CN112218486A - LTCC integrated refrigeration system based on heat pipe and thermoelectric refrigerator and manufacturing method thereof - Google Patents

LTCC integrated refrigeration system based on heat pipe and thermoelectric refrigerator and manufacturing method thereof Download PDF

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Publication number
CN112218486A
CN112218486A CN202010906195.1A CN202010906195A CN112218486A CN 112218486 A CN112218486 A CN 112218486A CN 202010906195 A CN202010906195 A CN 202010906195A CN 112218486 A CN112218486 A CN 112218486A
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China
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heat
green
thermoelectric refrigerator
mounting groove
heat pipe
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CN202010906195.1A
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CN112218486B (en
Inventor
王斌
陈睿
蔺孝堃
罗昭
宁国勋
周圣钧
史鑫龙
胡辉勇
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Xidian University
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Xidian University
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/38—Cooling arrangements using the Peltier effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes

Abstract

The invention discloses an LTCC integrated refrigeration system based on a heat pipe and a thermoelectric refrigerator, which comprises: the thermoelectric cooler, the heat pipe assembly and the lower layer ceramic chip, the middle layer ceramic chip and the upper layer ceramic chip are sequentially arranged from bottom to top; the upper layer ceramic chip is provided with an installation through hole; the thermoelectric refrigerator is fixedly arranged in the mounting through hole; a plurality of heat conducting through holes are formed in the middle layer ceramic chip; the heat conducting through hole is filled with a metal column; the lower layer ceramic chip is provided with a mounting groove; the heat pipe assembly is positioned in the mounting groove and is connected with external cooling equipment; the upper end of the metal column is in contact with the hot end of the thermoelectric refrigerator. The LTCC integrated refrigeration system based on the heat pipe and the thermoelectric refrigerator can quickly and effectively refrigerate the heat source chip through the thermoelectric refrigerator and the heat pipe assembly, so that the heat source chip can continuously work at a proper low temperature, the problem of poor heat dissipation of the LTCC substrate is solved, and the heat dissipation performance of the LTCC substrate is improved. The invention also discloses a manufacturing method of the LTCC integrated refrigeration system based on the heat pipe and the thermoelectric refrigerator.

Description

LTCC integrated refrigeration system based on heat pipe and thermoelectric refrigerator and manufacturing method thereof
Technical Field
The invention belongs to the technical field of semiconductor hybrid integrated circuits, and particularly relates to an LTCC integrated refrigeration system based on a heat pipe and a thermoelectric refrigerator and a manufacturing method thereof.
Background
With the rapid development of microelectronic technology and the miniaturization development of electronic products, Low Temperature Co-fired Ceramic (LTCC) with high density integration has become the mainstream technology of passive integration, high density packaging of chips and passive devices can be realized by using the technology, and the LTCC has good high frequency characteristics, Low thermal expansion coefficient and high yield, is suitable for high current and high Temperature environments, and has wide application prospects in the field of system integration.
LTCC technology was initially used primarily in military and avionics communications and radar systems, and was later generalized for use in wireless communications, electronic information, automotive electronics, and other fields. LTCC packaging technology opens a new door to the integration field and faces new challenges.
In consideration of the thermal problem of system integration, high-density integrated radio frequency circuits, photoelectric imaging circuits and the like have high heat dissipation requirements on the system, heat source chips such as radio frequency chips and semiconductor chips in the circuits generate a large amount of heat during working, the thermal conductivity of the LTCC substrate is generally 2-3W/mk, the heat dissipation performance is poor, and the heat dissipation requirements of high-power chips in the micro-system are difficult to meet.
In order to solve the thermal problem of LTCC packaging, the heat dissipation efficiency of LTCC is generally improved by adopting a mode of integrating micro channels in LTCC. However, microchannels cannot achieve refrigeration, while the introduction of microchannels raises many other problems: (1) when the micro-channel is prepared, sacrificial materials need to be filled in the micro-channel, and the shape of the sacrificial materials needs to be precisely matched with the shape of the prepared micro-channel, so that the process is difficult, the precise processing is very difficult, and the micro-channel is difficult to accurately fill. (2) If the sacrificial material is improperly prepared, the ceramic forming characteristics of the sacrificial material cannot be matched with those of the LTCC material, and serious problems of collapse, deformation and the like of the substrate can be caused. (3) The size of the micro-channel prepared by the prior art is limited. Meanwhile, the micro-channel technology needs to introduce heat-conducting fluid into the system, and the system is large in size and difficult to meet the refrigeration requirement of the LTCC micro-system.
Disclosure of Invention
In order to solve the problems in the prior art, the invention provides an LTCC integrated refrigeration system based on a heat pipe and a thermoelectric refrigerator and a manufacturing method thereof. The technical problem to be solved by the invention is realized by the following technical scheme:
the first aspect of the embodiments of the present invention provides an LTCC integrated refrigeration system based on a heat pipe and a thermoelectric refrigerator, including: the thermoelectric cooler, the heat pipe assembly and the lower layer ceramic chip, the middle layer ceramic chip and the upper layer ceramic chip are sequentially arranged from bottom to top;
the upper layer ceramic chip is provided with an installation through hole;
the thermoelectric refrigerator is fixedly arranged in the mounting through hole, the hot end of the thermoelectric refrigerator is flush with the lower surface of the upper ceramic chip, and the cold end of the thermoelectric refrigerator is flush with the upper surface of the upper ceramic chip; an external heat source chip is fixedly arranged on the surface of the cold end of the thermoelectric refrigerator;
a plurality of heat conducting through holes are formed in the middle layer ceramic chip;
the plurality of heat conducting through holes are all positioned below the thermoelectric refrigerator;
the upper end of the heat conduction through hole is in contact with the thermoelectric refrigerator, the lower end of the heat conduction through hole extends towards the lower layer ceramic chip, and a metal column is filled in the heat conduction through hole;
the lower layer ceramic chip is provided with a mounting groove;
one end of the mounting groove is communicated with the outside and is positioned below the plurality of heat conduction through holes;
the heat pipe assembly is characterized in that the evaporation section is positioned in the mounting groove and below the plurality of heat conduction through holes, and the condensation section extends out of one end of the mounting groove and is connected with external cooling equipment;
and the upper end of the metal column is in contact with the hot end of the thermoelectric refrigerator, and the lower end of the metal column extends to the notch of the mounting groove.
In one embodiment of the invention, the heat-conducting glue is also included;
the heat-conducting glue is filled in the mounting groove and is in contact with the metal column;
the heat pipe assembly is fixed in the mounting groove through heat conducting glue.
In one embodiment of the invention, the plurality of thermally conductive vias are evenly distributed.
In one embodiment of the present invention, the depth of the installation groove is 0.2mm to 5 mm.
A second aspect of the embodiments of the present invention provides a method for manufacturing an LTCC integrated refrigeration system based on a heat pipe and a thermoelectric refrigerator, including:
step S1, arranging a plurality of mounting through holes on the upper layer green porcelain segment at intervals; a plurality of heat conducting through hole arrays are arranged on the middle layer green porcelain segment at intervals, metal slurry is filled in the heat conducting through holes to form metal columns, and a plurality of metal columns in the plurality of heat conducting through holes form a metal column array; a plurality of mounting grooves are formed in the lower layer of raw porcelain segment at intervals;
step S2, carrying out lamination and isostatic pressing layer processing on a first preset number of carbon ribbon pieces to obtain a first carbon ribbon green compact crude product, carrying out lamination and isostatic pressing layer processing on a second preset number of carbon ribbon pieces to obtain a second carbon ribbon green compact crude product, and then respectively carrying out laser scribing on the first carbon ribbon green compact crude product and the second carbon ribbon green compact crude product to obtain a plurality of first carbon ribbon green compact samples and a plurality of second carbon ribbon green compact samples;
the shape and the size of the first carbon tape green blank sample are the same as those of the mounting through hole; the shape and the size of the second carbon tape green blank sample are the same as those of the mounting groove;
step S3, placing each first carbon ribbon green blank sample into each mounting through hole, placing each second carbon ribbon green blank sample into each mounting groove, and then performing lamination treatment on the lower layer green porcelain segment, the middle layer green porcelain segment and the upper layer green porcelain segment in sequence from bottom to top to obtain green blanks;
the mounting groove is positioned below the plurality of heat conducting through holes, and the plurality of heat conducting through holes are all positioned below the mounting through holes;
step S4, carrying out vacuum encapsulation on the green body, and then carrying out isostatic pressing lamination treatment;
step S5, carrying out hot cutting on the green bodies subjected to isostatic pressing lamination to obtain a plurality of monomer green bodies, and carrying out low-temperature sintering treatment on the plurality of monomer green bodies to obtain a plurality of monomer substrates;
step S6, embedding a thermoelectric refrigerator into the installation through hole of each single substrate, inserting a heat pipe assembly into the installation groove of each single substrate and fixing the heat pipe assembly to obtain a plurality of LTCC integrated refrigeration systems based on heat pipes and thermoelectric refrigerators in the technical scheme;
the hot end of the thermoelectric refrigerator is flush with the lower end of the mounting through hole, and the cold end of the thermoelectric refrigerator is flush with the upper end of the mounting through hole; the upper end of the metal column is contacted with the hot end of the thermoelectric refrigerator, and the lower end of the metal column extends to the notch of the mounting groove; the evaporation zone of the heat pipe component is positioned in the mounting groove and below the plurality of heat conduction through holes, and the condensation zone of the heat pipe component extends out of one end of the mounting groove.
In an embodiment of the present invention, the step S4 includes the following specific steps: firstly, wrapping a green body by using a preservative film, then placing a lower layer of green porcelain segment of the green body on a first pressure bearing plate, placing a second pressure bearing plate on an upper layer of green porcelain segment, wrapping soft silica gel sheets on the first pressure bearing plate and the second pressure bearing plate, then integrally placing the green body into an encapsulation belt, carrying out vacuum encapsulation, and integrally carrying out isostatic pressing lamination after the vacuum encapsulation is finished.
In an embodiment of the present invention, the specific process of the low-temperature sintering process in step S5 is: firstly heating from room temperature to 550 ℃, wherein the heating rate is 2 ℃/min, then keeping at 550 ℃ for 2 hours, then heating from 550 ℃ to 870 ℃, wherein the heating rate is 3 ℃/min, then keeping at 870 ℃ for 1 hour, and finally cooling from 870 ℃ to room temperature for natural cooling.
In one embodiment of the present invention, the fixing the heat pipe assembly in step S6 includes: the mounting groove is filled with heat-conducting glue, and the heat pipe assembly is fixed in the mounting groove by the heat-conducting glue;
the lower end of the metal column is contacted with the heat-conducting glue.
In one embodiment of the invention, the heat conducting through holes are formed by laser drilling by a picosecond laser;
the mounting through hole and the mounting groove are obtained by laser scribing.
The invention has the beneficial effects that:
1. the refrigeration type LTCC integrated system can effectively refrigerate the heat source chip by integrating the thermoelectric refrigerator, and solves the refrigeration problem of the LTCC integrated system.
2. The refrigeration type LTCC integrated system improves the heat dissipation efficiency of the LTCC and realizes the efficient heat dissipation of the thermoelectric refrigerator through the integrated heat pipe and the metal column array.
3. According to the manufacturing method of the refrigeration type LTCC integrated system, the carbon ribbon is used as a sacrificial material, impurities cannot be left through high-temperature oxidation and volatilization, and the influence on the circuit characteristics on the substrate can be avoided.
The present invention will be described in further detail with reference to the accompanying drawings and examples.
Drawings
Fig. 1 is a schematic cross-sectional structure diagram of an LTCC integrated refrigeration system based on a heat pipe and a thermoelectric refrigerator according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of an upper tile according to an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a middle layer tile according to an embodiment of the present invention;
fig. 4 is a schematic cross-sectional structure diagram of an LTCC integrated refrigeration system based on a heat pipe and a thermoelectric refrigerator according to an embodiment of the present invention;
FIG. 5 is a schematic structural diagram of an integrated LTCC refrigeration system based on a heat pipe and a thermoelectric refrigerator according to an embodiment of the present invention;
fig. 6 is a schematic cross-sectional structure diagram of an LTCC integrated refrigeration system based on a heat pipe and a thermoelectric refrigerator according to an embodiment of the present invention;
fig. 7 is a flowchart of a method for manufacturing an LTCC integrated refrigeration system based on a heat pipe and a thermoelectric refrigerator according to an embodiment of the present invention;
fig. 8 is a sintering temperature curve of a method for manufacturing an LTCC integrated refrigeration system based on a heat pipe and a thermoelectric refrigerator according to an embodiment of the present invention;
fig. 9 is a schematic cross-sectional structure diagram of an LTCC integrated refrigeration system based on a heat pipe and a thermoelectric refrigerator according to an embodiment of the present invention;
fig. 10 is a schematic structural diagram of an LTCC integrated refrigeration system based on a heat pipe and a thermoelectric refrigerator according to an embodiment of the present invention.
Description of reference numerals:
10-upper layer ceramic tile; 11-mounting a through hole; 12-a thermoelectric refrigerator; 20-middle layer ceramic tile; 21-a thermally conductive via; 22-metal posts; 30-lower layer ceramic tile; 31-a mounting groove; 32-a heat pipe assembly; 321-an evaporation section; 322-a condensation section; 33-heat conducting glue; 40-a heat source chip; 50-a cooling device; and 60, mounting the ceramic tiles.
Detailed Description
The present invention will be described in further detail with reference to specific examples, but the embodiments of the present invention are not limited thereto.
Example one
In a first aspect of the embodiments of the present invention, an LTCC integrated refrigeration system based on a heat pipe and a thermoelectric refrigerator is provided, please refer to fig. 1, fig. 2, fig. 3, fig. 4, fig. 5 and fig. 9, an LTCC integrated refrigeration system based on a heat pipe and a thermoelectric refrigerator includes: the thermoelectric refrigerator 12, the heat pipe assembly 32, and the lower, middle and upper tiles 30, 20, 10 arranged in this order from bottom to top. In this embodiment, a Thermo Electric Cooler (TEC) is also referred to as a semiconductor Cooler or a semiconductor cooling plate. The upper layer ceramic tile 10, the middle layer ceramic tile 20 and the lower layer ceramic tile are mutually attached together. The upper layer ceramic tile 10 is provided with a mounting through hole 11. The thermoelectric refrigerator 12 is fixedly arranged in the mounting through hole 11, the hot end of the thermoelectric refrigerator 12 is flush with the lower surface of the upper layer ceramic tile 10, and the cold end of the thermoelectric refrigerator 12 is flush with the upper surface of the upper layer ceramic tile 10. The lower end of the mounting through hole 11 is flush with the lower surface of the upper layer ceramic tile 10, and the upper layer ceramic tile 10 is closely attached to the middle layer ceramic tile 20, so that the hot end of the thermoelectric refrigerator 12 can be closely attached to the middle layer ceramic tile 20. The upper end of the mounting through hole 11 is flush with the upper surface of the upper layer ceramic tile 10, and the surface of the cold end of the thermoelectric refrigerator 12 is fixedly provided with an external heat source chip 40. The external heat source chip 40 includes, but is not limited to, a functional chip such as a semiconductor chip. The attached circuit of the thermoelectric cooler 12 is printed on the upper surface of the upper tile 10. The middle layer tile 20 is provided with a plurality of heat conducting through holes 21. A plurality of thermally conductive through holes 21 are located below the thermoelectric cooler 12. The upper end of the heat conducting through hole 21 is contacted with the thermoelectric refrigerator 12, the lower end of the heat conducting through hole 21 extends towards the lower layer ceramic sheet 30, and the metal column 22 is filled in the heat conducting through hole 21. The upper end of the heat conduction through hole 21 is parallel and level with the upper surface of the middle layer ceramic chip 20, the upper end of the heat conduction through hole 21 is in contact with the hot end of the thermoelectric refrigerator 12, the lower end of the heat conduction through hole 21 is parallel and level with the lower surface of the middle layer ceramic chip 20, the metal column 22 completely fills the heat conduction through hole 21, the upper end of the metal column 22 is parallel and level with the upper surface of the middle layer ceramic chip 20, the lower end of the metal column 22 is parallel and level with the lower surface of the middle layer ceramic chip 20, the middle layer ceramic chip 20 is attached to the lower layer ceramic chip 30, the upper end of the metal column 22 is in contact with the hot. The lower tile 30 is provided with an installation slot 31. One end of the mounting groove 31 communicates with the outside, and the mounting groove 31 is located below the plurality of heat conductive through holes 21. The lower end of the metal pillar 22 is flush with the lower surface of the middle ceramic tile 20, and the middle ceramic tile 20 and the lower ceramic tile 30 are attached, so that the lower end of the metal pillar 22 extends to the opening of the mounting groove 31, that is, the metal pillar 22 is communicated with the mounting groove 31. The wall of the mounting groove 31 is a semi-surrounding structure, and one end of the mounting groove 31 is open and communicated with the outside. The evaporation section 321 of the heat pipe assembly 32 is located in the mounting groove 31 and below the plurality of heat conducting through holes 21, and the condensation section 322 of the heat pipe assembly 32 extends from one end of the mounting groove 31 and is connected with the external cooling device 50. The portion of the heat pipe assembly 32 located in the mounting groove 31 is fixed in the mounting groove 31. In this embodiment, the cold end of the thermoelectric refrigerator 12 cools the heat source chip 40, and the heat at the hot end of the thermoelectric refrigerator 12 can be transferred to the mounting groove 31 through the plurality of metal columns 22 and transferred to the evaporation section 321 of the heat pipe assembly 32, and the condensation section 322 of the heat pipe assembly 32 is connected with the external cooling device 50, so that the heat is transferred to the outside of the LTCC substrate, thereby achieving the purpose of efficient heat dissipation. In the embodiment, the heat source chip 40 can be more effectively dissipated through the thermoelectric refrigerator 12 and the heat pipe assembly 32, and the heat source chip 40 can work at a proper temperature, and the heat pipe assembly 32 can effectively transfer heat in the system to the outside of the system, thereby further improving the heat dissipation performance of the LTCC substrate. The temperature of the hot end of the thermoelectric refrigerator 12 can be adjusted to maintain the temperature of the cold end, and the thermoelectric refrigerator is suitable for components with high power and strict requirements on temperature environment.
In a possible implementation, the plurality of heat conducting through holes 21 are located below the mounting through holes 11, and the number of the plurality of heat conducting through holes 21 is as large as possible to cover the hot end surface of the thermoelectric refrigerator 12 as much as possible. The plurality of heat conductive through holes 21 may be located within the notch range of the mounting groove 31 to achieve that the plurality of metal posts 22 can be entirely located within the notch range of the mounting groove 31. The shape of the mounting through-hole 11 matches the shape of the thermoelectric cooler 12, and may be generally in the shape of a square or rectangular hole.
In one possible implementation, the shapes of the upper layer tile 10, the middle layer tile 20 and the lower layer tile 30 can be quadrilateral or polygonal, such as square or rectangle, etc., and can be made into the required shapes according to actual needs. And circuit wiring can be carried out on each layer of green ceramic chip. The heat pipe assembly 32 includes a plurality of heat pipes, which are heat sinks made up of sealed pipes, wicks, and vapor passages. The liquid absorbing core surrounds the pipe wall of the sealing pipe and is soaked with volatile saturated liquid. The liquid may be distilled water, or ammonia, methanol, acetone, or the like. The heat pipe assembly 32 filled with ammonia, methanol, acetone, etc. still has good heat dissipation capability at low temperatures. When the heat pipe assembly 32 is operated, the evaporation section 321 absorbs heat generated by a heat source (power semiconductor device, etc.), and the liquid in the wick tube is boiled into steam. The vapor with heat moves from the evaporation section 321 to the condensation section 322 of the heat pipe assembly 32, and condenses into a liquid as the vapor transfers heat to the condensation section 322. The condensed liquid is returned to the evaporator section 321 by capillary action of the wick on the walls of the tube, thus repeating the above cycle to dissipate heat continuously.
Example two
The embodiment is an improvement on the first embodiment.
As shown in fig. 6, further, an LTCC integrated refrigeration system based on heat pipe and thermoelectric refrigerator further includes a heat conductive adhesive 33. The heat conductive adhesive 33 is filled in the mounting groove 31, and the heat conductive adhesive 33 is in contact with the metal pillar 22. The heat pipe assembly 32 is fixed in the mounting groove 31 by a heat conductive paste 33. In this embodiment, the heat pipe assembly 32 is fixed in the mounting groove 31 by the heat conducting glue 33, the mounting groove 31 is filled with the heat conducting glue 33, and the lower ends of the plurality of metal posts 22 extend to the notches of the mounting groove 31, so that the metal posts 22 contact with the heat conducting glue 33, the heat of the metal posts 22 is transferred to the heat conducting glue 33, and the heat conducting glue 33 transfers the heat to the heat pipe assembly 32. The heat conducting glue 33 is wrapped on the heat pipe assembly 32, so that the heat pipe assembly 32 can be heated uniformly, and the heat dissipation speed is further improved. The heat-conducting adhesive 33 is a high-temperature-resistant heat-conducting adhesive 33, and includes, but is not limited to, Kafter silica gel K-5205.
Further, as shown in fig. 5, the plurality of heat conductive through holes 21 are uniformly distributed. The plurality of heat conducting through holes 21 are arranged at intervals and uniformly distributed, therefore, the plurality of metal columns 22 are arranged at intervals and uniformly distributed to form a metal array, the plurality of metal columns 22 can be uniformly distributed at the hot end of the thermoelectric refrigerator 12, all heat generated at the hot end of the thermoelectric refrigerator 12 is transferred to the heat pipe assembly 32 uniformly and rapidly as much as possible, and the heat dissipation performance is further improved.
Further, the depth of the mounting groove 31 is 0.2mm to 5 mm. The depth of the mounting groove 31 is the distance from the notch to the bottom of the groove, preferably, the depth of the mounting groove 31 is 0.2 mm-1 mm, and the strength of the next secondary ceramic chip can be ensured while the heat pipe assembly 32 is placed.
In one possible implementation, the hot side of thermoelectric cooler 12 is proximate to the upper end of metal post 22.
In a possible implementation manner, as shown in fig. 9 and 10, a mounting tile 60 may be further disposed on the LTCC integrated refrigeration system based on the heat pipe and the thermoelectric refrigerator, specifically, a mounting tile 60 is further disposed on the lower surface of the lower layer tile 30, and the mounting tile 60 is used for passive device integration or circuit routing, pin out and mounting with external components. The mounting tile 60 has circuitry printed thereon.
EXAMPLE III
Referring to fig. 1 to 7, a second aspect of the embodiments of the present invention provides a method for manufacturing an LTCC integrated refrigeration system based on a heat pipe and a thermoelectric refrigerator, including: step S1-step S6. The manufacturing method of the embodiment is batch manufacturing, and a plurality of LTCC integrated refrigeration systems based on heat pipes and thermoelectric refrigerators in any of the above embodiments can be obtained.
Before the step S1, the method further includes the step S11: and classifying the green porcelain fragments. And pre-drying the plurality of raw porcelain fragments, dividing the plurality of raw porcelain fragments into three types, namely a plurality of upper layer raw porcelain fragments, a plurality of middle layer raw porcelain fragments and a plurality of lower layer raw porcelain fragments, and manufacturing the upper layer raw porcelain fragments, the middle layer raw porcelain fragments and the lower layer raw porcelain fragments according to the step S1.
Step S1: punching and slotting, and filling metal columns. A plurality of mounting through holes 11 are formed in the upper layer green ceramic segment at intervals; a plurality of heat conducting through hole arrays are arranged on the middle layer green porcelain segment at intervals, metal slurry is filled in the heat conducting through holes 21 to form metal columns 22, and a plurality of metal columns 22 in the heat conducting through holes 21 form the metal column 22 arrays; a plurality of mounting grooves 31 are arranged on the lower layer green porcelain segment at intervals. In this embodiment, a picosecond laser is used to punch a hole, the heat conducting through hole 21 is punched, and the mounting through hole 11 and the mounting groove 31 are manufactured by laser dicing. Adopt picosecond laser to punch, can not produce the fuel factor, it is concrete, the mode of punching adopts the tape frame to punch, puts into middle level green porcelain fragment rather than shape assorted frame, then punches, can make the position of punching more accurate. Wherein, certain distance is separated between two adjacent mounting through holes 11, reserve the position for follow-up green porcelain piece cutting becomes the green porcelain piece, and in the same way, certain distance is separated between two adjacent mounting grooves 31. When the heat conducting through holes 21 are manufactured, the heat conducting through holes 21 can form heat conducting through hole arrays, a certain distance is reserved between every two adjacent heat conducting through hole arrays, a plurality of middle layer green ceramic chips are obtained after the middle layer green ceramic chips are cut, and each middle layer green ceramic chip is provided with one heat conducting through hole array.
In this embodiment, the copper paste for filling the heat conduction through hole 21 forms the metal column 22 array after the filling by the micropore filling machine is completed, and after the injection is completed, the planarization treatment is performed on the middle-layer green porcelain segment, and the specific process of the planarization treatment is as follows: grinding and polishing the surface of the middle layer green ceramic segment, then sequentially and respectively cleaning the treated middle layer green ceramic segment with acetone and ethanol, and then drying. The metal pillars 22 are formed in the heat conductive via 21, and the plurality of metal pillars 22 in the plurality of heat conductive vias 21 form a metal pillar array.
In one possible implementation, the depth of the mounting groove 31 is 0.2mm to 5 mm. The depth of the mounting groove 31 is the distance from the notch to the bottom of the groove, preferably, the depth of the mounting groove 31 is 0.2 mm-1 mm, and the strength of the next secondary ceramic chip can be ensured while the heat pipe assembly 32 is placed. Further preferably, the depth of the mounting groove 31 is 0.4 mm.
Step S2: and (5) manufacturing a carbon ribbon sheet. The method comprises the steps of conducting lamination and isostatic pressing layer processing on a first preset number of carbon ribbon pieces to obtain a first carbon ribbon green compact crude product, conducting lamination and isostatic pressing layer processing on a second preset number of carbon ribbon pieces to obtain a second carbon ribbon green compact crude product, and then conducting laser scribing on the first carbon ribbon green compact crude product and the second carbon ribbon green compact crude product respectively to obtain a plurality of first carbon ribbon green compact samples and a plurality of second carbon ribbon green compact samples.
Wherein the shape and size of the first carbon tape green compact sample are the same as those of the mounting through hole 11; the shape and size of the second green tape sample are the same as those of the mounting groove 31.
In this example, a green carbon tape sample was produced in a batch manner from a carbon tape sheet. The carbon tape sheet material is 95% carbon and 5% organic matter, and the sheet, the first carbon tape green compact sample and the second carbon tape green compact sample need to be put into the mounting through hole 11 and the mounting groove 31. The number of the carbon tape pieces is calculated according to the thickness of the carbon tape green blank sample, for example, the thickness of the carbon tape green blank sample is required to be 2mm, the thickness of the carbon tape piece is required to be 0.1mm, the number of the carbon tape pieces is required to be 20-22, specifically, during lamination, bonding glue is coated on each layer of the carbon tape pieces, and then isostatic pressing lamination is carried out. Therefore, the required number of layers is calculated according to the required thickness, and the thickness of a plurality of carbon tape sheets which are laminated before lamination is slightly larger than that of the crude product of the laminated carbon tape green compact due to the need of isostatic pressing lamination. In the step, a plurality of first carbon belt green body samples and second carbon belt green body samples with corresponding sizes and shapes are obtained through laser scribing. The shape and size of the first carbon tape green compact sample are the same as those of the mounting through-holes 11, and the first preset number may be 30 to 32 to completely fill the mounting through-holes 11, and preferably, the first preset number may be 30. The shape and size of the second green tape sample are the same as those of the mounting groove 31, and the second preset number may be 2 to 10 to completely fill the mounting groove 31, and preferably, the second preset number may be 4.
In this example, the role of the green carbon tape sample is as follows: firstly, the installation through holes 11 and the installation grooves 31 are filled, so that the surface of the substrate is prevented from collapsing during lamination; and secondly, the carbon tape material is composed of 95% of carbon and 5% of organic matters, and is completely oxidized after being sintered at high temperature to form carbon dioxide, carbon monoxide and water vapor which are volatilized.
The manufacturing process of the carbon ribbon sheet material in the above steps should be carried out at normal temperature, and heating treatment should not be carried out, so that organic matters in the carbon ribbon material are prevented from volatilizing.
In a possible implementation, step S2 may also be made before or after step S1 or step S11, or step S2 may be made in synchronization with step S1 and step S11.
Step S3: and (6) arranging the laminates. And (3) putting each first carbon ribbon green compact sample into each mounting through hole 11, putting each second carbon ribbon green compact sample into each mounting groove 31, and then performing lamination treatment according to the sequence of a lower layer green ceramic segment, a middle layer green ceramic segment and an upper layer green ceramic segment from bottom to top in sequence to obtain a green compact.
Wherein, the mounting groove 31 is located below the plurality of heat conducting through holes 21, and the plurality of heat conducting through holes 21 are all located below the mounting through holes 11.
In this embodiment, a first green tape sample is placed in one of the mounting through holes 11, a second green tape sample is placed in one of the mounting grooves 31, and then the upper green ceramic segment on which the first green tape sample is placed, the middle green ceramic segment on which the metal posts 22 are filled, and the lower green ceramic segment on which the second green tape sample is placed are sequentially laminated by using a lamination grinding tool from bottom to top. During lamination, the positions of the mounting groove 31, the metal column 22 and the mounting through hole 11 need to be corresponding, the mounting groove 31 is located below the metal column 22 array, the metal column 22 array is located below the mounting through hole 11, and green bodies are obtained after lamination processing is performed according to the corresponding sequence.
Step S4: and (5) packaging and laminating. The green body was vacuum encapsulated and then subjected to an isostatic lamination process.
In this embodiment, wrap up the unburned bricks with the plastic wrap at first, place the lower floor's raw porcelain fragment of unburned bricks on first bearing plate, place the second bearing plate on the upper strata raw porcelain fragment, the size of first bearing plate and second bearing plate is greater than the size of lower floor's raw porcelain fragment and upper strata raw porcelain fragment, cladding soft silica gel piece on first bearing plate and second bearing plate, then wholly put into the envelope and take, carry out vacuum envelope, adopt the whole isostatic pressing of laminator after the vacuum envelope is accomplished. The pressure used for the isostatic pressing process is, for example, equal to 3000psi, where psi is the pressure unit: pounds force per square inch (pound per square inch).
Step S5: cutting and low-temperature sintering. And carrying out hot cutting on the green bodies subjected to isostatic pressing lamination to obtain a plurality of monomer green bodies, and carrying out low-temperature sintering treatment on the plurality of monomer green bodies to obtain a plurality of monomer substrates.
In this embodiment, after the isostatic pressing lamination is completed, the plastic wrap, the first pressure-bearing plate, and the second pressure-bearing plate are removed from the green body to obtain a laminated green body, and then the laminated green body is subjected to hot cutting. Generally, the cutting is performed by using a device such as a heat cutter, and the cutting is performed in accordance with a desired shape and size. The temperature of the cutting table and the temperature of the blade need to be controlled during cutting, so that the required cutting precision is achieved. The cutting equipment is divided into full-automatic cutting equipment and semi-automatic cutting equipment, the cutting equipment has high requirements on the quality of a cutter, the cutter with high durability and small cutting resistance is needed, and the edge of the substrate after cutting can be smooth and has no broken slag. After the green body is thermally cut, the green ceramic segments are cut into a plurality of green ceramic pieces, and each of the green body is divided into an upper ceramic piece 10 on the upper layer, a middle ceramic piece 20 on the middle layer, and a lower ceramic piece 30 on the lower layer. The upper, middle and lower tiles 10, 20 and 30 can be quadrilateral or polygonal, such as square or rectangular, and can be made into the desired shape and size according to the actual needs.
As shown in fig. 8, the low-temperature sintering process is performed on the plurality of monomer green compacts, and the specific process is as follows: firstly heating from room temperature to 550 ℃, wherein the heating rate is 2 ℃/min, then keeping at 550 ℃ for 2 hours, the process of keeping for 2 hours is a constant-temperature glue discharging process, then heating from 550 ℃ to 870 ℃, wherein the heating rate is 3 ℃/min, then keeping at 870 ℃ for 1 hour, the process is a sintering process, and finally cooling from 870 ℃ to room temperature for natural cooling. Wherein, the binder contained in the green porcelain segments is decomposed and discharged at a certain temperature, so that deformation and even cracking during sintering are prevented. This step is added because the binder is likely to cause oxygen deficiency during the subsequent sintering process, which is not favorable for sintering the oxide ceramic. The influence of the glue discharging degree on the quality of the substrate is great, and if the glue discharging degree is too much, deformation and fragmentation can be caused; insufficient glue removal can lead to the deformation and delamination of the substrate. The sintering process is to heat and burn the green ceramic chip after the binder removal into a cooked ceramic chip, so that the ceramic body is hardened, the internal slurry is solidified and the structure is stable. The low-temperature co-firing is carried out by putting the green ceramic chip into a sintering furnace, and the process is mainly characterized in that the sintering temperature and the sintering curve are controlled, so that the uniformity of the temperature of a hearth is ensured, and the problem that the flatness of a substrate is influenced due to the large shrinkage rate of the substrate caused by the over-high sintering temperature is avoided. The plurality of monomer green compacts can be co-fired in a sintering furnace, the plurality of monomer green compacts to be sintered are required to be placed on a burning pot box, and a burning temperature curve is preset. The temperature rise is generally slow, usually 2-5 ℃ per minute, when the temperature rises to 550 ℃, the temperature needs to be preserved for one to two hours, so that organic matters and binders in the monomer green bodies can be discharged, then the temperature rise is continued to 850 or 870 ℃, and the temperature can be naturally reduced after the curing time is 1 hour. The overall process of sintering typically takes 3 to 8 hours, adjusted to the size and thickness of the green monolith and the binder characteristics.
Step S6: and (6) assembling. The thermoelectric refrigerator 12 is embedded into the mounting through hole 11 of each single substrate, the heat pipe assembly 32 is inserted into the mounting groove 31 of each single substrate, and the heat pipe assembly 32 is fixed, so that a plurality of LTCC integrated refrigeration systems based on heat pipes and thermoelectric refrigerators in the technical solutions of the first embodiment and the second embodiment are obtained.
Wherein the hot end of the thermoelectric refrigerator 12 is flush with the lower end of the mounting through hole 11, and the cold end of the thermoelectric refrigerator 12 is flush with the upper end of the mounting through hole 11; the upper end of the metal column 22 contacts with the hot end of the thermoelectric refrigerator 12, the lower end of the metal column 22 extends to the notch of the mounting groove 31, the evaporation section 321 of the heat pipe assembly 32 is located in the mounting groove 31 and below the plurality of heat conducting through holes 21, and the condensation section 322 of the heat pipe assembly 32 extends out of one end of the mounting groove 31.
In this embodiment, the upper end and the lower end of the mounting through hole 11 are flush with the upper surface and the lower surface of the upper ceramic tile 10, the hot end of the thermoelectric refrigerator 12 is flush with the lower surface of the upper ceramic tile 10, and the cold end of the thermoelectric refrigerator 12 is flush with the upper surface of the upper ceramic tile 10; the upper end of metal column 22 and the upper surface parallel and level of middle level ceramic chip 20, the lower extreme of metal column 22 and the lower surface parallel and level of middle level ceramic chip 20, upper strata ceramic chip 10, middle level ceramic chip 20 and lower floor's ceramic chip 30 all hug closely together, the upper end of metal column 22 and the hot junction contact of thermoelectric refrigerator 12, the lower extreme of metal column 22 can extend to the notch department of mounting groove 31, the evaporation zone 321 of heat pipe subassembly 32 is located mounting groove 31 and is located a plurality of heat conduction through-holes 21 below, the condensation zone 322 of heat pipe subassembly 32 is stretched out by the one end of mounting groove 31. In this embodiment, after the heat pipe assembly 32 is inserted into the mounting groove 31, the mounting groove 31 is filled with the heat conductive adhesive 33, the heat pipe assembly 32 is fixed in the mounting groove 31 by the heat conductive adhesive 33, and the lower end of the metal pillar 22 is in contact with the heat conductive adhesive 33, so that the metal pillar 22 can transfer heat to the heat pipe assembly 32 through the heat conductive adhesive 33.
The LTCC integrated refrigeration system based on the heat pipe and the thermoelectric refrigerator manufactured in the above steps of this embodiment can effectively improve the heat dissipation performance of the substrate. Finally, the heat source chip 40 may be soldered on the upper surface of the thermoelectric refrigerator 12 for use.
Example four
The difference from the third embodiment is that, specifically, before the punching and grooving in step S1, the upper green ceramic sheet 10, the middle green ceramic sheet 20 and the lower green ceramic sheet 30 are printed with a circuit in advance outside the punching and grooving region to produce the upper green ceramic sheet 10, the middle green ceramic sheet 20 and the lower green ceramic sheet 30 having the printed circuit. Then, punching and grooving are carried out and steps S2-S4 are carried out. Before step S5, the mounting tiles 60 printed with the circuit are laminated with the green body with the printed circuit and the mounting slot body after isostatic pressing, then the green body with the mounting tiles 60 is subjected to the sintering process of step S5, then the assembling process of step S6, and finally the heat source chip 40 is soldered on the upper surface of the thermoelectric refrigerator 12, and can be assembled with the electronic components by the mounting tiles 60. Wherein, the lamination of the mounting tile 60 printed with the circuit and the green body after isostatic pressing is to place the mounting tile 60 on the lower surface of the lower layer tile 30 with the printed circuit for lamination, the mounting tile 60 is used for passive device integration or circuit wiring, pin leading-out and mounting with external components.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples described in this specification can be combined and combined by those skilled in the art.
The foregoing is a more detailed description of the invention in connection with specific preferred embodiments and it is not intended that the invention be limited to these specific details. For those skilled in the art to which the invention pertains, several simple deductions or substitutions can be made without departing from the spirit of the invention, and all shall be considered as belonging to the protection scope of the invention.

Claims (9)

1. An integrated refrigerating system of LTCC based on heat pipe and thermoelectric refrigerator, characterized by that includes: the thermoelectric refrigerator comprises a thermoelectric refrigerator (12), a heat pipe assembly (32), and a lower layer ceramic chip (30), a middle layer ceramic chip (20) and an upper layer ceramic chip (10) which are sequentially arranged from bottom to top;
the upper layer ceramic chip (10) is provided with a mounting through hole (11);
the thermoelectric refrigerator (12) is fixedly arranged in the mounting through hole (11), the hot end of the thermoelectric refrigerator (12) is flush with the lower surface of the upper ceramic chip (10), and the cold end of the thermoelectric refrigerator (12) is flush with the upper surface of the upper ceramic chip (10); an external heat source chip (40) is fixedly arranged on the surface of the cold end of the thermoelectric refrigerator (12);
a plurality of heat conducting through holes (21) are formed in the middle layer ceramic chip (20);
the plurality of heat conducting through holes (21) are all positioned below the thermoelectric refrigerator (12);
the upper end of the heat conduction through hole (21) is in contact with the thermoelectric refrigerator (12), the lower end of the heat conduction through hole extends towards the lower layer ceramic sheet (30), and a metal column (22) is filled in the heat conduction through hole (21);
the lower layer ceramic chip (30) is provided with an installation groove (31);
the mounting groove (31) is communicated with the outside at one end and is positioned below the plurality of heat conduction through holes (21);
the heat pipe assembly (32) is provided with an evaporation section which is positioned in the mounting groove (31) and below the plurality of heat conduction through holes (21), and a condensation section which extends out of one end of the mounting groove (31) and is connected with external cooling equipment;
the upper end of the metal column (22) is in contact with the hot end of the thermoelectric refrigerator (12), and the lower end of the metal column extends to the notch of the mounting groove (31).
2. A LTCC integrated refrigeration system based on heat pipe and thermoelectric refrigerator as claimed in claim 1 further comprising a heat conducting glue (33);
the heat-conducting glue (33) is filled in the mounting groove (31) and is in contact with the metal column (22);
the heat pipe assembly (32) is fixed in the mounting groove (31) through heat conducting glue (33).
3. An LTCC integrated refrigeration system based on heat pipes and thermoelectric coolers according to claim 1 or 2, characterized in that the plurality of heat conducting through holes (21) are evenly distributed.
4. An LTCC integrated refrigeration system based on heat pipes and thermoelectric refrigerators according to claim 1 or 2, characterized in that the depth of the mounting groove (31) is 0.2 mm-5 mm.
5. A manufacturing method of an LTCC integrated refrigeration system based on a heat pipe and a thermoelectric refrigerator is characterized by comprising the following steps:
step S1, arranging a plurality of mounting through holes (11) on the upper layer green porcelain segment at intervals; a plurality of heat conduction through holes (21) arrays are formed in the middle-layer green porcelain segment at intervals, metal slurry is filled in the heat conduction through holes (21) to form metal columns (22), and a plurality of metal columns (22) in the heat conduction through holes (21) form the metal column (22) arrays; a plurality of mounting grooves (31) are arranged on the lower layer green porcelain segment at intervals;
step S2, carrying out lamination and isostatic pressing layer processing on a first preset number of carbon ribbon pieces to obtain a first carbon ribbon green compact crude product, carrying out lamination and isostatic pressing layer processing on a second preset number of carbon ribbon pieces to obtain a second carbon ribbon green compact crude product, and then respectively carrying out laser scribing on the first carbon ribbon green compact crude product and the second carbon ribbon green compact crude product to obtain a plurality of first carbon ribbon green compact samples and a plurality of second carbon ribbon green compact samples;
wherein the shape and size of the first carbon tape green compact sample are the same as those of the mounting through hole (11); the shape and the size of the second carbon tape green blank sample are the same as those of the mounting groove (31);
s3, putting each first carbon ribbon green-pressing sample into each mounting through hole (11), putting each second carbon ribbon green-pressing sample into each mounting groove (31), and then performing lamination treatment on a lower layer green porcelain segment, a middle layer green porcelain segment and an upper layer green porcelain segment in sequence from bottom to top to obtain green-pressing;
wherein the mounting groove (31) is positioned below the plurality of heat conducting through holes (21), and the plurality of heat conducting through holes (21) are all positioned below the mounting through holes (11);
step S4, carrying out vacuum encapsulation on the green body, and then carrying out isostatic pressing lamination treatment;
step S5, carrying out hot cutting on the green bodies subjected to isostatic pressing lamination to obtain a plurality of monomer green bodies, and carrying out low-temperature sintering treatment on the plurality of monomer green bodies to obtain a plurality of monomer substrates;
step S6, embedding a thermoelectric refrigerator (12) in the mounting through hole (11) of each single substrate, inserting a heat pipe assembly (32) in the mounting groove (31) of each single substrate and fixing the heat pipe assembly (32), so as to obtain a plurality of LTCC integrated refrigeration systems based on heat pipes and thermoelectric refrigerators as claimed in any one of claims 1-4;
the hot end of the thermoelectric refrigerator (12) is flush with the lower end of the mounting through hole (11), and the cold end of the thermoelectric refrigerator (12) is flush with the upper end of the mounting through hole (11); the upper end of the metal column (22) is in contact with the hot end of the thermoelectric refrigerator (12), and the lower end of the metal column (22) extends to the notch of the mounting groove (31); the evaporation section of the heat pipe assembly (32) is located in the installation groove (31) and below the heat conduction through holes (21), and the condensation section of the heat pipe assembly (32) extends out of one end of the installation groove (31).
6. The manufacturing method according to claim 5, wherein the specific step of the step S4 includes: firstly, wrapping the green body by using a preservative film, then placing the lower layer of raw porcelain segments of the green body on a first pressure bearing plate, placing a second pressure bearing plate on the upper layer of raw porcelain segments, wrapping soft silica gel sheets on the first pressure bearing plate and the second pressure bearing plate, then integrally placing the green body in an encapsulation belt for vacuum encapsulation, and integrally carrying out isostatic pressing lamination after the vacuum encapsulation is finished.
7. The manufacturing method according to claim 5, wherein the specific process of the low-temperature sintering process in the step S5 is as follows: firstly heating from room temperature to 550 ℃, wherein the heating rate is 2 ℃/min, then keeping at 550 ℃ for 2 hours, then heating from 550 ℃ to 870 ℃, wherein the heating rate is 3 ℃/min, then keeping at 870 ℃ for 1 hour, and finally cooling from 870 ℃ to room temperature for natural cooling.
8. The method of manufacturing according to claim 5, wherein the fixing of the heat pipe assembly (32) in the step S6 includes: filling the mounting groove (31) with heat-conducting glue (33), wherein the heat pipe assembly (32) is fixed in the mounting groove (31) by the heat-conducting glue (33);
the lower end of the metal column (22) is in contact with the heat-conducting glue (33).
9. Manufacturing method according to claim 5, characterized in that the mounting through-hole (11) and the mounting groove (31) are obtained by laser scribing;
the heat conduction through hole (21) is formed by picosecond laser drilling.
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