CN101155495B - Micro-channel single phase convection and capillary groove phase inversion heat combined cooling method and device - Google Patents
Micro-channel single phase convection and capillary groove phase inversion heat combined cooling method and device Download PDFInfo
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- CN101155495B CN101155495B CN2006101134070A CN200610113407A CN101155495B CN 101155495 B CN101155495 B CN 101155495B CN 2006101134070 A CN2006101134070 A CN 2006101134070A CN 200610113407 A CN200610113407 A CN 200610113407A CN 101155495 B CN101155495 B CN 101155495B
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Abstract
The invention, relates to a cooling method, using the combination of micorchannel single-phase convection and remoteness groove phase transforming heat, and a device thereof, special components and a method of heat dissipation. The process is: high boiling point working liquid flows through the surface of a heating body, enters a plurality of micor-channels arranged inside heat conducting material after absorping heat; another low boiling point liquid in the remoteness grooves is inhaled by the capillary force produced by a plurality of remoteness grooves arranged on the outer surface of heat conducting material; heat is transferred by the high boiling working liquid in the micro-channels through heat exchanging of high intensity microscale singlephase convection to heat conducting material. The heat of a heating body is taken away by another low boiling point working liquid, which generates evaporation and boiling of high intensity when the working liquid is heated, in the remoteness grooves arranged on outer surface of heat conducting material. The heat exchanging element of remoteness grooves arranged on outer surface of heat conducting material has micro-channels inside is special device of the invention.
Description
Technical field:
The present invention relates to a kind of radiation cooling method, particularly be applied to the cooling means and the device thereof of great-power electronic and opto-electronic device.
Background technology:
At present, dual mode is mainly adopted in cooling to great-power electronic and opto-electronic device: a kind of is to adopt fin to carry out air cooling in conjunction with fan, this technology is smeared heat conductive silica gel (silicone grease) to reduce thermal conduction resistance by sticking on the heater surface on radiating fin and the contact-making surface at both, fan is placed in and utilizes the heat convection principle that heat is lost in the environment by fin surface on the radiating fin end face to go, thereby guarantees that device works in the normal working temperature scope.The major defect of this technology is: along with the increase of electronics and opto-electronic device power, it is big more to keep the required dispersed heat of normal working temperature, the power consumption of fan is just big more, the required area of dissipation of fin is also big more, and the increase of area of dissipation can reduce fin efficiency, and the heat radiation total capacity can't significantly improve.Another kind method is to adopt water pump to carry out Forced water cooling, and the heat that heater produces is taken away on the surface that water flows through heater, and along with the increase of electronics and opto-electronic device power, the heat exchange area of radiator will be big more, and the heat radiation total capacity can't significantly improve equally.
Summary of the invention:
The objective of the invention is to overcome the technological deficiency of the existing air-cooled and big area of dissipation of water-cooling Technology Need, heat-sinking capability deficiency, provide that a kind of area of dissipation is little, the heat radiation density of heat flow rate is high and big microchannel single-phase convection and based on capillary slot phase-change heat-exchange combined cooling method and the device thereof of heat radiation total capacity.
Technical scheme of the present invention is: directly in Heat Conduction Material inside many microchannels are set, form the microchannel group, described microchannel size is fit to utilize minute yardstick effect enhanced heat exchange; At the Heat Conduction Material outer surface many based on capillary slot are set, form the microflute group, described based on capillary slot size is fit to form capillary force, is drawn in the micro-channel with the liquid working substance with the based on capillary slot limit, and forms the thin liquid film zone that can carry out the high strength phase-change heat-exchange in based on capillary slot.After high boiling liquid working substance flows through heater surface absorption heat, enter into the microchannel of Heat Conduction Material inside, by high strength single-phase convection heat exchange mode with the heat transferred Heat Conduction Material, after being heated, another kind of low-boiling point liquid working medium on the Heat Conduction Material outer surface in the based on capillary slot forms high-intensity evaporation and boiling, take away the heat of heater, thereby make heater obtain cooling.
Boiling point in the above-mentioned microchannel under the high boiling liquid working medium normal pressure is 0 ℃～300 ℃, boiling point in the based on capillary slot under the low-boiling point liquid working medium normal pressure is 0 ℃～150 ℃, and the boiling point of the interior liquid working substance of based on capillary slot is lower than the boiling point of flowing liquid working medium in the microchannel.
The cross section of above-mentioned microchannel is circular, and diameter is in 0.05～1mm scope, and the spacing between the microchannel is in 0.05～5mm scope, and the length of every microchannel is in 5～50mm scope.
The width of above-mentioned based on capillary slot and the degree of depth are in 0.05～2mm scope, and the spacing of based on capillary slot is in 0.05～5mm scope.
Described a plurality of based on capillary slot, in the vertically densely covered arrangement of Heat Conduction Material outer surface, its cross section is that trapezoidal, trapezoidal upper base edge lengths is 0.05～2mm, and bottom length is 0.08～2.5mm, and groove depth is 0.05～2mm, and the spacing between the based on capillary slot is 0.05～5mm.
Described a plurality of based on capillary slot, in the vertically densely covered arrangement of Heat Conduction Material outer surface, its cross section is a triangle, and leg-of-mutton bottom land drift angle is 5 °～60 °, and groove depth is 0.05～2mm, and the spacing between the based on capillary slot road is 0.05～5mm.
A kind of isolated plant of realizing said method---microchannel and based on capillary slot are heat sink, comprise a Heat Conduction Material, and described Heat Conduction Material inside is provided with many microchannels, form the microchannel group, and described microchannel size is fit to utilize minute yardstick effect enhanced heat exchange; Outer surface is provided with many based on capillary slot, form based on capillary slot group, the size of described based on capillary slot is fit to form capillary force, is drawn in the micro-channel with the liquid working substance with described based on capillary slot limit, and forms the thin liquid film zone that can carry out the high strength phase-change heat-exchange in microflute.
The cross section of above-mentioned microchannel is circular, and diameter is in 0.05～1mm scope, and the spacing between the microchannel is in 0.05～5mm scope, and the length of every microchannel is in 5～50mm scope.
Gather in the Heat Conduction Material inner transverse and arrange in above-mentioned microchannel.
The width of above-mentioned based on capillary slot and the degree of depth are in 0.05～2mm scope, and the spacing between the based on capillary slot is in 0.05～5mm scope.
Above-mentioned based on capillary slot gathers at the Heat Conduction Material surface longitudinal and arranges.
Above-mentioned based on capillary slot vertically gathers and arranges, and intersects on the microflute of arranging that vertically gathers to be arranged with many horizontal based on capillary slot roads, and laterally the width in based on capillary slot road and the degree of depth are in 0.05～2mm scope, and spacing is in 0.05～10mm scope.
Technique effect: the present invention absorbs the microchannel that enters into Heat Conduction Material inside behind the heat by the position that makes liquid working substance flow through heater surface to need heat radiation, heat conduction by the high boiling liquid working medium in the microchannel and high strength minute yardstick heat convection between the wall of microchannel and Heat Conduction Material with heat transferred to the outer surface of Heat Conduction Material, the Heat Conduction Material outer surface is provided with many based on capillary slot that can produce capillary force, capillary force is drawn into another kind of low-boiling point liquid working medium in the based on capillary slot, and in microflute, form the thin liquid film zone to carry out the high strength phase-change heat-exchange, high strength phase-change heat-exchange by low boiling working fluid in this zone finally is with the heat that heater produces from the Heat Conduction Material outer surface, thereby reaches the purpose that makes the heater cooling.Domestic and international research shows, result in the overall characteristic of minute yardstick current downflow and heat transfer and the large scale passage has a great difference, liquid working substance single-phase convection heat exchange mode has very high convection transfer rate in the microchannel, exceeds an order of magnitude at least than stock size single-phase convection heat exchange coefficient; Simultaneously, the evaporation of working medium and boiling also have high intensity in the based on capillary slot, the theoretical boundary of its evaporation and boiling density of heat flow rate goes out about two orders of magnitude than the high heat flux of present high performance chips is taller, liquid working substance thin liquid film phase-change heat-exchange all belongs to the extraordinary phenomenon of the heat and mass under the minute yardstick space in the based on capillary slot group in the microchannel in the Heat Conduction Material on heat exchange of liquid working substance single-phase convection and the Heat Conduction Material outer surface, utilizes the combination of these two kinds of heat exchange modes can obtain extraordinary cooling heat dissipation effect.This high efficiency microchannel single-phase convection and based on capillary slot phase transformation combination cooling heat dissipation can make heat-transfer surface small-sized, thereby adopt the present invention to solve to a great extent at present and the heat dissipation problem of great-power electronic and opto-electronic device from now on, reduce and control the working temperature of great-power electronic and opto-electronic device, guarantee also to improve working performance of devices.
Diameter in the microchannel is in 0.05～1mm scope, has high convection transfer rate between the liquid working substance of its internal flow and the microchannel wall.
The capillary force that the width of based on capillary slot and the degree of depth produce in the microflute in 0.05～2mm scope the time is strong, has the ability that stronger driving liquid working substance flows.
The transversely arranged width and the degree of depth are set in 0.05～2mm scope, the many piece horizontal based on capillary slot roads of spacing in 0.05～10mm scope can guarantee the REFRIGERATION SYSTEM DRIVEN BY CAPILLARY FORCE power that flows of based on capillary slot longitudinally of liquid working substance under the excessive heat load, make the liquid working substance that evaporates obtain replenishing timely, thereby improve cooling effectiveness.
Description of drawings:
Fig. 1 is first kind of heat sink structural representation of microchannel of the present invention and based on capillary slot;
Fig. 2 is an outer surface based on capillary slot arrangement mode schematic diagram of the present invention;
Fig. 3 is the A-A generalized section of Fig. 2;
Fig. 4 is second kind of structural representation of the heat sink middle based on capillary slot of microchannel of the present invention and based on capillary slot;
Fig. 5 is the third structural representation of the heat sink middle based on capillary slot of microchannel of the present invention and based on capillary slot.
Embodiment:
Embodiment 1: see Fig. 1, at metallic plate or other Heat Conduction Materials 1 inside many circular microchannels 2 are set, form the microchannel group, many rectangle based on capillary slot 3 are set on the outer surface, form based on capillary slot group, this heat exchange structure that has microchannel and based on capillary slot is called heat sink.See among Fig. 1, Fig. 3 that gathering in Heat Conduction Material 1 inner transverse and arrange in microchannel 2, sees Fig. 1, Fig. 2, based on capillary slot 3 vertically gathers and arranges.The diameter of microchannel 2 is in 0.05～1mm scope, spacing between the microchannel is in 0.05～5mm scope, the length of every microchannel is in 5～50mm scope, and the cross section, microchannel is circular, the conduit of based on capillary slot 3 is the rectangle micro-channel, its width and the conduit degree of depth are in 0.05～2mm scope, and the spacing between the micro-channel is in 0.05～5mm scope, and 3 pairs of multiple working medium of the based on capillary slot of this scope such as absolute ethyl alcohol or distilled water all have the sucking action of capillary force.High boiling liquid working medium in the microchannel flows through the heater surface, enter into microchannel 2 behind the heat of absorption heater, in microchannel 2 with metallic plate Heat Conduction Material 1 high-intensity heat convection takes place, 1 heating of metallic plate Heat Conduction Material, simultaneously, capillary force is drawn onto another kind of low-boiling point liquid working medium in the metallic plate Heat Conduction Material 1 lip-deep based on capillary slot 3, and liquid working substance evaporates in the heat affected zone of based on capillary slot 3 and seethes with excitement takes away a large amount of heats, thereby realizes the heat radiation cooling to heater.Heater can be electronics and opto-electronic device or other heaters.
Boiling point in the microchannel under the high boiling liquid working medium normal pressure is 0 ℃～300 ℃, and the boiling point in the based on capillary slot under the low-boiling point liquid working medium normal pressure is 0 ℃～150 ℃, and the boiling point of the interior liquid working substance of based on capillary slot is lower than the boiling point of flowing liquid working medium in the microchannel.
Embodiment 2: see Fig. 2, a plurality of based on capillary slot that present embodiment is heat sink 3 vertically gather and arrange, intersect on the based on capillary slot of arranging 3 that vertically gathers be arranged with a plurality of horizontal based on capillary slot road 3 '.The excessive heat load liquid working substance REFRIGERATION SYSTEM DRIVEN BY CAPILLARY FORCE power that flows of based on capillary slot 3 longitudinally down in transversely arranged based on capillary slot road 3 ' can guarantee is set, and the liquid working substance that the heat affected zone is evaporated obtains replenishing in time, thereby improves cooling effectiveness.The groove width 0.2mm of present embodiment based on capillary slot 3, groove depth 0.5mm, separation 0.2mm, laterally based on capillary slot road 3 ' groove width 0.4mm, groove depth 0.8mm, separation 5mm.
Embodiment 3: see Fig. 4, a plurality of based on capillary slot 4 that present embodiment is heat sink vertically gather and arrange, and its cross section is that trapezoidal, trapezoidal upper base edge lengths is 0.2mm, and bottom length is 0.4mm, and groove depth is 0.8mm, and spacing is 0.2mm.
Embodiment 4: see Fig. 5, a plurality of based on capillary slot 5 that present embodiment is heat sink vertically gather and arrange, and its cross section is a triangle, and leg-of-mutton bottom land drift angle is 30 °, and groove depth is 0.6mm, and spacing is 0.2mm.
Claims (9)
1. microchannel single-phase convection and based on capillary slot phase-change heat-exchange combined cooling method is characterized in that step is as follows:
A) high boiling liquid working medium flows through the position that the heater surface needs heat radiation, enters into the inner many microchannels that are provided with of a Heat Conduction Material behind the absorption heat;
B) in the Heat Conduction Material outer setting many based on capillary slot that can produce capillary force are arranged, capillary force is drawn into another kind of low-boiling point liquid working medium in the based on capillary slot;
C) the high boiling liquid working medium in the microchannel by and the microchannel wall between the heat exchange of high-intensity minute yardstick single-phase convection with the heat transferred Heat Conduction Material;
D) the low-boiling point liquid working medium in the based on capillary slot on the Heat Conduction Material heating Heat Conduction Material outer surface produces high-intensity evaporation and boiling, thereby takes away the heat of heater in based on capillary slot after this liquid working substance is heated, and makes the heater cooling.
2. microchannel according to claim 1 single-phase convection and based on capillary slot phase-change heat-exchange combined cooling method, it is characterized in that, boiling point in the described microchannel under the high boiling liquid working medium normal pressure is 0 ℃～300 ℃, boiling point in the based on capillary slot under the low-boiling point liquid working medium normal pressure is 0 ℃～150 ℃, and the boiling point of the interior liquid working substance of based on capillary slot is lower than the boiling point of flowing liquid working medium in the microchannel.
3. microchannel according to claim 1 single-phase convection and based on capillary slot phase-change heat-exchange combined cooling method, it is characterized in that, the diameter of described microchannel is in 0.05～1mm scope, and spacing is in 0.05～5mm scope, and the length of every microchannel is in 5～50mm scope; The based on capillary slot cross section is a rectangle, and its width and the degree of depth are in 0.05～2mm scope, and the spacing between the based on capillary slot is in 0.05～5mm scope.
4. the isolated plant of microchannel according to claim 1 single-phase convection and based on capillary slot phase-change heat-exchange combined cooling method, it is characterized in that, comprise a Heat Conduction Material, Heat Conduction Material inside is provided with many microchannels, form the microchannel group, described microchannel size is fit to utilize minute yardstick effect enhanced heat exchange; The Heat Conduction Material outer surface is provided with many based on capillary slot, forms based on capillary slot group, and the size of described based on capillary slot is fit to form capillary force, is drawn in the based on capillary slot with the liquid working substance with described based on capillary slot limit.
5. isolated plant according to claim 4 is characterized in that, the diameter of described microchannel is in 0.05～1mm scope, and spacing is in 0.05～5mm scope, and the length of every microchannel is in 5～50mm scope; The based on capillary slot cross section is a rectangle, and its width and the degree of depth are in 0.05～2mm scope, and the spacing between the based on capillary slot is in 0.05～5mm scope.
6. according to claim 4 or 5 described isolated plants, it is characterized in that, described many microchannels, in the densely covered arrangement of Heat Conduction Material inner transverse, most based on capillary slot in the vertically densely covered arrangement of Heat Conduction Material outer surface, move towards the quadrature setting with the microchannel.
7. isolated plant according to claim 6, it is characterized in that, described based on capillary slot vertically gathers at the Heat Conduction Material outer surface and arranges, intersect on most the based on capillary slot of arranging that vertically gather and be arranged with most laterally based on capillary slot, laterally the cross section of based on capillary slot is a rectangle, its width and the degree of depth are in 0.05～2mm scope, and the spacing between the based on capillary slot is in 0.05～10mm scope.
8. isolated plant according to claim 4, it is characterized in that, described many based on capillary slot, in the vertically densely covered arrangement of Heat Conduction Material outer surface, its cross section is that trapezoidal, trapezoidal upper base edge lengths is 0.05～2mm, and bottom length is 0.08～2.5mm, groove depth is 0.05～2mm, and the spacing between the based on capillary slot is 0.05～5mm.
9. isolated plant according to claim 6 is characterized in that, described many based on capillary slot, in the vertically densely covered arrangement of Heat Conduction Material outer surface, its cross section is a triangle, and leg-of-mutton bottom land drift angle is 5 °～60 °, groove depth is 0.05～2mm, and the spacing between the based on capillary slot is 0.05～5mm.
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| CN2006101134070A CN101155495B (en) | 2006-09-27 | 2006-09-27 | Micro-channel single phase convection and capillary groove phase inversion heat combined cooling method and device |
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| CN2006101134070A CN101155495B (en) | 2006-09-27 | 2006-09-27 | Micro-channel single phase convection and capillary groove phase inversion heat combined cooling method and device |
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| CN101155495B true CN101155495B (en) | 2011-12-21 |
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| CN101835369B (en) * | 2010-04-29 | 2012-01-18 | 内蒙古科技大学 | Thermoelectric refrigeration liquid cooling device |
| CN103542765B (en) * | 2012-07-11 | 2017-08-29 | 边疆 | Internal liquid type duct flow increasing flat radiator |
| CN107223004B (en) * | 2017-06-09 | 2023-04-21 | 苏州科技大学 | Microchannel surface type spray cooling enhanced heat transfer device and method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5453641A (en) * | 1992-12-16 | 1995-09-26 | Sdl, Inc. | Waste heat removal system |
| CN1482523A (en) * | 2002-09-10 | 2004-03-17 | 赵耀华 | Microflute evaporating and cooling method and apparatus using same |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5453641A (en) * | 1992-12-16 | 1995-09-26 | Sdl, Inc. | Waste heat removal system |
| CN1482523A (en) * | 2002-09-10 | 2004-03-17 | 赵耀华 | Microflute evaporating and cooling method and apparatus using same |
Non-Patent Citations (2)
| Title |
|---|
| 胡学功等.微槽群蒸发器在电子芯片冷却方面的应用.化工学报56 3.2005,56(3),412-416. |
| 胡学功等.微槽群蒸发器在电子芯片冷却方面的应用.化工学报56 3.2005,56(3),412-416. * |
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