CN109830443B - LTCC process-based large-scale micro-channel manufacturing method - Google Patents
LTCC process-based large-scale micro-channel manufacturing method Download PDFInfo
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Abstract
The invention discloses a large-scale micro-channel manufacturing method based on an LTCC process, which belongs to the technical field of components and comprises the following steps: manufacturing a rough blank of a sacrificial material precast block and a rough blank of a support material precast block, processing a composite sacrificial precast block, putting the composite sacrificial precast block into LTCC substrate green porcelain in an LTCC substrate lamination process, laminating and sintering the composite sacrificial precast block and the LTCC green porcelain substrate, and further processing and forming; the large-scale micro-channel manufacturing technology based on the LTCC process has the advantages that the large-scale micro-channel manufacturing technology is simple in material, good in process compatibility and easy to process, and can manufacture large-scale micro-channels with the sectional areas of 20 x 0.35mm, so that the design and processing difficulty of micro-channel LTCC products is greatly reduced; the cooling capacity of the LTCC substrate is greatly enhanced, so that the requirement of high heat flux density heat management is met, and the LTCC substrate has high practical value.
Description
Technical Field
The invention relates to the technical field of components, in particular to a large-scale micro-channel manufacturing method based on an LTCC (low temperature co-fired ceramic) process.
Background
With the improvement of system integration level and further reduction of size, the existing backward heat dissipation technologies such as heat conduction, forced air cooling or heat pipes cannot meet the heat management requirements of local high heat flow density devices, and internal heat cannot be dissipated quickly and effectively, so that the devices fail. To is coming toThe problem of heat dissipation after three-dimensional packaging high integration and miniaturization is solved, people develop a technique of integrating liquid cooling micro channels inside an LTCC ceramic substrate for module packaging, and therefore high-efficiency liquid cooling heat exchange is carried out on a high-heat-flux device. The technology is that in the process of manufacturing the LTCC ceramic substrate, a sacrificial material is placed in a reserved embedded cavity, and in the process of sintering, the sacrificial material is removed to form a liquid cooling micro-channel. The introduction of the micro flow channel can damage the original structure of the ceramic, and cause the deformation and cracking of the ceramic. In order to reduce the influence of the micro flow channel on the ceramic structure, the micro flow channel used for manufacturing the LTCC substrate is mainly a small-scale micro flow channel, for example, the cross-sectional area of the micro flow channel disclosed in chinese patent CN205385017U is 0.2 × 0.2mm2。
The existing conventional micro-channel has the following defects: (1) due to the limitation of the size of the micro-channel, the trend and the arrangement position of the micro-channel need to be considered when the LTCC product is designed, so that the micro-channel penetrates through the lower part of the chip as much as possible, and the design difficulty of the LTCC product is increased; (2) in order to realize higher cooling capacity, a complex flow channel design is needed, and great difficulty is brought to the processing of the micro-flow channel LTCC substrate; (3) because the cross section of the existing micro-channel is small, the flow resistance of the channel is large, the flow velocity of cooling liquid in the channel is small, and meanwhile, the cross section area of the channel is small, the heat exchange area of the cooling liquid is small, the cooling capacity of the substrate is limited, and the requirement of high heat flow density heat management cannot be met.
Disclosure of Invention
The invention aims to provide a large-scale micro-channel manufacturing method based on LTCC technology to solve the problems.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows:
a large-scale micro-channel manufacturing method based on LTCC technology comprises the following steps:
a. respectively manufacturing a rough blank of a prefabricated sacrificial material block and a rough blank of a prefabricated support material block;
b. b, processing the rough blank of the prefabricated sacrificial material block and the rough blank of the prefabricated support material block obtained in the step a into a prefabricated sacrificial material block and a prefabricated support material block respectively;
c. b, forming a composite sacrificial precast block by the sacrificial material precast block and the support material precast block prepared in the step b, and then putting the composite sacrificial precast block into the LTCC substrate green porcelain in the LTCC substrate lamination process;
d. pressing the composite sacrificial precast block and the LTCC green ceramic substrate together;
e. sintering the LTCC green porcelain substrates pressed together in the step d to obtain a semi-finished product; after sintering is finished, the sacrificial material prefabricated block completely disappears to form a large-scale micro-channel, the supporting material prefabricated block is sintered together with the LTCC substrate and can support the large-scale micro-channel, and the large-scale micro-channel is prevented from deforming or cracking;
f. and e, processing the semi-finished product obtained in the step e into the shape required by the large-scale micro-channel LTCC substrate.
The sacrificial material precast block is preferably made of a carbon-based green ceramic chip, is preferably made into a press molding by adopting the existing isostatic pressing, particularly warm isostatic pressing process, and has the thickness equivalent to that of a green ceramic flow channel, is preferably cut into the required micro-flow channel outline dimension by adopting laser, and is cut with a plurality of holes with specific shapes and positions as the placing positions of the supporting material precast block; the sacrificial material can react with oxygen when the LTCC substrate is sintered and is completely combusted, so that a large-scale micro-channel is formed;
the supporting material prefabricated block is preferably made by adopting an LTCC green ceramic chip and the existing warm isostatic pressing process, is pressed and formed, has the thickness equivalent to that of a green ceramic micro-channel, and is then cut into the required overall dimension of the supporting material by laser. Putting the cut prefabricated blocks of the support material into the prefabricated blocks of the sacrificial material to be combined into the required composite prefabricated blocks of the sacrificial material; the supporting material prefabricated block is sintered together with the LTCC substrate, and can support the large-scale micro-channel at the same time, so that the large-scale micro-channel is prevented from deforming or cracking;
the LTCC material is preferably Dupont951 and the support column preform material is also preferably Dupont951, i.e., consistent with LTCC material.
The invention is based on the purpose of large-scale micro-flow channels of LTCC process, can process large-scale micro-flow channels with the cross section area of 20 x 0.35mm, and can process the large-scale micro-flow channels on the same substrate bodyPackaging of a higher power device is achieved; the large-scale micro-flow channel technology has the advantages of simple design, easy manufacture and capability of providing 20 × 20mm2The liquid cooling heat exchange area and the flow rate of the cooling liquid of 600ml/min are realized, so that the heat dissipation capacity is improved, and the packaging method is suitable for packaging devices with high packaging density and high power.
In addition, the large-scale micro-channel structure containing the support column structure can realize the large-scale micro-channel manufacturing and improve the heat dissipation capacity of the substrate. The micro-channel is rapidly manufactured in a composite sacrificial precast block mode, the existing process is compatible, the design and manufacturing difficulty is reduced, and the production efficiency is improved.
Compared with the prior art, the invention has the advantages that: the large-scale micro-channel manufacturing technology based on the LTCC process has the advantages that the large-scale micro-channel manufacturing technology is simple in material, good in process compatibility and easy to process, and can manufacture large-scale micro-channels with the sectional areas of 20 x 0.35mm, so that the design difficulty of LTCC products and the processing difficulty of micro-channel LTCC substrates are greatly reduced; the cooling capacity of the LTCC substrate is greatly enhanced, so that the requirement of high heat flux density heat management is met, and the LTCC substrate has high practical value.
Drawings
FIG. 1 is a process flow diagram of examples 1 and 2 of the present invention;
fig. 2 is a schematic view of manufacturing the composite sacrificial precast block according to embodiments 1 and 2 of the present invention;
FIG. 3 is a schematic view of a stack of a large-scale micro flow channel LTCC substrate according to example 1 of the present invention;
FIG. 4 is a schematic structural diagram of a large-scale micro-fluidic channel LTCC substrate according to embodiment 1 of the present invention;
FIG. 5 is a schematic diagram of a large-scale micro-fluidic channel LTCC substrate stack with blind cavities according to example 2 of the present invention;
fig. 6 is a schematic structural diagram of a large-scale micro-fluidic channel LTCC substrate with blind cavities according to embodiment 2 of the present invention.
In the figure, 1, a prefabricated block of sacrificial material; 2. supporting the prefabricated block of material; 3. compounding sacrificial precast blocks; 4. an LTCC substrate.
Detailed Description
The invention will be further explained with reference to the drawings.
A large-scale micro-flow channel manufacturing method based on LTCC process, referring to fig. 1, comprising the following steps:
a. respectively manufacturing a rough blank of a prefabricated sacrificial material block and a rough blank of a prefabricated support material block by adopting a warm isostatic pressing process; the warm isostatic pressing process is the prior art well known to those skilled in the art, and is characterized in that an object to be processed is placed in a closed container filled with liquid, and pressure is gradually applied to all surfaces of the object by a pressurizing system to apply equal pressure, so that internal pores are reduced under the condition that the appearance shape of the object is not changed, and the density of a matrix is increased to improve the physical properties of the object;
b. b, processing the rough blank of the prefabricated sacrificial material block and the rough blank of the prefabricated support material block obtained in the step a into a prefabricated sacrificial material block and a prefabricated support material block by adopting a fine laser process;
c. b, forming a composite sacrificial precast block by the sacrificial material precast block and the support material precast block prepared in the step b, and then putting the composite sacrificial precast block into the LTCC substrate green porcelain in the LTCC substrate lamination process;
wherein, the manufacturing method of the composite sacrificial precast block is shown in figure 2,
the LTCC process adopts the prior art which is well known to a person skilled in the art, as shown in figure 1, the steps of punching, filling, printing, cavity opening, laminating, isostatic pressing and the like of a green ceramic chip are included, and the composite sacrificial precast block is placed in the green ceramic of the LTCC substrate after the cavity opening step and before the laminating step; the method is as shown in figure 3,
d. pressing the composite sacrificial precast block and the LTCC green ceramic substrate together by adopting an isostatic pressing process;
e. sintering the LTCC green porcelain substrates pressed together in the step d to obtain a semi-finished product;
f. and e, processing the semi-finished product obtained in the step e into the shape required by the large-scale micro-channel LTCC substrate.
To meet the requirements of the flow channel structure and the substrate dielectric constant, Dupont951 green ceramic materials are used for the LTCC and the support pillar materials of examples 1 and 2 of the present invention, but other green ceramic materials are not excluded. For example, when the substrate is made of a ceramic material with a dielectric constant of 5.9 and a dielectric loss of 2 ‰, the ceramic substrate may be made of Ferro A6M raw ceramic material.
In order to meet the requirements of the flow channel size, the sacrificial materials of the invention in examples 1 and 2 are both carbon-based green ceramic materials, but other sacrificial materials are not excluded.
Example 1:
the size of the LTCC substrate of this embodiment is 40 × 1.45 mm3The size of the large-scale micro-flow channel is 20 x 0.35mm3The number of the supporting columns is 9, and the size of the supporting columns is phi 1.8 x 0.35mm3The thickness of the upper and lower LTCC substrates of the micro channel is 0.5mm and 0.6mm respectively, and the size of the cooling liquid interface of the micro channel is phi 2, as shown in FIG. 4.
Example 2:
in the present embodiment, as shown in fig. 5 and 6, the size of the LTCC substrate is 40 × 1.95 mm3The size of the substrate cavity is 30 × 30mm2The size of the large-scale micro-flow channel is 20 x 0.35mm3The number of the supporting columns is 9, and the size of the supporting columns is phi 1.8 x 0.35mm3The thicknesses of the cavity, the upper LTCC substrate and the lower LTCC substrate of the micro-channel are respectively 0.5mm, 0.5mm and 0.6mm, and the size of a cooling liquid interface of the micro-channel is phi 2.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (8)
1. A large-scale micro-channel manufacturing method based on LTCC technology is characterized by comprising the following steps:
a. respectively manufacturing a rough blank of a prefabricated sacrificial material block and a rough blank of a prefabricated support material block;
b. b, processing the rough blank of the prefabricated sacrificial material block and the rough blank of the prefabricated support material block obtained in the step a into a prefabricated sacrificial material block and a prefabricated support material block respectively;
c. b, forming a composite sacrificial precast block by the sacrificial material precast block and the support material precast block prepared in the step b, and then putting the composite sacrificial precast block into the LTCC substrate green porcelain in the LTCC substrate lamination process;
d. pressing the composite sacrificial precast block and the LTCC green ceramic substrate together;
e. sintering the LTCC green porcelain substrates pressed together in the step d to obtain a semi-finished product; after sintering is finished, the sacrificial material prefabricated block completely disappears to form a large-scale micro-channel, the supporting material prefabricated block is sintered together with the LTCC substrate and can support the large-scale micro-channel, and the large-scale micro-channel is prevented from deforming or cracking;
f. processing the semi-finished product obtained in the step e into the shape required by the large-scale micro-channel LTCC substrate finally required;
wherein the support material is the same as the LTCC substrate material.
2. The method of claim 1, wherein: and step a, manufacturing by adopting an isostatic pressing process.
3. The method of claim 1, wherein: and step b, processing by adopting a fine laser process.
4. The method of claim 1, wherein: and step d, adopting an isostatic pressing process for pressing.
5. The method of claim 1, wherein: and f, processing by adopting a laser or grinding wheel scribing mode.
6. The method of claim 1, wherein: the sacrificial material prefabricated block adopts a carbon-based green ceramic chip, and the thickness of the sacrificial material prefabricated block is equal to that of a green ceramic flow channel.
7. The method of claim 1, wherein: the support material prefabricated block adopts an LTCC green ceramic chip, and the thickness of the support material prefabricated block is equivalent to that of the green ceramic micro-channel.
8. The method of claim 1, wherein: the LTCC substrate material is Dupont 951.
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| CN110828961B (en) * | 2019-11-26 | 2021-06-08 | 中国电子科技集团公司第五十四研究所 | Manufacturing method of LTCC embedded hollow rectangular waveguide structure |
| CN111223838A (en) * | 2020-01-10 | 2020-06-02 | 株洲中车时代半导体有限公司 | Insulating welt of high-efficient heat dissipation |
| CN112218486B (en) * | 2020-09-01 | 2021-06-04 | 西安电子科技大学 | LTCC integrated refrigeration system based on heat pipe and thermoelectric refrigerator and manufacturing method thereof |
| CN113155348B (en) * | 2021-02-26 | 2023-09-12 | 西安微电子技术研究所 | Piezoresistive pressure sensor signal processing module and integration method thereof |
| CN114046757B (en) * | 2021-11-09 | 2022-07-15 | 中国电子科技集团公司第二十九研究所 | Method for accurately controlling wall thickness of fine liquid cooling runner |
| CN113980406B (en) * | 2021-11-10 | 2022-12-09 | 中国电子科技集团公司第三十八研究所 | LTCC substrate sacrificial material, preparation method and application thereof |
| CN115321954B (en) * | 2022-08-09 | 2023-07-07 | 广东环波新材料有限责任公司 | Preparation method of ceramic substrate and low-temperature co-fired ceramic substrate |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101971398A (en) * | 2008-03-07 | 2011-02-09 | A·德沃 | Fuel cell device and system |
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| CN104103525B (en) * | 2014-06-24 | 2017-05-24 | 中国电子科技集团公司第十研究所 | Control method for defects of cavity structure of LTCC (Low Temperature Co-fired Ceramic) substrate |
| CN105304577B (en) * | 2015-07-28 | 2017-12-08 | 中国电子科技集团公司第十研究所 | The preparation method of multi-chip module cooling encapsulation ceramic composite substrate |
| CN105514060B (en) * | 2015-11-25 | 2018-05-25 | 中国电子科技集团公司第二十九研究所 | It is a kind of that the interior method for burying heat dissipation microchannel is integrated in LTCC ceramic substrates |
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| Title |
|---|
| LTCC腔体及微通道制作技术;李有成，李海燕，王颖麟;《电子工艺技术》;20140131;第35卷(第1期);22-25页 * |
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