CN112086415B - Novel multi-scale heat management structure and micro-assembly method - Google Patents
Novel multi-scale heat management structure and micro-assembly method Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
Abstract
The invention provides a novel multi-scale heat management structure, which comprises: the high-power chip is integrated with the chip-level micron-scale heat dissipation micro-channel through low-cavity welding and low thermal resistance, and the chip-level micron-scale heat dissipation micro-channel and the packaging-level millimeter-scale micro-channel are connected with each other through airtight welding to realize the interconnection of a liquid network; the packaging-level millimeter-scale micro-channel and the system-level centimeter-scale macroscopic liquid supply network are interconnected by adopting a bi-pass watertight connector; and the system-level centimeter-scale macroscopic liquid supply network is interconnected with an external liquid supply system through a liquid cooling connector. The technical problem of organic combination of micro-channels in microscale and complex macroscopic system equipment is solved by adopting the scheme of the invention; the problem of uniform heat dissipation of the arrayed micro-channel is solved by gradually increasing the channel size.
Description
Technical Field
The invention relates to the technical field of microelectronic heat dissipation, in particular to a novel multi-scale heat management structure and a micro-assembly method.
Background
In the next generation information system, the aperture of the radio frequency array is developed towards the direction of longer action distance and smaller volume, and a GaN chip and an array system are widely adopted. However, in the microwave range, GaN devices have very high power density and the self-heating effect is quite severe. For example, GaN HEMT devices can achieve power densities that are 10 times higher than conventional Si and GaAs devices; the heat flux density is greatly improved even up to 600W/cm 2 The above.
The traditional passive heat dissipation technology cannot meet the heat dissipation requirement of the high-power GaN chip. This is because: the traditional passive heat dissipation adopts metal heat sink, and the heat dissipation is realized through metal heat conduction and heat radiation, so that the heat dissipation is not suitable for large heat flow density heat transfer, and the heat dissipation device is large in size and heavy in weight; the traditional active heat dissipation technology comprises forced air cooling or forced liquid circulation refrigeration, and heat dissipation is carried out through rapid circulation of air and liquid or liquid phase change heat dissipation, so that the defects of high power consumption, large volume and low efficiency of a heat dissipation system are overcome, and the traditional active heat dissipation technology is not suitable for small-space efficient heat dissipation.
Thermal management techniques that utilize microscale fluids to achieve enhanced heat dissipation have become an important solution. Compared with passive heat dissipation and traditional active heat dissipation, the micro-channel heat dissipation technology has unique advantages. On one hand, the micro-channel heat dissipation technology using liquid as a cooling medium can realize heat transfer with large heat flow density; on the other hand, the heat convection coefficient of the liquid flowing heat exchange in the micro-channel is inversely proportional to the equivalent size of the channel, so that the heat exchange effect can be obviously improved while the equivalent size of the channel is reduced, and the volume can be greatly reduced, so that the structural size and the weight of the whole heat dissipation system are greatly simplified and reduced. Therefore, the micro-channel heat dissipation technology has wide application prospect in the fields of micro-system integration, high-power electronic devices and the like.
In the array system and the power amplifier assembly based on the GaN chip, the heat source distribution is characterized by multilayer stacking in the vertical direction and array arrangement in the horizontal direction; besides improving the heat dissipation capability of the terminal heat sink, a novel multi-scale heat management structure is constructed by comprehensively considering the system level, and the integrated assembly and integration of the multi-scale heat management structure of a chip-level micron-scale flow channel, a packaging-level millimeter-scale micro-flow channel and a system-level centimeter-scale liquid supply network are realized.
At present, there are many patents related to micro-channel heat dissipation, such as CN201710377322.1 and CN 201810412925.5. However, how to integrate micro-channels into a system and organically combine micro-channels with complex macro-system equipment to construct a novel multi-scale thermal management structure is rarely reported.
Disclosure of Invention
Aiming at the problems in the prior art, the invention aims to provide a novel micro-assembly method for a multi-scale heat management structure, which can form an array and system-level heat management structure while realizing high heat flux density heat dissipation in a local area, and meet the application requirements of the next-generation high-power information system. The novel multi-scale heat management structure is characterized by comprising a chip-level micron-scale heat dissipation micro-channel, a packaging-level millimeter-scale micro-channel and a system-level centimeter-scale macro liquid supply network.
The technical scheme adopted by the invention is as follows: a novel multi-scale thermal management structure, comprising: the high-power chip is integrated with the chip-level micron-scale heat dissipation micro-channel through low-cavity welding and low thermal resistance, and the chip-level micron-scale heat dissipation micro-channel and the packaging-level millimeter-scale micro-channel are connected with each other through airtight welding to realize the interconnection of a liquid network; the packaging-level millimeter-scale micro-channel and the system-level centimeter-scale macroscopic liquid supply network are interconnected by adopting a bi-pass watertight connector; and the system-level centimeter-scale macroscopic liquid supply network is interconnected with an external liquid supply system through a liquid cooling connector.
Furthermore, the chip-scale micro-scale heat dissipation micro-channel is a silicon-based micro-channel, the top metallization layer of the micro-channel meets the requirement of low-cavity welding, and the bottom metallization layer of the micro-channel meets the requirement of airtight welding; in the chip-scale micron-scale heat dissipation micro-channel, the size of the channel is between 10 and 100 mu m; the external fluid interface is positioned at the bottom of the micro-channel and is used for being connected with the packaging-level millimeter-scale micro-channel.
Furthermore, the packaging-level millimeter-scale micro-channel is a metal box body of the integrated micro-channel, and a metallization layer of the packaging-level millimeter-scale micro-channel meets the airtight welding requirement of the chip-level micrometer-scale heat dissipation micro-channel and the packaging-level millimeter-scale micro-channel; in the packaging-level millimeter-scale micro-flow channel, the size of the flow channel is between 100 mu m and 5 mm; the top and the bottom of the packaging-level millimeter-scale micro-channel are provided with external interfaces, the top external interface is used for being interconnected with the chip-level micrometer-scale heat dissipation micro-channel, and the bottom external interface is used for being interconnected with a system-level centimeter-scale macro liquid supply network.
Furthermore, the system-level centimeter-scale macroscopic liquid supply network is a large-size metal box body of an integrated shunt network, and the size of a flow channel is between 1mm and 1 cm; external interfaces are arranged at the top and the bottom of the system-level centimeter-scale macroscopic liquid supply network, the top external interfaces are used for being interconnected with a packaging-level millimeter-scale micro-channel, and the bottom external interfaces are used for being interconnected with an external liquid supply system.
Furthermore, the sizes of the external fluid interface of the chip-level micron-scale heat dissipation micro-channel and the external interface at the top of the packaging-level micron-scale micro-channel are both 500 micrometers-3 mm; the sizes of the external interface at the bottom of the packaging-level millimeter-scale micro-channel and the external interface at the top of the system-level centimeter-scale macro liquid supply network are both 1 mm-3 cm; the sizes of external interfaces of the system-level centimeter-scale macroscopic liquid supply network are all between 1cm and 10 cm.
Furthermore, the external interface of the chip-level micron-scale heat dissipation micro-channel, the packaging-level millimeter-scale micro-channel and the system-level centimeter-scale macro liquid supply network is one of a round, an oval or a square shape; the interfaces at the interconnection are the same in shape.
Further, the low thermal resistance is integrated into a gold-germanium eutectic or nano silver paste sintering welding process.
Further, the airtight welding is a gold-tin eutectic process or other welding processes resistant to fluid corrosion.
Furthermore, the packaging-level millimeter-scale micro-flow channel is provided with a plurality of top interfaces and can correspondingly interconnect a plurality of chip-level micrometer-scale heat dissipation micro-flow channels.
The invention also provides a novel micro-assembly method of the multi-scale heat management structure, which comprises the following steps:
step 1, welding a low cavity of a high-power chip on the surface of a micron-scale silicon-based micro-channel by adopting a low-thermal resistance integration process;
and 4, interconnecting the large-size metal box body integrated with the shunt network with an external liquid supply system through a liquid cooling connector.
Compared with the prior art, the beneficial effects of adopting the technical scheme are as follows:
(1) aiming at the array system and the power amplifier assembly based on the GaN chip, the heat dissipation efficiency of the tail end heat sink is obviously improved through the enhanced heat dissipation effect of the chip-level micron-scale heat dissipation micro-channel, and 600W/cm is realized 2 The above local high heat dissipation capability; the system level is comprehensively considered, a multi-scale heat management structure spanning a chip-level micron-scale micro-channel, a packaging-level millimeter-scale micro-channel and a system-level centimeter-scale liquid supply network is constructed, and the technical problem of organic combination of the micro-scale micro-channel and complex macro system equipment is solved; by the gradual increase of the flow passage dimension, the problem is solvedThe problem of uniform heat dissipation of the arrayed micro-channels is solved.
(2) By using a multi-temperature gradient welding technology, the airtight welding of the chip-level micron-scale flow channel and the packaging-level millimeter-scale micro flow channel is realized at a packaging level, the watertight connection of the packaging-level millimeter-scale micro flow channel and the system-level centimeter-scale liquid supply network is realized at a system level, and the heat dissipation requirement of an array system can be met.
Drawings
FIG. 1 is a schematic cross-sectional view of a multi-scale thermal management structure of the present invention.
FIG. 2 is a schematic cross-sectional view of a chip-scale micro-scale heat dissipation micro-channel of the present invention.
FIG. 3 is a schematic diagram of the front side of the package-level millimeter-scale micro flow channel of the present invention.
FIG. 4 is a cross-sectional view of a package-level millimeter-scale micro flow channel according to the present invention.
FIG. 5 is a schematic cross-sectional view of a system-level centimeter-scale macroscopic liquid supply network of the present invention.
Reference numerals: 1. a high-power chip; 2. a chip-scale micron-scale heat dissipation micro-channel; 3. a microscale representative flow channel; 4. a chip-scale micro-scale heat dissipation micro-channel external fluid interface; 5. packaging the millimeter-scale micro-channel; 6. packaging the external interface at the top of the millimeter-scale micro-channel; 7. a typical flow path of millimeter scale; 8. packaging the bottom external interface of the millimeter-scale micro-channel; 9. a bi-pass watertight connector; 10. a system level centimeter scale macro liquid supply network; 11. a system level centimeter scale macroscopic liquid supply network top external interface; 12. a typical flow channel of centimeter scale; 13. a system level centimeter scale macroscopic liquid supply network bottom external interface; 14. a liquid-cooled connector.
Detailed Description
The invention is further described below with reference to the accompanying drawings.
As shown in fig. 1, the present invention provides a novel multi-scale thermal management structure, comprising: the high-power chip is integrated with the chip-level micron-scale heat dissipation micro-channel through low-cavity welding and low thermal resistance, and the chip-level micron-scale heat dissipation micro-channel and the packaging-level millimeter-scale micro-channel are connected with each other through airtight welding to realize the interconnection of a liquid network; the packaging-level millimeter-scale micro-channel and the system-level centimeter-scale macroscopic liquid supply network are interconnected by adopting a bi-pass watertight connector; and the system-level centimeter-scale macroscopic liquid supply network is interconnected with an external liquid supply system through a liquid cooling connector.
In a preferred embodiment, the high-power chip is a high-power GaN chip, and the bottom metallization layer meets the requirement of low-hole welding.
As shown in fig. 2, the chip-scale micro-scale heat dissipation micro-channel is a silicon-based micro-channel, the top metallization layer of which meets the requirement of low-cavity welding, and the bottom metallization layer of which meets the requirement of airtight welding; the silicon-based MEMS is adopted for preparation.
In the chip-level micron-scale heat dissipation micro-channel, the scale of the scale channel is between 10 and 100 mu m; the external fluid interface is positioned at the bottom of the micro-channel and is used for being connected with the packaging-level millimeter-scale micro-channel.
As shown in fig. 3 and 4, the package-level millimeter-scale micro flow channel is a metal cartridge body of the integrated micro flow channel, the metalized layer of the package-level millimeter-scale micro flow channel meets the airtight welding requirement of the chip-level micrometer-scale heat dissipation micro flow channel and the package-level millimeter-scale micro flow channel, and the package-level millimeter-scale micro flow channel is prepared by combining a precise metal machining technology and a vacuum diffusion welding technology;
in the packaging-level millimeter-scale micro-flow channel, the size of the flow channel is between 100 mu m and 5 mm; the top and the bottom of the packaging-level millimeter-scale micro-channel are provided with external interfaces, the top external interface is used for being interconnected with the chip-level micrometer-scale heat dissipation micro-channel, and the bottom external interface is used for being interconnected with a system-level centimeter-scale macro liquid supply network.
As shown in fig. 5, the system-level centimeter-scale macroscopic liquid supply network is a large-size metal box body of the integrated shunt network, and is prepared by adopting a metal 3D printing technology, and the size of a flow channel is between 1mm and 1 cm; external interfaces are arranged at the top and the bottom of the system-level centimeter-scale macroscopic liquid supply network, the top external interfaces are used for being interconnected with a packaging-level millimeter-scale micro-channel, and the bottom external interfaces are used for being interconnected with an external liquid supply system.
In a preferred embodiment, the sizes of the external fluid interface of the chip-level micron-scale heat dissipation micro-channel and the external interface at the top of the packaging-level micron-scale micro-channel are both 500 μm-3 mm; the sizes of the external interface at the bottom of the packaging-level millimeter-scale micro-channel and the external interface at the top of the system-level centimeter-scale macro liquid supply network are both 1 mm-3 cm; the sizes of external interfaces of the system-level centimeter-scale macroscopic liquid supply network are all between 1cm and 10 cm.
In a preferred embodiment, the external interface of the chip-scale micro-scale heat dissipation micro-channel, the package-scale micro-channel and the system-level centimeter-scale macro liquid supply network is one of a circle, an ellipse or a square; the interfaces at the interconnection are the same in shape.
In this embodiment, the channel dimension of the chip-scale microscale heat dissipation microchannel is 50 micrometers; the external fluidic interface is circular with a typical interface size of 1 mm.
The flow channel size of the packaging-level millimeter-scale micro-flow channel is 1 mm; the external interface at the top of the packaging-level millimeter-scale micro-channel is circular, and the size of the interface is 1 mm; the bottom-to-outer fluid interface of the packaging-level millimeter-scale micro-flow channel is circular, and the size of the interface is 3 mm.
The size of a flow channel in the system-level centimeter-scale macroscopic liquid supply network is 1 cm; the external interface at the top of the system-level centimeter-scale macroscopic liquid supply network is circular, and the size of the interface is 3 mm; the external interface at the bottom of the system-level centimeter-scale macroscopic liquid supply network is circular, and the size of the interface is 1 cm.
In a preferred embodiment, the low thermal resistance is integrated into a nano silver paste sintering soldering process.
In a preferred embodiment, the hermetic soldering is a gold-tin eutectic process.
In a preferred embodiment, the package-level millimeter-scale micro-fluidic channel has a plurality of top interfaces, and can correspondingly interconnect a plurality of chip-level micrometer-scale heat dissipation micro-fluidic channels.
The invention also provides a novel micro-assembly method of the multi-scale heat management structure, which comprises the following steps:
step 1, welding a low cavity of a high-power chip on the surface of a micron-scale silicon-based micro-channel by adopting a nano silver paste sintering process;
and 4, interconnecting the large-size metal box body integrated with the shunt network with an external liquid supply system through a liquid cooling connector.
The high-power chip is integrated with the three structures by a micro-assembly method. Wherein, the integrated temperature gradient of the micro-assembly method is more than or equal to 3.
By adopting the novel multi-scale heat management structure micro-assembly method, the multi-scale heat management structure spanning a chip-level micro-scale micro-channel, a packaging-level micro-scale micro-channel and a system-level centimeter-scale liquid supply network is constructed, and the technical problem of organic combination of the micro-scale micro-channel and complex macro-system equipment is solved; the problem of uniform heat dissipation of the arrayed micro-channel is solved by gradually increasing the channel size. The airtight welding of the chip-level micron-scale flow channel and the packaging-level millimeter-scale micro flow channel is realized at the packaging level, the watertight connection of the packaging-level millimeter-scale micro flow channel and the system-level centimeter-scale liquid supply network is realized at the system level, and the heat dissipation requirement of the array system can be met. The local heat dissipation capacity can reach 600W/cm 2 The above. However, the common single-scale micro-channel radiator or heat dissipation network cannot realize the array and local high heat dissipation capability at the same time.
The invention is not limited to the foregoing embodiments. The invention extends to any novel feature or any novel combination of features disclosed in this specification, and to any novel method or process steps or any novel combination of steps disclosed. Those skilled in the art to which the invention pertains will appreciate that insubstantial changes or modifications can be made without departing from the spirit of the invention as defined by the appended claims.
All of the features disclosed in this specification, or all of the steps in any method or process so disclosed, may be combined in any combination, except combinations of features and/or steps that are mutually exclusive.
Any feature disclosed in this specification may be replaced by alternative features serving equivalent or similar purposes, unless expressly stated otherwise. That is, unless expressly stated otherwise, each feature is only an example of a generic series of equivalent or similar features.
Claims (10)
1. A novel multi-scale thermal management structure, comprising: the high-power chip is integrated with the chip-level micron-scale heat dissipation micro-channel through low-cavity welding and low thermal resistance, and the chip-level micron-scale heat dissipation micro-channel and the packaging-level millimeter-scale micro-channel are connected with each other through airtight welding to realize the interconnection of a liquid network; the packaging-level millimeter-scale micro-channel and the system-level centimeter-scale macroscopic liquid supply network are interconnected by adopting a bi-pass watertight connector; the system level centimeter scale macroscopic liquid supply network is interconnected with an external liquid supply system through a liquid cooling connector;
the chip-level microscale heat dissipation micro-channel is a silicon-based micro-channel, and an external fluid interface is positioned at the bottom of the micro-channel;
the packaging-level millimeter-scale micro-channel is a metal box body of the integrated micro-channel, and the top and the bottom of the packaging-level millimeter-scale micro-channel are both provided with external interfaces;
the system-level centimeter-scale macroscopic liquid supply network is a large-size metal box body of an integrated shunt network, and external interfaces are arranged at the top and the bottom of the system-level centimeter-scale macroscopic liquid supply network.
2. The novel multi-scale thermal management structure of claim 1, wherein the top metallization layer of the chip-scale micro-scale heat dissipation micro-fluidic channel meets the requirements of low-cavity soldering, and the bottom metallization layer meets the requirements of hermetic soldering; in the chip-scale micron-scale heat dissipation micro-channel, the size of the channel is 10-100 mu m; the external fluid interface is used for connecting with a packaging-level millimeter-scale micro-channel.
3. The novel multi-scale thermal management structure of claim 2, wherein the metallization layer of the package-level millimeter-scale micro-fluidic channel meets the hermetic welding requirements of the chip-level micrometer-scale heat dissipation micro-fluidic channel and the package-level millimeter-scale micro-fluidic channel; in the packaging-level millimeter-scale micro-flow channel, the size of the flow channel is between 100 mu m and 5 mm; the top external interface of the packaging-level millimeter-scale micro-channel is used for being interconnected with the chip-level micrometer-scale heat dissipation micro-channel, and the bottom external interface is used for being interconnected with the system-level centimeter-scale macro liquid supply network.
4. The novel multi-scale thermal management structure according to claim 3, wherein the system level centimeter scale macro liquid supply network has a flow channel scale between 1mm and 1 cm; and the top external interface of the system-level centimeter-scale macroscopic liquid supply network is used for being interconnected with the packaging-level millimeter-scale micro-channel, and the bottom external interface is used for being interconnected with an external liquid supply system.
5. The novel multi-scale heat management structure according to claim 4, wherein the sizes of the external fluid interface of the chip-level micro-scale heat dissipation micro-channel and the external interface at the top of the packaging-level micro-scale micro-channel are both 500 μm-3 mm; the sizes of the external interface at the bottom of the packaging-level millimeter-scale micro-channel and the external interface at the top of the system-level centimeter-scale macro liquid supply network are both 1 mm-3 cm; and the sizes of external interfaces of the system-level centimeter-scale macroscopic liquid supply network are all between 1cm and 10 cm.
6. The novel multi-scale thermal management structure according to any one of claims 2 to 5, wherein the external interface of the chip-scale micro-scale heat dissipation micro-channel, the package-scale micro-channel and the system-level centimeter-scale macro liquid supply network is one of a circle, an ellipse or a square; the interfaces at the interconnection are the same in shape.
7. The novel multi-scale thermal management structure of claim 1, wherein the low thermal resistance integration is a gold germanium eutectic or nano silver paste sintering welding process.
8. The novel multi-scale thermal management structure of claim 1, wherein the hermetic solder is a gold-tin eutectic process.
9. The novel multi-scale thermal management structure of claim 6, wherein the package-level micro-scale fluidic channels have a plurality of top interfaces for interconnecting a plurality of chip-level micro-scale heat dissipation fluidic channels.
10. A novel micro-assembly method for a multi-scale heat management structure is characterized by comprising the following steps:
step 1, welding a low cavity of a high-power chip on the surface of a micron-scale silicon-based micro-channel by adopting a low-thermal resistance integration process;
step 2, welding the micron-scale silicon-based micro-channel on a metal packaging box body of the integrated micro-channel by adopting an airtight welding process;
step 3, interconnecting the metal packaging box body to a large-size metal box body of the integrated shunt network by adopting a two-way watertight connector splicing process;
and 4, interconnecting the large-size metal box body integrated with the shunt network with an external liquid supply system through a liquid cooling connector.
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| CN113299618B (en) * | 2021-04-29 | 2023-07-14 | 中国电子科技集团公司第二十九研究所 | Three-dimensional integrated high-efficiency heat dissipation packaging structure and preparation method thereof |
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| CN113611695B (en) * | 2021-07-12 | 2022-08-05 | 南京中电芯谷高频器件产业技术研究院有限公司 | Van-level GaN-based solid-state power source system and manufacturing method thereof |
| CN113784501B (en) * | 2021-08-17 | 2022-12-13 | 中国电子科技集团公司第二十九研究所 | Micro-channel embedded printed circuit board integrated structure and manufacturing method |
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| CN107275297A (en) * | 2017-05-25 | 2017-10-20 | 中国电子科技集团公司第二十九研究所 | A kind of microfluid heat dissipation channel, heat dissipating method and preparation method |
| CN108666283A (en) * | 2018-05-03 | 2018-10-16 | 中国电子科技集团公司第二十九研究所 | A kind of microchannel heat sink structure and preparation method thereof |
| CN109411427A (en) * | 2018-09-06 | 2019-03-01 | 中国电子科技集团公司第二十九研究所 | A kind of fluid channel Radiator and its preparation method |
| CN109524373A (en) * | 2018-11-19 | 2019-03-26 | 中国电子科技集团公司第五十八研究所 | The three-dimensional active heat removal encapsulating structure and its manufacture craft of embedded fluid channel |
| CN110255490A (en) * | 2019-06-26 | 2019-09-20 | 中国电子科技集团公司第三十八研究所 | Integrated fluid channel radiator structure, preparation method and wafer level packaging structure |
| CN110707059A (en) * | 2019-09-26 | 2020-01-17 | 上海交通大学 | Multi-dimensional mesh-shaped mixed micro-channel fluid radiator |
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