CN108168345A - For the heat sink and its manufacturing method under superelevation heat flow density - Google Patents
For the heat sink and its manufacturing method under superelevation heat flow density Download PDFInfo
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- CN108168345A CN108168345A CN201810143868.5A CN201810143868A CN108168345A CN 108168345 A CN108168345 A CN 108168345A CN 201810143868 A CN201810143868 A CN 201810143868A CN 108168345 A CN108168345 A CN 108168345A
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- Prior art keywords
- heat sink
- open channel
- flow density
- heat
- hydrophilic coating
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
Abstract
The disclosure provides a kind of heat sink and its manufacturing method under superelevation heat flow density, including：Heat sink substrate, for radiating for heating device, including：Open channel is arranged in any plate face of the heat sink substrate, is flowed using capillary phenomenon driving heat radiation working medium along the open channel；And hydrophilic coating, it is arranged on the surface of the open channel, the hydrophilic coating Surface Creation polarized molecular radical, the hydrophilic coating and the polar molecule group are used to improve the fluid infusion ability of the open channel.The heat sink polar molecule group by setting hydrophilic coating and hydrophilic coating surface being used under superelevation heat flow density that the disclosure provides, greatly increase the capillary gradients in open channel, so that heat sink under superelevation heat flow density have timely fluid infusion ability, high heat-exchanging performance heat sink under superelevation heat flow density and high reliability ensure that.
Description
Technical field
This disclosure relates to phase-change heat-exchange technical field more particularly to a kind of heat sink and its system under superelevation heat flow density
Make method.
Background technology
Along with electronic industry high-performance, micromation, integrated development trend, the power density of electronic device is increasingly
Greatly, such as：Power density using COB (Chip On Board) integrated LED single light source of block fluorescence transition material reaches 50
~500W/cm2, the fever heat flow density of electronic device is thus brought rapidly to increase.Define 20~150W/cm2It is close for high hot-fluid
Degree；When heat flow density is more than 150W/cm2When, already exceed the critical heat flux that pool boiling phase-change heat-exchange occurs for stock size surface
Density is defined as superelevation heat flow density.Under high heat flux density, if the high intensity calorific value of electronic device cannot effectively dissipate
It goes, it will device temperature is caused to increase rapidly, serious performance, stability and the safety for reducing device and system.
In the prior art using it is high performance it is micro-/receive scale phase change enhanced heat exchange technology, exist in heat sink surface structure size
Tens to hundreds of microns of open micro-channel array, composite phase-change strengthening heat transfer can occur for surface.It is open
The capillary gradients that micro-channel array is formed can drive liquid working substance to flow, and three-phase line of contact region promotees in channel
Meniscus evaporation thin film is extended into being formed, so as to create the pure evaporation and heat-exchange condition of high intensity, and in higher thermal load conditions
Under, it may occur that thin liquid film evaporates and the composite phase-change heat exchange of thick liquid film region kernel state boiling, is a kind of typical high-performance quilt
Dynamic formula minute yardstick phase-change heat-exchange technology, can be utilized to implement the high coefficient of heat transfer under low thermal resistance and condition of small temperature difference and high hot-fluid
The heat transfer process of density.It is this that there is the heat sink of open micro-channel array can effectively solve electronic device under high heat flux density
Heat dissipation problem.
However during the disclosure is realized, applicants have discovered that, under the conditions of superelevation heat flow density, as hot-fluid is close
The further raising of degree, the liquid working substance in heat sink open micro-channel array will become to be easy to it is dry, once liquid pool
Dry place is not replenished in time in interior liquid working substance, then can not continuously form thin liquid film and thick liquid film region, can not just send out yet
The thin liquid film evaporation of raw high intensity and the composite phase-change heat exchange of thick liquid film nucleate boiling, heat sink heat dissipation performance and reliability are substantially
Decline.
Invention content
(1) technical problems to be solved
Based on above-mentioned technical problem, the disclosure provides a kind of heat sink and its manufacturing method under superelevation heat flow density,
To alleviate the heat dissipation work in of the prior art heat sink under the conditions of superelevation heat flow density, heat sink open micro-channel array
Matter will easily dry up, and dry place can not be replenished in time in heat radiation working medium, under leading to heat sink heat dissipation performance and reliability substantially
The technical issues of drop.
(2) technical solution
According to one aspect of the disclosure, provide it is a kind of for heat sink under superelevation heat flow density, including：Heat sink substrate,
For radiating for heating device, including：Open channel is arranged in any plate face of the heat sink substrate, is showed using capillary
As driving heat radiation working medium is flowed along the open channel；And hydrophilic coating, the surface of the open channel is arranged on, it should
Hydrophilic coating Surface Creation polarized molecular radical, the hydrophilic coating and the polar molecule group are used to improve the opening
The fluid infusion ability of formula channel.
In some embodiments of the present disclosure, the open channel includes N items, and open channel described in N items is set side by side
It puts；Wherein N >=10.
In some embodiments of the present disclosure, the arranging density of the open channel is not less than 5/cm.
In some embodiments of the present disclosure, wherein：The width of the open channel is between 10 μm to 2000 μm；
The depth of the open channel is between 10 μm to 2000 μm；The spacing of the two adjacent open channels between 10 μm extremely
Between 2000 μm；The thickness of the hydrophilic coating is between 20nm to 50 μm.
In some embodiments of the present disclosure, wherein：The width of the open channel is between 200 μm to 500 μm；
The depth of the open channel is between 200 μm to 1500 μm；The spacing of the two adjacent open channels is between 200 μm
To between 500 μm.
In some embodiments of the present disclosure, the cross section of the open channel is rectangle, trapezoidal, triangle, circular arc
Shape or irregular figure.
In some embodiments of the present disclosure, wherein：The hydrophilic coating includes：Woelm Alumina, porous oxidation niobium, oxygen
Change at least one of zinc sodium, titanium oxide, zinc oxide, tin oxide, vanadic anhydride, copper oxide, cuprous oxide, Kocide SD；
The polar molecule group includes：In carboxylic acid group, sulfonic group, phosphate, amino, quaternary ammonium group, hydroxyl, carboxylate, block polyether
At least one；The heat sink substrate includes：At least one of metal, alloy, semiconductor, ceramics, oxide；It is wherein described
The thermal conductivity factor of heat sink substrate is not less than 20W/mK.
According to another aspect of the disclosure, a kind of heat sink manufacturing method under superelevation heat flow density is also provided,
Including：Step A：Open channel is generated in the one side of heat sink substrate；Step B：In the Surface Creation of the open channel
Hydrophilic coating；Step C：In the Surface Creation polar molecule group of the hydrophilic coating, obtain disclosure offer is used for superelevation
It is heat sink under heat flow density.
In some embodiments of the present disclosure, wherein, in the step A, pass through wire cutting method or laser processing
The open channel is generated in the heat sink substrate.
In some embodiments of the present disclosure, wherein：In the step B, pass through physical vapour deposition (PVD), chemical vapor deposition
Hydrophilic coating described in product, the Surface Creation of electrochemistry or oxidation-reduction method in the open channel；In the step C, pass through
Polar molecule group described in the Surface Creation of chemical solution infusion method or Ultraviolet irradiation method in the hydrophilic coating.
(3) advantageous effect
It can be seen from the above technical proposal that the heat sink and its manufacturer being used under superelevation heat flow density that the disclosure provides
Method has the advantages that one of them or a portion：
(1) by setting the polar molecule group of hydrophilic coating and hydrophilic coating surface, the cooperative reinforcing effect of the two
The wetting characteristics on open channel surface can be greatly improved, greatly increases the capillary gradients in open channel so that
It is heat sink under superelevation heat flow density that there is timely fluid infusion ability, once there is dry region in hot localised points, in big capillary gradients
Driving under, heat radiation working medium adds to rapidly dry area, again soak open channel surface, persistently occur thin liquid film evaporation
With the high-strength composite phase transformation strengthening heat transfer process of thick liquid film nucleate boiling, high heat exchange heat sink under superelevation heat flow density ensure that
Performance and high reliability；
(2) a plurality of open channel is arranged side by side, and the width of open channel, depth and spacing are between 10 μm
To between 2000 μm, heat exchange area is not only increased, it is often more important that the interfacial effect and dimensional effect of open channel can be right
The flowing of heat radiation working medium and phase-change heat-exchange performance generate extraordinary invigoration effect, make its surface that thin liquid film evaporation and thick liquid film occur
The high-strength composite phase transformation strengthening heat transfer process of nucleate boiling, theoretical maximum take hot heat flow density to can reach 104W/cm2Number
Magnitude, phase-change heat transfer coefficient reach 106W/(m2The order of magnitude DEG C) takes thermal energy power to be much larger than the heat with stock size surface
It is heavy.
Description of the drawings
Fig. 1 is the embodiment of the present disclosure for the heat sink structure diagram under superelevation heat flow density.
Fig. 2 a are the partial elevational elevation view of open channel in Fig. 1.
Fig. 2 b are the partial elevational elevation view of another structure of open channel in Fig. 1.
Fig. 2 c are the partial elevational elevation view of the yet another construction of open channel in Fig. 1.
Fig. 2 d are the partial elevational elevation view of the yet another construction of open channel in Fig. 1.
Fig. 2 e are the partial elevational elevation view of the yet another construction of open channel in Fig. 1.
The step of Fig. 3 is the heat sink manufacturing method that the embodiment of the present disclosure is used under superelevation heat flow density is schemed.
【Embodiment of the present disclosure main element symbol description in attached drawing】
10- heat sink substrates；
11- open channels；12- hydrophilic coatings；
121- polar molecule groups.
Specific embodiment
What the embodiment of the present disclosure provided is used in the heat sink and its manufacturing method under superelevation heat flow density, hydrophilic by setting
Coating and the polar molecule group on hydrophilic coating surface, the cooperative reinforcing effect of the two can greatly improve open channel surface
Wetting characteristics, greatly increase the capillary gradients in open channel, and then improve fluid infusion velocity, ensure that excessive heat
Heat sink high heat-exchanging performance and high reliability under current density.
Purpose, technical scheme and advantage to make the disclosure are more clearly understood, below in conjunction with specific embodiment, and reference
The disclosure is further described in attached drawing.
Fig. 1 is the embodiment of the present disclosure for the heat sink structure diagram under superelevation heat flow density.Fig. 2 a are open in Fig. 1
The partial elevational elevation view of formula channel.
According to one aspect of the disclosure, provide it is a kind of for heat sink under superelevation heat flow density, as shown in Fig. 1-Fig. 2 a,
Including：Heat sink substrate 10, for radiating for heating device, including：Open channel 11 is arranged on the either plate of heat sink substrate 10
On face, flowed using capillary phenomenon driving heat radiation working medium along open channel 11；And hydrophilic coating 12, it is arranged on open logical
The surface in road 11, the 12 Surface Creation polarized molecular radical 121 of hydrophilic coating, hydrophilic coating 12 and polar molecule group 121
For improving the fluid infusion ability of open channel 11.By the polar molecule for setting 12 surface of hydrophilic coating 12 and hydrophilic coating
Group 121, the cooperative reinforcing effect of the two can greatly improve the wetting characteristics on 11 surface of open channel, greatly increase open
Capillary gradients in channel 11 so that it is heat sink under superelevation heat flow density that there is timely fluid infusion ability, once hot localised points
There is dry region, under the driving of big capillary gradients, heat radiation working medium adds to rapidly dry area, soaks again open
The high-strength composite phase transformation strengthening heat transfer process of thin liquid film evaporation and thick liquid film nucleate boiling persistently occurs for the surface of channel 11,
It ensure that high heat-exchanging performance heat sink under superelevation heat flow density and high reliability.
In the present embodiment, open channel 11 includes N items, and N open channel 11 is set up in parallel；Wherein N >=10.
In the present embodiment, the arranging density of open channel 11 is not less than 5/cm, i.e., a plurality of is opened along what is be set up in parallel
The orientation for putting formula channel counts, and the item number of interior open channel 11 per cm is not less than 5.
In the present embodiment, wherein：The width of open channel 11 is between 10 μm to 2000 μm；Open channel 11
Depth between 10 μm to 2000 μm；The spacing of two adjacent open channels 11 is between 10 μm to 2000 μm；It is hydrophilic
The thickness of coating 12 is between 20nm to 50 μm.A plurality of open channel 11 is arranged side by side, and the width of open channel 11
Degree, depth and spacing not only increase heat exchange area, it is often more important that open channel between 10 μm to 2000 μm
11 interfacial effect and dimensional effect can generate extraordinary invigoration effect to the flowing of heat radiation working medium and phase-change heat-exchange performance, make it
The high-strength composite phase transformation strengthening heat transfer process of thin liquid film evaporation and thick liquid film nucleate boiling occurs for surface, and theoretical maximum takes heat
Heat flow density can reach 104The order of magnitude of W/cm2, phase-change heat transfer coefficient reach 106W/(m2DEG C) the order of magnitude, take thermal energy power
Much larger than with the heat sink of stock size surface.
In the present embodiment, wherein：The width of open channel 11 is between 200 μm to 500 μm；Open channel 11
Depth between 200 μm to 1500 μm；The spacing of two adjacent open channels 11 is between 200 μm to 500 μm.It is open
The size of formula channel 11 is smaller, and capillary phenomenon is more apparent, and fluid infusion ability is stronger.
Fig. 2 b are the partial elevational elevation view of another structure of open channel in Fig. 1.Fig. 2 c are open logical in Fig. 1
The partial elevational elevation view of the yet another construction in road.Fig. 2 d are the partial enlargement master of the yet another construction of open channel in Fig. 1
View.Fig. 2 e are the partial elevational elevation view of the yet another construction of open channel in Fig. 1.
In the present embodiment, as shown in Fig. 2 a- Fig. 2 e, the cross section of open channel 11 is rectangle, trapezoidal, triangle,
Arc-shaped or irregular figure.
In the present embodiment, wherein：Hydrophilic coating 12 includes：Woelm Alumina, porous oxidation niobium, zinc oxide sodium, oxidation
At least one of titanium, zinc oxide, tin oxide, vanadic anhydride, copper oxide, cuprous oxide, Kocide SD；Polar molecule group
121 include：At least one of carboxylic acid group, sulfonic group, phosphate, amino, quaternary ammonium group, hydroxyl, carboxylate, block polyether；Heat
Heavy substrate 10 includes：At least one of metal, alloy, semiconductor, ceramics, oxide；Wherein, the heat conduction system of heat sink substrate 10
Number is not less than 20W/mK.
The step of Fig. 3 is the heat sink manufacturing method that the embodiment of the present disclosure is used under superelevation heat flow density is schemed.
According to another aspect of the disclosure, as shown in figure 3, providing a kind of heat sink system under superelevation heat flow density
Method is made, including：Step A：Open channel 11 is generated in the one side of heat sink substrate 10；Step B：In open channel 11
Surface Creation hydrophilic coating 12；Step C：In the Surface Creation polar molecule group 121 of hydrophilic coating 12, obtain the present embodiment and carry
Being used for for supplying is heat sink under superelevation heat flow density.
In the present embodiment, wherein, in step A, by wire cutting method or laser processing in heat sink substrate 10
Generate open channel 11.
In the present embodiment, wherein, in step B, pass through physical vapour deposition (PVD), chemical vapor deposition, electrochemistry or oxidation
Reduction method is in the Surface Creation hydrophilic coating 12 of open channel 11；In step C, pass through chemical solution infusion method or ultraviolet irradiation
Method is in the Surface Creation polar molecule group 121 of hydrophilic coating 12.
So far, attached drawing is had been combined the embodiment of the present disclosure is described in detail.It should be noted that it in attached drawing or says
In bright book text, the realization method that is not painted or describes is form known to a person of ordinary skill in the art in technical field, and
It is not described in detail.In addition, the above-mentioned definition to each element and method be not limited in mentioning in embodiment it is various specific
Structure, shape or mode, those of ordinary skill in the art simply can be changed or replaced to it.
According to above description, what those skilled in the art should provide the disclosure is used for heat sink under superelevation heat flow density
And its manufacturing method has clear understanding.
In conclusion the heat sink and its manufacturing method being used under superelevation heat flow density that the disclosure provides is hydrophilic by setting
The polar molecule group 121 on 12 surface of coating 12 and hydrophilic coating, the cooperative reinforcing effect of the two can greatly improve open
The wetting characteristics on 11 surface of channel so that it is heat sink under superelevation heat flow density that there is timely fluid infusion ability, it ensure that superelevation hot-fluid
Heat sink high heat-exchanging performance and high reliability under density.
It should also be noted that, the direction term mentioned in embodiment, for example, " on ", " under ", "front", "rear", " left side ",
" right side " etc. is only the direction of refer to the attached drawing, is not used for limiting the protection domain of the disclosure.Through attached drawing, identical element by
Same or similar reference numeral represents.When understanding of this disclosure may be caused to cause to obscure, conventional structure will be omitted
Or construction.
And the shape and size of each component do not reflect actual size and ratio in figure, and only illustrate the embodiment of the present disclosure
Content.In addition, in the claims, any reference mark between bracket should not be configured to the limit to claim
System.
Similarly, it should be understood that in order to simplify the disclosure and help to understand one or more of each open aspect,
Above in the description of the exemplary embodiment of the disclosure, each feature of the disclosure is grouped together into single implementation sometimes
In example, figure or descriptions thereof.However, the method for the disclosure should be construed to reflect following intention：I.e. required guarantor
The disclosure of shield requires features more more than the feature being expressly recited in each claim.More precisely, as following
Claims reflect as, open aspect is all features less than single embodiment disclosed above.Therefore,
Thus the claims for following specific embodiment are expressly incorporated in the specific embodiment, wherein each claim is in itself
All as the separate embodiments of the disclosure.
Particular embodiments described above has carried out the purpose, technical solution and advantageous effect of the disclosure further in detail
It describes in detail bright, it should be understood that the foregoing is merely the specific embodiment of the disclosure, is not limited to the disclosure, it is all
Within the spirit and principle of the disclosure, any modification, equivalent substitution, improvement and etc. done should be included in the guarantor of the disclosure
Within the scope of shield.
Claims (10)
1. it is a kind of for heat sink under superelevation heat flow density, including：
Heat sink substrate, for radiating for heating device, including：
Open channel is arranged in any plate face of the heat sink substrate, using capillary phenomenon driving heat radiation working medium described in
Open channel flows；And
Hydrophilic coating is arranged on the surface of the open channel, the hydrophilic coating Surface Creation polarized molecular radical, described
Hydrophilic coating and the polar molecule group are used to improve the fluid infusion ability of the open channel.
2. according to claim 1 for heat sink under superelevation heat flow density, the open channel includes N items, N items institute
Open channel is stated to be set up in parallel；
Wherein N >=10.
3. according to claim 2 for heat sink under superelevation heat flow density, the arranging density of the open channel is not
Less than 5/cm.
4. it is according to claim 3 for heat sink under superelevation heat flow density, wherein：
The width of the open channel is between 10 μm to 2000 μm；
The depth of the open channel is between 10 μm to 2000 μm；
The spacing of the two adjacent open channels is between 10 μm to 2000 μm；
The thickness of the hydrophilic coating is between 20nm to 50 μm.
5. it is according to claim 4 for heat sink under superelevation heat flow density, wherein：
The width of the open channel is between 200 μm to 500 μm；
The depth of the open channel is between 200 μm to 1500 μm；
The spacing of the two adjacent open channels is between 200 μm to 500 μm.
6. according to claim 1 for heat sink under superelevation heat flow density, the cross section of the open channel is square
Shape, trapezoidal, triangle, arc-shaped or irregular figure.
7. it is according to claim 1 for heat sink under superelevation heat flow density, wherein：
The hydrophilic coating includes：Woelm Alumina, porous oxidation niobium, zinc oxide sodium, titanium oxide, zinc oxide, tin oxide, five oxygen
Change at least one of two vanadium, copper oxide, cuprous oxide, Kocide SD；
The polar molecule group includes：Carboxylic acid group, sulfonic group, phosphate, amino, quaternary ammonium group, hydroxyl, carboxylate, block gather
At least one of ether；
The heat sink substrate includes：At least one of metal, alloy, semiconductor, ceramics, oxide；
The thermal conductivity factor of wherein described heat sink substrate is not less than 20W/mK.
8. a kind of heat sink manufacturing method under superelevation heat flow density, including：
Step A：Open channel is generated in the one side of heat sink substrate；
Step B：In the Surface Creation hydrophilic coating of the open channel；
Step C：In the Surface Creation polar molecule group of the hydrophilic coating, obtain such as any one of the claims 1 to 7
Described being used for is heat sink under superelevation heat flow density.
9. the heat sink manufacturing method according to claim 8 under superelevation heat flow density, wherein, in the step A,
The open channel is generated in the heat sink substrate by wire cutting method or laser processing.
10. the heat sink manufacturing method according to claim 8 under superelevation heat flow density, wherein：
In the step B, by physical vapour deposition (PVD), chemical vapor deposition, electrochemistry or oxidation-reduction method described open
Hydrophilic coating described in the Surface Creation of channel；
In the step C, pass through pole described in the Surface Creation of chemical solution infusion method or Ultraviolet irradiation method in the hydrophilic coating
Property molecular radical.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810143868.5A CN108168345A (en) | 2018-02-11 | 2018-02-11 | For the heat sink and its manufacturing method under superelevation heat flow density |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810143868.5A CN108168345A (en) | 2018-02-11 | 2018-02-11 | For the heat sink and its manufacturing method under superelevation heat flow density |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110608628A (en) * | 2019-09-12 | 2019-12-24 | Oppo广东移动通信有限公司 | Temperature-equalizing plate and hydrophilic treatment method of temperature-equalizing plate |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001149735A (en) * | 1999-11-25 | 2001-06-05 | Ebara Corp | Functional element for dehumidifying or heat exchanging and method of manufacturing the same |
| JP2010175131A (en) * | 2009-01-29 | 2010-08-12 | Mitsubishi Electric Corp | Heat exchange device, refrigerating air conditioner and method of manufacturing heat exchanger |
| US20110198059A1 (en) * | 2008-08-01 | 2011-08-18 | Commissariat A L'energie Atomique Et Aux Ene Alt | Heat exchange structure and cooling device comprising such a structure |
| CN103862766A (en) * | 2014-03-20 | 2014-06-18 | 常州市泛亚微透科技有限公司 | Coating film paster for automobile electric electronic equipment and manufacturing method of paster |
| CN206073779U (en) * | 2016-09-13 | 2017-04-05 | 中国科学院工程热物理研究所 | A kind of micro-nano compound structure surface is heat sink |
| CN107084378A (en) * | 2017-06-14 | 2017-08-22 | 中国科学院工程热物理研究所 | LED radiator |
| CN206442652U (en) * | 2017-01-26 | 2017-08-25 | 中国科学院工程热物理研究所 | A kind of flexible microflute group heat abstractor |
| CN208635621U (en) * | 2018-02-11 | 2019-03-22 | 中国科学院工程热物理研究所 | For heat sink under superelevation heat flow density |
-
2018
- 2018-02-11 CN CN201810143868.5A patent/CN108168345A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001149735A (en) * | 1999-11-25 | 2001-06-05 | Ebara Corp | Functional element for dehumidifying or heat exchanging and method of manufacturing the same |
| US20110198059A1 (en) * | 2008-08-01 | 2011-08-18 | Commissariat A L'energie Atomique Et Aux Ene Alt | Heat exchange structure and cooling device comprising such a structure |
| JP2010175131A (en) * | 2009-01-29 | 2010-08-12 | Mitsubishi Electric Corp | Heat exchange device, refrigerating air conditioner and method of manufacturing heat exchanger |
| CN103862766A (en) * | 2014-03-20 | 2014-06-18 | 常州市泛亚微透科技有限公司 | Coating film paster for automobile electric electronic equipment and manufacturing method of paster |
| CN206073779U (en) * | 2016-09-13 | 2017-04-05 | 中国科学院工程热物理研究所 | A kind of micro-nano compound structure surface is heat sink |
| CN206442652U (en) * | 2017-01-26 | 2017-08-25 | 中国科学院工程热物理研究所 | A kind of flexible microflute group heat abstractor |
| CN107084378A (en) * | 2017-06-14 | 2017-08-22 | 中国科学院工程热物理研究所 | LED radiator |
| CN208635621U (en) * | 2018-02-11 | 2019-03-22 | 中国科学院工程热物理研究所 | For heat sink under superelevation heat flow density |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110608628A (en) * | 2019-09-12 | 2019-12-24 | Oppo广东移动通信有限公司 | Temperature-equalizing plate and hydrophilic treatment method of temperature-equalizing plate |
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