heat sink substrate radiates for luminescent device, including：
Open channel is arranged in any plate face of the heat sink substrate, using capillary phenomenon driving heat radiation working medium described in
Open channel flows；And
Hydrophilic coating is arranged on the surface of the open channel, the hydrophilic coating Surface Creation polarized molecular radical, described
Hydrophilic coating and the polar molecule group improve the fluid infusion ability of the open channel；And
Articulamentum is arranged in the back side of plate face where the open channel, connection heat sink substrate and the luminescent device.
2. the photo-thermal integrated device according to claim 1 under superelevation heat flow density, which is characterized in that the opening
The back side setting of plate face where formula channel is fluted, and the articulamentum is embedded in by the groove in the heat sink substrate.
3. the photo-thermal integrated device according to claim 1 under superelevation heat flow density, which is characterized in that the opening
Formula channel includes N items, and open channel is set up in parallel described in N items；
Wherein N >=10.
4. the photo-thermal integrated device according to claim 3 under superelevation heat flow density, which is characterized in that the opening
The arranging density in formula channel is not less than 5/cm.
5. the photo-thermal integrated device according to claim 4 under superelevation heat flow density, which is characterized in that wherein：
The width of the open channel is between 20 μm to 5000 μm；
The depth of the open channel is between 20 μm to 5000 μm；
The spacing of the two adjacent open channels is between 20 μm to 5000 μm；
The thickness of the hydrophilic coating is between 20nm to 50 μm；
The thickness of the articulamentum is between 1 μm to 1400 μm.
6. the photo-thermal integrated device according to claim 1 under superelevation heat flow density, which is characterized in that the opening
The cross section in formula channel is rectangle, trapezoidal, triangle, arc-shaped or irregular figure.
7. the photo-thermal integrated device according to claim 1 under superelevation heat flow density, which is characterized in that wherein：
The hydrophilic coating includes：Woelm Alumina, porous oxidation niobium, zinc oxide sodium, titanium oxide, zinc oxide, tin oxide, five oxygen
Change at least one of two vanadium, copper oxide, cuprous oxide, Kocide SD；
The polar molecule group includes：Carboxylic acid group, sulfonic group, phosphate, amino, quaternary ammonium group, hydroxyl, carboxylate, block are poly-
At least one of ether；
The articulamentum includes：Tin solder；
The heat sink substrate includes：At least one of metal, alloy, semiconductor, ceramics, oxide；
The thermal coefficient of the wherein described heat sink substrate is not less than 20W/mK.
8. the photo-thermal integrated device according to claim 1 under superelevation heat flow density, which is characterized in that wherein：
The articulamentum is given birth to by physical vapour deposition (PVD), chemical vapor deposition or electric plating method on the surface of the heat sink substrate
At；Or
The articulamentum is connect by metal promoted layer with the surface of the heat sink substrate；
Wherein, the metal promoted layer includes：At least one of gold, silver, nickel, lead, organic solderability preservative.
9. a kind of radiator, which is characterized in that including：
Hollow heat-dissipating cavity is provided with connection opening for holding heat radiation working medium on any wall surface；And
Such as the above-mentioned photo-thermal integrated device described in any item of the claim 1 to 8 under superelevation heat flow density, it is entrenched in institute
It states in connection opening, and the open channel utilizes the compound of the heat radiation working medium towards the hollow heat-dissipating cavity inside
The heat of the luminescent device is taken in phase transformation away, and is dissipated in environment.
10. radiator according to claim 9, which is characterized in that be provided with M on the outside of the hollow heat-dissipating cavity and dissipate
Hot fin, circumferential array of the M radiating fins along the hollow heat-dissipating cavity outer wall；
Wherein M >=1.
11. radiator according to claim 10, which is characterized in that the surface of the radiating fin is provided with ripple,
Expand the heat loss through convection area of the radiating fin.
12. the radiator according to any one of claim 9 to 11, which is characterized in that wherein：
The hollow heat-dissipating cavity includes：
Opening, is arranged on the wall surface of the hollow heat-dissipating cavity, the heat dissipation work is packed into the hollow heat-dissipating cavity
Matter, and change the vacuum degree in the hollow heat-dissipating cavity；And
Sealing element matches setting with the opening, seals the hollow heat-dissipating cavity；
The heat radiation working medium includes：At least one of distilled water, deionized water, ethyl alcohol, methanol, acetone or refrigerant.
13. according to the radiator described in any one of claim 9-11, which is characterized in that the hollow heat-dissipating cavity includes：
At least one of metal, alloy, semiconductor, ceramics, oxide, wherein the thermal coefficient of the hollow heat-dissipating cavity is not less than
20W/m·K。
14. a kind of LED light, which is characterized in that including：
Radiator as described in any one of the claims 9 to 13 is the LED light source heat-dissipating；And
LED light source is connect with the articulamentum.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820248570.6U CN207893719U (en) | 2018-02-11 | 2018-02-11 | For photo-thermal integrated device, radiator and the LED light under superelevation heat flow density |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820248570.6U CN207893719U (en) | 2018-02-11 | 2018-02-11 | For photo-thermal integrated device, radiator and the LED light under superelevation heat flow density |
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| Publication Number | Publication Date |
|---|---|
| CN207893719U true CN207893719U (en) | 2018-09-21 |
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