CN108155164A - Microflute group is heat sink and preparation method thereof - Google Patents
Microflute group is heat sink and preparation method thereof Download PDFInfo
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- CN108155164A CN108155164A CN201810143983.2A CN201810143983A CN108155164A CN 108155164 A CN108155164 A CN 108155164A CN 201810143983 A CN201810143983 A CN 201810143983A CN 108155164 A CN108155164 A CN 108155164A
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- 238000002360 preparation method Methods 0.000 title claims abstract description 31
- 239000007788 liquid Substances 0.000 claims abstract description 75
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- 150000001875 compounds Chemical group 0.000 claims abstract description 40
- 239000002103 nanocoating Substances 0.000 claims abstract description 36
- 230000005684 electric field Effects 0.000 claims abstract description 14
- 229910052751 metal Inorganic materials 0.000 claims description 12
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- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 claims description 10
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 8
- 238000009413 insulation Methods 0.000 claims description 6
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- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 239000012153 distilled water Substances 0.000 claims description 4
- 235000019441 ethanol Nutrition 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical group O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 229910001512 metal fluoride Inorganic materials 0.000 claims description 3
- 150000004767 nitrides Chemical class 0.000 claims description 3
- 229920000620 organic polymer Polymers 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
It is heat sink and preparation method thereof present disclose provides a kind of microflute group, the microflute group is heat sink including：Microflute group is heat sink, nano coating and electrode, wherein, nano coating is created on the heat sink surface of microflute group, and heat sink to form micro-nano compound structure surface heat sink with microflute group；Electrode connect high voltage power supply, it is heat sink to micro-nano compound structure surface on liquid working substance apply electric field.The microflute group of the disclosure is heat sink to pass through nano coating hydrophilic on surface, enhance surface energy and roughness of the liquid working substance in micro-channel, improve surface wetting characteristic, draw is applied directional to liquid working substance by Coulomb force, dielectrophoresis force and the electroluminescent convergent force under electric field action, increase the mass flow of liquid working substance, reduce thermal resistance, effectively capillary wet length of the lifting liquid working substance in micro-channel, so that heat sink occur continual high-strength composite phase-change heat-exchange, heat sink exchange capability of heat is enhanced.
Description
Technical field
The disclosure belongs to enhanced heat exchange and electrical cooling field, and in particular to a kind of microflute group is heat sink and preparation method thereof.
Background technology
With microelectronics and the high speed development of MEMS, chip integration and performance are continuously improved so that electricity
Sub- equipment tends to high-power, miniaturization.Thus the calorific value of device is also significantly increased, if heat cannot be arranged in time
Go out, it will serious stability, reliability or even the collapse for causing system for reducing device and system.Therefore heat dissipation is high-power
Critical bottleneck problem in the design of high power density power electronic devices and manufacture.When heat flow density be more than 150W/cm2,
More than stock size surface occur pool boiling phase-change heat-exchange critical heat flux density, may be defined as superelevation heat flow density, at this time into
Capable heat transfer process is known as superpower heat exchange.
Micro slot group composite phase change heat transfer technology is set with the features such as its coefficient of heat transfer height, the operation is stable in high-power electric and electronic
It is used widely in standby, it utilizes three-phase line of contact at the extension meniscus that liquid working substance is formed by capillary force in microflute
The nucleate boiling of thickness liquid film region liquid working substance answers at the high intensity evaporation in neighbouring evaporation thin film region and intrinsic meniscus
Phase-change heat-exchange mechanism is closed, the exchange capability of heat of high intensity is realized, is a kind of novel high-performance minute yardstick phase-change heat-exchange technology.But
Be, under superelevation heat flow density under the conditions of, the liquid working substance in microflute group can be from top to bottom by with heat source heat flow density
Constantly increase and generate it is dry, if it is dry it is lasting occur, liquid working substance can not be replenished in time, and extend high-strength on meniscus
Degree evaporation will be unable to occur, and the heat exchange of the composite phase-change of high intensity can not also carry out, the exchange capability of heat that microflute group basis is heat sink by
Greatly deteriorate.Therefore, when liquid working substance along microflute flowing institute it is attainable extension meniscus on wet length become make
The about key point of microflute group exchange capability of heat.
The micro slot group composite phase change heat exchange skill proposed for technological deficiency existing for the cold heat transfer technology of existing air-cooled or liquid
Heat dissipation of many researchs that art and technique device in combination carry out to solution device for high-power power electronic or system
Problem has certain effect, but does not obtain obvious achievement.When power is increasing suffered by device, the hot-fluid faced is close
When degree is also higher and higher, situation that is dry too early and leading to heat transfer deterioration easily occurs for the liquid working substance in microflute.When heat source work(
When rate is increasing, heating power is also increasing, and the heat flow density being applied on microflute group's heating surface is also increasing, micro-
Heated liquid evaporation aggravation on extension meniscus in slot, liquid film is gradually thinning, and flow resistance increases, and wet length reduces, heat dissipation
Ability declines.
Invention content
(1) technical problems to be solved
It is heat sink and preparation method thereof present disclose provides a kind of microflute group, at least partly to solve technology set forth above
Problem.
(2) technical solution
According to one aspect of the disclosure, it is heat sink to provide a kind of microflute group, including：
Microflute group is heat sink；Nano coating is created on the heat sink surface of microflute group, compound with the heat sink composition micro-nano of microflute group
Body structure surface is heat sink；And electrode, connect high voltage power supply, it is heat sink to micro-nano compound structure surface on liquid working substance apply electricity
.
In some embodiments of the present disclosure, nano coating is nanoscale planar structures or nanoscale protrusion；Nanometer applies
The material of layer is metal, metal oxide, metal fluoride, semi-conducting material or organic polymer coating；The thickness of nano coating
It spends for 0~1000nm.
In some embodiments of the present disclosure, the arrangement form of electrode is line electrode, mesh electrode, plate electrode or needle-shaped
Electrode.
In some embodiments of the present disclosure, the voltage of high voltage power supply is 1~50kV.
In some embodiments of the present disclosure, the radius of line electrode is 0.001~1mm, and length is 1~500mm, with microflute
The axially vertical distance of group is 0.1~100mm；Mesh electrode length and width are 1~100mm, and thickness is 0.5~10mm, mesh electrode
Mesh equivalent diameter is 0.0001~1mm, is 0.1~100mm with the axially vertical distance of microflute group；The length and width of plate electrode are 1
~100mm, thickness are 0.5~10mm, and the positive and negative anodes vertical interval of plate electrode is 10~100mm；The song of needle electrode needle point
Rate radius is 0.01~1mm, is 0.1~100mm with the axially vertical distance of microflute group.
In some embodiments of the present disclosure, line electrode, the liquid working substance that the microflute group of mesh electrode is heat sink are insulation work
Matter；Plate electrode, the liquid working substance that the microflute group of needle electrode is heat sink are insulation working medium or conductive working medium.
In some embodiments of the present disclosure, insulation working medium is FC72, R113, R123, R141 or pentane；Conductive working medium
For distilled water or ethyl alcohol.
In some embodiments of the present disclosure, the surface texture that microflute group is heat sink is micron grooves channel array structure, nanometer slot
Channel array structure or micro-nano composite slot channel array structure；The micro-channel cross section that microflute group is heat sink is rectangle, triangle or trapezoidal,
Equivalent diameter is 10-3~1000 μm；The surfacing that microflute group is heat sink is metal, metal oxide, metal nitride, semiconductor
Material, glass or ceramics.
The heat sink preparation method of a kind of aforementioned microflute group another aspect of the present disclosure provides, including following step
Suddenly：
Step S1：It is heat sink to prepare microflute group；
Step S2：Prepare nano coating and be transferred to step S1 preparation microflute group it is heat sink on, formed micro-nano compound structure
Surface is heat sink；
Step S3：Open power supply, to step S2 prepare micro-nano compound structure surface it is heat sink on liquid working substance apply electricity
.
In some embodiments of the present disclosure, in step S2, nano coating is transferred to microflute group's base of step S1 preparations
Mode on plinth is heat sink is spraying, sputters or submerge.
In some embodiments of the present disclosure, it is 0 °~180 ° that micro-nano compound structure surface is heat sink with horizontal direction angle.
(3) advantageous effect
At least have below beneficial to effect it can be seen from the above technical proposal that disclosure microflute group is heat sink and preparation method thereof
One of fruit：
(1) hydrophilic nano coating has on micro-nano compound structure surface ultra-high surface can be into enhancing liquid work
Surface energy and roughness of the matter in micro-channel, improve surface wetting characteristic, so that heat sink occur continual height
Intensity composite phase-change exchanges heat, and enhances heat sink exchange capability of heat；
(2) liquid working substance is applied directional and is led by Coulomb force, dielectrophoresis force and the electroluminescent convergent force under electric field action
The effect of drawing increases the mass flow of liquid working substance, reduces thermal resistance, effectively lifts capillary wetting length of the liquid working substance in micro-channel
Degree；
(3) wet length of microflute group work is improved, quickly the liquid working substance in micro-channel is effectively and timely mended
It fills, prevents the constricted flow of liquid working substance and dry situation under the conditions of higher thermal current density, optimization liquid film distribution is further strong
Changed the high intensity evaporation and heat-exchange performance of extension meniscus liquid working substance in microflute group, avoid the heat exchange of dry initiation unstable and
The generation of deterioration.
Description of the drawings
Fig. 1 is the schematic diagram that microflute group is heat sink in the first embodiment of the present disclosure.
Fig. 2 is the microflute group structure figure that nano coating is nanoscale planar structures in the first embodiment of the present disclosure.
Fig. 3 is the microflute group structure figure that nano coating is nanoscale protrusion in the first embodiment of the present disclosure.
Fig. 4 is first embodiment of the present disclosure central electrode schematic diagram.
Fig. 5 is first embodiment of the present disclosure center line array electrode schematic diagram.
Fig. 6 is that EHD strengthens the heat sink wetting spy in micro-nano compound structure surface in closed cavity in the first embodiment of the present disclosure
The design sketch of property and heat exchange property.
Fig. 7 is the preparation method that microflute group is heat sink in the first embodiment of the present disclosure.
Fig. 8 is the schematic diagram that microflute group is heat sink in the second embodiment of the present disclosure.
Fig. 9 is the schematic diagram that microflute group is heat sink in the third embodiment of the present disclosure.
Figure 10 is the schematic diagram that microflute group is heat sink in the fourth embodiment of the present disclosure.
【Embodiment of the present disclosure main element symbol description in attached drawing】
10- micro-nano compound structures surface is heat sink；
11- microflute groups are heat sink；12- nanoscale planar structures；
13- nanoscale protrusions；
20- electrodes；
21- line electrodes；22- linear array electrodes；
23- plates/mesh electrode；24- needle electrodes；
25- plate electrodes；
30- heat sources face；
40- liquid working substances；
The closed cavity of 50- radiators；
60- high voltage power supplies.
Specific embodiment
It is heat sink and preparation method thereof present disclose provides a kind of microflute group, the microflute group is heat sink including：Microflute group is heat sink,
Nano coating and electrode, wherein, nano coating is created on the heat sink surface of microflute group, compound with the heat sink composition micro-nano of microflute group
Body structure surface is heat sink；Electrode connect high voltage power supply, it is heat sink to micro-nano compound structure surface on liquid working substance apply electric field.This public affairs
The microflute group that opens is heat sink by nano coating hydrophilic on surface, enhance surface of the liquid working substance in micro-channel can and it is thick
Rugosity improves surface wetting characteristic, by Coulomb force, dielectrophoresis force and the electroluminescent convergent force under electric field action to liquid work
Matter applies directional draw, increases the mass flow of liquid working substance, reduces thermal resistance, effectively lifts liquid working substance in micro-channel
Capillary wet length so that heat sink occur continual high-strength composite phase-change heat-exchange, enhance heat sink heat exchange
Ability.
Purpose, technical scheme and advantage to make the disclosure are more clearly understood, below in conjunction with specific embodiment, and reference
The disclosure is further described in attached drawing.
Disclosure some embodiments will be done with reference to appended attached drawing in rear and more comprehensively describe to property, some of but not complete
The embodiment in portion will be shown.In fact, the various embodiments of the disclosure can be realized in many different forms, and should not be construed
To be limited to this several illustrated embodiment；Relatively, these embodiments are provided so that the disclosure meets applicable legal requirement.
In first exemplary embodiment of the disclosure, it is heat sink and preparation method thereof to provide a kind of microflute group.
Fig. 1 is the schematic diagram that microflute group is heat sink in the first embodiment of the present disclosure.As shown in Figure 1, microflute group it is heat sink including：It is micro-
Slot group is heat sink 11, nano coating 12 and electrode 20, wherein, nano coating 12 is created on the surface of microflute group heat sink 11, and micro-
Slot group is heat sink 11 to form micro-nano compound structure surfaces heat sink 10；Electrode 20 is line electrode, connects high voltage power supply, compound to micro-nano
The liquid working substance that body structure surface is heat sink on 10 applies electric field.
The various pieces heat sink to the present embodiment microflute group are described in detail individually below.
Microflute group is heat sink 11 surface texture be micron grooves channel array structure, nanometer conduit array structure or micro-nano composite slot
Channel array structure, microflute group is heat sink 11 structure it is as shown in Figure 2.
Microflute group is heat sink 11 micro-channel cross section for rectangle, triangle or trapezoidal；Microflute group is heat sink 11 micro-channel it is horizontal
The equivalent diameter in section is 10-3~1000 μm；Microflute group is heat sink 11 surfacing for metal, metal oxide, nitride metal
Object, semi-conducting material, glass or ceramics.
A length of 80~the 150mm of apparent size that microflute group is heat sink, width are 20~50mm；The size of conduit for groove depth 0.05~
1mm, 0.05~1mm of groove width, 0.05~1mm of separation；
Nano coating 12 be nanoscale planar structures or nanoscale protrusion, wherein；Nano coating is nanometer-level plane knot
The microflute group structure figure of structure is as shown in Fig. 2, nano coating is as shown in Figure 3 for the microflute group structure figure of nanoscale protrusion.Nanometer
Coating is for strengthening micro-structure surface hydrophily, roughness, increases micro-structure surface surface energy.
The material of nano coating 12 is metal, metal oxide, metal fluoride, semi-conducting material or organic polymer apply
Material；Hydrophilic coating is aluminium oxide, titanium oxide or zinc oxide；The thickness of nano coating 12 is 10~300nm.
Electrode 20 is line electrode in the present embodiment, and line electrode includes single line electrode shown in Fig. 4 and line shown in fig. 5
Array electrode.
And liquid working substance line electrode arrangement is characterized in line electrode as anode, and one end is above liquid working substance, i.e.,
It does not contact, the other end is immersed in liquid working substance.Cathode is the array frid or other charged metal structures of micro-nano compound structure
Shell.
Fig. 4 is please referred to, line electrode radius is 0.3~1mm, and length is 50~150mm, and liquid working substance did not had line electrode height
5~20mm is adjusted with heat sink axially vertical distance in 1~20mm.
In the present embodiment, high voltage control is adjusted in the range of 2~20kV.
Liquid working substance is insulating liquid working medium, including FC72, R113, R123, R141, pentane etc..
It is vacuum condition or condition of normal pressure in closed cavity.
It should be noted that electrode 20 can also be mesh electrode, plate electrode and needle electrode.
According to the another aspect of the disclosure, a kind of heat sink preparation method of microflute group is additionally provided.Fig. 7 is the disclosure the
The preparation method schematic diagram that one embodiment microflute group is heat sink.As shown in fig. 7, the heat sink preparation method of disclosure microflute group include with
Lower step：
Step S1：It is heat sink to prepare microflute group；
Step S2：Prepare nano coating and be transferred to step S1 preparation microflute group it is heat sink on, formed micro-nano compound structure
Surface is heat sink；
Step S3：Open high voltage power supply, the micro-nano compound structure prepared using EHD (electric hydrodynamics effect) to step S2
Liquid working substance on surface is heat sink applies electric field.
It should be noted that step S2 in, by nano coating be transferred to step S1 preparation microflute group basis it is heat sink on, lead to
Cross spraying, sputtering or submergence mode.
It should be noted that micro-nano compound structure surface is heat sink and horizontal direction angle is 0~180 °.
So far, heat sink and preparation method thereof introduce of first embodiment of the present disclosure microflute group finishes.
Certainly, according to actual needs, the preparation method of disclosure display device also includes other techniques and step, due to
Innovation with the disclosure is unrelated, and details are not described herein again.
Fig. 6 is the design sketch that EHD strengthens the heat sink wetting characteristics in micro-nano compound structure surface and heat exchange property in closed cavity.
As shown in fig. 6, microflute group is heat sink in the embodiment of the present disclosure realizes superpower heat exchange by following two aspects：
(1) nano coating is prepared on microflute group is heat sink, forms micro-nano compound structure surface heat sink 10.Nano coating has
Hydrophily, stability, nano coating effect are the wetabilitys by strengthening microflute group's heat sink surface, improve the capillary profit of microflute group
Wet ability makes micro-nano compound structure heat sink in angle of inclination even vertical placement, and capillary moistening height is higher, realizes effect
As shown in fig. 6,
In application, heat source 30 is connected by high thermal conductivity materials such as heat-conducting silicone grease, heat conductive silica gel, graphenes, heat conduction
To microflute, group is heat sink, and the vertical micro-nano compound structure heat sink 10 for placing application is made first in the capillary of its own micro-nano compound structure
Under, liquid working substance 40 climbs along its array micro-channel to certain moistening height, when the superelevation hot-fluid that heat source 40 distributes is close
When degree is inputted perpendicular to heat sink direction, heat sink heat exchange surface major part region is wetted, and extension bent moon occurs in microflute at this time
The high-strength composite phase-change heat-exchange of the nucleate boiling of the evaporation in thin liquid film region and thick liquid film, strengthens changing for liquid working substance 40 on face
Hot property.The spreader surface that heat is delivered to outside closed cavity 50 simultaneously radiates.In closed cavity 50, occur compound
The steam of phase-change heat-exchange encounters peripheral wall surface and condenses, and condensing droplet, which reenters, realizes cycle in liquid working substance.
(2) electric field applied in micro-nano compound structure heat sink surface to liquid working substance generates EHD effects, the effect realized
Fruit is as shown in Figure 6.
In application, collective effect of the EHD effects by the Coulomb force of electric field, dielectrophoretic force and electroluminescent convergent force, once
Occur under superelevation heat flow density, in micro-channel part it is dry when, the various different forms arranged on the surface that is faced in conduit
Electrode 20 liquid working substance 40 on micro-nano compound structure surface 10 is acted, liquid working substance is on the one hand generated
Existing moistening height is lifted in time under electric field force effect, hydrophilic nano coating on another aspect micro-nano compound structure surface
The ultra-high surface having also can further strengthen the wetting characteristics of microflute, so that heat sink occur continual high intensity
Composite phase-change exchanges heat, and not only enhances heat sink exchange capability of heat, but also improve heat sink be resistant to critical heat flux density, finally makes
The heat sink heating problem that can solve high-power, superelevation heat flow density power electric component, further, the heat quilt of releasing
It is transmitted to outside closed cavity and carries out cooling.Heat sink timely fluid infusion ability ensure that the reliable of heat sink superpower heat exchange property
Property.
In second exemplary embodiment of the disclosure, it is heat sink to provide a kind of microflute group.Fig. 8 is real for the disclosure second
Apply the heat sink structure diagram of microflute group.As shown in figure 8, with heat sink and preparation method thereof the phase of the microflute group of first embodiment
Than, the present embodiment microflute group is heat sink and preparation method thereof difference lies in：
Electrode is mesh electrode 23.The form of this electrode arrangement be electrode as anode, one end is in liquid working substance
Above, i.e., it is not contacted with liquid working substance, the other end is immersed in liquid working substance.Cathode for micro-nano compound structure array frid or
The shell of other charged metal structures.
A length of 80~the 150mm of apparent size of mesh electrode, width for 20~50mm, (if mesh electrode, then work as by mesh
Measure a diameter of 0.5~1mm), liquid working substance did not had mesh electrode 5~20mm of height, with heat sink axially vertical distance in 1~20mm
In the range of adjust.
Under the driving that microflute group acts in itself micro-nano compound capillary structure, a part of liquid working substance enters in micro-channel simultaneously
Climb certain altitude.Fig. 8 mesh electrodes are disposed on the surface faced in micro-channel, liquid working substance is in the electricity of positive very high voltage
It is climbed in time to higher moistening height, superhigh intensity evaporation occurs and boiled compound by drives edge micro-channel under field force effect
Phase-change heat-exchange acts on.
In order to achieve the purpose that brief description, in above-described embodiment 1, any technical characteristic narration for making same application is all
And in this, without repeating identical narration.
So far, the heat sink introduction of a kind of microflute group of the second embodiment of the present disclosure finishes.
In the third exemplary embodiment of the disclosure, it is heat sink to provide a kind of microflute group.
Fig. 9 is the heat sink structure diagram of third embodiment of the present disclosure microflute group.As shown in figure 9, with first embodiment
Microflute group is heat sink and preparation method thereof compares, the present embodiment microflute group is heat sink and preparation method thereof difference lies in：
Electrode is needle electrode 24, this kind of electrode arrangement form vacantly arranges that cathode is answered for micro-nano as anode for electrode
Close the array frid of structure or the shell of other charged metal structures.
The radius of curvature of needle electrode needle point is 0.05~0.5mm, can be in 1~20mm ranges with heat sink axially vertical distance
Interior adjusting.
It can be insulating liquid working medium that liquid working substance, which is, including FC72, R113, R123, R141, pentane etc.；It can also
For conductive working medium, including distilled water, ethyl alcohol etc..
It is condition of normal pressure in closed cavity.
Under the driving that microflute group acts in itself micro-nano compound capillary structure, a part of liquid working substance enters in micro-channel simultaneously
Climb certain altitude.Needle electrode shown in Fig. 9 is disposed on the surface faced in micro-channel, needle electrode is empty by ionizing
Gas generates suction force, and lifting in time has the liquid working substance of certain altitude in array channel structure, makes moistening height further
It is promoted, the composite phase-change heat exchange effect of superhigh intensity evaporation and boiling occurs.
In order to achieve the purpose that brief description, in above-described embodiment 1, any technical characteristic narration for making same application is all
And in this, without repeating identical narration.
So far, the heat sink introduction of a kind of microflute group of the third embodiment of the present disclosure finishes.
In the 4th exemplary embodiment of the disclosure, it is heat sink to provide a kind of microflute group.
Figure 10 is the heat sink structure diagram of third embodiment of the present disclosure microflute group.As shown in Figure 10, with first embodiment
Microflute group it is heat sink and preparation method thereof compare, the present embodiment microflute group is heat sink and preparation method thereof difference lies in：
Electrode is plate electrode 25, this kind of electrode arrangement is characterized in that electrode did not had liquid as anode in closed cavity
Working medium, cathode are fixed on vertical frid upper end.
The size length and width of plate electrode positive and negative anodes are 10~30mm, and anode is immersed in liquid working substance, positive electrode and negative electrode
Axial distance is 40~100mm.
Liquid working substance can be insulating liquid working medium, including FC72, R113, R123, R141, pentane；Or it leads
Electrician's matter, including distilled water, ethyl alcohol.
It is vacuum condition or condition of normal pressure in closed cavity.
Under the driving that microflute group acts in itself micro-nano compound capillary structure, a part of liquid working substance enters in micro-channel simultaneously
Climb certain altitude.Plate electrode shown in Fig. 10 is disposed on the surface faced in micro-channel, since anode tablet is placed in
In liquid working substance, liquid working substance is climbed in time by drives edge micro-channel to certain under the electric field force effect of positive very high voltage
The composite phase-change heat exchange effect of superhigh intensity evaporation and boiling occurs for moistening height.
In order to achieve the purpose that brief description, in above-described embodiment 1, any technical characteristic narration for making same application is all
And in this, without repeating identical narration.
So far, the heat sink introduction of a kind of microflute group of the fourth embodiment of the present disclosure finishes.
So far, attached drawing is had been combined the embodiment of the present disclosure is described in detail.According to above description, art technology
Personnel heat sink and preparation method thereof to the microflute group of the present invention should have clear understanding.
It should be noted that in attached drawing or specification text, the realization method that is not painted or describes is affiliated technology
Form known to a person of ordinary skill in the art in field, is not described in detail.In addition, the above-mentioned definition to each element and method is simultaneously
Various concrete structures, shape or the mode mentioned in embodiment are not limited only to, those of ordinary skill in the art can carry out letter to it
It singly changes or replaces.
In conclusion heat sink and preparation method thereof present disclose provides a kind of microflute group, the microflute group is heat sink including：It is micro-
Slot group is heat sink, nano coating and electrode, wherein, nano coating is created on the heat sink surface of microflute group, with the heat sink structure of microflute group
It is heat sink into micro-nano compound structure surface；Electrode connect high voltage power supply, it is heat sink to micro-nano compound structure surface on liquid working substance apply
Added electric field.The microflute group of the disclosure is heat sink by nano coating hydrophilic on surface, enhances liquid working substance in micro-channel
Surface can and roughness, improve surface wetting characteristic, pass through Coulomb force, dielectrophoresis force and the electroluminescent receipts under electric field action
Contracting power applies directional draw to liquid working substance, increases the mass flow of liquid working substance, reduces thermal resistance, effectively lifts liquid work
Capillary wet length of the matter in micro-channel so that heat sink occur continual high-strength composite phase-change heat-exchange, is strengthened
Heat sink exchange capability of heat.
Unless there are known entitled phase otherwise meaning, the numerical parameter in this specification and appended claims are approximations, energy
Enough required characteristic changings according to as obtained by content of this disclosure.Specifically, all be used in specification and claim
The number of the middle content for representing composition, reaction condition etc., it is thus understood that repaiied by the term of " about " in all situations
Decorations.Under normal circumstances, the meaning of expression refers to include by specific quantity ± 10% variation in some embodiments, at some
± 5% variation in embodiment, ± 1% variation in some embodiments, in some embodiments ± 0.5% variation.
Furthermore word "comprising" does not exclude the presence of element or step not listed in the claims.Before element
Word "a" or "an" does not exclude the presence of multiple such elements.
In addition, unless specifically described or the step of must sequentially occur, there is no restriction in more than institute for the sequence of above-mentioned steps
Row, and can change or rearrange according to required design.And above-described embodiment can be based on the considerations of design and reliability, that
This mix and match is used using or with other embodiment mix and match, i.e., the technical characteristic in different embodiments can be freely combined
Form more embodiments.
Similarly, it should be understood that in order to simplify the disclosure and help to understand one or more of each open aspect,
Above in the description of the exemplary embodiment of the disclosure, each feature of the disclosure is grouped together into single implementation sometimes
In example, figure or descriptions thereof.However, the method for the disclosure should be construed to reflect following intention：I.e. required guarantor
The disclosure of shield requires features more more than the feature being expressly recited in each claim.More precisely, as following
Claims reflect as, open aspect is all features less than single embodiment disclosed above.Therefore,
Thus the claims for following specific embodiment are expressly incorporated in the specific embodiment, wherein each claim is in itself
All as the separate embodiments of the disclosure.
Particular embodiments described above has carried out the purpose, technical solution and advantageous effect of the disclosure further in detail
It describes in detail bright, it should be understood that the foregoing is merely the specific embodiment of the disclosure, is not limited to the disclosure, it is all
Within the spirit and principle of the disclosure, any modification, equivalent substitution, improvement and etc. done should be included in the guarantor of the disclosure
Within the scope of shield.
Claims (10)
1. a kind of microflute group is heat sink, including：
Microflute group is heat sink (11)；
Nano coating (12) is created on the surface of the microflute group heat sink (11), and (11) heat sink with the microflute group form micro-
Nano compound structure surface is heat sink (10)；And
Electrode (20) connects high voltage power supply, applies electricity to the liquid working substance on the micro-nano compound structure surface heat sink (10)
.
2. microflute group according to claim 1 is heat sink, wherein,
The nano coating (12) is nanoscale planar structures or nanoscale protrusion；
The material of the nano coating (12) is metal, metal oxide, metal fluoride, semi-conducting material or organic polymer
Coating；
The thickness of the nano coating (12) is 0~1000nm.
3. microflute group according to claim 1 is heat sink, wherein,
The electrode (20) is line electrode, mesh electrode, plate electrode or needle electrode.
4. microflute group according to claim 1 is heat sink, wherein,
The voltage of the high voltage power supply is 1~50kV.
5. microflute group according to claim 1 is heat sink, wherein,
The radius of the line electrode is 0.001~1mm, and length is 1~500mm, and the axial direction of (11) heat sink with the microflute group is hung down
Straight distance is 0.1~100mm；
The mesh electrode length and width are 1~100mm, and thickness is 0.5~10mm, and the mesh equivalent diameter of the mesh electrode is
0.0001~1mm, the axially vertical distance of (11) heat sink with the microflute group is 0.1~100mm；
The length and width of the plate electrode are 1~100mm, and thickness is 0.5~10mm, and the positive and negative anodes vertical interval of plate electrode is 10
~100mm；
The radius of curvature of the needle electrode needle point is 0.01~1mm, is 0.1~100mm with the axially vertical distance of microflute group.
6. microflute group according to claim 1 is heat sink, wherein,
The line electrode, the liquid working substance that the microflute group of mesh electrode is heat sink are insulation working medium；
The plate electrode, the liquid working substance that the microflute group of needle electrode is heat sink are insulation working medium or conductive working medium.
7. microflute group according to claim 1 is heat sink, wherein,
The insulation working medium is FC72, R113, R123, R141 or pentane；
The conduction working medium is distilled water or ethyl alcohol.
8. microflute group according to claim 1 is heat sink, wherein,
The surface texture of the microflute group heat sink (11) is micron grooves channel array structure, nanometer conduit array structure or micro-nano are compound
Conduit array structure；
The micro-channel cross section of the microflute group heat sink (11) is rectangle, triangle or trapezoidal, equivalent diameter 10-3~1000 μ
m；
The surfacing of the microflute group heat sink (11) is metal, metal oxide, metal nitride, semi-conducting material, glass
Or ceramics.
9. the preparation method that a kind of microflute group described in claim 1~8 is heat sink, includes the following steps：
Step S1：It is heat sink to prepare microflute group；
Step S2：Prepare nano coating and be transferred to step S1 preparations microflute group it is heat sink on, form micro-nano compound structure surface
It is heat sink；
Step S3：Open power supply, to step S2 prepare micro-nano compound structure surface it is heat sink on liquid working substance apply electric field.
10. the preparation method that microflute group according to claim 9 is heat sink, wherein,
In step S2, by nano coating be transferred to step S1 preparation microflute group basis it is heat sink on mode for spraying, sputtering or
Submergence；
It is 0 °~180 ° that the micro-nano compound structure surface is heat sink with horizontal direction angle.
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