CN109449088A - A kind of high heat dissipation ltcc substrate and its manufacturing method of built-in fluidic channels - Google Patents
A kind of high heat dissipation ltcc substrate and its manufacturing method of built-in fluidic channels Download PDFInfo
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- CN109449088A CN109449088A CN201811280602.1A CN201811280602A CN109449088A CN 109449088 A CN109449088 A CN 109449088A CN 201811280602 A CN201811280602 A CN 201811280602A CN 109449088 A CN109449088 A CN 109449088A
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- green compact
- metal column
- carbon ribbon
- ceramic chips
- column array
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4857—Multilayer substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49822—Multilayer substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
Abstract
The present invention provides the high heat dissipation ltcc substrate and its manufacturing method of built-in fluidic channels, including top section, middle layer part and underclad portion；Top section is equipped with metal column array, and middle layer part is equipped with the cavity being connected to by two fluid channels with hollow cavity, and metal column array is equipped in hollow cavity, and the metal column of top section and the metal column of middle layer part correspond；Underclad portion enters and leaves equipped with coolant liquid.Prepare the carbon ribbon green compact sample with metal column array and pure carbon ribbon green compact sample；Prepare upper layer ceramic chips corresponding with top section, middle layer part and underclad portion, middle layer ceramic chips and lower layer's ceramic chips；Carbon ribbon green compact sample lamination corresponding with ceramic chips, sintering.Substrate of the present invention is there are metal column array, cavity and microchannel, metal column array generates chip in upper layer heat transfer to middle layer metal column array；Middle layer metal column array is transferred heat in inside cavity heat dissipation medium by the surface area increased, improves substrate heat dissipation performance.
Description
Technical field
The invention belongs to hybrid semiconductor integrated circuit technical fields, are related to a kind of high heat dissipation LTCC base of built-in fluidic channels
Plate and its manufacturing method.
Background technique
Modern electronic equipment constantly faces High Density Integration, high-power demand for development, although ltcc substrate is with highly dense
The integrated feature of degree, but its heat radiation power is lower, is not able to satisfy growth requirement, and in ltcc substrate embedded set fluid channel, benefit
Substrate heat transfer efficiency is improved with heat-conducting fluid, is to realize high density, the key technology of high thermal conductivity ltcc substrate.
Under normal conditions, ceramic substrate of the ltcc substrate as a kind of High Density Integration, thermal conductivity is generally in 2~3W/
M-k is difficult to meet the cooling requirements of high power circuit, the SiP product and LTCC RF/Microwave Integrated Circuits being especially a highly integrated,
It is high to circuit cooling requirements itself, or even the requirement thermal conductivity having is in 10~20W/m-k or more, and current ltcc substrate
It is not able to satisfy requirement.
Summary of the invention
Aiming at the problems existing in the prior art, the present invention provide a kind of built-in fluidic channels high heat dissipation ltcc substrate and its
Manufacturing method realizes the heat dissipation of circuit substrate height.
The present invention is to be achieved through the following technical solutions:
A kind of high heat dissipation ltcc substrate of built-in fluidic channels, including top section, middle layer part and underclad portion；Upper layer part
Be arranged with metal column array, middle layer part is equipped be connected to as two fluid channels with hollow cavity made of cavity, set in hollow cavity
There is metal column array, the metal column of top section and the metal column of middle layer part correspond；Underclad portion enters equipped with coolant liquid
Hole and coolant outlet, coolant liquid enters hole and coolant outlet and two fluid channels of middle layer part respectively correspond.
The manufacturing method of the high heat dissipation ltcc substrate of the built-in fluidic channels, includes the following steps,
The first step, by carbon ribbon piece according to preset thickness carry out arrangement lamination, etc. static pressure be laminated to form carbon ribbon green compact crude product, will
Carbon ribbon green compact crude product prepares two kinds of carbon ribbon green compact samples respectively, and one is the carbon ribbon green compact samples with metal column array, another
It is pure carbon ribbon green compact sample；
Second step carries out prebake to ceramic chips, ceramic chips is divided into upper layer ceramic chips, middle layer ceramic chips and lower layer's green
Piece；Got through on the ceramic chips of upper layer hole array go forward side by side row metal filling, formed metal column array, the metal column array with metal
The metal column array corresponding matching of the carbon ribbon green compact sample of column array；Begin to speak on ceramic chips in middle level, cavity by two fluid channels and
Hollow cavity is connected to；Coolant liquid is beaten on lower layer's ceramic chips and enters hole and coolant outlet, and coolant liquid enters hole and coolant liquid goes out
Hole is respectively corresponded with two fluid channels；
Then multiple middle layer ceramic chips are carried out lamination, make lower layer's green by third step first by multiple lower layer's ceramic chips laminations
The coolant liquid of piece enters hole and coolant outlet and is respectively communicated with two fluid channels on the ceramic chips of middle layer, in all middle layer ceramic chips
After having folded, the carbon ribbon green compact sample with metal column array is put into the ceramic chips hollow cavity of middle layer, pure carbon ribbon green compact sample is put
Enter inside fluid channel, then upper layer ceramic chips be subjected to lamination so that metal column on the ceramic chips of upper layer with metal column array
Metal column in carbon ribbon green compact sample corresponds, and green compact are obtained after the completion of lamination；
Green compact are carried out vacuum encapsulating and wait static pressure lamination by the 4th step；
5th step, fervent, low-temperature sintering.
Preferably, in the first step, the carbon ribbon green compact sample with metal column array the preparation method comprises the following steps: in carbon ribbon green compact crude product
Upper progress laser punching reuses Gold conductor and carries out through-hole filling, then carries out through-hole planarization process to it, finally swashed
Light scribing.
Preferably, laser boring uses picosecond laser.
Preferably, pure carbon ribbon green compact sample is obtained by laser scribing.
Preferably, in second step, pure carbon ribbon green compact sample is placed on raw with the carbon ribbon with metal column array inside fluid channel
The linking gap that base sample is formed is less than or equal to 200 μm.
Preferably, the 4th step concrete operations are as follows: entirely wrapped up green compact with preservative film, then by the life with metal column array
The base back side is placed on bearing plate, and one is placed on front can cover green compact active graphical and be less than the bearing plate of green compact, is reused
Soft silica gel piece wraps up front, is then paved and is put into Wrapping belt, and vacuum encapsulating is carried out；By the green compact encapsulated it is whole into
The lamination of the static pressure such as row.
Further, vacuum packet strip of paper used for sealing part are as follows: pressure is less than or equal to -0.1MPa, and the encapsulating number of plies is more than or equal to 2 layers.
Preferably, the 5th step concrete operations are as follows: the green compact for completing lamination are passed through to the figure and size for earnestly cutting out needs,
The green compact low-temperature sintering of cutting will be completed, when low-temperature sintering, green tape metal column array is placed on load bearing board on one side.
Preferably, when low-temperature sintering, 25-120 DEG C of heating-up time is 60 ± 5min, 120-500 DEG C of heating-up time be 800 ±
100min, 500 DEG C of holding 300 ± 100min, 500-850 DEG C of heating-up time are 250 ± 50min, 850 DEG C of 35 ± 5min of holding,
850-500 DEG C of temperature fall time is 200+30min, and 500-25 DEG C of temperature fall time is 60 ± 5min.
Compared with prior art, the invention has the following beneficial technical effects:
Ltcc substrate of the present invention is there are metal column array, cavity and microchannel, and metal column array is used for chip in upper layer
Metal column array of the heat transfer of generation to middle layer；The metal column array in middle layer is transferred heat to by the surface area increased
Inside cavity radiates in medium (coolant liquid)；Heat is taken to outside substrate by fluid channel and realizes high heat dissipation by heat dissipation medium, is had
Improve to effect the heat dissipation performance of ltcc substrate.
Carbon ribbon green compact sample with metal column array is placed in the hollow cavity of ceramic chips by manufacturing method of the present invention
In, the pure carbon ribbon green compact sample not with metal is placed in the fluid channel of ceramic chips, the effect of carbon ribbon green compact: first is that filling green
Piece internal cavity, fluid channel avoid substrate surface when lamination from collapsing；Second is that the material is the organic matter of 95% carbon and 5%,
It is oxidized completely after being sintered under high temperature, forms CO2、CO1With gas H2O (850 DEG C) is vapored away, and fluid channel, chamber are formed inside substrate
Body and metal column array.The present invention manufactures metal column array also in the ceramic chips of upper layer, which is used for chip
The heat of generation is transmitted to the intracorporal metal column array of middle layer ceramic chips hollow cavity by metal column array；Middle layer ceramic chips are hollow
The intracorporal metal column array of chamber is transferred heat in inside cavity heat dissipation medium (coolant liquid) by the surface area increased；Heat dissipation
Heat is taken to outside substrate by fluid channel and realizes high heat dissipation by medium, is effectively improved the heat dissipation performance of ltcc substrate, is
High-power circuit provides a kind of method of active heat removal, has important social benefit and economic value.The present invention can be used for height
The LTCC circuit substrate manufacture of power, such as the integrated class SiP substrate of LTCC and LTCC RF/Microwave substrate heat dissipation knot
Structure.
Further, laser boring prevents carbon ribbon material internal organic matter from waving using picosecond laser substantially without fuel factor
Hair.
Further, pure carbon ribbon green compact sample is placed on inside fluid channel and the carbon ribbon green compact sample shape with metal column array
At linking gap cannot be greater than 200 μm, can prevent lamination when collapse.
Further, green compact are wrapped up using preservative film, it can be prevented to be bonded bearing plate in lamination.
Detailed description of the invention
Fig. 1 is the high heat dissipation ltcc substrate structural schematic diagram of built-in fluidic channels；
Fig. 2 is the high heat dissipation ltcc substrate production flow diagram of built-in fluidic channels；
Fig. 3 is the high heat dissipation ltcc substrate lamination sample drawing of built-in fluidic channels；
Fig. 4 is the high heat dissipation ltcc substrate sintering curre figure of built-in fluidic channels；
Fig. 5 is the high heat dissipation ltcc substrate sintered sample sectional view of built-in fluidic channels, and (a) is hollow cavity interior metal column
Array (b) is fluid channel section.
Specific embodiment
Below with reference to specific embodiment, the present invention is described in further detail, it is described be explanation of the invention and
It is not to limit.
The structural schematic diagram of the ltcc substrate of built-in fluidic channels of the present invention as shown in Figure 1, include top section, in
Layer part and underclad portion；Top section is equipped with metal column array, and middle layer part is equipped with and is connected to by two fluid channels with hollow cavity
Made of cavity, metal column array is equipped in hollow cavity, the metal column of top section and the metal column one of middle layer part are a pair of
It answers；Underclad portion is equipped with coolant liquid and enters hole and coolant outlet, and it is two micro- to enter hole and coolant outlet and middle layer part for coolant liquid
Runner respectively corresponds.
Its structure and radiating principle are carried out as described in detail below:
(1) the metal column array on upper layer is used to for heat that chip generates being transmitted to the metal in middle layer by metal column array
Column array；
(2) the metal column array in middle layer transfers heat to inside cavity heat dissipation medium (cooling by the surface area increased
Liquid) in；
(3) heat is taken to outside substrate by fluid channel and realizes high heat dissipation by heat dissipation medium.
The present invention is based on the process characteristics that LTCC is successively processed, and the LTCC base of built-in fluidic channels is realized by following steps
Plate manufacture, flow chart are as shown in Figure 2.
The first step carries out the processing of carbon ribbon piece (carbon ribbon piece purity is up to 95%, and sheet is called carbon ribbon piece below), will
Carbon ribbon piece is cut into 100mm × 100mm size (size can be depending on design layout)；By needing carbon ribbon green compact THICKNESS CALCULATION
Number, for example need carbon ribbon green compact thickness 0.5mm, carbon ribbon single-sheet thickness are 0.1mm, then need the number for preparing carbon ribbon piece to be
0.5 ÷ 0.1=5.By the carbon ribbon piece cut according to the thickness of needs carry out arrangement lamination, etc. static pressure be laminated that form carbon ribbon raw
Base crude product, then two kinds of carbon ribbon green compact samples are prepared respectively, one is the carbon ribbon green compact sample with metal column array, another kind is pure
Carbon ribbon green compact sample；Carbon ribbon green compact sample with metal column array the preparation method comprises the following steps: carrying out laser on carbon ribbon green compact crude product
Punching reuses Gold conductor and carries out through-hole filling, then carry out through-hole planarization process to it, finally carries out laser scribing acquirement
Desired size；Pure carbon ribbon green compact sample obtains desired size by laser scribing, and pure carbon ribbon green compact sample prepares two,
For strip；In Fig. 3, carbon ribbon green compact 1 are the carbon ribbon green compact sample with metal column array, and carbon ribbon green compact 2 are pure carbon ribbon green compact
Sample.
Second step, carry out ceramic chips processing, to all ceramic chips carry out prebake, by ceramic chips be divided into upper layer ceramic chips,
Middle layer ceramic chips and lower layer's ceramic chips, got through on the ceramic chips of upper layer hole array go forward side by side row metal filling, formed metal column array,
The metal column array corresponding matching of the metal column array and the carbon ribbon green compact sample with metal column array；It is opened on ceramic chips in middle level
Chamber, cavity is connected to by the fluid channel of two sides with the hollow cavity at middle part, after beginning to speak, to realize other function, is given birth in middle level
Tile other parts carry out aperture, the filling of conductor through-hole, through-hole planarization and conductor printing；Cooling is played on lower layer's ceramic chips
Liquid enters hole and coolant outlet, and coolant liquid enters hole and coolant outlet and respectively corresponds with two fluid channels.
Third step carries out arrangement lamination, carries out in order by using lamination die to ceramic chips and carbon ribbon green compact sample
Lamination, specific steps are as follows: first by multiple lower layer's ceramic chips laminations, multiple middle layer ceramic chips are then subjected to lamination by direction, are made
Two through-holes of lower layer's ceramic chips are respectively communicated with two fluid channels on the ceramic chips of middle layer, have been folded in all middle layer ceramic chips
Afterwards, the carbon ribbon green compact sample with metal column array being put into the cavity at middle part, pure carbon ribbon green compact sample is put into inside fluid channel,
Upper layer ceramic chips are subjected to lamination in order again, so that the metal column on the ceramic chips of upper layer and the carbon ribbon green compact with metal column array
Metal column in sample corresponds, and all ceramic chips claim green compact after completing lamination.
4th step, vacuum encapsulating are laminated with static pressure are waited
Removed from lamination die by the green compact for completing lamination are whole, entirely wrapped up green compact with preservative film, prevent its
Bearing plate is bonded when lamination, then the back side is placed on bearing plate downwards, and it is smaller (greater than active graphical face that a size is placed in front
Product, be less than back side bearing plate) bearing plate, reuse soft silica gel piece by its front wrap up, then paved and be put into Wrapping belt
Interior, carry out vacuum encapsulating, vacuum packet strip of paper used for sealing part: -0.1MPa, the encapsulating number of plies are 2 layers；The green compact encapsulated integrally are carried out etc. quiet
Pressurized layer pressure.
5th step, fervent, low-temperature sintering
The green compact for completing lamination are passed through to the figure and size for earnestly cutting out needs, remove extra corner material.Completion is cut
The green compact cut are put into the sintering of low-temperature sintering furnace, and 25-120 DEG C of heating-up time is 60 ± 5min, and 120-500 DEG C of heating-up time is 800
± 100min, 500 DEG C of holding 300 ± 100min, 500-850 DEG C of heating-up time are 250 ± 50min, 850 DEG C keep 35 ±
5min, 850-500 DEG C of temperature fall times are 200+30min, and 500-25 DEG C of temperature fall time is 60 ± 5min, and sintering curre is shown in attached drawing 4；
Ceramic substrate is formed, which has built-in fluidic channels, metallic hole array and metal column array, can effectively improve substrate and dissipates
Thermal energy power, ltcc substrate sectional view are as shown in Figure 5.
Above-mentioned preparation flow one should also note that item:
(1) it should all be carried out at normal temperature in the manufacturing process of carbon ribbon material in above-mentioned process, forbid being heated, prevented
Organic matter volatilization inside blocking carrying material；Laser boring uses picosecond laser, substantially without fuel factor.
(2) when carbon ribbon green compact sample and ceramic chips carry out arrangement lamination together should in certain sequence, an orientation carries out；By
Metal column array is made in the carbon ribbon green compact sample with metal column array, when placement should be noted that direction and position, pure carbon ribbon
Green compact sample is placed on inside runner to be connected gap and cannot be greater than 200 μ with the carbon ribbon green compact sample formation with metal column array
M prevents from collapsing when lamination.
(3) the warm area time that carbon ribbon green compact sample volatilizees when low-temperature sintering should lengthen as far as possible, avoid carbon ribbon green compact sample not
It can volatilize completely.
In summary technique can produce the ltcc substrate of built-in fluidic channels, then recyclable by filling in fluid channel
The heat dissipation medium of flowing is diffused into substrate heat outside substrate by the medium that radiates, to improve ltcc substrate heat-sinking capability.
The effect of carbon ribbon green compact: first is that filling internal cavity, runner, avoid substrate surface when lamination from collapsing；Second is that the material
Material is the organic matter of 95% carbon and 5%, is oxidized completely after being sintered at high temperature, and CO is formed2、CO1With gas H2O(850℃)
It vapors away, forms fluid channel, cavity and metal column array inside substrate.
Claims (10)
1. a kind of high heat dissipation ltcc substrate of built-in fluidic channels, which is characterized in that including top section, middle layer part and lower layer part
Point；Top section is equipped with metal column array, and middle layer part is hollow equipped with cavity made of being connected to as two fluid channels with hollow cavity
Metal column array is equipped in cavity, the metal column of top section and the metal column of middle layer part correspond；Underclad portion is equipped with
Coolant liquid enters hole and coolant outlet, and coolant liquid enters hole and coolant outlet and two fluid channels of middle layer part respectively correspond.
2. the manufacturing method of the high heat dissipation ltcc substrate of built-in fluidic channels described in claim 1, which is characterized in that including as follows
Step,
The first step, by carbon ribbon piece according to preset thickness carry out arrangement lamination, etc. static pressure be laminated to form carbon ribbon green compact crude product, by carbon ribbon
Green compact crude product prepares two kinds of carbon ribbon green compact samples respectively, and one is the carbon ribbon green compact sample with metal column array, another kind is pure
Carbon ribbon green compact sample；
Second step carries out prebake to ceramic chips, ceramic chips is divided into upper layer ceramic chips, middle layer ceramic chips and lower layer's ceramic chips；
Got through on the ceramic chips of upper layer hole array go forward side by side row metal filling, formed metal column array, the metal column array with metal column
The metal column array corresponding matching of the carbon ribbon green compact sample of array；It begins to speak on ceramic chips in middle level, cavity is by two fluid channels in
Cavity body is connected to；Coolant liquid is beaten on lower layer's ceramic chips and enters hole and coolant outlet, and coolant liquid enters hole and coolant outlet
It is respectively corresponded with two fluid channels；
Then multiple middle layer ceramic chips are carried out lamination, make lower layer's ceramic chips by third step first by multiple lower layer's ceramic chips laminations
Coolant liquid enters hole and coolant outlet and is respectively communicated with two fluid channels on the ceramic chips of middle layer, has folded in all middle layer ceramic chips
Afterwards, the carbon ribbon green compact sample with metal column array is put into the ceramic chips hollow cavity of middle layer, pure carbon ribbon green compact sample is put into micro-
Inside runner, then by upper layer ceramic chips progress lamination, so that the metal column on the ceramic chips of upper layer and the carbon ribbon with metal column array
Metal column in green compact sample corresponds, and green compact are obtained after the completion of lamination；
Green compact are carried out vacuum encapsulating and wait static pressure lamination by the 4th step；
5th step, fervent, low-temperature sintering.
3. the manufacturing method of the high heat dissipation ltcc substrate of built-in fluidic channels according to claim 2, which is characterized in that first
In step, the carbon ribbon green compact sample with metal column array the preparation method comprises the following steps: carry out laser punching on carbon ribbon green compact crude product, then make
Through-hole filling is carried out with Gold conductor, through-hole planarization process then is carried out to it, finally carries out laser scribing.
4. the manufacturing method of the high heat dissipation ltcc substrate of built-in fluidic channels according to claim 3, which is characterized in that laser
Punching uses picosecond laser.
5. the manufacturing method of the high heat dissipation ltcc substrate of built-in fluidic channels according to claim 2, which is characterized in that pure carbon
Band green compact sample is obtained by laser scribing.
6. the manufacturing method of the high heat dissipation ltcc substrate of built-in fluidic channels according to claim 2, which is characterized in that second
In step, pure carbon ribbon green compact sample, which is placed on inside fluid channel, is connected gap with what the carbon ribbon green compact sample with metal column array was formed
Less than or equal to 200 μm.
7. the manufacturing method of the high heat dissipation ltcc substrate of built-in fluidic channels according to claim 2, which is characterized in that the 4th
Walk concrete operations are as follows: green compact are entirely wrapped up with preservative film, then the green compact back side with metal column array is placed on bearing plate,
One is placed on front can cover green compact active graphical and be less than the bearing plate of green compact, reuse soft silica gel piece and wrap up front,
Then it is paved and is put into Wrapping belt, carry out vacuum encapsulating；The green compact encapsulated integrally are carried out to equal static pressure lamination.
8. the manufacturing method of the high heat dissipation ltcc substrate of built-in fluidic channels according to claim 7, which is characterized in that vacuum
Encapsulating condition are as follows: pressure is less than or equal to -0.1MPa, and the encapsulating number of plies is more than or equal to 2 layers.
9. the manufacturing method of the high heat dissipation ltcc substrate of built-in fluidic channels according to claim 2, which is characterized in that the 5th
Walk concrete operations are as follows: the green compact for completing lamination are passed through to the figure and size for earnestly cutting out needs, the green compact for completing cutting are low
Temperature sintering, when low-temperature sintering, green tape metal column array is placed on load bearing board on one side.
10. the manufacturing method of the high heat dissipation ltcc substrate of built-in fluidic channels according to claim 2, which is characterized in that low
When temperature sintering, 25-120 DEG C of heating-up time is 60 ± 5min, and 120-500 DEG C of heating-up time is 800 ± 100min, 500 DEG C of holdings
300 ± 100min, 500-850 DEG C of heating-up times are 250 ± 50min, 850 DEG C of 35 ± 5min of holding, 850-500 DEG C of temperature fall time
For 200+30min, 500-25 DEG C of temperature fall time is 60 ± 5min.
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| CN112218486A (en) * | 2020-09-01 | 2021-01-12 | 西安电子科技大学 | LTCC integrated refrigeration system based on heat pipe and thermoelectric refrigerator and manufacturing method thereof |
| CN112260648A (en) * | 2020-12-22 | 2021-01-22 | 四川大学 | High-power light-gathering intensive array photovoltaic cell microchannel liquid cooling module and heat dissipation structure |
| CN113056087A (en) * | 2021-01-28 | 2021-06-29 | 中国电子科技集团公司第二十九研究所 | Printed circuit board embedded with micro-channel and preparation method thereof |
| CN113629484A (en) * | 2021-07-01 | 2021-11-09 | 佛山华智新材料有限公司 | Porous heat sink and manufacturing method thereof |
| CN113990823A (en) * | 2021-10-22 | 2022-01-28 | 珠海粤科京华科技有限公司 | Metallized ceramic substrate for power module and manufacturing method thereof |
| CN116454045A (en) * | 2023-04-12 | 2023-07-18 | 广东工业大学 | Chip substrate with micro-channels and radiating system utilizing fluid reverse thermophoresis to radiate |
| CN116454045B (en) * | 2023-04-12 | 2024-05-17 | 广东工业大学 | Chip substrate with micro-channels and radiating system utilizing fluid reverse thermophoresis to radiate |
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| CN112103252B (en) * | 2020-08-07 | 2022-12-09 | 西安电子科技大学 | Refrigeration type LTCC micro-system based on metal micro-channel and preparation method thereof |
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| CN116454045A (en) * | 2023-04-12 | 2023-07-18 | 广东工业大学 | Chip substrate with micro-channels and radiating system utilizing fluid reverse thermophoresis to radiate |
| CN116454045B (en) * | 2023-04-12 | 2024-05-17 | 广东工业大学 | Chip substrate with micro-channels and radiating system utilizing fluid reverse thermophoresis to radiate |
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