CN202103311U - Micro-channel heat sink for laser - Google Patents
Micro-channel heat sink for laser Download PDFInfo
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- CN202103311U CN202103311U CN2011202294092U CN201120229409U CN202103311U CN 202103311 U CN202103311 U CN 202103311U CN 2011202294092 U CN2011202294092 U CN 2011202294092U CN 201120229409 U CN201120229409 U CN 201120229409U CN 202103311 U CN202103311 U CN 202103311U
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- flow deflector
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- heat sink
- broach
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Abstract
The utility model discloses a micro-channel heat sink of a laser, which is formed by hollow rectangular thin pieces packaged in laminated mode. The rectangular thin pieces sequentially are a tungstencopper alloy chip installation piece, a micro-channel piece, a flow deflector, a drainage piece and a tungstencopper alloy sealing fin from top to bottom. Corresponding water inlet holes, water outlet holes and mechanical installation holes are respectively arranged on the five thin pieces. Eudipleural inclined comb teeth are arranged on top of the micro-channel piece. Groove holes communicated with the inclined comb teeth are arranged on two sides of the middle of the micro-channel piece. A rectangular water guiding groove is arranged on top of the flow deflector, and first water way grooves communicated with the water outlet holes of the flow deflector are arranged on the left side and the right side of the flow deflector symmetrically. Eudipleura vertical comb teeth communicated with the water inlet holes on the drainage piece are arranged on top of the flow deflector. Second water way grooves corresponding to the first water way grooves are arranged on the left side and the right side of the flow deflector. The micro-channel heat sink is applicable to high power gallium arsenide base chip radiating and lays a solid foundation for reliability and long service life of the laser.
Description
Technical field
The utility model belongs to field of photoelectric technology, is specifically related to micro-channel heat sink for semi-conductor laser.
Background technology
Because the volume of semiconductor laser is little, in light weight, conversion efficiency is high, the life-span is long, be easy to advantage such as modulation, makes it very extensive in Application for Field such as industry, medical treatment, communication, information demonstration, military affairs at present.The high-power semiconductor laser technology is the important technology basis of Developing Defence Industry, and its development will directly promote the update of technology such as fuse, tracking, guidance, weapon simulation, igniting blasting, radar, night vision, target identification and antagonism.At present the subject matter that faced of Superpower semiconductor laser array is the laser heat dissipation problem, and this problem has also become the difficult problem of the present world, and one of micro-channel heat sink heat dissipation technology state-of-the-art technology of folded battle array encapsulation that is high power semiconductor lasers.
Commercial widely used micro-channel heat sink is the oxygen-free copper micro-channel heat sink at present; The oxygen-free copper micro-channel heat sink is owing to differ bigger with the matching of the thermal coefficient of expansion of GaAs based chip, in encapsulation process, very easily " smile " effect occurs and has a strong impact on the package reliability and the life-span of chip.Now main still through heat sink control of level of on the oxygen-free copper micro-channel heat sink, freezing a time, produce more negative influence but introduce the secondary heat sink heat radiation that not only need increase by a step welding technology and also increased a heat transfer interface noise spectra of semiconductor lasers.
The utility model content
The technical problem that the utility model will solve provides a kind of and GaAs based chip thermal expansion matching, laser micro-channel heat sink that thermal conductivity is high.
For solving the problems of the technologies described above, the technical scheme that the utility model is taked is:
A kind of laser micro-channel heat sink is made up of the rectangular tab of the inside hollow out of superimposed encapsulation, and said rectangular tab is five, is followed successively by the diaphragm seal of chip installation sheet, microchannel sheet, flow deflector, drainage sheet and the tungsten-copper alloy of tungsten-copper alloy from top to bottom; Top, bottom and the middle part of said chip installation sheet, microchannel sheet, flow deflector, drainage sheet and diaphragm seal is respectively equipped with corresponding inlet opening, apopore and mechanical installing hole; The top of said microchannel sheet is provided with symmetrical oblique broach, and the middle part is provided with the slotted eye that is communicated with said oblique broach; The top of said flow deflector is provided with the guiding gutter of rectangle, the left and right sides of said flow deflector be arranged with flow deflector on the first water route groove that is connected of apopore; The top of said drainage sheet be provided with the drainage sheet on the symmetrical vertical broach that is communicated with of inlet opening, the left and right sides of said drainage sheet is provided with the second water route groove corresponding with the first water route groove.
The number of teeth of said oblique broach >=8; The vertical number of teeth >=8 of broach.
Slotted eye on the sheet of said microchannel is near the apopore of bottom.
The interdental space of said oblique broach equates; The interdental space of said vertical broach equates.
The oblique angle of said oblique broach is 30-50 °.
The utility model chips installation sheet and diaphragm seal adopt copper-tungsten, and the thermal coefficient of expansion of copper-tungsten is close with GaAs based chip thermal expansion, make that chip installation sheet and chip of laser coupling is good, can realize not having the sintering stress encapsulation; In encapsulation process, can effectively avoid " smile " effect; In the inside microchannels pipeline because pipeline size is less, current inner because external water pressure produces very big flow velocity; Flow velocity is big more, and the suffered impulsive force of fluid molecule is just big more, and the instantaneous quantity of atom also just increases severely; The collision rate of fluid integral body is also just big more, just is easy to generate turbulent flow more; The microchannel sheet is as the main fin of micro-channel heat sink in addition, and the strenuous exercise of the oblique angle of its tooth design also can increase fluid is easy to form turbulent flow.
Adopt the beneficial effect that technique scheme produced to be: 1) to adopt the chip installation sheet of copper-tungsten and the diaphragm seal of tungsten-copper alloy, effectively avoided the smile effect in the encapsulation process; 2) adopt the utility model, the micro-channel heat sink water flow inside presents the turbulent flow state, has increased heat exchange coefficient.
Description of drawings
Below in conjunction with accompanying drawing and embodiment the utility model is done further detailed explanation.
Fig. 1 is that the chip installation sheet master of the utility model looks sketch map;
Fig. 2 is that the master of the utility model microchannel sheet looks sketch map;
Fig. 3 is that the master of the utility model flow deflector looks sketch map;
Fig. 4 is that the master of the utility model drainage sheet looks sketch map;
Fig. 5 is that the master of the utility model diaphragm seal looks sketch map;
1, chip installation sheet, 2, the microchannel sheet, 3, flow deflector, 4, the drainage sheet, 5, diaphragm seal, 101, first inlet opening; 102, the first mechanical installing hole, 103, first apopore, 201, second apopore, 202, the second mechanical installing hole, 203, second apopore; 204, slotted eye, 205, oblique broach, the 301, the 3rd apopore, the 302, the 3rd mechanical installing hole, the 303, the 3rd apopore; 304, the first water route groove, 305, guiding gutter, the 401, the 4th inlet opening, the 402, the 4th mechanical installing hole, the 403, the 4th apopore; 404, the second water route groove, 405, vertical broach, the 501, the 5th inlet opening, the 502, the 5th mechanical installing hole, the 503, the 5th apopore.
Embodiment
Referring to Fig. 1-Fig. 5; The utility model is made up of the rectangular tab of the inside hollow out of superimposed encapsulation; Said rectangular tab is five, is followed successively by the diaphragm seal 5 of chip installation sheet 1, microchannel sheet 2, flow deflector 3, drainage sheet 4 and the tungsten-copper alloy of tungsten-copper alloy from top to bottom.The top of said chip installation sheet 1, bottom and middle part are provided with first inlet opening 101, first apopore 103 and the first mechanical installing hole 102 symmetrically; First inlet opening 101 and first apopore 103 are used for the watertightness of fitted seal circle when guaranteeing that a plurality of micro-channel heat sinks are connected, simultaneously as the entery and delivery port of micro-channel heat sink.
On said microchannel sheet 2, be provided with second inlet opening 201, second mechanical installing hole 202 and second apopore 203 corresponding with said chip installation sheet 1; The top of sheet 2 is provided with symmetrical oblique broach 205 in the microchannel, and the both sides at middle part are provided with the slotted eye 204 that is communicated with said oblique broach 205; Said slotted eye 204 is near second apopore 203 of bottom.The oblique angle of oblique broach 205 is 30-50 °, can on the flow direction of fluid, fluid flow form disturbance, increases the strenuous exercise of fluid, is easy to form turbulent flow.
On flow deflector 3, be provided with three inlet opening 301, three mechanical installing hole 302 and three apopore 303 corresponding with said chip installation sheet 1; Be provided with the guiding gutter 305 of rectangle at the top of said flow deflector 3, the left and right sides of said flow deflector 3 is arranged with the first water route groove 304 that is connected with the 3rd apopore 303.
On said drainage sheet 4, be provided with four inlet opening 401, four mechanical installing hole 402 and four apopore 403 corresponding with said chip installation sheet 1; Be provided with the symmetrical vertical broach 405 that is communicated with the 4th inlet opening 403 at the top of drainage sheet 4; The left and right sides of said drainage sheet 4 is provided with the second water route groove 404 corresponding with the first water route groove 304.The number of teeth of said vertical broach 405 >=8.
Said microchannel sheet 2, flow deflector 3 and drainage sheet 4 adopt no-oxygen copper plate.
On said diaphragm seal 5, be provided with five inlet opening 501, five mechanical installing hole 502 and five apopore 503 corresponding with said chip installation sheet 1.Said diaphragm seal 5 adopts copper-tungstens, and wherein the molar content of tungsten is 85%, is complementary with the thermal coefficient of expansion of GaAs based chip.
The utility model employing machining or etching technics are processed into said structure with the diaphragm seal 5 of sheet installation sheet 1, microchannel sheet 2, flow deflector 3, drainage sheet 4 and tungsten-copper alloy, adopt welding technology to sinter above-mentioned five rectangular tab into whole micro-channel heat sink then.
During use, current or other liquid from the 5th inlet opening 501 of diaphragm seal 5 through the oblique broach 205 on the guiding gutter 305 entering microchannel sheets 2 on the vertical broach on the drainage sheet 4 405 and the flow deflector 3; Current or liquid are through the slotted eye 204 that is communicated with oblique broach 205 apopore near micro-channel heat sink then; The current or the liquid that get in the slotted eye 204 get into the apopore of said micro-channel heat sink through the first water route groove 304, the second water route groove 404, and flow out from the apopore of diaphragm seal 5.
Claims (5)
1. laser micro-channel heat sink; Rectangular tab by the inside hollow out of superimposed encapsulation constitutes; It is characterized in that said rectangular tab is five, be followed successively by the diaphragm seal (5) of chip installation sheet (1), microchannel sheet (2), flow deflector (3), drainage sheet (4) and the tungsten-copper alloy of tungsten-copper alloy from top to bottom; Top, bottom and the middle part of said chip installation sheet (1), microchannel sheet (2), flow deflector (3), drainage sheet (4) and diaphragm seal (5) is respectively equipped with corresponding inlet opening, apopore and mechanical installing hole; The top of said microchannel sheet (2) is provided with symmetrical oblique broach (205), and the middle part is provided with the slotted eye (204) that is communicated with said oblique broach (205); The top of said flow deflector (3) is provided with the guiding gutter (305) of rectangle, the left and right sides of said flow deflector (3) be arranged with flow deflector on the first water route groove (304) that is connected of apopore; The top of said drainage sheet (4) be provided with the drainage sheet on the symmetrical vertical broach (405) that is communicated with of inlet opening, the left and right sides of said drainage sheet (4) is provided with the second water route groove (404) corresponding with the first water route groove (304).
2. laser micro-channel heat sink according to claim 1 is characterized in that the number of teeth >=8 of said oblique broach (205); The vertical number of teeth >=8 of broach (405).
3. laser micro-channel heat sink according to claim 2 is characterized in that slotted eye (204) on the said microchannel sheet (2) is near the apopore of bottom.
4. laser micro-channel heat sink according to claim 2 is characterized in that the interdental space of said oblique broach (205) equates; The interdental space of said vertical broach (405) equates.
5. laser micro-channel heat sink according to claim 4, the oblique angle that it is characterized in that oblique broach (205) is 30-50 °.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202294092U CN202103311U (en) | 2011-07-01 | 2011-07-01 | Micro-channel heat sink for laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202294092U CN202103311U (en) | 2011-07-01 | 2011-07-01 | Micro-channel heat sink for laser |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202103311U true CN202103311U (en) | 2012-01-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011202294092U Expired - Lifetime CN202103311U (en) | 2011-07-01 | 2011-07-01 | Micro-channel heat sink for laser |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202103311U (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103956649A (en) * | 2014-05-15 | 2014-07-30 | 西安炬光科技有限公司 | Liquid refrigeration type semiconductor laser device with anti-corrosion structure |
| CN104347429A (en) * | 2013-07-25 | 2015-02-11 | 常州鼎悦电子科技有限公司 | Micro channel heat sink manufacturing method |
| CN104682189A (en) * | 2015-02-12 | 2015-06-03 | 中国科学院半导体研究所 | High-power density semiconductor laser heat sink |
| CN105048281A (en) * | 2015-08-25 | 2015-11-11 | 中国科学院半导体研究所 | Cooling small channel heat sink |
| CN107042363A (en) * | 2017-04-26 | 2017-08-15 | 广东工业大学 | A kind of device and method of processing high-power semiconductor laser thermal sediment lamination |
| CN109794698A (en) * | 2019-04-01 | 2019-05-24 | 苏州匠恒智造科技有限公司 | A kind of laser process equipment with microchannel heat sink |
| CN109822242A (en) * | 2019-04-01 | 2019-05-31 | 苏州匠恒智造科技有限公司 | A kind of laser process equipment with combined micro-channel radiator |
| CN111001982A (en) * | 2019-11-25 | 2020-04-14 | 大连理工大学 | Metal copper micro-channel heat sink with comb-tooth structure and manufacturing method |
| CN112490844A (en) * | 2020-11-26 | 2021-03-12 | 苏州长光华芯光电技术股份有限公司 | Bar laser packaging structure and preparation method thereof |
-
2011
- 2011-07-01 CN CN2011202294092U patent/CN202103311U/en not_active Expired - Lifetime
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104347429A (en) * | 2013-07-25 | 2015-02-11 | 常州鼎悦电子科技有限公司 | Micro channel heat sink manufacturing method |
| CN104347429B (en) * | 2013-07-25 | 2017-05-17 | 常州鼎悦电子科技有限公司 | Micro channel heat sink manufacturing method |
| CN103956649A (en) * | 2014-05-15 | 2014-07-30 | 西安炬光科技有限公司 | Liquid refrigeration type semiconductor laser device with anti-corrosion structure |
| CN103956649B (en) * | 2014-05-15 | 2017-01-25 | 西安炬光科技股份有限公司 | Liquid refrigeration type semiconductor laser device with anti-corrosion structure |
| CN104682189A (en) * | 2015-02-12 | 2015-06-03 | 中国科学院半导体研究所 | High-power density semiconductor laser heat sink |
| CN105048281A (en) * | 2015-08-25 | 2015-11-11 | 中国科学院半导体研究所 | Cooling small channel heat sink |
| CN105048281B (en) * | 2015-08-25 | 2018-09-04 | 中国科学院半导体研究所 | Cooling small channel heat sink |
| CN107042363A (en) * | 2017-04-26 | 2017-08-15 | 广东工业大学 | A kind of device and method of processing high-power semiconductor laser thermal sediment lamination |
| CN109794698A (en) * | 2019-04-01 | 2019-05-24 | 苏州匠恒智造科技有限公司 | A kind of laser process equipment with microchannel heat sink |
| CN109822242A (en) * | 2019-04-01 | 2019-05-31 | 苏州匠恒智造科技有限公司 | A kind of laser process equipment with combined micro-channel radiator |
| CN111001982A (en) * | 2019-11-25 | 2020-04-14 | 大连理工大学 | Metal copper micro-channel heat sink with comb-tooth structure and manufacturing method |
| CN112490844A (en) * | 2020-11-26 | 2021-03-12 | 苏州长光华芯光电技术股份有限公司 | Bar laser packaging structure and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120104 |
|
| CX01 | Expiry of patent term |