CN109830443A - A kind of large scale fluid channel production method based on LTCC technique - Google Patents
A kind of large scale fluid channel production method based on LTCC technique Download PDFInfo
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- CN109830443A CN109830443A CN201910139806.1A CN201910139806A CN109830443A CN 109830443 A CN109830443 A CN 109830443A CN 201910139806 A CN201910139806 A CN 201910139806A CN 109830443 A CN109830443 A CN 109830443A
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- prefabricated section
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Abstract
The large scale fluid channel production method based on LTCC technique that the invention discloses a kind of, belong to component technical field, its step includes: production expendable material prefabricated section crude green body and backing material prefabricated section crude green body, process compound sacrifice prefabricated section, compound sacrifice prefabricated section is put into ltcc substrate green in ltcc substrate laminated process, compound sacrifice prefabricated section, LTCC green substrate are pressed and be sintered, further processing；Large scale fluid channel manufacturing technology based on LTCC technique of the invention, its advantage is that material is simple, processing compatibility is good, easy to process, the large scale fluid channel that sectional area is 20*0.35mm can be made, fluid channel LTCC product design and difficulty of processing are thus greatly reduced；Also the cooling capacity of ltcc substrate is greatly strengthened, to meet high heat flux density thermal management requirements, there is very strong practical value.
Description
Technical field
The present invention relates to component technical field more particularly to a kind of large scale fluid channel production sides based on LTCC technique
Method.
Background technique
With the raising of level of integrated system, size is further reduced, heat transfer, forced air cooling or heat pipe of existing backwardness etc.
Heat dissipation technology is no longer satisfied local high heat flux density device thermal management requirements, and internal heat can not be scattered away quickly and effectively and will be led
Cause component failure.In order to solve heat dissipation problem after three-dimension packaging is highly integrated and miniaturization, it is developed and a kind of is sealed in module
Dress is internally integrated the technology of liquid cooling fluid channel with LTCC ceramic substrate, carries out highly effective liquid cooling to high heat flux density device to realize
Heat exchange.The technology is that expendable material is put into reserved and is buried in cavity, sintered in LTCC ceramic substrate manufacturing process
Cheng Zhong, expendable material remove to form liquid cooling fluid channel.The introducing of fluid channel can destroy the original structure of ceramics, cause ceramic change
Shape and cracking.In order to reduce influence of the fluid channel to ceramic structure, it is mainly currently used for fluid channel inside production ltcc substrate
Small scale fluid channel, such as fluid channel sectional area disclosed in Chinese patent CN205385017U are 0.2*0.2mm2。
The shortcomings that existing conventional microchannel, is: (1) due to the limitation of fluid channel size, in LTCC product design, needing
Consider the trend of fluid channel, position of arranging makes fluid channel is as much as possible to pass through beneath chips, increases LTCC product design
Difficulty；(2) in order to realize higher cooling capacity, complicated runner design is needed, is brought to the processing of fluid channel ltcc substrate
Great difficulty；(3) since existing fluid channel cross section is small, runner flow resistance is bigger than normal, and cooling liquid speed is small in runner, simultaneously
The cross-sectional area of runner is small, and for the heat exchange area of coolant liquid with regard to small, the cooling capacity of restricting substrate causes it to be unable to satisfy high fever
Current density thermal management requirements.
Summary of the invention
The object of the invention is that a kind of large scale fluid channel production method based on LTCC technique is provided, on solving
State problem.
To achieve the goals above, the technical solution adopted by the present invention is that it is such:
A kind of large scale fluid channel production method based on LTCC technique, comprising the following steps:
A. expendable material prefabricated section crude green body and backing material prefabricated section crude green body are made respectively；
B. it is pre- the resulting expendable material prefabricated section crude green body of step a and backing material prefabricated section crude green body to be processed into expendable material respectively
Clamp dog and backing material prefabricated section；
C. expendable material prefabricated section obtained by step b and backing material prefabricated section are formed into compound sacrifice prefabricated section, then existed
The compound sacrifice prefabricated section is put into ltcc substrate green when ltcc substrate laminated process；
D. compound sacrifice prefabricated section, LTCC green substrate are pressed together；
E. the LTCC green substrate that step d is pressed together is sintered, obtains semi-finished product；After the completion of sintering, expendable material
Prefabricated section completely disappears to form large scale fluid channel, and backing material prefabricated section is sintered with ltcc substrate, while can be big ruler
Fluid channel support is spent, prevents large scale fluid channel from deforming or cracking；
F. shape needed for the resulting semi-finished product of step e being processed into final required large scale fluid channel ltcc substrate.
The expendable material prefabricated section preferably uses carbon-based ceramic chips, it is preferred to use existing equal static pressure especially temperature etc. are quiet
Technique is pressed to make compression moulding, thickness is suitable with green gate thickness, then preferably uses and is laser-cut into required fluid channel
Outer dimension, and the emptying aperture of many specific shapes and position is cut on it as backing material prefabricated section placement location；It sacrifices
Material can be with oxygen reaction when ltcc substrate is sintered, and completely burned is fallen, to form large scale fluid channel；
The backing material prefabricated section preferentially uses LTCC ceramic chips and existing temperature isostatic pressing process makes compression moulding, thick
Degree is suitable with green fluid channel thickness, is then laser-cut into required backing material outer dimension.The backing material cut is pre-
Clamp dog is put into the expendable material prefabricated section made, is combined into required compound sacrifice prefabricated section；Backing material prefabricated section with
Ltcc substrate is sintered together, while can be supported for large scale fluid channel, prevents large scale fluid channel from deforming or cracking；
The LTCC material is preferably Dupont951, and the prefabricated block of material of support column is preferably also Dupont951, i.e., with
LTCC material is consistent.
The present invention is based on the purposes of the large scale fluid channel of LTCC technique, and it is the big of 20*0.35mm that cross-sectional area, which can be processed,
Scale fluid channel realizes the encapsulation to higher power device under same substrate volume；The large scale microchannel technology advantage
It is that design is simple, is easy to make, 20*20mm can be provided2Liquid cooling heat exchange area and realization 600ml/min cooling liquid speed, from
And heat-sinking capability is improved, adapt to high packaging density and the encapsulation of powerful device.
Also, the present invention contains the large scale micro-channel structure of support column arrangement, is able to achieve the production of large scale fluid channel, mentions
The heat-sinking capability of high substrate.Using the compound quick Fabrication sacrificed prefabricated block mode and realize fluid channel, compatible prior art is reduced
Design and manufacture difficulty, improving production efficiency.
Compared with the prior art, the advantages of the present invention are as follows: the large scale fluid channel system of the invention based on LTCC technique
Make technology, its advantage is that material is simple, processing compatibility is good, it is easy to process, the big ruler that sectional area is 20*0.35mm can be made
Fluid channel production is spent, the difficulty of LTCC product design and the difficulty of fluid channel ltcc substrate processing are thus greatly reduced；Also big
The cooling capacity of ltcc substrate is enhanced greatly, to meet high heat flux density thermal management requirements, there is very strong practical value.
Detailed description of the invention
Fig. 1 is the process flow chart of the embodiment of the present invention 1,2；
Fig. 2 is that the compound sacrifice prefabricated section of the embodiment of the present invention 1,2 makes schematic diagram；
Fig. 3 is the large scale fluid channel ltcc substrate lamination schematic diagram of the embodiment of the present invention 1；
Fig. 4 is the large scale fluid channel ltcc substrate structural schematic diagram of the embodiment of the present invention 1；
Fig. 5 is the large scale fluid channel ltcc substrate lamination schematic diagram with blind chamber of the embodiment of the present invention 2；
Fig. 6 is the large scale fluid channel ltcc substrate structural schematic diagram with blind chamber of the embodiment of the present invention 2.
In figure, 1, expendable material prefabricated section；2, backing material prefabricated section；3, compound sacrifice prefabricated section；4, ltcc substrate.
Specific embodiment
The present invention will be further described with reference to the accompanying drawings.
A kind of large scale fluid channel production method based on LTCC technique, referring to Fig. 1, comprising the following steps:
A. expendable material prefabricated section crude green body and backing material prefabricated section crude green body are made using warm isostatic pressing process respectively；The temperature
Isostatic pressing process is the prior art well known to those skilled in the art, is object to be processed to be placed in the closed appearance for filling with liquid
In device, is gradually pressurizeed by pressure charging system and each surface of object is applied with equal pressure, make it outside not changing
Internal porosity is reduced in the case where seeing shape, is increased matrix density and is improved the physical property of substance；
B. it is processed using fine laser technology respectively that the resulting expendable material prefabricated section crude green body of step a and backing material is prefabricated
Block crude green body is processed into expendable material prefabricated section and backing material prefabricated section；
C. expendable material prefabricated section obtained by step b and backing material prefabricated section are formed into compound sacrifice prefabricated section, then existed
The compound sacrifice prefabricated section is put into ltcc substrate green when ltcc substrate laminated process；
Wherein, it is compound sacrifice prefabricated section production method as shown in Fig. 2,
LTCC technique uses the prior art well known to those skilled in the art, as shown in Figure 1, including ceramic chips punching, filling perforation, print
Brush, begin to speak, lamination, etc. static pressure, the present invention put after it begins to speak step, before lamination by compound sacrifice prefabricated section
Enter in ltcc substrate green；Its method as indicated at 3,
D. compound sacrifice prefabricated section, LTCC green substrate are pressed together using isostatic pressing process；
E. the LTCC green substrate that step d is pressed together is sintered, obtains semi-finished product；
F. shape needed for the resulting semi-finished product of step e being processed into final required large scale fluid channel ltcc substrate.
In order to meet the requirement of flow passage structure and substrate dielectric constant, the LTCC and support column material of present example 1 and 2
Dupont951 green material is used, but is not excluded for using other green materials.Such as when substrate is needed using dielectric constant
5.9, when the ceramic material of dielectric loss 2 ‰, ceramic substrate can select Ferro A6M green material to make.
In order to meet the requirement of channel size, the expendable material of present example 1 and 2 uses carbon-based green material, but
It is not excluded for using other expendable materials.
Embodiment 1:
The size 40*40*1.45 mm of the ltcc substrate of the present embodiment3, the size 20*20*0.35 mm of large scale fluid channel3,
The quantity of support column is 9, and the size of support column is Φ 1.8*0.35mm3, ltcc substrate thickness is respectively 0.5mm to fluid channel up and down
And 0.6mm, the size of fluid channel coolant connection are Φ 2, as shown in Figure 4.
Embodiment 2:
The present embodiment is as shown in 5 and 6, the size 40*40*1.95 mm of ltcc substrate3, the size of substrate cavity is 30*30mm2,
The size 20*20*0.35 mm of large scale fluid channel3, the quantity of support column is 9, and the size of support column is Φ 1.8*0.35mm3,
Ltcc substrate thickness is respectively 0.5mm, 0.5mm and 0.6mm up and down for cavity, fluid channel, and the size of fluid channel coolant connection is
Φ2。
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.
Claims (8)
1. a kind of large scale fluid channel production method based on LTCC technique, which comprises the following steps:
A. expendable material prefabricated section crude green body and backing material prefabricated section crude green body are made respectively；
B. it is pre- the resulting expendable material prefabricated section crude green body of step a and backing material prefabricated section crude green body to be processed into expendable material respectively
Clamp dog and backing material prefabricated section；
C. expendable material prefabricated section obtained by step b and backing material prefabricated section are formed into compound sacrifice prefabricated section, then existed
The compound sacrifice prefabricated section is put into ltcc substrate green when ltcc substrate laminated process；
D. compound sacrifice prefabricated section, LTCC green substrate are pressed together；
E. the LTCC green substrate that step d is pressed together is sintered, obtains semi-finished product；
F. shape needed for the resulting semi-finished product of step e being processed into final required large scale fluid channel ltcc substrate.
2. according to the method described in claim 1, it is characterized by: step a is made of isostatic pressing process.
3. according to the method described in claim 1, it is characterized by: step b is processed using fine laser technology.
4. according to the method described in claim 1, it is characterized by: step d is pressed using isostatic pressing process.
5. according to the method described in claim 1, it is characterized by: step f is processed by the way of laser or grinding wheel scribing.
6. according to the method described in claim 1, it is characterized by: the expendable material prefabricated section use carbon-based ceramic chips,
Thickness is suitable with green gate thickness.
7. according to the method described in claim 1, it is characterized by: the backing material prefabricated section use LTCC ceramic chips,
Thickness is suitable with green fluid channel thickness.
8. according to the method described in claim 1, it is characterized by: the ltcc substrate material is Dupont951.
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Cited By (7)
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| CN110828961A (en) * | 2019-11-26 | 2020-02-21 | 中国电子科技集团公司第五十四研究所 | Manufacturing method of LTCC embedded hollow rectangular waveguide structure |
| CN111223838A (en) * | 2020-01-10 | 2020-06-02 | 株洲中车时代半导体有限公司 | Insulating welt of high-efficient heat dissipation |
| CN112218486A (en) * | 2020-09-01 | 2021-01-12 | 西安电子科技大学 | LTCC integrated refrigeration system based on heat pipe and thermoelectric refrigerator and manufacturing method thereof |
| CN113155348A (en) * | 2021-02-26 | 2021-07-23 | 西安微电子技术研究所 | Piezoresistive pressure sensor signal processing module and integration method thereof |
| CN113980406A (en) * | 2021-11-10 | 2022-01-28 | 中国电子科技集团公司第三十八研究所 | LTCC substrate sacrificial material, preparation method and application thereof |
| CN114046757A (en) * | 2021-11-09 | 2022-02-15 | 中国电子科技集团公司第二十九研究所 | Method for accurately controlling wall thickness of fine liquid cooling runner |
| CN115321954A (en) * | 2022-08-09 | 2022-11-11 | 广东环波新材料有限责任公司 | Preparation method of ceramic substrate and low-temperature co-fired ceramic substrate |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110828961A (en) * | 2019-11-26 | 2020-02-21 | 中国电子科技集团公司第五十四研究所 | Manufacturing method of LTCC embedded hollow rectangular waveguide structure |
| CN111223838A (en) * | 2020-01-10 | 2020-06-02 | 株洲中车时代半导体有限公司 | Insulating welt of high-efficient heat dissipation |
| CN112218486A (en) * | 2020-09-01 | 2021-01-12 | 西安电子科技大学 | LTCC integrated refrigeration system based on heat pipe and thermoelectric refrigerator and manufacturing method thereof |
| CN112218486B (en) * | 2020-09-01 | 2021-06-04 | 西安电子科技大学 | LTCC integrated refrigeration system based on heat pipe and thermoelectric refrigerator and manufacturing method thereof |
| CN113155348A (en) * | 2021-02-26 | 2021-07-23 | 西安微电子技术研究所 | Piezoresistive pressure sensor signal processing module and integration method thereof |
| CN113155348B (en) * | 2021-02-26 | 2023-09-12 | 西安微电子技术研究所 | Piezoresistive pressure sensor signal processing module and integration method thereof |
| CN114046757A (en) * | 2021-11-09 | 2022-02-15 | 中国电子科技集团公司第二十九研究所 | Method for accurately controlling wall thickness of fine liquid cooling runner |
| CN114046757B (en) * | 2021-11-09 | 2022-07-15 | 中国电子科技集团公司第二十九研究所 | Method for accurately controlling wall thickness of fine liquid cooling runner |
| CN113980406A (en) * | 2021-11-10 | 2022-01-28 | 中国电子科技集团公司第三十八研究所 | LTCC substrate sacrificial material, preparation method and application thereof |
| CN113980406B (en) * | 2021-11-10 | 2022-12-09 | 中国电子科技集团公司第三十八研究所 | LTCC substrate sacrificial material, preparation method and application thereof |
| CN115321954A (en) * | 2022-08-09 | 2022-11-11 | 广东环波新材料有限责任公司 | Preparation method of ceramic substrate and low-temperature co-fired ceramic substrate |
| CN115321954B (en) * | 2022-08-09 | 2023-07-07 | 广东环波新材料有限责任公司 | Preparation method of ceramic substrate and low-temperature co-fired ceramic substrate |
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