CN208635621U - For heat sink under superelevation heat flow density - Google Patents
For heat sink under superelevation heat flow density Download PDFInfo
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- CN208635621U CN208635621U CN201820248815.5U CN201820248815U CN208635621U CN 208635621 U CN208635621 U CN 208635621U CN 201820248815 U CN201820248815 U CN 201820248815U CN 208635621 U CN208635621 U CN 208635621U
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- open channel
- heat sink
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- flow density
- hydrophilic coating
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Abstract
The disclosure provides heat sink under a kind of heat flow density for superelevation, it include: heat sink substrate, for radiating for heating device, comprising: open channel, it is arranged in any plate face of the heat sink substrate, is flowed using capillary phenomenon driving heat radiation working medium along the open channel；And hydrophilic coating, the surface of the open channel is set, and the hydrophilic coating Surface Creation polarized molecular radical, the hydrophilic coating and the polar molecule group are for improving the fluid infusion ability of the open channel.What the disclosure provided is used for the heat sink polar molecule group by the way that hydrophilic coating and hydrophilic coating surface is arranged under superelevation heat flow density, greatly increase the capillary gradients in open channel, so that heat sink under superelevation heat flow density have timely fluid infusion ability, high heat-exchanging performance and high reliability heat sink under superelevation heat flow density ensure that.
Description
Technical field
This disclosure relates to heat sink under phase-change heat-exchange technical field more particularly to a kind of heat flow density for superelevation.
Background technique
Along with electronic industry high-performance, micromation, integrated development trend, the power density of electronic device is increasingly
Greatly, such as: the power density using COB (Chip On Board) integrated LED single light source of block fluorescence transition material reaches
50~500W/cm2, the fever heat flow density of electronic device is thus brought rapidly to increase.Define 20~150W/cm2It is close for high hot-fluid
Degree；When heat flow density is more than 150W/cm2When, already exceed the critical heat flux that pool boiling phase-change heat-exchange occurs for stock size surface
Density is defined as superelevation heat flow density.Under high heat flux density, if the high-intensitive calorific value of electronic device cannot effectively dissipate
It goes, it will cause device temperature to increase rapidly, serious performance, stability and the safety for reducing device and system.
In the prior art using it is high performance it is micro-/receive scale phase change enhanced heat exchange technology, exist in heat sink surface building size
Tens Dao several hundred microns open micro-channel array, composite phase-change strengthening heat transfer can occur for surface.It is open
The capillary gradients that micro-channel array is formed can drive liquid working substance to flow, and three-phase line of contact region promotees in channel
Meniscus evaporation thin film is extended into being formed, so that high-intensitive pure evaporation and heat-exchange condition is created, and in more high heat load condition
Under, it may occur that the composite phase-change heat exchange of thin liquid film evaporation and thick liquid film region kernel state boiling, is a kind of typical high-performance quilt
Dynamic formula minute yardstick phase-change heat-exchange technology can be utilized to implement the high coefficient of heat transfer and high hot-fluid under low thermal resistance and condition of small temperature difference
The heat transfer process of density.It is this that there is the heat sink of open micro-channel array can effectively solve electronic device under high heat flux density
Heat dissipation problem.
However in implementing the present disclosure, applicants have discovered that, under the conditions of superelevation heat flow density, as hot-fluid is close
The further raising of degree, the liquid working substance in heat sink open micro-channel array will become to be easy to it is dry, once liquid pool
Dry place is not replenished in time in interior liquid working substance, then can not continuously form thin liquid film and thick liquid film region, can not just send out yet
The composite phase-change heat exchange of raw high-intensitive thin liquid film evaporation and thick liquid film nucleate boiling, heat sink heat dissipation performance and reliability are substantially
Decline.
Utility model content
(1) technical problems to be solved
Based on above-mentioned technical problem, the disclosure provide it is heat sink under a kind of heat flow density for superelevation, to alleviate existing skill
Heat sink under the conditions of superelevation heat flow density in art, the heat radiation working medium in heat sink open micro-channel array will be easily dry
It dries up, and dry place can not be replenished in time in heat radiation working medium, the technology for causing heat sink heat dissipation performance and reliability to decline to a great extent is asked
Topic.
(2) technical solution
The disclosure provides heat sink under a kind of heat flow density for superelevation, comprising: heat sink substrate, for being dissipated for heating device
Heat, comprising: open channel is arranged in any plate face of the heat sink substrate, drives heat radiation working medium edge using capillary phenomenon
The open channel flowing；And hydrophilic coating, the surface of the open channel is set, the hydrophilic coating Surface Creation
Polarized molecular radical, the hydrophilic coating and the polar molecule group improve the fluid infusion ability of the open channel.
In some embodiments of the present disclosure, the open channel includes N item, and open channel described in N item is set side by side
It sets；Wherein N >=10.
In some embodiments of the present disclosure, the arranging density of the open channel is not less than 5/cm.
In some embodiments of the present disclosure, in which: the width of the open channel between 10 μm to 2000 μm it
Between；The depth of the open channel is between 10 μm to 2000 μm；The spacing of the two adjacent open channels is between 10 μ
Between m to 2000 μm；The thickness of the hydrophilic coating is between 20nm to 50 μm.
In some embodiments of the present disclosure, in which: the width of the open channel between 200 μm to 500 μm it
Between；The depth of the open channel is between 200 μm to 1500 μm；The spacing of the two adjacent open channels between
Between 200 μm to 500 μm.
In some embodiments of the present disclosure, the cross section of the open channel is rectangle, trapezoidal, triangle, circular arc
Shape or irregular figure.
In some embodiments of the present disclosure, wherein the thermal coefficient of the heat sink substrate is not less than 20W/mK.
(3) beneficial effect
It can be seen from the above technical proposal that having for heat sink under superelevation heat flow density of providing of the disclosure following has
One of beneficial effect or in which a part:
(1) pass through setting hydrophilic coating and the polar molecule group on hydrophilic coating surface, the cooperative reinforcing effect of the two
The wetting characteristics that open channel surface can be greatly improved greatly increases the capillary gradients in open channel, so that
It is heat sink under superelevation heat flow density that there is timely fluid infusion ability, once there is dry region in hot localised points, in big capillary gradients
Driving under, heat radiation working medium adds to rapidly dry area, again soak open channel surface, persistently occur thin liquid film evaporation
With the high-strength composite phase transformation strengthening heat transfer process of thick liquid film nucleate boiling, high heat exchange heat sink under superelevation heat flow density ensure that
Performance and high reliability；
(2) a plurality of open channel is arranged side by side, and the width of open channel, depth and spacing are between 10 μm
To between 2000 μm, heat exchange area is not only increased, it is often more important that the interfacial effect and dimensional effect of open channel can be right
The flowing of heat radiation working medium and phase-change heat-exchange performance generate extraordinary invigoration effect, make its surface that thin liquid film evaporation and thick liquid film occur
The high-strength composite phase transformation strengthening heat transfer process of nucleate boiling, theoretical maximum take hot heat flow density to can reach 104W/cm2Number
Magnitude, phase-change heat transfer coefficient reach 106W/(m2DEG C) the order of magnitude, take thermal energy power be much larger than with stock size surface heat
It is heavy.
Detailed description of the invention
Fig. 1 is the embodiment of the present disclosure for the heat sink structural schematic diagram under superelevation heat flow density.
Fig. 2 is the partial elevational elevation view of open channel in Fig. 1.
Fig. 3 is the partial elevational elevation view of another structure of open channel in Fig. 1.
Fig. 4 is the partial elevational elevation view of the yet another construction of open channel in Fig. 1.
Fig. 5 is the partial elevational elevation view of the yet another construction of open channel in Fig. 1.
Fig. 6 is the partial elevational elevation view of the yet another construction of open channel in Fig. 1.
[embodiment of the present disclosure main element symbol description in attached drawing]
10- heat sink substrate；
11- open channel；12- hydrophilic coating；
121- polar molecule group.
Specific embodiment
The embodiment of the present disclosure provide in heat sink under superelevation heat flow density, by setting hydrophilic coating and hydrophilic
The polar molecule group of coating surface, the cooperative reinforcing effect of the two can greatly improve the wetting characteristics on open channel surface,
The capillary gradients in open channel are greatly increased, and then improve fluid infusion velocity, ensure that hot under superelevation heat flow density
Heavy high heat-exchanging performance and high reliability.
For the purposes, technical schemes and advantages of the disclosure are more clearly understood, below in conjunction with specific embodiment, and reference
The disclosure is further described in attached drawing.
Fig. 1 is the embodiment of the present disclosure for the heat sink structural schematic diagram under superelevation heat flow density.Fig. 2 is open in Fig. 1
The partial elevational elevation view in formula channel.
According to one aspect of the disclosure, provide it is heat sink under a kind of heat flow density for superelevation, as Figure 1-Figure 2,
It include: heat sink substrate 10, for radiating for heating device, comprising: the either plate of heat sink substrate 10 is arranged in open channel 11
On face, flowed using capillary phenomenon driving heat radiation working medium along open channel 11；And hydrophilic coating 12, setting is open logical
The surface in road 11, the 12 Surface Creation polarized molecular radical 121 of hydrophilic coating, hydrophilic coating 12 and polar molecule group 121
Improve the fluid infusion ability of open channel 11.Pass through setting hydrophilic coating 12 and the polar molecule base on 12 surface of hydrophilic coating
Group 121, the cooperative reinforcing effect of the two can greatly improve the wetting characteristics on 11 surface of open channel, greatly increase open
Capillary gradients in channel 11, so that heat sink under superelevation heat flow density have timely fluid infusion ability, once hot localised points
There is dry region, under the driving of big capillary gradients, heat radiation working medium adds to rapidly dry area, soaks again open
The high-strength composite phase transformation strengthening heat transfer process of thin liquid film evaporation and thick liquid film nucleate boiling persistently occurs for the surface in channel 11,
It ensure that high heat-exchanging performance and high reliability heat sink under superelevation heat flow density.
In the present embodiment, open channel 11 includes N item, and N open channel 11 is set side by side；Wherein N >=10.
In the present embodiment, the arranging density of open channel 11 is not less than 5/cm, i.e., a plurality of opens along what is be set side by side
The orientation for putting formula channel counts, and the item number of interior open channel 11 per cm is not less than 5.
In the present embodiment, in which: the width of open channel 11 is between 10 μm to 2000 μm；Open channel 11
Depth between 10 μm to 2000 μm；The spacing of two adjacent open channels 11 is between 10 μm to 2000 μm；It is hydrophilic
The thickness of coating 12 is between 20nm to 50 μm.A plurality of open channel 11 is arranged side by side, and the width of open channel 11
Degree, depth and spacing not only increase heat exchange area, it is often more important that open channel between 10 μm to 2000 μm
11 interfacial effect and dimensional effect can flowing to heat radiation working medium and phase-change heat-exchange performance generate extraordinary invigoration effect, make it
The high-strength composite phase transformation strengthening heat transfer process of thin liquid film evaporation and thick liquid film nucleate boiling occurs for surface, and theoretical maximum takes heat
Heat flow density can reach 104The order of magnitude of W/cm2, phase-change heat transfer coefficient reach 106W/(m2DEG C) the order of magnitude, take thermal energy power
Much larger than with the heat sink of stock size surface.
In the present embodiment, in which: the width of open channel 11 is between 200 μm to 500 μm；Open channel 11
Depth between 200 μm to 1500 μm；The spacing of two adjacent open channels 11 is between 200 μm to 500 μm.It is open
The size in formula channel 11 is smaller, and capillary phenomenon is more obvious, and fluid infusion ability is stronger.
Fig. 3 is the partial elevational elevation view of another structure of open channel in Fig. 1.Fig. 4 is open logical in Fig. 1
The partial elevational elevation view of the yet another construction in road.Fig. 5 is the partial enlargement main view of the yet another construction of open channel in Fig. 1
Figure.Fig. 6 is the partial elevational elevation view of the yet another construction of open channel in Fig. 1.
In the present embodiment, as shown in Fig. 2-Fig. 6, the cross section of open channel 11 is rectangle, trapezoidal, triangle, circle
Arc or irregular figure.
In the present embodiment, in which: hydrophilic coating 12 includes: porous aluminas, porous oxidation niobium, zinc oxide sodium, oxidation
At least one of titanium, zinc oxide, tin oxide, vanadic anhydride, copper oxide, cuprous oxide, Kocide SD；Polar molecule group
121 include: at least one of carboxylic acid group, sulfonic group, phosphate, amino, quaternary ammonium group, hydroxyl, carboxylate, block polyether；Heat
Heavy substrate 10 includes: at least one of metal, alloy, semiconductor, ceramics, oxide；Wherein, heat sink substrate 10 is thermally conductive
Coefficient is not less than 20W/mK.
So far, attached drawing is had been combined the embodiment of the present disclosure is described in detail.It should be noted that in attached drawing or saying
In bright book text, the implementation for not being painted or describing is form known to a person of ordinary skill in the art in technical field, and
It is not described in detail.In addition, the above-mentioned definition to each element and method be not limited in mentioning in embodiment it is various specific
Structure, shape or mode, those of ordinary skill in the art simply can be changed or be replaced to it.
According to above description, what those skilled in the art should provide the disclosure is used for heat sink under superelevation heat flow density
There is clear understanding.
In conclusion hydrophilic coating 12 and parent is arranged for heat sink pass through under superelevation heat flow density in disclosure offer
The polar molecule group 121 on 12 surface of water coating, the cooperative reinforcing effect of the two can greatly improve 11 surface of open channel
Wetting characteristics ensure that heat sink under superelevation heat flow density so that heat sink under superelevation heat flow density have timely fluid infusion ability
High heat-exchanging performance and high reliability.
It should also be noted that, the direction term mentioned in embodiment, for example, "upper", "lower", "front", "rear", " left side ",
" right side " etc. is only the direction with reference to attached drawing, not is used to limit the protection scope of the disclosure.Through attached drawing, identical element by
Same or similar appended drawing reference indicates.When may cause understanding of this disclosure and cause to obscure, conventional structure will be omitted
Or construction.
And the shape and size of each component do not reflect actual size and ratio in figure, and only illustrate the embodiment of the present disclosure
Content.In addition, in the claims, any reference symbol between parentheses should not be configured to the limit to claim
System.
Similarly, it should be understood that in order to simplify the disclosure and help to understand one or more of each open aspect,
Above in the description of the exemplary embodiment of the disclosure, each feature of the disclosure is grouped together into single implementation sometimes
In example, figure or descriptions thereof.However, the disclosed method should not be interpreted as reflecting the following intention: i.e. required to protect
The disclosure of shield requires features more more than feature expressly recited in each claim.More precisely, as following
Claims reflect as, open aspect is all features less than single embodiment disclosed above.Therefore,
Thus the claims for following specific embodiment are expressly incorporated in the specific embodiment, wherein each claim itself
All as the separate embodiments of the disclosure.
Particular embodiments described above has carried out further in detail the purpose of the disclosure, technical scheme and beneficial effects
Describe in detail it is bright, it is all it should be understood that be not limited to the disclosure the foregoing is merely the specific embodiment of the disclosure
Within the spirit and principle of the disclosure, any modification, equivalent substitution, improvement and etc. done should be included in the guarantor of the disclosure
Within the scope of shield.
Claims (7)
1. heat sink under a kind of heat flow density for superelevation, wherein include:
Heat sink substrate radiates for heating device, comprising:
Open channel is arranged in any plate face of the heat sink substrate, using capillary phenomenon driving heat radiation working medium described in
Open channel flowing；And
The surface of the open channel is arranged in hydrophilic coating, the hydrophilic coating Surface Creation polarized molecular radical, described
Hydrophilic coating and the polar molecule group improve the fluid infusion ability of the open channel.
2. according to claim 1 for heat sink under superelevation heat flow density, wherein the open channel includes N item,
Open channel described in N item is set side by side；
Wherein N >=10.
3. according to claim 2 for heat sink under superelevation heat flow density, wherein the arrangement of the open channel is close
Degree is not less than 5/cm.
4. according to claim 3 for heat sink under superelevation heat flow density, in which:
The width of the open channel is between 10 μm to 2000 μm；
The depth of the open channel is between 10 μm to 2000 μm；
The spacing of the two adjacent open channels is between 10 μm to 2000 μm；
The thickness of the hydrophilic coating is between 20nm to 50 μm.
5. according to claim 4 for heat sink under superelevation heat flow density, in which:
The width of the open channel is between 200 μm to 500 μm；
The depth of the open channel is between 200 μm to 1500 μm；
The spacing of the two adjacent open channels is between 200 μm to 500 μm.
6. according to claim 1 for heat sink under superelevation heat flow density, wherein the cross section of the open channel
For rectangle, trapezoidal, triangle, arc-shaped or irregular figure.
7. according to claim 1 for heat sink under superelevation heat flow density, wherein the thermal coefficient of the heat sink substrate
Not less than 20W/mK.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201820248815.5U CN208635621U (en) | 2018-02-11 | 2018-02-11 | For heat sink under superelevation heat flow density |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201820248815.5U CN208635621U (en) | 2018-02-11 | 2018-02-11 | For heat sink under superelevation heat flow density |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108168345A (en) * | 2018-02-11 | 2018-06-15 | 中国科学院工程热物理研究所 | For the heat sink and its manufacturing method under superelevation heat flow density |
| CN110425914A (en) * | 2019-06-28 | 2019-11-08 | 中国空间技术研究院 | A kind of low-resistance augmentation of heat transfer structure surpassing wetting interface based on nanometer |
-
2018
- 2018-02-11 CN CN201820248815.5U patent/CN208635621U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108168345A (en) * | 2018-02-11 | 2018-06-15 | 中国科学院工程热物理研究所 | For the heat sink and its manufacturing method under superelevation heat flow density |
| CN110425914A (en) * | 2019-06-28 | 2019-11-08 | 中国空间技术研究院 | A kind of low-resistance augmentation of heat transfer structure surpassing wetting interface based on nanometer |
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