CN113155348B - Piezoresistive pressure sensor signal processing module and integration method thereof - Google Patents
Piezoresistive pressure sensor signal processing module and integration method thereof Download PDFInfo
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- CN113155348B CN113155348B CN202110218233.9A CN202110218233A CN113155348B CN 113155348 B CN113155348 B CN 113155348B CN 202110218233 A CN202110218233 A CN 202110218233A CN 113155348 B CN113155348 B CN 113155348B
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- ltcc substrate
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/02—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning
- G01L9/06—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning of piezo-resistive devices
- G01L9/065—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning of piezo-resistive devices with temperature compensating means
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/04—Means for compensating for effects of changes of temperature, i.e. other than electric compensation
Abstract
The invention discloses a piezoresistive pressure sensor signal processing module and an integration method thereof. The voltage conversion unit comprises a voltage stabilizer and a thin film resistor block, the signal processing unit comprises a bare chip with a built-in temperature sensor, an LTCC substrate and a shell, and the voltage stabilizer and the thin film resistor block are arranged on the front surface of the LTCC substrate; the LTCC substrate is provided with a through cavity, the back surface of the LTCC substrate is provided with a blind cavity, and a capacitor is embedded in the blind cavity; the inside of the shell is provided with a special-shaped boss structure, and the bottom surface of the shell is provided with shell pins; the LTCC substrate is sleeved in the abnormal boss structure in the shell through the through cavity; the bare chip is arranged on the surface of the special-shaped boss structure and is connected with the LTCC substrate through the bonding wire. The piezoresistive pressure sensor signal processing module is integrated through a three-dimensional assembly process. The invention solves the technical difficulties of miniaturized integrated design and high-precision temperature compensation of the sensor signal processing module.
Description
Technical Field
The invention belongs to the technical field of semiconductor hybrid integrated circuits, and relates to a piezoresistive pressure sensor signal processing module and an integration method thereof.
Background
The piezoresistive pressure sensor is used as a high-sensitivity and high-precision element, is one of key devices such as an absolute pressure meter, a flow rate meter, a flowmeter, an acoustic sensor, a pneumatic process controller and the like, and has very wide application in systems such as airborne, carrier-borne, missile-borne hydraulic detection, air pressure detection and the like. The traditional piezoresistive pressure sensor signal processing circuit has the characteristics of large volume, poor temperature coefficient and the like, is unfavorable for realizing the integrated integration of a pressure detection system in the weapon equipment, so the design of the metal fully-sealed piezoresistive pressure sensor signal processing module with small volume and temperature compensation function has important significance for improving the performance of the pressure detection system and realizing the miniaturization and the light weight of the weapon equipment.
The implementation of the signal processing module of the traditional piezoresistive pressure sensor has the following disadvantages:
1. the large circuit size is disadvantageous for miniaturization of the piezoresistive pressure sensor system. The size of the signal processing module of the traditional piezoresistive pressure sensor is larger than 25mm multiplied by 25mm, the weight and the volume of a circuit are large, and a miniaturized sensor system is required to be smaller than 15mm multiplied by 15 mm. Along with the requirements of miniaturization and light weight of hydraulic detection, pneumatic detection and other systems, the piezoresistive pressure sensor signal processing module needs to be integrated and optimized, and compared with the traditional piezoresistive pressure sensor signal processing circuit, the volume and weight of the optimized circuit need to be greatly reduced. 2. The nonlinear error of the circuit is large, and the use requirement of the piezoresistive pressure sensor in high-precision compensation cannot be met. The traditional piezoresistive pressure sensor signal processing circuit processes signals in an analog mode, temperature compensation adopts temperature sensitive elements such as a thermistor, and has the advantages of low compensation precision, large nonlinear error, low reliability and large circuit overall size, and cannot meet the use requirements of the existing high-precision compensation.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention aims to provide a piezoresistive pressure sensor signal processing module and an integration method thereof, which solve the technical difficulties of miniaturized integrated design and high-precision temperature compensation of the sensor signal processing module.
In order to achieve the above purpose, the invention is realized by adopting the following technical scheme:
the invention discloses a piezoresistive pressure sensor signal processing module, which comprises a voltage conversion unit and a signal processing unit, wherein the voltage conversion unit comprises a voltage stabilizer and a thin film resistor block, the signal processing unit comprises a bare chip with a built-in temperature sensor, an LTCC substrate and a shell, and the voltage stabilizer and the thin film resistor block are arranged on the front surface of the LTCC substrate;
the LTCC substrate is provided with a through cavity, the back surface of the LTCC substrate is provided with a blind cavity, and a capacitor is embedded in the blind cavity; the inside of the shell is provided with a special-shaped boss structure, and the bottom surface of the shell is provided with shell pins; the LTCC substrate is sleeved in the abnormal boss structure in the shell through the through cavity; the bare chip is arranged on the surface of the special-shaped boss structure and is connected with the LTCC substrate through the bonding wire.
Preferably, at least one blind cavity is arranged on the back surface of the LTCC substrate.
Preferably, the inner wall of the through cavity of the LTCC substrate is not contacted with the side wall of the special-shaped boss structure in the shell.
Preferably, the LTCC substrate is secured within the housing by a back surface.
Preferably, the housing is made of 10# steel with nickel plated surface.
Preferably, the capacitor is a surface-mounted ceramic capacitor.
Preferably, the bare chip is a digital chip MAX1452.
The invention discloses an integration method of a piezoresistive pressure sensor signal processing module, which realizes integration through a three-dimensional assembly process and comprises the following steps: firstly, assembling a bare chip on the surface of a special-shaped boss structure arranged in a shell; secondly, assembling the capacitor into a blind cavity on the back of the LTCC substrate, and fixing the LTCC substrate in the shell; thirdly, the voltage stabilizer group and the thin film resistor block are assembled on the front surface of the LTCC substrate, and the thin film resistor block is assembled on the front surface of the LTCC substrate in an insulating adhesive bonding mode; fourthly, realizing electrical interconnection between the LTCC substrate and the bare chip and between the LTCC substrate and the shell pins; and fifthly, hermetically packaging the shell.
Preferably, the first step adopts a conductive adhesive bonding mode, the second step and the third step adopt a reflow soldering mode, the fourth step adopts a bonding technology, and the fifth step adopts a parallel seam welding technology.
Preferably, the LTCC substrate is realized by adopting an LTCC multilayer substrate process, and the resistor is embedded in the LTCC substrate.
Compared with the prior art, the invention has the following beneficial effects:
the invention discloses a piezoresistive pressure sensor signal processing module, which adopts a mixed integrated circuit design technology based on an LTCC technology to carry out miniaturized integrated design on a piezoresistive pressure sensor signal processing circuit, so that each component of the circuit is integrated in a small-size metal shell, and the signal processing module is matched with a miniature sensor system. The LTCC substrate is provided with a through cavity and a blind cavity to form a special-shaped cavity-opening substrate structure, so that miniaturization integration of required components is realized. The piezoresistive pressure sensor signal processing module is internally provided with a special-shaped boss structure inside the shell to form a special-shaped cavity structure, so that the sensor signal processing module can collect shell temperature, the piezoresistive pressure sensor signal processing module can realize high-precision temperature compensation, the nonlinearity error of the system is reduced, and the reliability of the piezoresistive pressure sensor signal processing module is improved. Therefore, the piezoresistive pressure sensor signal processing module disclosed by the invention has the advantages of miniaturization and high-precision temperature compensation.
Further, through setting up a blind cavity at least in LTCC base plate back, can assemble the required partial electric capacity of module in the blind cavity, compare in assembling electric capacity at LTCC base plate surface, can effectively reduce the module height, can effectively reduce the area of LTCC base plate again.
Further, through the arrangement that the inner wall of the through cavity of the LTCC substrate is not contacted with the side wall of the special-shaped boss structure inside the shell, accurate collection of the shell temperature by the module can be realized, the influence of heat dissipation of the LTCC substrate on temperature collection is effectively reduced, and wiring of the surface layer of the substrate is facilitated under the condition that the size of the LTCC substrate is determined.
Furthermore, the shell is made of 10# steel with nickel plated on the surface, so that good heat conduction performance can be ensured, and high-precision temperature acquisition is facilitated.
Furthermore, the surface-mounted ceramic capacitor is used as a capacitor element, so that the miniaturized integrated design is facilitated.
The invention also discloses an integration method of the piezoresistive pressure sensor signal processing module, and the piezoresistive pressure sensor signal processing module is miniaturized in design and process by reasonable structural assembly, so that the reliability is improved, and the piezoresistive pressure sensor signal processing module can be matched with a miniature piezoresistive pressure sensor system.
Furthermore, the specific operation conventional process in the integrated method is simple, can be matched with the existing process equipment, and is beneficial to reducing the manufacturing cost.
Further, the LTCC substrate realized by adopting the LTCC multilayer substrate process can be beneficial to the reduction of the piezoresistive pressure sensor signal processing module in volume to a greater extent.
Drawings
FIG. 1 is a schematic circuit diagram of a piezoresistive pressure sensor signal processing module according to the present invention;
FIG. 2 is a diagram showing the internal structure of a signal processing module of a piezoresistive pressure sensor according to the present invention;
fig. 3 is a block diagram of an LTCC substrate according to the present invention.
Wherein: 1-bare chip; 2-bonding wire; a 3-LTCC substrate; 4-a special-shaped boss structure; 5-a housing; 6-capacitance.
Detailed Description
In order that those skilled in the art will better understand the present invention, a technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, shall fall within the scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and the claims of the present invention and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments of the invention described herein may be implemented in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
The invention is described in further detail below with reference to the attached drawings and to specific embodiments:
the invention discloses a piezoresistive pressure sensor signal processing module which consists of a shell 5 with a special-shaped metal structure, an LTCC substrate 3 with a special-shaped cavity structure and components. Wherein, the shell 5 part is provided with a special boss structure, and the bottom surface of the shell 5 is provided with a shell 5 pin; the LTCC substrate 3 is provided with a through cavity, the LTCC substrate 3 is sleeved in the abnormal-shaped boss structure 4 in the shell 5 through the through cavity, and the inner wall of the through cavity of the LTCC substrate 3 is not contacted with the side wall of the abnormal-shaped boss structure 4 in the shell 5; the back of the LTCC substrate 3 is provided with at least one blind cavity, a capacitor 6 is embedded in the blind cavity, and the LTCC substrate 3 is fixed in the shell 5 through the back. The surface of the special-shaped boss structure 4 is provided with a bare chip 1 with a built-in temperature sensor, the bare chip 1 is connected with an LTCC substrate 3 through a bonding wire 2, and a thin film resistor block and a voltage stabilizer are assembled on the front surface of the LTCC substrate 3.
Specifically, the capacitor 6 is a surface-mounted ceramic capacitor.
Preferably, in a specific embodiment of the present invention, the front surface of the LTCC substrate 3 is assembled with a capacitor 6, which is used with a voltage conversion unit, so that the influence of the power supply ripple on the bare chip 1 can be reduced, which is beneficial to improving the working stability of the bare chip 1.
Wherein, the voltage stabilizer and the thin film resistor block form a voltage conversion unit, and the other elements form a signal processing unit. The LTCC substrate 3 in the piezoresistive pressure sensor signal processing module is based on an LTCC process, a circuit layout is reasonably laid out and wired, a passive network is manufactured on the LTCC substrate 3 through sintering, screen printing and other processes, and a through cavity is formed in the middle of the LTCC substrate 3 and is used for matching the shell 5 special-shaped boss structure 4 in the piezoresistive pressure sensor signal processing module. The front side of the LTCC substrate 3 is provided with components such as a bare chip 1, and the back side of the LTCC substrate is provided with a blind cavity, so that the embedding of the surface-mounted ceramic capacitor can be realized. As shown in fig. 2.
Specifically, the bare chip 1 is used as a core device, the digital chip MAX1452 is selected, and a temperature sensor is arranged in the digital chip MAX1452, so that the functions of temperature acquisition and signal processing can be realized. The acquisition of the shell temperature is realized by assembling the digital chip MAX1452 on the surface of the special-shaped boss structure 4 in the piezoresistive pressure sensor signal processing module, and the acquisition is used for high-precision compensation of sensor signals. The remaining components are assembled on the LTCC substrate 3.
The piezoresistive pressure sensor signal processing module realizes the integration of components through a three-dimensional assembly process. The method specifically comprises the following steps: adopting a three-dimensional assembly process, firstly, assembling a bare chip 1 to the surface of a special-shaped boss structure 4 arranged in a shell 5; secondly, assembling part of the capacitor 6 into a blind cavity on the back surface of the LTCC substrate 3, and fixing the LTCC substrate 3 in the shell 5; thirdly, assembling the voltage stabilizer on the front surface of the LTCC substrate 3, and assembling the thin film resistor block on the front surface of the LTCC substrate 3 in an insulating adhesive bonding mode; fourthly, realizing electrical interconnection between the LTCC substrate 3 and the bare chip 1 and between the LTCC substrate 3 and pins of the shell 5 through a bonding technology; and fifthly, realizing airtight packaging in a parallel seam welding mode.
Referring to fig. 1, a schematic circuit diagram of a signal processing module of a piezoresistive pressure sensor according to the present invention is composed of two parts: the first part is a voltage conversion unit which converts the input 12-28V power supply voltage into +5V voltage for supplying power to the bare chip 1, and consists of a voltage stabilizer and a thin film resistor block; the second part is a signal processing unit and consists of a bare chip 1 and the like. The working principle is as follows: firstly, providing constant current source excitation for a silicon piezoresistive sensor; secondly, amplifying an original voltage signal output by the sensor and compensating nonlinearity; thirdly, carrying out temperature compensation on the signals according to the acquired shell temperature; and finally outputting a voltage signal. In addition, before the sensor is used, the original signals of the sensor are required to be acquired at different temperatures, and the compensation coefficient is calculated by an upper computer and then written into a memory of the chip.
Specifically, in one embodiment of the present invention, the voltage regulator is a three terminal voltage regulator LM117.
Specifically, in one embodiment of the present invention, the special-shaped boss structure 4 is designed as a part of the inner cavity of the housing 5, the size is 2.8mm×2.8mm×2.5mm, the material is 10# steel, and nickel plating is performed on the surface, so that good heat conduction performance can be ensured. And a digital chip MAX1452 is assembled on the surface of the special-shaped boss structure 4 in a conductive adhesive bonding mode, so that the real-time acquisition of the temperature of the shell is realized.
Specifically, in an embodiment of the present invention, the structure of the LTCC substrate 3 is shown in fig. 3, and the layout and the wiring of the circuit board in the piezoresistive pressure sensor signal processing module are optimally designed, so that the substrate can carry all passive networks, voltage regulators and surface-mounted ceramic capacitors under the dimensions of 11mm×11mm×2.4 mm. The through cavity size of the LTCC substrate 3 is 3.4mm multiplied by 3.4mm, and the LTCC substrate can be completely matched with the abnormal boss structure 4 in the inner cavity of the shell 5. The two blind cavities on the back of the LTCC substrate 3 can be embedded with 7 surface-mounted ceramic capacitors.
Specifically, when three-dimensional assembly is performed on the LTCC substrate 3, firstly, a bare chip 1 is assembled on the surface of a special-shaped boss structure 4 arranged in the shell in a conductive adhesive bonding mode; secondly, 7 surface-mounted ceramic capacitors are assembled in two blind cavities on the back surface of the LTCC substrate 3 in a reflow soldering mode, and the LTCC substrate 3 is fixed in the shell 5; secondly, 3 surface-mounted ceramic capacitors and 2 voltage regulators are assembled on the front surface of the LTCC substrate 3 in a reflow soldering mode; thirdly, 1 thin film resistor block is assembled on the front surface of the LTCC substrate 3 by adopting an insulating adhesive bonding mode; and finally, performing airtight packaging in a parallel front welding mode. Finally, the size of the signal processing module of the piezoresistive pressure sensor is 14mm multiplied by 5.5mm.
The miniaturization of the module size is realized by adopting an LTCC multilayer substrate process, and the LTCC substrate 3 has the following two functions: 1. the module embeds partial resistors in the multilayer LTCC substrate 3 through printing, sintering and other processes, so that the use area of the substrate is reduced; 2. the back of the LTCC substrate 3 is opened, and part of the capacitor 6 is assembled in a blind cavity on the back of the substrate, so that the volume of the substrate is effectively reduced.
In particular, in one embodiment of the invention, the piezoresistive pressure sensor signal processing module is in the form of a metal parallel seam welded full-sealed package,
the above is only for illustrating the technical idea of the present invention, and the protection scope of the present invention is not limited by this, and any modification made on the basis of the technical scheme according to the technical idea of the present invention falls within the protection scope of the claims of the present invention.
Claims (8)
1. The piezoresistive pressure sensor signal processing module is characterized by comprising a voltage conversion unit and a signal processing unit, wherein the voltage conversion unit comprises a voltage stabilizer and a thin film resistor block, the signal processing unit comprises a bare chip with a built-in temperature sensor, an LTCC substrate and a shell, and the voltage stabilizer and the thin film resistor block are arranged on the front surface of the LTCC substrate;
the LTCC substrate is provided with a through cavity, the back surface of the LTCC substrate is provided with a blind cavity, and a capacitor is embedded in the blind cavity; the inside of the shell is provided with a special-shaped boss structure, and the bottom surface of the shell is provided with shell pins; the LTCC substrate is sleeved in the abnormal boss structure in the shell through the through cavity; the bare chip is arranged on the surface of the special-shaped boss structure and is connected with the LTCC substrate through the bonding wire;
the back of the LTCC substrate is provided with at least one blind cavity;
the inner wall of the through cavity of the LTCC substrate is not contacted with the side wall of the special-shaped boss structure in the shell;
the signal processing unit is used for providing constant current source excitation for the silicon piezoresistive sensor; amplifying an original voltage signal output by a sensor and compensating nonlinearity; performing temperature compensation on the signals according to the acquired shell temperature; and finally outputting a voltage signal, collecting original signals of the sensor at different temperatures before use, calculating a compensation coefficient by using an upper computer, and writing the compensation coefficient into a memory of the bare chip.
2. The piezoresistive pressure sensor signal processing module according to claim 1, wherein the LTCC substrate is fixed in the housing by a back surface.
3. The piezoresistive pressure sensor signal processing module according to claim 1, wherein the housing is made of 10# steel surface-plated with nickel.
4. The piezoresistive pressure sensor signal processing module according to claim 1, wherein the capacitance is a surface-mounted ceramic capacitance.
5. The piezoresistive pressure sensor signal processing module according to claim 1, wherein the bare chip is a digital chip MAX1452.
6. The method for integrating a piezoresistive pressure sensor signal processing module according to any one of claims 1 to 5, wherein the integration is achieved through a three-dimensional assembly process, comprising the steps of:
firstly, assembling a bare chip on the surface of a special-shaped boss structure arranged in a shell;
secondly, assembling the capacitor into a blind cavity on the back of the LTCC substrate, and fixing the LTCC substrate in the shell;
thirdly, the voltage stabilizer group and the thin film resistor block are assembled on the front surface of the LTCC substrate, and the thin film resistor block is assembled on the front surface of the LTCC substrate in an insulating adhesive bonding mode;
fourthly, realizing electrical interconnection between the LTCC substrate and the bare chip and between the LTCC substrate and the shell pins;
and fifthly, hermetically packaging the shell.
7. The method of integrating a piezoresistive pressure sensor signal processing module according to claim 6, wherein the first step is a conductive adhesive bonding method, the second and third steps are reflow soldering methods, the fourth step is a bonding technique, and the fifth step is a parallel seam welding technique.
8. The method of claim 6, wherein the LTCC substrate is implemented by using an LTCC multilayer substrate technology, and the LTCC substrate has resistors embedded therein.
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| CN117168546B (en) * | 2023-11-02 | 2024-01-23 | 苏州敏芯微电子技术股份有限公司 | Temperature and pressure combined sensor, preparation method thereof and packaging structure |
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| 提高刚挠结合印制板耐热性能制造方法;吴东坡 等;《印制电路信息》(第11期);第64-65页 * |
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| CN113155348A (en) | 2021-07-23 |
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