CN107958884A - A kind of semiconductor chip thermal recycle device - Google Patents
A kind of semiconductor chip thermal recycle device Download PDFInfo
- Publication number
- CN107958884A CN107958884A CN201711457735.7A CN201711457735A CN107958884A CN 107958884 A CN107958884 A CN 107958884A CN 201711457735 A CN201711457735 A CN 201711457735A CN 107958884 A CN107958884 A CN 107958884A
- Authority
- CN
- China
- Prior art keywords
- cooling
- water
- heat
- integrated circuit
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/38—Cooling arrangements using the Peltier effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The present invention is a kind of semiconductor chip thermal recycling system.The system mainly includes, water pump, pipeline, and integrated circuit pyrotoxin, thermoelectric refrigeration element, micro-channel is heat sink, Recovery of the hot water case, shut-off valve.The function of the present invention is, accurately reduces the temperature of core hot zone in integrated circuit, avoids electronic device from causing failure because of overtemperature；Large scale integrated circuit and the caloric value of its cooling device are recycled at the same time, avoids this portion of energy from directly arranging to air and causes waste.One aspect of the present invention can improve the cooling radiating efficiency of integrated circuit, improve the stability of electronic device work, on the other hand improve the efficiency of cooling device, reduce the waste of resource, energy conservation and environmental protection.The present invention combines the advantages of type of cooling of two kinds of electronics, has evaded its drawback, has realized the recycling of heat.
Description
Technical field
The invention belongs to electronic device cooling field, specifically designs a kind of semiconductor chip thermal recycle device.
Background technology
With the fast development of economic society and science and technology, the also continuous development of the microelectric technique in China, therewith phase
The heat flow density that exactly gradually increased electronic device is produced with it of companion, this trend also propose the rate of heat dissipation of electronic device
The requirement of higher.Meanwhile the heat production of the electronic equipment of high heat generation density is more more than traditional electronic equipment heat production, there is investigation statistics
The problems such as display, more than half electronic equipments fails all is excessive caused by temperature.Therefore, efficiently heat dissipation technology is still
It is a great problem for limiting electronic equipment development.
With increasing for integrated circuit heat production, the energy of heat dissipation loss, which seems, can not ignore, especially supercomputing
Machine, operating cost is high, and fever and heat dissipation problem are two very important broad aspects.For supercomputer computer room,
Substantial amounts of heat scatter and disappear it is clearly a kind of waste, recycle this part caloric value, and meet high efficiency of energy is utilized instantly and
The demand of Green Development.
In conclusion to solve the problems, such as two above, it is necessary to electronic equipment can either efficiently be cooled down by designing set of device,
The caloric value of electronic equipment and cooling device can be recycled again.
The content of the invention
It is an object of the invention to provide a kind of semiconductor chip thermal recycle device, can neatly be controlled using this device
The temperature of integrated circuit processed so that the temperature of electronic equipment within the scope of rational, be unlikely to cause system because of overtemperature therefore
Barrier.Heat recovery system is set at the same time, by heat recovery caused by the integrated circuit plate and cooling device of high heat generation density
Get up, with to be utilized.
To reach above-mentioned purpose, the present invention is adopted the following technical scheme that to realize：
A kind of semiconductor chip thermal recycle device, including the water pump of pressure is provided before pipeline, connect all multiple ics
Pipeline, with the heat sink of micro-channel, the integrated circuit plate of heat sink upper placement, the thermoelectric cooling member arranged under core heater element
Part, the shut-off valve recycled in boiler and circuit of pipe end.
The water pump provides power for the flowing of water in pipeline.
The thermoelectric refrigeration element can be realized passes to effect to lower surface by upper surface heat, is placed in core hair
The lower section of thermal element, realizes that kernel component precisely cools down.
The heat sink coldplate for whole integrated circuit with micro-channel, at the same also serve as integrated circuit and
The heat absorption plate of thermoelectric refrigeration element.
The pipe end recycling boiler effect is to collect heated water.
The shut-off valve is opened when Water in Water Tanks temperature is relatively low, can heating for multiple times backwater, it is fully heated up.
Beneficial effect of the present invention is：Compared to types of cooling such as traditional water cooling, heat pipe, air blast coolings, heat sink fortune
With more safer than water cooling, energy consumption is lower, and is cooled down in the part that caloric value is concentrated the most using thermoelectric refrigeration element, has
The characteristics of precisely efficient；Individually using it is heat sink recycling semiconductor chip thermal when, outlet cooler-water temperature is often relatively low can not be very
Utilize well, while hot-spot also easily occur, it is difficult to it is balanced the problem of；When thermoelectric refrigeration element is used alone, the element
Also extra heat can be produced, there are inefficiency, the problem of job costs are high；Both are used in combination, and can prevent local mistake
The generation of heat, at the same time, the heat sink heat that can recycle thermoelectric refrigeration element generation so that it, which loses, reduces, and efficiency improves,
This partial heat also improves outlet cooler-water temperature, can reach the requirement of domestic hot-water.
Brief description of the drawings
Fig. 1 is the system composition schematic diagram of the present invention.
In figure：1 is water pump, and 2 be water lines, and 3 be integrated circuit, and 4 be core heater element, and 5 be thermoelectric refrigeration element, 6
For micro-channel heat sink, 7 be boiler, 8 shut-off valves.
Embodiment
The present invention is described in further detail by specific embodiment below in conjunction with attached drawing.
As shown in Fig. 1, the present invention provides a kind of semiconductor chip thermal recycling system, and critical piece includes integrated electricity
Road 3, thermoelectric refrigeration element 5 and micro-channel heat sink 6.
It is specifically：Water pump provide pressure, and in control pipeline water flow velocity, cooling velocity is controlled with this；Pipeline unicom
It is each heat sink, it is each heat sink offer cooling water；Cooling water flows in heat sink microchannel, cools down integrated circuit, and absorb
Its liberated heat；Groove is stayed in heat sink, for placing thermoelectric refrigerating module, the placement location of thermoelectric refrigerating module is in core
The lower section of heart heater element, its upper surface are excessive in core temperature of heating elements by heat sink cooling close to heater element, lower surface
When, refrigeration of starting to work, plays the role of regulating and controlling temperature；Cooling water is in heat sink middle absorption heat and flows into boiler；Work as hot merit
When rate is relatively low, hot water temperature can open shut-off valve so that cooling water again flows into boiler at this time accordingly also than relatively low
System is absorbed heat, and the water temperature for being adapted to utilize is reached with this, while also save and use water.
Claims (4)
1. a kind of semiconductor chip thermal recycling system, which includes water pump, pipeline, heat sink, collection with micro-channel
Into circuit board, thermoelectric refrigeration element, the shut-off valve in Recovery of the hot water case and circuit；It is characterized in that, cooling water is by water pump control
System is squeezed into the heat sink of micro-channel, and with cooling water flow control intensity of cooling, integrated circuit is placed in heat sink top, and
Accurately cooled down in core heater element positioned beneath thermoelectric refrigeration element, cooling water absorption integrated circuit and thermoelectric cooling
Heat caused by element, brings Recovery of the hot water case into, when water temperature is too low, will open shut-off valve, enters again as cooling water
System is absorbed heat, and is finally reached suitable water temperature with to be utilized.
2. a kind of semiconductor chip thermal recycling system according to claim 1, it is characterised in that water pump can control
Hydraulic pressure, so as to adjust flow velocity, controls cooling power so that cooling water is fully absorbed heat.
A kind of 3. semiconductor chip thermal recycling system according to claim 1, it is characterised in that thermoelectric refrigeration element
Cooling temperature can be accurately controlled so that overtemperature does not damage core heater element.
4. a kind of semiconductor chip thermal recycling system according to claim 1, it is characterised in that in Recovery of the hot water case
Water cooling water can be re-used as when temperature is relatively low absorbs heat into system, be finally reached suitable temperature, it is convenient to utilize.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711457735.7A CN107958884A (en) | 2017-12-28 | 2017-12-28 | A kind of semiconductor chip thermal recycle device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711457735.7A CN107958884A (en) | 2017-12-28 | 2017-12-28 | A kind of semiconductor chip thermal recycle device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107958884A true CN107958884A (en) | 2018-04-24 |
Family
ID=61956531
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711457735.7A Pending CN107958884A (en) | 2017-12-28 | 2017-12-28 | A kind of semiconductor chip thermal recycle device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107958884A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110631120A (en) * | 2018-06-21 | 2019-12-31 | 梁少峰 | Heating system |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2561099Y (en) * | 2002-08-05 | 2003-07-16 | 广州市高澜水技术有限公司 | Closed circulating water cooling apparatus |
| CN102620590A (en) * | 2012-03-30 | 2012-08-01 | 中国科学院工程热物理研究所 | Micro-channel heat sink and performance testing device thereof |
| CN103940272A (en) * | 2014-05-07 | 2014-07-23 | 浙江大学 | Hot water system and method based on computer server waste heat utilization |
-
2017
- 2017-12-28 CN CN201711457735.7A patent/CN107958884A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2561099Y (en) * | 2002-08-05 | 2003-07-16 | 广州市高澜水技术有限公司 | Closed circulating water cooling apparatus |
| CN102620590A (en) * | 2012-03-30 | 2012-08-01 | 中国科学院工程热物理研究所 | Micro-channel heat sink and performance testing device thereof |
| CN103940272A (en) * | 2014-05-07 | 2014-07-23 | 浙江大学 | Hot water system and method based on computer server waste heat utilization |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110631120A (en) * | 2018-06-21 | 2019-12-31 | 梁少峰 | Heating system |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20180424 |