CN107275297A - A kind of microfluid heat dissipation channel, heat dissipating method and preparation method - Google Patents
A kind of microfluid heat dissipation channel, heat dissipating method and preparation method Download PDFInfo
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- CN107275297A CN107275297A CN201710377322.1A CN201710377322A CN107275297A CN 107275297 A CN107275297 A CN 107275297A CN 201710377322 A CN201710377322 A CN 201710377322A CN 107275297 A CN107275297 A CN 107275297A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
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- H—ELECTRICITY
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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Abstract
The invention belongs to microelectronics technical field of heat dissipation, the problem of existing for prior art, the present invention provides a kind of microfluid heat dissipation channel, heat dissipating method and preparation method.The preparation method realizes the all-metal radiating microchannel based on distributed jet structure by techniques such as photoetching, the micro- electroforming of metal and metal bondings.The present invention corresponds on bottom, intermediate layer and top-level metallic substrate and to prepare corresponding microstructural mold using light-sensitive material respectively；By metal microelectroforming technology, microstructural mold transfer is prepared into metal micro structure A；Hole machined is carried out to metal micro structure A by laser assisted microprocessing technique, the metal micro structure B with opening is formed；After being chemically-mechanicapolish polished to metal micro structure B, by metal bonding technique, the microfluid heat dissipation channel based on distributed jet structure is formed.
Description
Technical field
The invention belongs to microelectronics technical field of heat dissipation, especially a kind of microfluid heat dissipation channel, heat dissipating method and preparation
Method.
Background technology
With the increase and the lifting of integrated level of chip power, the caloric value of chip is significantly increased；Traditional long-range radiating
Technology can not meet the radiating requirements of high-power chip.Heat-sinking capability is not enough, chip efficiency can be caused to reduce, even resulted in
Chip failure；Therefore, it is necessary to using new cooling technology.
Microfluid heat dissipation technology is a kind of emerging embedded chip level enhancing cooling technology.It passes through the continuous of minute yardstick
Fluid is directly cooled down to chip, and each heat sink thermal resistance is reduced in long-range radiating mode to greatest extent to radiating efficiency
Influence, so as to significantly lift the cooling effectiveness of chip.
Microfluid heat dissipation technology based on distributed jet structure is a kind of efficient microfluid heat dissipation technology.Its typical case
Structure is generally included：Positioned at the inlet and liquid outlet of structural base；The straight-through runner being connected respectively with inlet and liquid outlet；
With the distributed inlet opening and return port of straight-through flow passage；And positioned at the distributed jet of structural top.This radiating skill
Art produces the fluid of spurting using distributed jet.Chip realizes cooling by this continuous fluid.With it is simple straight
Logical fluid channel is compared, and the type of cooling of this spurting significantly improves the flow regime of coolant, and cooling effectiveness is higher.
Deep silicon dry etch process commonly used in the trade, bonding technology prepare silicon substrate microfluid heat dissipation channel, and this method is difficult
Prepare labyrinth；And depth silicon dry etch process technical difficulty is higher, high processing costs.
John et al. (Embedded Cooling Of High Heat Flux Electronics Utilizing
Distributed Microfluidic Impingement Jets,Proceedings of the ASME 2015
International Technical Conference and Exhibition on Packaging and
Integration of Electronic and Photonic Microsystems InterPACK2015July 6-9,
2015, San Francisco, California, USA) add the technique of the micro- electroforming of metal to be prepared for being based on dividing using successively photoetching
The all-metal microfluid heat dissipation channel of cloth nozzle arrangements.But, this technique depends on vacuum coating technology (thermal evaporation, electricity
Beamlet evaporation and magnetron sputtering etc.) Seed Layer is prepared, high processing costs, processing efficiency are low.
The content of the invention
The technical problems to be solved by the invention are：The problem of existing for prior art is radiated there is provided a kind of microfluid
Passage, heat dissipating method and preparation method.The preparation method realizes base by techniques such as photoetching, the micro- electroforming of metal and metal bondings
In the all-metal radiating microchannel of distributed jet structure.This method and technology is simple, it is not necessary to dry etching and vacuum coating
Technology, cost is relatively low.The microfluid heat dissipation channel radiating efficiency is high.
The technical solution adopted by the present invention is as follows：
A kind of microfluid heat dissipation channel preparation method includes：
Correspond to respectively on bottom, intermediate layer and top-level metallic substrate and to prepare corresponding micro-structural mould using light-sensitive material
Tool；
By metal microelectroforming technology, microstructural mold transfer is prepared into metal micro structure A；
Hole machined is carried out to metal micro structure A by laser assisted microprocessing technique, the micro- knot of metal with opening is formed
Structure B；
After being chemically-mechanicapolish polished to metal micro structure B, by metal bonding technique, formed and be based on distributed jet knot
The microfluid heat dissipation channel of structure.
Further, the metal micro structure A preparation methods are：
By metal microelectroforming technology, using described microstructural mold, the top-level metallic with cylinder boss is made
Substrate, the intermediate layer metal substrate with straight-through feed liquor runner and the underlying metal substrate with straight-through return flow line；It is described
Cylinder boss bottom correspondence and the straight-through feed liquor flow passage of intermediate layer metal substrate；Top-level metallic substrate, metallic intermediate layer
Substrate and underlying metal substrate all have marginal texture.
The straight-through feed liquor runner is n rows；The straight-through backflow runner is n+1 rows or n-1 rows；Straight-through feed liquor runner with
Straight-through backflow runner is spaced in two metallic substrate layers to be correspondingly arranged.
Further, the metal micro structure B preparation methods are：
Processed and straight-through return flow line communicating position pair on metal micro structure A top-level metallic substrate by laser technology
The return port that should and connect；The round-meshed nozzle arrangements of tool will be processed at the top of cylinder boss, while convex in each cylinder
Platform bottom processes inlet opening；
P return port is processed on metal micro structure A intermediate layer metal substrate by laser technology, while in intermediate layer
Metal substrate is processed with leading directly to the inlet that feed pathway is connected；The backflow hole site processed on top-level metallic substrate and centre
The position of return port in layer metal substrate is corresponded；
Processed by laser technology on metal micro structure A underlying metal substrate and straight-through return flow line is connected goes out liquid
Mouthful, while processing and inlet correspondingly-sized, the inlet of correspondence position on intermediate layer on underlying metal substrate；
The return port is connected with straight-through return flow line and liquid outlet；The inlet opening is connected with inlet.
Further, the nozzle arrangements are arranged on top-level metallic substrate center, and n rows m row nozzles are set altogether.
Further, it is described that metal micro structure B progress chemically mechanical polishings are referred to serving as a contrast metal structure B top-level metallics
Basal surface, intermediate layer metal substrate surface and underlying metal substrate surface are chemically-mechanicapolish polished；The surface it is coarse
Spend RMS small less than or equal to 10nm.
Further, the radiation processes include：
Coolant is sprayed after passing sequentially through inlet, straight-through feed liquor runner, inlet opening and the nozzle of microfluid heat dissipation channel
Go out；Then spray the coolant fallen and pass sequentially through return port, straight-through backflow runner, liquid outlet outflow.
Heat dissipation channel using microfluid heat dissipation channel preparation method includes：
Top layer microfluid heat-dissipating channel structure, for by electroforming process, microstructural mold transfer being prepared into metal micro-
Structure A, is made the top-level metallic substrate with cylinder boss；Then it is golden in metal micro structure A top layer by laser technology
Belong to the return port that processing on substrate is corresponding with straight-through return flow line position and connects；It will be processed at the top of cylinder boss with circle
The nozzle arrangements in hole, while processing inlet opening in each cylinder boss bottom；
Intermediate layer microfluid heat-dissipating channel structure, for by electroforming process, microstructural mold transfer to be prepared into metal
Micro-structural A, is made the intermediate layer metal substrate with straight-through feed liquor runner；Then by laser technology metal micro structure A's
P return port is processed on intermediate layer metal substrate, while being processed in intermediate layer metal substrate and leading directly to feed pathway UNICOM
Inlet；Top-level metallic substrate upper return port position and the position of intermediate layer metal substrate upper return port are corresponded；
Bottom microfluid heat-dissipating channel structure, for by electroforming process, microstructural mold transfer being prepared into metal micro-
Structure A, is made with straight-through return flow line underlying metal substrate；By being processed on metal micro structure A underlying metal substrate
The liquid outlet connected with straight-through return flow line, while processing corresponding with inlet correspondingly-sized on intermediate layer in underlying metal substrate
The inlet of position；
The microfluid heat dissipation channel of distributed jet structure, for top layer microfluid heat-dissipating channel structure, intermediate layer to be micro-
Fluid for radiating heat channel design, after bottom microfluid heat-dissipating channel structure surface is all polished, is carried out using metal bonding technique
Processing, forms the microfluid heat dissipation channel based on distributed jet structure, wherein cylinder boss bottom correspondence and centre
The straight-through feed liquor flow passage of layer metal substrate；Top-level metallic substrate, intermediate layer metal substrate and top-level metallic substrate all have
There is marginal texture；
The return port is connected with straight-through return flow line；The inlet opening is connected with inlet.
Further, the straight-through feed liquor runner is n rows；The liquid runner that leads directly to out leads directly to for n+1 rows or n-1 rows
Feed liquor runner is spaced in two metallic substrate layers with straight-through backflow runner and is correspondingly arranged；The nozzle arrangements are arranged on top layer gold
Belong to substrate center, n rows m row nozzles are set altogether.
Further, it is described that metal micro structure B progress chemically mechanical polishings are referred to serving as a contrast metal structure B top-level metallics
Basal surface, intermediate layer metal substrate surface and underlying metal substrate surface are chemically-mechanicapolish polished；The surface it is coarse
Spend RMS and be less than or equal to 10nm.
In summary, by adopting the above-described technical solution, the beneficial effects of the invention are as follows：
(1) silicon substrate fluid channel commonly used in the trade is replaced using all-metal microfluid heat dissipation channel, it is not necessary to which deep silicon dry method is carved
Etching technique, technical difficulty is low.
(2) layering electroforming and metal bonding technique have been used, it is not necessary to which technique for vacuum coating, processing cost is low.
(3) the microfluid heat dissipation channel radiating efficiency obtained is high, is more than the three times of traditional heat-dissipating method.
Brief description of the drawings
Examples of the present invention will be described by way of reference to the accompanying drawings, wherein：
Fig. 1 is the microfluid heat-dissipating channel structure schematic diagram based on distributed jet structure.
Fig. 2 is the microfluid heat-dissipating channel structure exploded view based on distributed jet structure.
Fig. 3 is the process schematic diagram of heat dissipation channel.
It is metal structure A, metal structure B with metal structure C-shaped into schematic diagram that Fig. 4 a, Fig. 4 b, Fig. 4 c are corresponded to respectively.
Embodiment
All features disclosed in this specification, or disclosed all methods or during the step of, except mutually exclusive
Feature and/or step beyond, can combine in any way.
Any feature disclosed in this specification, unless specifically stated otherwise, can be equivalent by other or with similar purpose
Alternative features are replaced.I.e., unless specifically stated otherwise, each feature is an example in a series of equivalent or similar characteristics
.
Related description of the present invention：
1st, direct current backflow runner and direct current feed liquor runner coolant flow direction are on the contrary, location interval is set.
2nd, top-level metallic substrate, intermediate layer metal substrate and underlying metal substrate all have marginal texture, and its effect is
Mechanical support；Complete after metal bonding technique, closing space is formed by marginal texture.
3rd, m, n, p are greater than 0 integer.According to the difference of area of dissipation, m, n, p choose different numerical value.M, n, p's
Representative value is 15,5,70.
Embodiment one：
Step 1：The metal substrate that surface roughness RMS is less than 10nm is provided.
Preferably, the metal is copper.
Preferably, the quantity of the metal substrate be three, respectively top-level metallic substrate, intermediate layer metal substrate and
Underlying metal substrate.
Step 2：Respectively microstructural mold is prepared in three-layer metal substrate surface using photoresist or photosensitive dry film.
Step 3：The structure is translated into by metal structure A (such as Fig. 4 (a)) by electroforming process.
Preferably, the electroforming process is copper electroforming process.
Preferably, described metal structure A is three-decker, is respectively：
(a) the straight-through backflow runner on underlying substrate surface；
(b) the straight-through feed liquor runner of intermediate layer substrate surface；
(c) the cylinder boss of top layer substrate surface.
Step 4：Using laser processing technology, microfabrication is carried out to the metal structure A described in step 3, metal is obtained
Structure B (Fig. 4 (b)).
Preferably, described laser assisted microprocessing process is respectively：
(a) inlet and liquid outlet are processed in underlying substrate；
(b) inlet and return port are processed on the substrate of intermediate layer；
(c) distributed jet, inlet opening and return port are processed on top layer substrate；Wherein, nozzle is located in metal structure A
(return port of top layer substrate is identical with the return port size on the substrate of intermediate layer, and position is one by one at the center of the cylinder boss
Correspondence).
Step 5：Metal structure B surface is chemically-mechanicapolish polished, photoresist or photosensitive dry film is then removed.
Step 6：Using metal bonding technique, the multi-layer metal structure B after chemically mechanical polishing is bonded, gold is obtained
Belong to structure C (Fig. 4 (c)).
Preferably, described metal bonding technique is copper copper bonding technology.
Obtained microfluid heat dissipation channel is welded on chip bottom, the mixed solution using water and glycerine is used as cooling
Liquid, is tested its heat dispersion：Its radiating efficiency is more than the three times of traditional heat-dissipating method.
The invention is not limited in foregoing embodiment.The present invention, which is expanded to, any in this manual to be disclosed
New feature or any new combination, and disclose any new method or process the step of or any new combination.
Claims (10)
1. a kind of microfluid heat dissipation channel preparation method, it is characterised in that including：
Correspond to respectively on bottom, intermediate layer and top-level metallic substrate and to prepare corresponding microstructural mold using light-sensitive material；
By metal microelectroforming technology, microstructural mold transfer is prepared into metal micro structure A；
Hole machined is carried out to metal micro structure A by laser assisted microprocessing technique, the metal micro structure B with opening is formed；
After being chemically-mechanicapolish polished to metal micro structure B, by metal bonding technique, formed based on distributed jet structure
Microfluid heat dissipation channel.
2. a kind of microfluid heat dissipation channel preparation method according to claim 1, it is characterised in that the metal micro structure A
Preparation method is：
By metal microelectroforming technology, using described microstructural mold, be made the top-level metallic substrate with cylinder boss,
Intermediate layer metal substrate with straight-through feed liquor runner and the underlying metal substrate with straight-through return flow line；The cylinder
Boss bottom correspondence and the straight-through feed liquor flow passage of intermediate layer metal substrate；Top-level metallic substrate, intermediate layer metal substrate with
And underlying metal substrate all has marginal texture.
3. a kind of microfluid heat dissipation channel preparation method according to claim 2, it is characterised in that the straight-through feed liquor stream
Road is n rows；The straight-through backflow runner is n+1 rows or n-1 rows；Straight-through feed liquor runner is with straight-through backflow runner in two metals
Interval is correspondingly arranged on substrate layer.
4. a kind of microfluid heat dissipation channel preparation method according to claim 1, it is characterised in that the metal micro structure B
Preparation method is：
Processed by laser technology on metal micro structure A top-level metallic substrate it is corresponding with straight-through return flow line communicating position and
The return port of connection；The round-meshed nozzle arrangements of tool will be processed at the top of cylinder boss, while at each cylinder boss bottom
Portion processes inlet opening；
P return port is processed on metal micro structure A intermediate layer metal substrate by laser technology, while in metallic intermediate layer
Substrate is processed with leading directly to the inlet that feed pathway is connected；The backflow hole site processed on top-level metallic substrate and intermediate layer gold
The position for belonging to the return port on substrate is corresponded；
The liquid outlet connected with straight-through return flow line is processed on metal micro structure A underlying metal substrate by laser technology,
Processed simultaneously on underlying metal substrate and inlet correspondingly-sized, the inlet of correspondence position on intermediate layer；
The return port is connected with straight-through return flow line and liquid outlet；The inlet opening is connected with inlet.
5. a kind of microfluid heat dissipation channel preparation method according to claim 4, it is characterised in that the nozzle arrangements are set
Put in top-level metallic substrate center, n rows m row nozzles are set altogether.
6. a kind of microfluid heat dissipation channel preparation method according to claim 1, it is characterised in that enter to metal micro structure B
Row chemically mechanical polishing is referred to metal structure B top-level metallics substrate surface, intermediate layer metal substrate surface and bottom gold
Category substrate surface is chemically-mechanicapolish polished；The roughness RMS on the surface is less than or equal to 10nm.
7. the heat dissipating method based on microfluid heat dissipation channel preparation method described in claim 4, it is characterised in that radiation processes bag
Include：
Coolant sprays after passing sequentially through inlet, straight-through feed liquor runner, inlet opening and the nozzle of microfluid heat dissipation channel；So
The coolant fallen is sprayed afterwards passes sequentially through return port, straight-through backflow runner, liquid outlet outflow.
8. the heat dissipation channel based on microfluid heat dissipation channel preparation method described in claim 4, it is characterised in that including：
Top layer microfluid heat-dissipating channel structure, for by electroforming process, microstructural mold transfer to be prepared into metal micro structure
A, is made the top-level metallic substrate with cylinder boss；Then the top-level metallic by laser technology in metal micro structure A is served as a contrast
Corresponding with straight-through return flow line position and connection return port is processed on bottom；By being processed at the top of cylinder boss, tool is round-meshed
Nozzle arrangements, while processing inlet opening in each cylinder boss bottom；
Intermediate layer microfluid heat-dissipating channel structure, for by electroforming process, microstructural mold transfer to be prepared into the micro- knot of metal
Structure A, is made the intermediate layer metal substrate with straight-through feed liquor runner；Then by laser technology in metal micro structure A in
P return port is processed in interbed metal substrate, while processing the feed liquor with leading directly to feed pathway UNICOM in intermediate layer metal substrate
Mouthful；Top-level metallic substrate upper return port position and the position of intermediate layer metal substrate upper return port are corresponded；
Bottom microfluid heat-dissipating channel structure, for by electroforming process, microstructural mold transfer to be prepared into metal micro structure
A, is made with straight-through return flow line underlying metal substrate；By being processed on metal micro structure A underlying metal substrate and directly
The liquid outlet of logical return flow line connection, while in the processing of underlying metal substrate and inlet correspondingly-sized correspondence position on intermediate layer
Inlet；
The microfluid heat dissipation channel of distributed jet structure, for top layer microfluid heat-dissipating channel structure, intermediate layer microfluid
Heat-dissipating channel structure, after bottom microfluid heat-dissipating channel structure surface is all polished, is handled using metal bonding technique,
The microfluid heat dissipation channel based on distributed jet structure is formed, wherein cylinder boss bottom correspondence and metallic intermediate layer
The straight-through feed liquor flow passage of substrate；Top-level metallic substrate, intermediate layer metal substrate and top-level metallic substrate all have edge
Structure；
The return port is connected with straight-through return flow line；The inlet opening is connected with inlet.
9. a kind of microfluid heat dissipation channel according to claim 8, it is characterised in that the straight-through feed liquor runner is n rows；
The liquid runner that leads directly to out leads directly to feed liquor runner with leading directly to backflow runner in two metallic substrate layers for n+1 rows or n-1 rows
Interval is correspondingly arranged；The nozzle arrangements are arranged on top-level metallic substrate center, and n rows m row nozzles are set altogether.
10. a kind of microfluid heat dissipation channel according to claim 9, it is characterised in that described to be carried out to metal micro structure B
Chemically mechanical polishing is referred to metal structure B top-level metallics substrate surface, intermediate layer metal substrate surface and underlying metal
Substrate surface is chemically-mechanicapolish polished；The roughness RMS on the surface is less than or equal to 10nm.
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109275311A (en) * | 2018-08-28 | 2019-01-25 | 电子科技大学 | A kind of three-dimensional micro-channel and Pulsating Flow radiator |
| CN109449088A (en) * | 2018-10-30 | 2019-03-08 | 西安微电子技术研究所 | A kind of high heat dissipation ltcc substrate and its manufacturing method of built-in fluidic channels |
| CN110190376A (en) * | 2018-12-31 | 2019-08-30 | 杭州臻镭微波技术有限公司 | A kind of radio frequency system grade package module of antenna combination liquid-cooling heat radiation structure and preparation method thereof |
| CN110534436A (en) * | 2019-08-22 | 2019-12-03 | 中国电子科技集团公司第五十五研究所 | A kind of silicon substrate is adaptively gushed the fluid for radiating heat substrate and preparation method thereof that declines |
| CN111081660A (en) * | 2019-12-12 | 2020-04-28 | 上海交通大学 | Stacked micro-channel heat dissipation device and manufacturing method thereof |
| CN112086415A (en) * | 2020-08-11 | 2020-12-15 | 中国电子科技集团公司第二十九研究所 | Novel multi-scale heat management structure and micro-assembly method |
| CN113587692A (en) * | 2021-06-25 | 2021-11-02 | 佛山华智新材料有限公司 | Micro-channel heat sink and manufacturing method thereof |
| CN114150362A (en) * | 2022-02-07 | 2022-03-08 | 浙江大学杭州国际科创中心 | Preparation method and preparation device of chip back embedded microfluid cooling channel |
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| CN102014598A (en) * | 2010-11-27 | 2011-04-13 | 上海大学 | Prism-array jet micro-channel radiator |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109275311A (en) * | 2018-08-28 | 2019-01-25 | 电子科技大学 | A kind of three-dimensional micro-channel and Pulsating Flow radiator |
| CN109275311B (en) * | 2018-08-28 | 2020-05-12 | 电子科技大学 | Three-dimensional micro-channel and pulsating flow heat dissipation device |
| CN109449088A (en) * | 2018-10-30 | 2019-03-08 | 西安微电子技术研究所 | A kind of high heat dissipation ltcc substrate and its manufacturing method of built-in fluidic channels |
| CN110190376A (en) * | 2018-12-31 | 2019-08-30 | 杭州臻镭微波技术有限公司 | A kind of radio frequency system grade package module of antenna combination liquid-cooling heat radiation structure and preparation method thereof |
| CN110534436A (en) * | 2019-08-22 | 2019-12-03 | 中国电子科技集团公司第五十五研究所 | A kind of silicon substrate is adaptively gushed the fluid for radiating heat substrate and preparation method thereof that declines |
| CN111081660A (en) * | 2019-12-12 | 2020-04-28 | 上海交通大学 | Stacked micro-channel heat dissipation device and manufacturing method thereof |
| CN112086415A (en) * | 2020-08-11 | 2020-12-15 | 中国电子科技集团公司第二十九研究所 | Novel multi-scale heat management structure and micro-assembly method |
| CN112086415B (en) * | 2020-08-11 | 2022-08-02 | 中国电子科技集团公司第二十九研究所 | Novel multi-scale heat management structure and micro-assembly method |
| CN113587692A (en) * | 2021-06-25 | 2021-11-02 | 佛山华智新材料有限公司 | Micro-channel heat sink and manufacturing method thereof |
| CN114150362A (en) * | 2022-02-07 | 2022-03-08 | 浙江大学杭州国际科创中心 | Preparation method and preparation device of chip back embedded microfluid cooling channel |
| CN114150362B (en) * | 2022-02-07 | 2022-05-03 | 浙江大学杭州国际科创中心 | Preparation method and preparation device of chip back embedded microfluid cooling channel |
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