CN105048281A - Cooling small channel heat sink - Google Patents
Cooling small channel heat sink Download PDFInfo
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- CN105048281A CN105048281A CN201510526353.XA CN201510526353A CN105048281A CN 105048281 A CN105048281 A CN 105048281A CN 201510526353 A CN201510526353 A CN 201510526353A CN 105048281 A CN105048281 A CN 105048281A
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Abstract
A cooling small channel heat sink comprises an upper layer and a lower layer, wherein the upper layer is an inner concave rectangle; one side of a center section of an upper surface is provided with a round water inlet channel and the other side is a multilayer connection water channel; the lower layer is an inner concave rectangle and water inlet and water outlet channels are arranged on left and right sides; the upper layer is fixed above the lower layer. Laminated array packaging is performed on a high-density laser diode. A high-efficiency heat dissipation effect is achieved. A manufacturing technology is simple and easy and a service life is long.
Description
Technical field
The present invention relates to the one cooling small channel heat sink that high power density laser diode stack array package is used, in use, simple and convenient, durable in use, long service life, cooling effect is better, and the scope of application is wider; Preparation technology is simple, and expense is low, and applies medium power and consume low.
Background technology
In recent years, high-power semiconductor laser because its volume is little, lightweight, efficiency is high, easy adjustment and the advantage such as easy of integration, become pumped solid-state laser (DPSSL, DPL) the most promising pumping source of fiber laser (FL), it develops the update directly promoting the technology such as laser ranging, fuse, tracking, guidance, weapon simulation, igniting blasting, radar, night vision, target identification and antagonism.Especially the high energy application system requirements pumping source such as solid-state laser weapon has more high-density power density and exports, diode laser matrix lamination is the effective way improving laser output power, but power density and hear rate become the principal element limiting its power and improve further.Caused by heat power consumption, the temperature rise of laser diode active area can reduce laser electro-optical efficiency, reduces power output, makes excitation wavelength red shift, laser can be made time serious to wrack.
Summary of the invention
The object of the present invention is to provide a kind of cooling small channel heat sink, to high-density laser diode stack array package, play the effect of high efficiency and heat radiation, preparation is simple, long service life.
For achieving the above object, the invention provides a kind of cooling small channel heat sink, comprising:
One upper strata, this upper strata is the rectangle of indent, and the side in the middle of above it has a circular inlet channel, and opposite side is that multilayer is communicated with water channel;
One lower floor, this lower floor is the rectangle of indent, and left and right is turnover water channel, and described upper strata is fixed on above lower floor.
The invention has the beneficial effects as follows, play the effect of high efficiency and heat radiation, preparation is simple, long service life.
Accompanying drawing explanation
Below by way of by reference to the accompanying drawings to the detailed description of instantiation, further illustrate structure of the present invention, feature and technology contents, wherein:
Fig. 1 is a kind of structural representation cooling the upper strata 1 of small channel heat sink of the present invention;
Fig. 2 is a kind of structural representation cooling the lower floor 2 of small channel heat sink of the present invention.
Embodiment
Refer to shown in Fig. 1 and Fig. 2, the invention provides a kind of new and effective cooling small channel heat sink, comprising:
One upper strata 1 (consulting Fig. 1), the material on this upper strata 1 is metal red copper, this upper strata is the rectangular rectangular configuration of indent, it is of a size of 48mm × 24mm × 11mm, red copper material is solid and heat conductivility is good, can overall thermal resistance be reduced, fast distribute heat be taken away, ensure that device runs under normal temperature conditions.14 rectangle passage aisles 11 (consulting Fig. 1) are cut on indent rectangular channel top, upper strata, and every bar sulculus is of a size of 21mm × 0.5mm × 2mm, and the cycle is 1mm, more than this layer rectangle sulculus distance upper surface, need the device by dispelling the heat very near, on the one hand because distance is near, heat conduction speed ratio is very fast, be conducive to device heat radiation, ensure that it normally works, two is many square sulculuses cut, and considerably increases and cooling water contact area, accelerate heat diffusion speed, be conducive to device heat radiation.At the bottom surface on upper strata 1, open the rectangular channel 12 (consulting Fig. 1) of a dark 6mm along 9mm place apart from left side, the bed-plate dimension of rectangular channel 12 is 14mm × 2mm, and the distance apart from upper and lower edge is 5mm, and this rectangular channel 12 is successive watercourse of upper and lower two-layer radiation water channel, size is moderate, both not excessive, waste volume, makes overall volume excessive, increase cost, destroy overall appearance effect again; Also volume is not too small, and the water yield is blocked, and hinders cold water normally to circulate, causes heat not distribute not go out, make overall heat sink forfeiture heat sinking function, finally causes device to lose efficacy because heat is too much.Open the rectangular channel 13 (consulting Fig. 1) of a dark 3mm along 25mm place near left side, the bed-plate dimension of rectangular channel 13 is 14mm × 7mm, distance apart from upper and lower edge is 5mm, and rectangular channel 13 is the water return outlets on upper strata 1, and volume is suitable, to ensure that backwater is unobstructed, not so backwater accumulation too much, thermal reservoir that device distributes can be made at this, do not distribute not go out, cause overall heat sink forfeiture heat sinking function, finally cause device to lose efficacy because heat is too much.The rectangle major path 14 (consulting Fig. 1) of 5 dark 3mm is processed between rectangular channel 12 and rectangular channel 13, every bar rectangle sulculus bed-plate dimension is 14mm × 1.5mm, cycle 2.8mm, bulky many than rectangle passage aisle 11 of this rectangle major path 14, main purpose is the fluency increasing water, due to air and heat sink heat exchange, and the fluxion strap of water walks heat, the water flowing to this is flowed away as far as possible as soon as possible more suitable, so the cumulative volume of rectangle major path 14 is larger a little more suitable than the volume of rectangle passage aisle 11, nor can be excessive, also to ensure with cooling water contact area large as far as possible, increase heat-transfer rate.On distance the right along 8mm place, open the circular channel 15 (consulting Fig. 1) of a diameter 6mm, the degree of depth is 6mm, the distance of its centre-to-centre spacing lower edges is 12mm, this circular channel 15 is the inlet channels on upper strata 1, its cross section determines the discharge entering upper strata water channel, the diameter of this circular channel 15 should be designed by many factors, such as need the heat amount taken away, the inlet area of water velocity and upper strata water channel, size should be suitable for, because heat sink internal water channel structure is compacter closely knit, heat sink cumulative volume is less, the raw material of such needs are fewer, therefore processing charges is fewer, and volume is less, heat sink smaller and more exquisite, outward appearance is also more attractive in appearance, and just, the space taken is also less to use also Vietnamese side, is conducive to the Integration Design of device.
One lower floor 2 (consulting Fig. 2), the material of this lower floor 2 is metal red copper, this lower floor 2 is rectangular configuration, it is of a size of 52mm × 28mm × 32mm, red copper material is solid and thermal conductivity is good, can overall thermal resistance be reduced, fast distribute heat be taken away, ensure that device works under normal temperature conditions.Lower floor 2 opens in the middle of end face (52mm × 28mm) rectangular channel 21 (consulting Fig. 2) of a dark 11mm indent, bed-plate dimension is 48mm × 24mm, object upper strata 1 is put into the rectangular channel 21 of indent, make it to become an integral heat sink heat sink, this kind of design can realize two kinds of sealing means, one utilizes soldering tech, weld together two-layer up and down, but this kind of technical requirement is stricter, if technology does not answer mark, if there is large-area welding, the probability of the possibility that occurs leaking is larger; Another kind method is exactly that profit is screwed, firmly balanced on four angles, just than being easier to the object realizing us, but this kind of method is owing to employing screw, occupies certain space, when making bamboo product small channel heat sink, volume is certain to increase, and too increases process, so just increases cost, and due to screw outside exposed, also have impact on overall appearance.On rectangular channel 21 bottom surface, apart from right edge along 8mm place, open the circular channel 22 (consulting Fig. 2) that a diameter is 6mm, dark 11.8mm, its centre-to-centre spacing upper edge 12mm, the position of this circular channel 22 is corresponding with the position of the circular channel 15 on upper strata 1, this circular channel 22 communicates with the intake tunnel of lower floor 2, the cross-sectional area of this circular channel 22 is the key factors determining inflow, so will strictly calculate in the design process, not so overall effect can be affected, not only comprise radiating effect, also have overall volume, and then affect aesthetic, concentric with circular channel 22, open a dark 1.6mm annular groove 23 (consulting Fig. 2), inner and outer diameter is respectively 8mm and 14mm, this annular groove 23 is used to placement and has flexible rubber Ou Quan, play sealing function, object makes linking together of the inlet channel positive alignment of upper strata 1 and lower floor 2, when ensureing water flowing, anti-sealing overflows from the contact position of upper strata 1 and lower floor 2, impact enters the water speed of upper strata radiation water channel, water is caused to enter the rectangular channel 13 on upper strata 1, inlet channel and backwater road are communicated, so just thoroughly destroy the effect of Double-layer drain heat radiation, cause overall heat sink inefficacy, at distance left side edge 24mm place, open the circular channel 24 (consulting Fig. 2) that a diameter is 6mm, dark 11.8mm, its centre-to-centre spacing upper edge 12mm, the position of this circular channel 24 is corresponding with the position of the rectangular channel 13 of recess in upper strata 1, this circular channel 24 communicates with the backwater road of lower floor 2, flow through from the rectangular channel 15 on upper strata 1 water come and enter circular channel 24, just can complete and once circulate, the cross-sectional area of this circular channel 24 should be suitable with the cross-sectional area of inlet channel, guarantee there will not be seeping phenomenon at this, affects heat sink radiating effect, outside circular channel 24, open a dark 1.6mm, the rectangle annular groove 25 (consulting Fig. 2) of wide 6mm, interior rectangular dimension is 20.9mm × 14mm, outer rectangular dimension is 26.9mm × 20mm, outer rectangle left side bearing is apart from groove 21 bottom surface left side bearing 6mm, on outer rectangle, lower sideline is 2mm apart from the distance of lower sideline on groove 21 bottom surface, fillet 26 (consulting Fig. 2) is made at interior rectangle four angles, radius is 1mm, this rectangle annular groove 25 and rectangular channel 12, rectangular channel 13 and rectangle major path 14 position correspondence, this rectangle annular groove 25 is used for placement and has flexible rubber Ou Quan, object is the rectangle major path 14 making upper strata 1, linking together of the rectangle annular groove 25 intermediate space positive alignment of rectangular channel 12 and rectangular channel 13 and lower floor 2, ensure to form normal loop state, water flowing is smooth and easy, anti-sealing overflows from loop, affect the water speed in backwater road, anti-sealing enters inlet channel region, inlet channel and backwater road are communicated, so just thoroughly destroy the effect of Double-layer drain heat radiation, make overall heat sink inefficacy, the left surface of lower floor 2 is opened the circular water outlet 28 (consulting Fig. 2) of a diameter 6mm, dark 28mm, this circular water outlet 28 center is 14mm to lower floor 2 left and right sideline distance, distance to lower floor 2 hemline is 12.2mm, this circular water outlet 28 communicates with circular channel 24, make communicating of lower floor 2 backwater road and outside supply equipment, ensure that the water flowed out by inside passes back into the backwater water pipe of supply equipment, the annular groove 29 (consulting Fig. 2) of an alignment dark 1.9mm outside circular water outlet 28, its inner and outer diameter is respectively 10mm and 16.4mm, this annular groove 29 is used for being connected with the water pipe of outside supply equipment, ensure the backwater water pipe compact siro spinning technology of heat sink delivery port and supply equipment, backwater can not be overflowed, avoid occurring unrestrained water phenomenon, cause unthinkable consequence.Lower floor 2 right flank is opened the circular inlet channel 210 (consulting Fig. 2) that a diameter is 6mm, dark 10mm, this circular inlet channel 210 center is 14mm to lower floor 2 left and right sideline distance, distance to lower floor 2 hemline is 12.2mm, this circular inlet channel 210 is communicated with circular channel 22, this circular inlet channel 210 is that inlet channel communicates with outside supply equipment, and cooling water is sent to inlet channel by water pipe by assure feed water equipment; The annular groove 211 (consulting Fig. 2) of an alignment dark 1.9mm outside circular inlet channel 210, its inner and outer diameter is respectively 10mm and 16.4mm, this annular groove 211 is used for being connected with the water inlet pipe of outside supply equipment, ensure the water inlet water pipe compact siro spinning technology of heat sink water inlet and supply equipment, make can not overflow into water, avoid occurring unrestrained water phenomenon, ensure that heat sink operation is working properly.
Angle, 1 four, upper strata is opened the through hole 16 (consulting Fig. 1) of a diameter 3.4mm respectively, and its center is 2.5mm to the distance on dual-side edge.Lower floor 2 four angles are opened the screwed hole 27 (consulting Fig. 2) of a diameter 3mm, dark 10mm respectively, and its center is 2.5mm to the distance of closing on sideline, groove 21 bottom surface.And upper strata 1 is when overlapping with lower floor 2 center, four through holes 16 on upper strata 1 are corresponding coinciding together with the screwed hole of four in lower floor 2 27, are just in time screwed together, upper strata 1 and lower floor 2 combining tightly, ensure that the water channel of the inside is unimpeded, water can not overflow.
The course of work of the present invention is, first in the rectangle annular groove 25 on the bottom surface of the groove 21 of lower floor 2 and annular groove 23, each placement Ou Quan, then upper strata 1 is inserted in the groove 21 of lower floor 2, the circular channel 15 on upper strata 1 and the circular channel 22 of lower floor 2 are aimed at, and the screwed hole 27 on the through hole 16 on angle, 1 four, upper strata and lower floor 2 four angles is aimed at, be finally fixed together in upper strata 1 and lower floor 2 with the long spiro nail of M3, heat sink like this assembling completes.
The new and effective cooling small channel heat sink of described one, line cutting technology is utilized to machined 14 rectangle sulculuses, every bar sulculus is of a size of 21mm × 0.5mm × 2mm, cycle 1mm, such processing, both ensure that our meticulous requirement, turn avoid application fine processing technique, such as chemical corrosion technology etc., reduce the difficulty of preparation technology.
The new and effective cooling small channel heat sink of described one, in upper strata 1, utilize line cutting technology to machined 14 rectangle sulculuses 11, and on a surface on upper strata 1, utilize machine tools milling cutter to mill out 5 rectangle sulculuses 14, on upper strata 1, machined two-layer water channel like this.When utilizing line cutting technology to process rectangle sulculus 11 on upper strata 1, a rectangular channel need be opened respectively in left and right side, line cutting technology could be utilized to process, finally to form sealing water channel, need to insert a cutting respectively in the rectangular channel by left side and right side, and utilizing solder technology to seal, sealing area is 56mm2.In conventional machining techniques, if need to process two-layer water channel, be generally middlely to process respectively two-layer independence is heat sink, and then by two-layer independent heat sink welding together, or be screwed together.If utilize solder technology to seal, sealing area is 1152mm2, and the chances are utilizes present method to need 100 times of bonding area, considerably increases the possibility of leaking like this.If utilize screw to be fixed together, need to utilize Ou Quan to seal, so just need to open the sulculus putting Ou Quan in a lower layer, but the degree of depth 2-3mm of every layer of water channel, and every layer of independence is heat sink only has 5-6mm, then open sulculus, place Ou Quan, thickness does not allow, more difficult, and may going of leaking is also larger.Now we two-layer water channel is worked into one deck heat sink on, avoid large-area welded seal, or open rectangular channel place Ou Quan, substantially reduce the possibility of leaking.
The new and effective cooling small channel heat sink of described one, four long spiro nails are utilized to be linked together with lower floor 2 on upper strata 1, form an entirety, utilize two diameter and the suitable Ou Quan of elasticity, avoid and utilize large-scale solder technology to occur the possibility of leaking, this kind of method is simple, easily realizes the requirement of design.
Above-described specific embodiment; object of the present invention, technical scheme and beneficial effect are further described; be understood that; the foregoing is only specific embodiments of the invention; be not limited to the present invention; within the spirit and principles in the present invention all, any amendment made, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (4)
1. cool a small channel heat sink, comprising:
One upper strata, this upper strata is the rectangle of indent, and the side in the middle of above it has a circular inlet channel, and opposite side is that multilayer is communicated with water channel;
One lower floor, this lower floor is the rectangle of indent, and left and right is turnover water channel, and described upper strata is fixed on above lower floor.
2. cooling small channel heat sink according to claim 1, wherein in this upper strata, recess longitudinally has many square small channels, these many square small channels are communicated with circular channel and narrow rectangular channel, many square major paths are had on many square small channels, the side of this square major path is narrow rectangular channel, opposite side is wide rectangular channel, and the corner place on upper strata has 4 fixing holes.
3. cooling small channel heat sink according to claim 1, wherein in this lower floor, recess is rectangular channel, rectangular channel is equal with the floor space on upper strata, just in time be embedded into this rectangular channel completely, there is a circular channel side, bottom surface of rectangular channel, the position of this circular channel is corresponding with the position of the circular channel on upper strata, be positioned at the side of circular channel simultaneously, a circular channel, this circular channel is positioned at the opposite side of rectangular channel, the position of this circular channel is corresponding with the position of the wide rectangular channel of recess in upper strata, corner place on lower floor has 4 fixing holes, corresponding with the fixing hole position of the corner on upper strata, one side of this lower floor there is inlet channel, the side of opposite side there is water outlet, this inlet channel is communicated with circular channel, water outlet is communicated with circular channel.
4. cooling small channel heat sink according to claim 1, wherein the material homogeneous phase of these the upper and lower is all red copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510526353.XA CN105048281B (en) | 2015-08-25 | 2015-08-25 | Cooling small channel heat sink |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510526353.XA CN105048281B (en) | 2015-08-25 | 2015-08-25 | Cooling small channel heat sink |
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| CN105048281A true CN105048281A (en) | 2015-11-11 |
| CN105048281B CN105048281B (en) | 2018-09-04 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107104359A (en) * | 2016-02-22 | 2017-08-29 | 中国科学院半导体研究所 | A kind of heat sink, preparation method and its application in semiconductor laser |
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| JP2004186527A (en) * | 2002-12-05 | 2004-07-02 | Tecnisco Ltd | Laser diode cooling apparatus |
| US20050168950A1 (en) * | 2004-01-30 | 2005-08-04 | Hokichi Yoshioka | Semiconductor cooling device and stack of semiconductor cooling devices |
| CN101164163A (en) * | 2005-06-20 | 2008-04-16 | 浜松光子学株式会社 | Heat sink, laser apparatus provided with such heat sink, and laser stack apparatus |
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| CN202103311U (en) * | 2011-07-01 | 2012-01-04 | 中国电子科技集团公司第十三研究所 | Micro-channel heat sink for laser |
| CN102620590A (en) * | 2012-03-30 | 2012-08-01 | 中国科学院工程热物理研究所 | Micro-channel heat sink and performance testing device thereof |
| US8264841B2 (en) * | 2007-05-31 | 2012-09-11 | Sony Corporation | Heat sink and laser diode |
-
2015
- 2015-08-25 CN CN201510526353.XA patent/CN105048281B/en not_active Expired - Fee Related
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5005640A (en) * | 1989-06-05 | 1991-04-09 | Mcdonnell Douglas Corporation | Isothermal multi-passage cooler |
| JP2004186527A (en) * | 2002-12-05 | 2004-07-02 | Tecnisco Ltd | Laser diode cooling apparatus |
| US20050168950A1 (en) * | 2004-01-30 | 2005-08-04 | Hokichi Yoshioka | Semiconductor cooling device and stack of semiconductor cooling devices |
| CN101164163A (en) * | 2005-06-20 | 2008-04-16 | 浜松光子学株式会社 | Heat sink, laser apparatus provided with such heat sink, and laser stack apparatus |
| US8264841B2 (en) * | 2007-05-31 | 2012-09-11 | Sony Corporation | Heat sink and laser diode |
| CN101883483A (en) * | 2009-05-06 | 2010-11-10 | 中国科学院半导体研究所 | Three-plate mini-type heat radiator |
| CN202103311U (en) * | 2011-07-01 | 2012-01-04 | 中国电子科技集团公司第十三研究所 | Micro-channel heat sink for laser |
| CN102620590A (en) * | 2012-03-30 | 2012-08-01 | 中国科学院工程热物理研究所 | Micro-channel heat sink and performance testing device thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107104359A (en) * | 2016-02-22 | 2017-08-29 | 中国科学院半导体研究所 | A kind of heat sink, preparation method and its application in semiconductor laser |
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