CN109631651B - Local self-adaptive controllable wettability coupling microstructure enhanced boiling heat exchange method - Google Patents

Local self-adaptive controllable wettability coupling microstructure enhanced boiling heat exchange method Download PDF

Info

Publication number
CN109631651B
CN109631651B CN201811486437.5A CN201811486437A CN109631651B CN 109631651 B CN109631651 B CN 109631651B CN 201811486437 A CN201811486437 A CN 201811486437A CN 109631651 B CN109631651 B CN 109631651B
Authority
CN
China
Prior art keywords
heat exchange
wettability
electrode
boiling
electrode film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201811486437.5A
Other languages
Chinese (zh)
Other versions
CN109631651A (en
Inventor
陈宏霞
肖红洋
孙源
刘霖
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
North China Electric Power University
Original Assignee
North China Electric Power University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by North China Electric Power University filed Critical North China Electric Power University
Priority to CN201811486437.5A priority Critical patent/CN109631651B/en
Publication of CN109631651A publication Critical patent/CN109631651A/en
Application granted granted Critical
Publication of CN109631651B publication Critical patent/CN109631651B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)

Abstract

The invention discloses a local self-adaptive controllable wettability coupling microstructure enhanced boiling heat exchange method, belonging to the technical field of enhanced heat transfer. Specifically, an electrode film is arranged on a heat exchange substrate microstructure, the electrode film and a metal electrode are connected to a power supply to form an electric field, and charged metal nanoparticles in a heat exchange medium are intermittently adsorbed on a heat exchange surface under the action of the electric field, so that the controllable conversion of the wettability of the heat exchange surface is realized; the invention actively and controllably switches the surface wettability into the boiling process, actively controls the nucleation and the separation of bubbles, enables controllable enhanced boiling and self-adaptive phase change heat exchange to be possible, and has profound academic value and application value.

Description

Local self-adaptive controllable wettability coupling microstructure enhanced boiling heat exchange method
Technical Field
The invention belongs to the technical field of enhanced heat transfer, and particularly relates to an enhanced boiling heat exchange method of a local self-adaptive controllable wettability coupling microstructure.
Background
Boiling phase change heat transfer is used as an efficient heat exchange means and is widely applied to the fields of efficient heat exchangers, rockets and the like which need enhanced heat transfer and rapid cooling. Based on the basic physical knowledge of the boiling process, the boiling stage can be divided into several stages, namely natural convection heat transfer, nucleate boiling, transition boiling and film boiling. When the superheat degree of the wall surface is small, the heating surface and the heat exchange fluid exchange heat mainly in a natural convection heat transfer mode, at the moment, the heat flow density is low, and no boiling bubbles are generated, so that the natural convection stage is called; when the superheat degree of the wall surface is increased to a certain degree, nucleation is started on the wall surface to generate bubbles, the bubbles grow and are separated from the wall surface, the bubbles exchange heat with surrounding liquid in the rising process and gradually enter a stable nucleate boiling stage, the heat transfer coefficient is large, the wall temperature is low in the nucleate boiling stage, and the heat transfer coefficient obviously rises along with the increase of the superheat degree of the wall surface; when the superheat degree reaches a critical value, the nucleation center of the wall surface is rapidly increased, a large number of bubbles are generated, and a stable vapor film with low thermal conductivity begins to be formed on the wall surface, so that the heat transfer coefficient is reduced, and the film enters a film boiling stage; in the film boiling stage, due to the existence of a vapor film, the heat transfer efficiency is low, the heat exchange capacity is poor, the heat transfer surface generates a dry burning phenomenon, and the heat exchanger is in danger of burning. Thus, nucleate boiling is the dominant form of boiling phase transition heat transfer in practical applications.
The method is based on the complex bubble dynamics research of the boiling phase change process. The heat exchanger has the danger of burning out due to dry burning of the heat transfer surface in transition boiling and film boiling, and the heat transfer efficiency is obviously reduced; therefore, the boiling dynamics law in the active heat control mainly aims at the physical processes of bubble nucleation, growth, merging, separation, updating and the like in the nucleate boiling process. How to accurately regulate the boiling form in the nucleate boiling stage and effectively improve the phase change heat transfer performance becomes the key point of enhancing the boiling heat transfer.
The nucleation of the boiling bubbles, the separation of the bubbles and the renewal and supplement of liquid are comprehensively considered, the local hydrophilic and hydrophobic treatment is carried out on the boiling surface, and the separation of the bubbles can be directly accelerated or inhibited by changing the hydrophilic and hydrophobic properties of the wall surface. The hydrophobic surface is easy to promote the nucleation of the bubbles, but inhibits the detachment of the bubbles and reduces the detachment frequency of the bubbles, while the boiling process of the hydrophilic surface has a higher bubble detachment frequency, but theoretically is difficult to cause the nucleation of the bubbles. More and more researchers couple microstructures such as porous silk screen, sintered porous, micro-pit, micro-column array, etc. to perform local hydrophilic and hydrophobic treatment on the surface of the microstructure. Generally, the micro structure below the micron directly influences the hydrophilicity and hydrophobicity of the wall surface, and the boiling performance is not greatly influenced by modifying the local hydrophilicity and hydrophobicity. For the boiling surface of a microstructure with the diameter of more than dozens of microns, the boiling surface is limited by a processing means and a wetting treatment method, the bottom of the microstructure is a hydrophilic matrix, and the top of the microstructure is subjected to hydrophobic treatment; the method has the advantages that vaporization cores are increased, and bubbles easily rise to the top of the microstructure and grow; but the disadvantage is also apparent that the bubbles do not easily escape.
Disclosure of Invention
The invention aims to provide a local self-adaptive controllable wettability coupling microstructure enhanced boiling heat exchange method, which has the following specific technical scheme:
a boiling heat exchange strengthening method for a local self-adaptive controllable wettability coupling microstructure specifically comprises the following steps: an electrode film is arranged on the top of the heat exchange substrate microstructure, the electrode film and the metal electrode are connected to a power supply to form an electric field, and charged metal nanoparticles in the heat exchange working medium are intermittently adsorbed on the heat exchange surface under the action of the electric field, so that the controllable conversion of the wettability of the heat exchange surface is realized;
the metal electrode is fixed outside the heat exchange substrate; the metal electrode is preferably a copper electrode or an aluminum electrode, and is preferably plate-like, mesh-like, or rod-like in shape.
The heat exchange substrate material is metal such as red copper or nonmetal such as monocrystalline silicon, sapphire, graphene and the like, and it can be understood that heat exchange materials commonly used in the heat exchange field are all suitable for the heat exchange substrate material, and the substrate material with good heat conductivity is preferably selected.
The heat exchange substrate is shaped like a flat plate, a round tube or a special shape, wherein the special shape is the shape of a common heat exchanger in the field of heat exchange.
The heat exchange substrate microstructure is a microcolumn, a micro pit or a micro channel with the size of nano-scale or micron-scale; it is understood that all microstructures for improving heat exchange efficiency in the prior art are suitable for the present invention, and are preferably square micro-pillars, rectangular micro-pillars, hemispherical micro-pits, or cylindrical micro-pits in nano-or micro-scale.
The arrangement mode of the heat exchange substrate microstructures is regular arrangement such as array type, staggered type arrangement or irregular arrangement.
The electrode film is led out through an electrode lead so as to communicate the electrode film and be connected to a power supply; the surfaces of the heat exchange substrate, the electrode film and the electrode lead are all insulated.
The surface insulation can be realized by arranging an insulating layer on the surface, and the thickness of the insulating layer is hundreds of nanometers. When the heat exchange substrate is made of non-conductive materials such as monocrystalline silicon and the like, an insulating layer is not required to be arranged.
The insulating layer is made of inert metal, metal oxide, ceramic or silica gel; the insulating material having excellent thermal conductivity is preferable, and the thermal conductivity of the insulating material can be improved by doping the material having excellent thermal conductivity.
The electrode film and the electrode lead are made of conductive materials; preferably a metal, more preferably gold, silver, copper or aluminum.
The thickness of the electrode film is hundreds of nanometers.
The charged metal nanoparticles have a uniform hydrophilic surface, a uniform hydrophobic surface, or an amphiphilic wetting surface; hydrophilic, hydrophobic or amphiphilic wetting surfaces are obtained by modification; the charged metal nanoparticles are nano-sized and micro-sized, are regular or irregular in shape, and are preferably spherical or cylindrical.
The wettability of the charged metal nanoparticles is different from that of the heat exchange substrate, and the wettability of the charged metal nanoparticles is used for changing the wettability of the heat exchange surface. For example, the surface of the heat exchange substrate is hydrophilic (or hydrophobic), and the surface of the charged metal nanoparticles is hydrophobic (or hydrophilic), and can also have amphiphilic wettability.
The power supply is a direct current power supply or an alternating current power supply; the direct current power supply realizes electric field controllability through power on and power off; the alternating current power supply realizes the controllability of an electric field by controlling the alternating current frequency, and the alternating current frequency is adjusted according to the dynamic period of the boiling bubbles.
The invention has the beneficial effects that:
(1) the method realizes controllable conversion of wettability of local positions of the heat exchange surface microstructure through electric field regulation, and can promote bubble nucleation by utilizing hydrophobicity in bubble nucleation and rising stages, thereby accelerating regeneration and activation of nucleation centers; in the bubble separation stage, the hydrophilicity can be used for promoting the bubble separation, so that the enhanced heat transfer of the whole bubble kinetic process (bubble nucleation, growth and separation) is realized;
(2) according to the invention, an electric field wettability control technology is introduced into a boiling heat exchange process, and by virtue of a local self-adaptive controllable wettability coupling microstructure, nucleation density of a boiling surface is increased, and meanwhile, nucleation, combination and separation of bubbles are actively controlled, so that overall enhancement of boiling is realized, heat exchange efficiency is improved, development of an active control boiling technology is promoted, and a new technology and a new method are provided for enhancing boiling phase change heat transfer.
Drawings
FIG. 1 is a schematic view of a heat exchange surface of a microstructure coupled local electrode;
FIG. 2 is a schematic view of enhanced boiling heat transfer of a local adaptive controllable wettability coupling microstructure;
FIG. 3 is a schematic diagram of a conversion process of gap adsorption of charged metal particles under the action of an electric field and controllable surface wettability;
description of reference numerals: 1-a heat exchange substrate; 2-an electrode film; 3-an insulating layer; 4-charged metal nanoparticles; 5-heat exchange working medium; 6-a metal electrode; 7-a wire; 8-a power supply; 9-a heat exchange vessel; 10-bubbles.
Detailed Description
The invention provides a local self-adaptive controllable wettability coupling microstructure enhanced boiling heat exchange method, which is further described by combining embodiments and drawings.
The microstructure coupled local electrode heat exchange surface shown in the attached figure 1 is characterized in that the surface of a heat exchange substrate 1 is insulated and is provided with a microstructure surface, an electrode film 2 is arranged at the top of the microstructure, and a high-heat-conductivity insulating layer 3 is arranged on the surface of the electrode film 2.
Wherein, the shape, equivalent size, spacing and other parameters of the microstructure of the heat exchange substrate 1 are designed based on the factors of boiling bubble nucleation density, bubble climbing, convergence and the like; the surface of the heat exchange substrate 1 is insulated, and the insulating material is a material with excellent heat conductivity; the electrode films 2 are not communicated because of being positioned on the surfaces of the microstructures, and the electrode films 2 on the microstructures are communicated and led out through electrode leads so as to be connected to a power supply, and all the electrode films can form an electric field.
As shown in figure 2, the local self-adaptive controllable wettability coupling microstructure enhances boiling heat exchange, a heat exchange substrate 1 microstructure is coupled with a surface electrode film 2 thereof to form a local electrode, and the local electrode is connected with a metal electrode 6 through an electrode lead and a lead 7 to a power supply 8 to form a controllable electric field; the heat exchange working medium 5 in the heat exchange container 9 is a nano fluid, the heat exchange working medium 5 contains charged metal nanoparticles 4 with surface wettability, the charged metal nanoparticles 4 are controlled by an electric field to be adsorbed and desorbed on a boiling surface local electrode, and controllable conversion of the boiling surface wettability is realized based on the difference of the charged metal nanoparticles 4 and the boiling surface wettability.
As shown in fig. 3: in the bubble nucleation and rising stage, the power supply 8 is regulated and controlled, and the charged metal nanoparticles 4 are adsorbed on the surface of the electrode film 2 on the microstructure of the heat exchange substrate 1 to form hydrophobic nucleation points so as to increase the nucleation density of bubbles and promote the nucleation, growth and combination of bubbles 10; as shown in fig. 3-a. In the separation stage after the combination of the bubbles 10, the power supply 8 is regulated and controlled to desorb the charged metal nanoparticles 4 from the surface of the electrode film 2 on the microstructure of the heat exchange substrate 1, and the hydrophilicity of the surface of the heat exchange substrate 1 is utilized to promote the bubbles 10 to be quickly separated; as shown in fig. 3-b.
Or, the surface of the charged metal nano-particles 4 is subjected to hydrophilic treatment, and in the bubble nucleation and rising stage, the power supply 8 is regulated and controlled, the bubble nucleation density is increased by utilizing the surface hydrophobicity of the heat exchange substrate, and the nucleation, growth and combination of the bubbles 10 are promoted; in the separation stage after the combination of the bubbles 10, the power supply 8 is regulated and controlled to enable the charged metal nanoparticles 4 to be adsorbed on the surface of the electrode film 2 on the microstructure, and the hydrophilicity of the surface of the charged metal nanoparticles 4 is utilized to promote the bubbles 10 to be rapidly separated.
The invention controls the charged metal nano particles 4 with surface wettability to be intermittently adsorbed on the heat exchange surface through the electric field, realizes the active controllable conversion of the local wettability of the heat exchange surface, further promotes the nucleation, combination and separation of bubbles, and realizes the whole-process reinforcement of the boiling phase change process; meanwhile, the heat exchange substrate microstructure is coupled, so that the nucleation density of the boiling surface is increased, and the overall enhancement of boiling is realized; so as to fundamentally strengthen boiling heat exchange.
Example 1
Monocrystalline silicon is selected as a heat exchange substrate material, the size of the plate is 30mm × 10mm × 2mm, the surface of the plate is designed with a micro-column array, the size of the micro-column is 150 mu m × 150 mu m × 150 mu m, the distance is 200 mu m, the surface of the heat exchange substrate is a metal oxide insulating layer with excellent heat conduction performance, and the thickness is 100 nm.
The top end of the microcolumn is provided with a conductive gold film with the thickness of 100nm as an electrode film, the conductive gold film with the thickness of 100nm is used as an electrode lead to connect and lead out the electrode films distributed at the top end of the microcolumn, and the surfaces of the electrode films and the electrode lead are provided with metal oxide insulating layers with the thickness of 100nm and excellent heat conduction performance.
The method comprises the steps of selecting metal copper nanoparticles with the particle size of 30nm, carrying out charge treatment and hydrophobic treatment on the metal copper nanoparticles through an anion and cation surfactant, configuring nanofluid as a heat exchange working medium, connecting a copper plate with the surface subjected to insulation treatment and the thickness of 30mm × 10mm × 2mm as a metal electrode to a 250V direct current power supply, forming an electric field with an electrode film, and controlling intermittent adsorption of the metal copper nanoparticles on the top end of a microcolumn by controlling the on-off of the power supply.
And in the bubble nucleation stage, the power supply is electrified, under the action of an electric field, the charged metal copper nanoparticles are adsorbed at the top end of the microcolumn, and the density of the hydrophobic nucleation points on the boiling surface is increased by 1-2 times. After the bubbles grow and are combined, the power supply is turned off, so that the charged metal copper nanoparticles are promoted to be desorbed from the heat exchange surface and to be dispersed in the nanofluid again; the re-exposed monocrystalline silicon substrate has hydrophilicity, and bubbles are quickly separated. And electrifying the power supply again, adsorbing the charged metal copper nanoparticles on the top of the microcolumn again, and nucleating the boiling surface again. Namely, the active controllable conversion of the wettability of the boiling surface is realized by controlling the on-off of the power supply, thereby achieving the purpose of enhancing the boiling heat exchange.
Compared with a monocrystalline silicon heat exchange surface which is the same in shape and size and provided with a microcolumn structure on the surface and not provided with an electrode film, the heat exchange performance of the heat exchange surface in the embodiment 1 is improved by 1-2 times.
The above embodiments and drawings are only for illustrating the technical solutions of the present invention and not for limiting the same; modifications that are simple or obvious to those skilled in the art are intended to be covered by this patent.

Claims (7)

1. A local self-adaptive controllable wettability coupling microstructure enhanced boiling heat exchange method is characterized in that an electrode film is arranged at the top of a heat exchange substrate microstructure, the electrode film and a metal electrode are connected to a power supply to form an electric field, charged metal nanoparticles in a heat exchange working medium are intermittently adsorbed on a heat exchange surface under the action of the electric field, and controllable conversion of wettability of the heat exchange surface is realized; the metal electrode is fixed outside the heat exchange substrate;
the charged metal nanoparticles have a uniform hydrophilic surface, a uniform hydrophobic surface or an amphiphilic wettability surface, and the wettability of the charged metal nanoparticles is different from that of the heat exchange substrate;
in the bubble nucleation and rising stage, the hydrophobic property is utilized to promote the nucleation of the bubbles and accelerate the regeneration and activation of the nucleation center; in the bubble separation stage, the hydrophilicity is utilized to promote the bubble separation, and the enhanced heat transfer of the whole bubble dynamic process is realized.
2. The method of claim 1, wherein the heat exchange substrate is made of metal or monocrystalline silicon, sapphire or graphene, and the heat exchange substrate is shaped as a flat plate, a round tube or a profile.
3. The method of claim 1, wherein the heat exchange substrate microstructures are micro-pillars, micro-pits, or micro-channels having dimensions of the order of nanometers or micrometers.
4. The method according to claim 1, wherein the electrode film is drawn out through an electrode lead; the surfaces of the heat exchange substrate, the electrode film and the electrode lead are all insulated.
5. The method of claim 4, wherein the insulation is achieved by providing an insulating layer on the surface, the insulating layer being made of an inert metal, metal oxide, ceramic or silica gel.
6. The method according to claim 4, wherein the electrode film and electrode lead material is a conductive material.
7. The method of claim 1, wherein the power source is a direct current power source or an alternating current power source.
CN201811486437.5A 2018-12-06 2018-12-06 Local self-adaptive controllable wettability coupling microstructure enhanced boiling heat exchange method Active CN109631651B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201811486437.5A CN109631651B (en) 2018-12-06 2018-12-06 Local self-adaptive controllable wettability coupling microstructure enhanced boiling heat exchange method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201811486437.5A CN109631651B (en) 2018-12-06 2018-12-06 Local self-adaptive controllable wettability coupling microstructure enhanced boiling heat exchange method

Publications (2)

Publication Number Publication Date
CN109631651A CN109631651A (en) 2019-04-16
CN109631651B true CN109631651B (en) 2020-07-07

Family

ID=66071501

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201811486437.5A Active CN109631651B (en) 2018-12-06 2018-12-06 Local self-adaptive controllable wettability coupling microstructure enhanced boiling heat exchange method

Country Status (1)

Country Link
CN (1) CN109631651B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110274508B (en) * 2019-06-13 2024-05-17 华南师范大学 Active enhanced heat transfer device and active enhanced heat transfer method
CN112366192B (en) * 2020-12-01 2022-09-06 哈尔滨工业大学 Electronic component heat abstractor based on electric field regulation and control solid-liquid phase change
CN114485253B (en) * 2022-01-25 2024-01-26 郑州轻工业大学 Intelligent surface heat exchange tube for hydrophilic-hydrophobic conversion
CN114963820B (en) * 2022-05-23 2023-04-28 中南大学 Boiling heat exchange device with multi-scale microstructure coupled with external electric field and manufacturing method

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0057728B1 (en) * 1980-07-21 1986-05-28 Hitachi, Ltd. Moisture-sensitive element, moisture-sensitive material and manufacturing method for same
JPS61225590A (en) * 1985-03-29 1986-10-07 Agency Of Ind Science & Technol Heat transferring rate regulator utilizing electric field on high-performance boiling surface
FR2950133B1 (en) * 2009-09-14 2011-12-09 Commissariat Energie Atomique THERMAL EXCHANGE DEVICE WITH IMPROVED EFFICIENCY
CN203298644U (en) * 2013-04-27 2013-11-20 上海大学 Boiling heat transfer device applied under microgravity condition
JP2015025174A (en) * 2013-07-26 2015-02-05 シャープ株式会社 Porous conductive member for water electrolysis, and functional water generator using the same
CN107021449B (en) * 2016-04-19 2018-12-21 北京航空航天大学 Prepare the preparation method and applications of ordered micro-configuration and controllable chemical composition interface
CN106855374A (en) * 2016-11-16 2017-06-16 华南师范大学 A kind of active strengthening and heat transferring device and heat-transferring method
CN107193122B (en) * 2017-07-31 2020-06-02 京东方科技集团股份有限公司 Reflection-type display panel and display device
CN108133918B (en) * 2018-02-11 2024-04-26 中国科学院工程热物理研究所 Micro-groove group radiator
CN108562067B (en) * 2018-04-17 2023-12-05 华南理工大学 Electric field enhanced refrigerant boiling heat transfer micro-channel heat exchanger based on needle electrode

Also Published As

Publication number Publication date
CN109631651A (en) 2019-04-16

Similar Documents

Publication Publication Date Title
CN109631651B (en) Local self-adaptive controllable wettability coupling microstructure enhanced boiling heat exchange method
Cao et al. Pool boiling heat transfer of FC-72 on pin-fin silicon surfaces with nanoparticle deposition
Li et al. Review of two types of surface modification on pool boiling enhancement: Passive and active
CN109320286B (en) Magnetic graphene-based aerogel material with ordered structure and preparation method thereof
CN110267485B (en) Evaporation-boiling capillary core coupling liquid-supplementing capillary core combined structure
Shi et al. Magneto-responsive thermal switch for remote-controlled locomotion and heat transfer based on magnetic nanofluid
Khan et al. Design, synthesis and nucleate boiling performance assessment of hybrid micro-nano porous surfaces for thermal management of concentrated photovoltaics (CPV)
CN110842202B (en) Free particle/porous medium composite reinforced boiling structure and preparation method thereof
US20050134167A1 (en) Thermoelectric transducer, a manufacturing method thereof, a cooling device using the same, and a method for controlling the cooling device
CN112225204B (en) Control method and equipment for graphene orientation in graphene sponge
CN108133918B (en) Micro-groove group radiator
Chen et al. Pool boiling on the superhydrophilic surface with TiO 2 nanotube arrays
CN109855075B (en) Boiling heat exchange surface of wall surface microstructure coupled local electrode
CN114593630B (en) Nano magnetic particle hydrophilic-hydrophobic intelligent tube and control system thereof
CN109592988A (en) A kind of preparation method of diamond microtrabeculae enhancing high-heat conductivity graphite material
CN111302335A (en) Ultrahigh-thermal-conductivity graphene thick film with vertical micropores and preparation method thereof
Sezer et al. Enhanced nucleate boiling heat transfer on bubble-induced assembly of 3D porous interconnected graphene oxide/silver nanowire hybrid network
CN111343836B (en) Columnar array porous surface structure, preparation method and jet phase change cooling method thereof
CN110408977B (en) Multi-scale enhanced boiling functional surface and composite preparation method
Rahman et al. Nucleate boiling on biotemplated nanostructured surfaces
CN103911621A (en) Method for changing surface energy of electroforming structure
CN100356556C (en) Thermal interfacial material and method of manufacture
CN208240661U (en) Micro capillary groove evaporator
CN106535576B (en) A kind of radiator of nano-fluid
CN113782452A (en) Micro-channel structure design and preparation method for efficiently strengthening boiling heat transfer surface

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant