CN205746098U - A kind of LED lamp utilizing cover surface to dispel the heat - Google Patents
A kind of LED lamp utilizing cover surface to dispel the heat Download PDFInfo
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- CN205746098U CN205746098U CN201620481144.8U CN201620481144U CN205746098U CN 205746098 U CN205746098 U CN 205746098U CN 201620481144 U CN201620481144 U CN 201620481144U CN 205746098 U CN205746098 U CN 205746098U
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- heat
- led lamp
- lampshade
- dispel
- cover surface
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Abstract
This utility model relates to heat-producing device technical field of heat dissipation, particularly relates to a kind of LED lamp utilizing cover surface to dispel the heat.This LED lamp includes that LED light source module and lampshade, wherein said LED light source module are connected with the upper end of described lampshade, is provided with some finned heat exchangers on the outer surface of described lampshade.This LED lamp can not only effectively control temperature during LED operation, moreover it is possible to effectively reduces the overall size of light fixture and weight so that whole LED lamp have simple and compact for structure, easy to assembly, lightweight, reliability is high, the advantage of low cost, good heat dissipation effect.
Description
Technical field
This utility model relates to LED lamp technical field of heat dissipation, particularly relates to a kind of LED utilizing cover surface to dispel the heat
Tool.
Background technology
In recent years, from house, hospital, factory, a large amount of lighting demands of various indoor and outdoor such as gymnasium to street, square etc.
It is greatly promoted the fast development of LED technology.Electric light transformation efficiency is high, volume is little, brightness is high, one-tenth owing to having for LED light source
This is the lowest, waterproof, shake-proof ability strong, life-span length, the material environment friendly advantage such as safely, gradually replaces electric filament lamp and fluorescent lamp becomes the most main
One of green light source wanted.
Although LED has higher luminous efficiency relative to electric filament lamp, but luminous efficiency is generally between 20%～30%,
The energy having 70%～more than 80% is converted into heat, and too high temperature can cause light output intensity and the service efficiency of LED
Reduce, optical wavelength offsets, the aging acceleration of chip, thus shortens the service life of LED.Additionally, at medical treatment, plant cultivation
Control have the illumination application of strict demand also existing heat dissipation technology to be had higher requirement Deng to temperature, and along with
LED chip integrated level and the increase of power, the heat dissipation problem of LED illumination device is the most serious.
Common LED illumination lamp, generally relies only on heat transfer free convection and dispels the heat, and radiating effect is very poor, at light fixture
While serious heating, the life-time service of light fixture and life-span can be had a negative impact, this and the theory of current energy-conserving and environment-protective
Run in the opposite direction.This is to this situation, and more existing high-power LED lamps are equipped with bigger radiator and dispel the heat, but this
Planting the radiator provisioned in high-power LED lamp to be independently arranged, this version not only increases the overall body of light fixture
Long-pending, and add light fixture weight.But, all can be restricted in a lot of applications, size and weight.
Utility model content
(1) to solve the technical problem that
The purpose of this utility model is to provide a kind of LED lamp utilizing cover surface to dispel the heat, and solves existing LED lamp and dissipates
Thermal effect is poor, equipped with the technical problem that the LED lamp size of large scale separated radiator and weight are excessive.
(2) technical scheme
In order to solve above-mentioned technical problem, this utility model provides a kind of LED lamp utilizing cover surface to dispel the heat, bag
Including LED light source module and lampshade, wherein said LED light source module is connected with the upper end of described lampshade, in the appearance of described lampshade
Face is provided with some finned heat exchangers.
Further, described LED light source module includes LED light source chip and heat sink, described LED light source chip and described heat
Heavy thermo-contact, described heat sink and described lampshade upper end is connected.
Further, the inner surface of described lampshade is provided with some heat transfer elements, and described heat transfer element is with described heat sink heat even
Connect.
Specifically, described heat transfer element is heat pipe or liquid SAPMAC method pipe.
Specifically, described lampshade is round table surface structure, and described some heat transfer elements are radially distributed on described lampshade
Inner surface on.
Specifically, described lampshade is round table surface structure, and described some finned heat exchangers are radially distributed on described lamp
On the outer surface of cover.
Further, described lampshade inner surface is pasted with conduction graphite film.
Specifically, described finned heat exchanger is inserted on the outer surface being embedded in described lampshade.
Specifically, welded by tin cream between described finned heat exchanger with described lampshade.
Specifically, described lampshade and described finned heat exchanger all use alloy in lightweight to make.
(3) beneficial effect
Technique scheme of the present utility model has the advantage that
This utility model utilizes the LED lamp that cover surface dispels the heat, and is connected with LED light source module the upper end of lampshade, uses
The heat produced in time LED light source module being worked is delivered on lampshade, then by the fin arranged on the outer surface of lampshade
Heat exchanger, carries out heat exchange with surrounding air, reaches to carry out whole light fixture the effect of cooling heat radiation, this by lampshade and fin
The version that heat exchanger combines, can effectively control temperature during LED operation, can effectively reduce again the size that light fixture is overall
And weight so that whole LED lamp have simple and compact for structure, easy to assembly, lightweight, reliability is high, low cost, heat radiation effect
The best advantage.
Accompanying drawing explanation
Fig. 1 is the structural representation of the LED lamp that this utility model utilizes cover surface to dispel the heat；
Fig. 2 is the half-sectional view of the LED lamp that this utility model utilizes cover surface to dispel the heat.
In figure: 1:LED light source module；2: lampshade；3: finned heat exchanger；4: heat transfer element.
Detailed description of the invention
For making the purpose of this utility model embodiment, technical scheme and advantage clearer, new below in conjunction with this practicality
Accompanying drawing in type embodiment, is clearly and completely described the technical scheme in this utility model embodiment, it is clear that retouched
The embodiment stated is a part of embodiment of the present utility model rather than whole embodiments.Based on the reality in this utility model
Execute example, the every other embodiment that those of ordinary skill in the art are obtained on the premise of not making creative work, all
Belong to the scope of this utility model protection.
As shown in Figure 1-2, this utility model embodiment provides a kind of LED lamp utilizing cover surface to dispel the heat, including LED
Light source module 1, lampshade 2 and finned heat exchanger 3, wherein said LED light source module 1 is connected with the upper end of described lampshade 2, described
Some described finned heat exchangers 3 are set on the outer surface of lampshade 2.
In LED lamp, the luminous heat produced of described LED light source module 1 is relatively big, this utility model utilize in light fixture with
The lampshade that described LED light source module 1 is closely coupled, the heat produced when described LED light source module 1 being worked is delivered to described lamp
On cover 2, then by being arranged on the described finned heat exchanger 3 on the outer surface of described lampshade 2, carry out heat exchange with surrounding air,
Reaching to carry out whole light fixture the purpose of cooling heat radiation, meanwhile, this utility model is by described lampshade 2 and described finned heat exchanger
3 structures combined are dispelled the heat, it is also possible to significantly reduce size and the weight of LED lamp.
Furthermore, described LED light source module 1 includes LED light source chip and heat sink, described LED light source chip and institute
Stating heat sink thermo-contact, described heat sink and described lampshade 2 upper end is connected.Can according to different lighting demands or design requirement,
Select the dissimilar and LED light source chip of power.
Furthermore, the inner surface of described lampshade 2 is provided with some heat transfer elements 4, and described heat transfer element 4 is heat sink with described
Thermally coupled, described heat transfer element 4 can use the method for welding to be fixed on the inner surface of described lampshade 2.Described heat transfer element 4 uses
Heat pipe or liquid SAPMAC method pipe, wherein said liquid SAPMAC method pipe can select water-cooled or liquid metal cooling shape according to radiating requirements
Formula.By arranging described heat transfer element 4 at the inner surface of described lampshade 2, it is possible to described LED light source module 1 is produced
Even heat is transferred to the surface of described lampshade 2, consequently facilitating by being arranged on the described fin on the outer surface of described lampshade 2
Heat exchanger 3 dispels the heat.
Specifically, described lampshade 2 can take different shapes according to different configuration design demands, but needs circle
Sliding surfaces externally and internally is in order to arrange described finned heat exchanger 3.In the present embodiment, described lampshade 2 uses round table surface structure, wherein
The lampshade upper end of described round table surface structure is little, and lower end is big, arranges screw, by described fin heat exchange on the surface of described lampshade 2
Device 3 is arranged on described lampshade 2 by screw.
Specifically, described some heat transfer elements 4 are radially distributed on the inner surface of described lampshade 2.Described
The outer surface of lampshade 2 is provided with two kinds of finned heat exchangers varied in size, and the biggest finned heat exchanger is radially distributed on institute
Stating on the outer surface of lampshade 2, little finned heat exchanger is then distributed between big finned heat exchanger, thus increases to greatest extent and dissipate
Hot side amasss, and strengthens radiating effect.It is additionally provided with hot interface coating, to keep good heat to connect in the bottom of described finned heat exchanger
Touch.For the lampshade of difformity size, the finned heat exchanger of suitable quantity and size can be selected, make radiating effect reach
Good.
For the LED lamp of common power, the radiator structure in usual above-described embodiment can meet radiating requirements, but
For the LED lamp with high power density, only rely on described finned heat exchanger 3, described heat transfer element 4 and described lamp
The radiating effect of cover 2 self, still can cause LED lamp temperature too high.For this situation, of the present utility model further
In embodiment, the inner surface at described lampshade 2 is pasted with conduction graphite film, thus the heat that described LED light source module 1 is produced
On uniform conductive extremely described lampshade 2, reach more preferably radiating effect.
In order to alleviate the weight of LED lamp further, in further embodiment of the present utility model, described fin heat exchange
Device 3 can by directly by insert embedding in the way of be arranged on the outer surface of described lampshade 2.In order to reduce described finned heat exchanger 3 and institute
State the thermal resistance between lampshade 2, welded by tin cream between described finned heat exchanger 3 with described lampshade 2.
Additionally, described lampshade 2 uses alloy in lightweight to make, typically select aluminium alloy or magnesium alloy that heat conductivility is good,
To guarantee that the heat that described LED light source chip produces can be delivered on described lampshade 2 efficiently, can also effectively alleviate described simultaneously
The weight of LED lamp.Described finned heat exchanger 3 is also adopted by alloy in lightweight and makes, the general aluminium alloy selecting heat conductivility good
Or magnesium alloy, in order to alleviate the weight of LED lamp further.
In sum, at the LED lamp utilizing cover surface to dispel the heat that this utility model provides, described LED light source chip
The heat produced during work is transmitted on described lampshade 2 by the heat sink and described heat transfer element 4 thermally contacted with it.By
The described heat transfer element 4 arranged on the inner surface of described lampshade 2, is distributed to whole lampshade by even heat, and recycling is described
The described finned heat exchanger 3 arranged on the outer surface of lampshade 2, effective increasing heat radiation area, and carry out heat exchange with surrounding air,
Realize the heat radiation purpose to LED lamp.Additionally, the outer surface of described lampshade 2 is itself by heat transfer free convection, it may have certain
Heat-sinking capability.On the basis of above-described embodiment, can strengthen in combination with using other kinds of heat abstractor or device
The radiating effect that LED lamp is overall.
In description of the present utility model, it should be noted that except as otherwise noted, term " on ", D score, " left ",
Orientation or the position relationship of the instruction such as " right ", " interior ", " outward " they are based on orientation shown in the drawings or position relationship, merely to just
Describe in description this utility model and simplification rather than indicate or imply that the device of indication or element must have specific side
Position, with specific azimuth configuration and operation, therefore it is not intended that to restriction of the present utility model.Additionally, term " big fin changes
Hot device " and " little finned heat exchanger " represent the difference of size, be only used for describing purpose, therefore it is not intended that to this practicality
Novel restriction.
In description of the present utility model, in addition it is also necessary to explanation, unless otherwise clearly defined and limited, term " peace
Dress ", should be interpreted broadly " being connected ", " connection ", for example, it may be fix connection, it is also possible to be to removably connect, or integratedly
Connect；Can be to be mechanically connected, it is also possible to be electrical connection；Can be to be joined directly together, it is also possible to be indirectly connected to by intermediary.
For the ordinary skill in the art, the visual concrete condition above-mentioned term of understanding specifically containing in this utility model
Justice.
Last it is noted that above example is only in order to illustrate the technical solution of the utility model, it is not intended to limit；
Although this utility model being described in detail with reference to previous embodiment, it will be understood by those within the art that:
Technical scheme described in foregoing embodiments still can be modified by it, or carries out wherein portion of techniques feature
With replacing；And these amendments or replacement, do not make the essence of appropriate technical solution depart from this utility model each embodiment technology
The spirit and scope of scheme.
Claims (10)
1. the LED lamp utilizing cover surface to dispel the heat, it is characterised in that: include LED light source module and lampshade, wherein said
LED light source module is connected with the upper end of described lampshade, is provided with some finned heat exchangers on the outer surface of described lampshade.
The LED lamp utilizing cover surface to dispel the heat the most according to claim 1, it is characterised in that: described LED light source module
Including LED light source chip and heat sink, described LED light source chip heat sink thermally contacts with described, described heat sink and described lampshade upper
End is connected.
The LED lamp utilizing cover surface to dispel the heat the most according to claim 2, it is characterised in that: the interior table of described lampshade
Face is provided with some heat transfer elements, described heat transfer element and described heat sink thermally coupled.
The LED lamp utilizing cover surface to dispel the heat the most according to claim 3, it is characterised in that: described heat transfer element is
Heat pipe or liquid SAPMAC method pipe.
The LED lamp utilizing cover surface to dispel the heat the most according to claim 3, it is characterised in that: described lampshade is round platform
Face structure, described some heat transfer elements are radially distributed on the inner surface of described lampshade.
The LED lamp utilizing cover surface to dispel the heat the most according to claim 1, it is characterised in that: described lampshade is round platform
Face structure, described some finned heat exchangers are radially distributed on the outer surface of described lampshade.
The LED lamp utilizing cover surface to dispel the heat the most according to claim 1, it is characterised in that: described lampshade inner surface
It is pasted with conduction graphite film.
The LED lamp utilizing cover surface to dispel the heat the most according to claim 1, it is characterised in that: described finned heat exchanger
Insert and be embedded on the outer surface of described lampshade.
The LED lamp utilizing cover surface to dispel the heat the most according to claim 1, it is characterised in that: described finned heat exchanger
Welded by tin cream with between described lampshade.
The LED lamp utilizing cover surface to dispel the heat the most according to claim 1, it is characterised in that: described lampshade and described
Finned heat exchanger all uses alloy in lightweight to make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620481144.8U CN205746098U (en) | 2016-05-24 | 2016-05-24 | A kind of LED lamp utilizing cover surface to dispel the heat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620481144.8U CN205746098U (en) | 2016-05-24 | 2016-05-24 | A kind of LED lamp utilizing cover surface to dispel the heat |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205746098U true CN205746098U (en) | 2016-11-30 |
Family
ID=57363003
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620481144.8U Active CN205746098U (en) | 2016-05-24 | 2016-05-24 | A kind of LED lamp utilizing cover surface to dispel the heat |
Country Status (1)
| Country | Link |
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| CN (1) | CN205746098U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105841003A (en) * | 2016-05-24 | 2016-08-10 | 中国科学院理化技术研究所 | LED lamp for dissipating heat by using surface of lamp cover |
| CN107949246A (en) * | 2017-11-27 | 2018-04-20 | 南京师范大学 | Data center module rotates micro channel heat exchanger with noise-reduction type ultrasonic wave |
-
2016
- 2016-05-24 CN CN201620481144.8U patent/CN205746098U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105841003A (en) * | 2016-05-24 | 2016-08-10 | 中国科学院理化技术研究所 | LED lamp for dissipating heat by using surface of lamp cover |
| CN107949246A (en) * | 2017-11-27 | 2018-04-20 | 南京师范大学 | Data center module rotates micro channel heat exchanger with noise-reduction type ultrasonic wave |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |