TW512505B - Common type packaging method of microsensor - Google Patents

Abstract

The present invention is a common type packaging method of microsensor, which mainly utilizes low temperature co-fired ceramic (LTCC) as the carrying substrate, and utilizes flip chip to associate the sensing device and circuit device, i.e. signal processing IC on the upper and lower surface of the carrying substrate. The method is: (1) dispose the sensing device and circuit device into pre-dug cavity on the substrate, and electrically connect the circuits by printed pad on the low-temperature co-firing ceramic substrate and flip-chip bump; (2) coordinate the flip-chip bump and underfill to increase the mechanical bonding strength, and, on the other hand, protect the electronic devices from being damaged by the detrimental environment of exterior and ensure the reliability of circuit connection by the use of underfill. Also, this method provides a self-packaging function to reduce the complexity of the process; (3) use low-temperature co-firing ceramic as the carrying substrate, which concurrently has the function of environmental interface and electrical interface. Thus, the packaging design of each type of sensor is simpler, the process is standardized, so that the packaging of microsensor becomes the item of ordered factory, thereby the scale of mass production being reached, the cost being even cheaper.

Description

V. Description of the invention (1) [Background of the invention] In general, the core technology of sensor packaging can be described in accordance with the following levels: Level 0ne Wafer layer (Wa ferie ve j) The main f is the crust of the same material or different materials, providing multiple layers of different, and mouth, biased to complete the more thick or complex sensing to include ... Anodic bonding, fused gold bonding, dry, see the method ( silicon fusion bonding) > CVD

Unt glass b〇nding) δ) Λέ / ^ νΐ) / Sealing and hybrid glass bonding g. The approximate process is shown in the table below. Process anodizing material Pyrex borosilicate glass is doped with a lot of nano-process specifications. 30 0-450 〇C, 3 00-1 000V, ~ 30 minutes Very flat surface co-fusion gold bonding (reactive metal bonding) Thin metal such as gold 363 t Organic bonding polymer or epoxy silver glue Low temperature, disadvantages: incomplete Sealed, with aging effects 512505 V. Description of the invention (2) Shi Xirong joins silicon with silicon hydrophilicity (Hydrophi 1 ic), clean and polished silicon wafer, 1 00-1 2 0 〇 it, For several hours, the second layer (Leve 1 Two) chip layer (Ch ip 1 eve 1) is mainly the pin-out of the sensing element and the circuit element itself. The commonly used technique is to place the component on a lead frame. The fresh pad on the lead is leaded to the lead frame, or the bump is made on the fresh wafer of the component by using a flip-chip manufacturing bump technology. The third level (Board level) is mainly the connection between the sensing element and the circuit element to the circuit substrate, so that the sensing element and the circuit element can communicate with each other, and also allows the circuit substrate to have larger pads. 'Electrical equipment that can be connected to the outside world, commonly used technology is Surface Mount Technology (SMT); In addition, flip-chip technology is also used as the combination of sensing elements and circuit elements (integratiQn). _ The fourth layer (Level Four) sensor (system) layer mainly provides the interface between the body to be sealed and the shell. The body to be sealed here is a component above the substrate layer. The focus of technological development is: & (a ) What kind of insulating glue, oil, and paint should be used for the insulation of the lead wire. earth

(b) Positioning of the to-be-sealed body The shape of the shell can be poorly cut. The positioning glue enables the square to-be-sealed body to be combined with the round Δ mountain cut without misalignment, closed or open. The design and production of wires or wireless connectors, the choice of wired wires, including circuit components on the right, must be more than four lines, including ^ 2 power lines, two signal lines; if only active sensing elements, For thermocouples, piezoelectric materials, etc., two wires are required. Housing (housing) design and selection of materials are metal, plastic, ceramic, glass or more of the above; the addition method also depends on the material (㈧Plastic: injection molding, dipping " / (Η Meng: pumping Drawing, welding, pressing, cutting, discharging, locking, stamping c) pottery: glued (d) glass: glued, anodic bonding. There are changes in the shape of the tube and box, etc .; the installation methods are external and intrusive. : F-hole insertion; the reduction of power takes into account mechanical strength, chemical strength, and EMC heat transfer test. In recent years, under the consideration of cost, plastic housing has been paid more attention, and there is greater flexibility in production, for example, using double layers ( (Or dual-material) co-injection injection molding process, which will prevent electromagnetic interference or high conductivity and other materials or core materials. ^ ^ The package can be divided into semi-closed and single-sided: chemical sensor is fully closed

512505 V. Description of the invention (4) Overhead and down pressure sensor Overhead and down accelerometer (acceleration sensors) Overhead and down absolute pressure sensor Top and bottom dense coil package Up and down differential pressure sensor, wind speed Interface a: Sensitivity and example gas Ion gas temperature Optical electric ant pressure Refer to Figure 1 to explain the problems between components when general microsystems are packaged, a, b, c, d, e, which represent various types of packaging interfaces . The interface between the measuring element 1 0 1 and the environment 1 0 2 requires that the parameters to be measured should be transparent, and other unrelated environmental physical and chemical parameters should be blocked. Gas sensors: semi-transparent membranes, ionic sensors: paSsiVation layers, gas and humidity sensors: net Grids and filters temperature sensors: metal studs optical sensors: giass windows magnetic field sensors: plastic layers ( pressure sensors): Direct contact with the medium under test

Page 8 512505 V. Description of the invention (5) Flow sensor (f 1 〇wsens 〇rs): direct contact with the medium to be measured acceleration (acceleration sensors): no contact with the medium to be tested chemical sensors (chemical sensors) : Direct contact with the medium to be tested b: the interface between the sensing element and the packaging material 丨 〇5 chip mounting and interconnection techniques (chip mounting and interconnection techniques) possible problems are mechanical stress-generated during the bonding process, such as Bonding force generated by processes such as anodic bonding, fusion bonding, fusion gold bonding, and adhesive bonding

Thermal stress-occurs after the bonding process, such as wafers, sticky crystal materials, and has a different coefficient of thermal expansion (CTE) from the substrate. Thermal effect-offset temperature coefficient, drift. Quasi (mi sal ignment)-Allows pressure sensors or acceleration sensors to measure other unrelated components c · The interface between the sensing element and the electronic circuit element 丨 〇3, possible problems are parasitic effects and load effects d • The interface between electronic components and packaging materials is EMC.

And moisture, dust, corrosion, damage to the pads and connection lines, heat dissipation e: the interface between electronic components and electrical 104, that is, electrical wiring (electrical

Wlre) ’Possible problems are small to large, EMC, pull damage, or wireless transmission

Page 9

k a: 玎 ’5. Description of the invention (6) From the above description, we know that a micro-sensor packaging method needs to overcome the interface problems between the above components Π

'J μ

Applying flip-chip packaging technology to the packaging of microsensors has been studied in recent years, (Mayer, F .; Haberli, A .; Jacobs, Η .; Ofner, G .; Paul, 0 .; Baltes, H MSingle-chip CMOS anemometer ", Electron Devices Meeting, 1997. Technical Digest., International, 1997, pp. 895 -8 9 8) The concept of flip-chip is used to integrate thermal CMOS anemometer components (including signal processing circuits). ), Packaged on a ceramic substrate, which uses a 2 micron CMOS process to complete the circuit and film, and then completes the process with a single photomask

Micromachined parts. First PECVD deposited 1 micron silicon nitride (sn icon ni tr ide (Si3N4)) on the upper surface as a protective layer, and then PEC on the lower surface, and the hole area was defined by a 0.66 "meter nitride plant,- K0 dirty etched to the upper field oxide layer (fie 1 d ox i de), we can get the required thin film structure. 'There is a set of heaters, 2 sets of thermopiles, each set of thermopiles It consists of 20 bidoped (brake-polycrystalline) / (capacitor-polycrystalline silicon) thermocouples. The heating input and output terminals of the thermopile are connected to 5 contact pads 2 0 丄, female port | ^ 1 one by one; no. The ceramic substrate is printed in thick film to make 6 large pads 2 2 for the wires, and 5 small pads for connecting the bumps on the sensor chip. A pad with a rectangular frame printed in the middle is used to connect and seal with the bump frame 204 on the sensing crystal. The material is up to 'corrosion resistant, 25 microns in height' and then cut with laser rectangle

Page 10 512505 V. Description of the invention (7) Cut out an opening as an access hole 2 0 5. After the sensing wafer is combined with the ceramic substrate flip chip 206, there is corrosive gas, which will not be able to contact the circuit of the wafer due to the sealing function of the long box and the bump box, so the circuit on the wafer will not be damaged. . In US Patent 6140144 (10/31/2000), a method similar to [Mayer] is only disclosed. The main purpose is to use a substrate containing perforations or holes, on which a wafer containing a sensing element is placed, and a pad and an underfill are used to fill the connection with a capillary phenomenon, and then a metal is used. Wires, wireb and pads connect electronic circuits. If necessary, a protective film can be selectively deposited on them to protect these circuits. The applicable object is extended to a variety of sensors, such as pressure, accelerometer, Chemical sensors, etc., but this method is complicated, reduces yield and increases manufacturing costs. The upper part is slightly miscellaneous. In the US patent 6 1 469 1 7 (1 1 / ΐ4 / 2〇〇ίΠ +), it can be made by a silicon wafer as a substrate, and The tomb of Sheng Er Er is covered with two ί, f broken glass on the Shi Xi wafer. If sand is used. Shi Xi is fused into dense glass ^ Lid, then the temperature required for anode connection is higher; Bu ' The expansion coefficient of the upper and lower layers is the same, the point (400 ° C ~ 500 t), but the dense cover is anodically bonded, and the required temperature is lower. If it is covered with broken glass, the upper and lower layers are different. Expansion coefficient: The method mentioned in this patent ^ ® can be used to make up for shortcomings. The silicon substrate is used throughout the nightmare; the mechanism of the work lies in the role of microfabrication, which must be accompanied by materials.

The shoulder protector is still around the processed structure. Fifth, the invention is explained. (8) The flat silicon θ circle # before the processing is maintained. As a wafer-level nozzle, the microstructure of the cavity must be etched to seal the microstructure of 301, and the perforation 302 should also be etched, with # 俨 姑 山 合, protruding inside as m ^ i The tooth holes 3 02, so that the electrical wires are badly connected. The disadvantage of this method is that it is limited to a sealed structure. Wu Du Chong and the like are described in US Patent 6225 69 2 (3/1 2/00) a method for packaging micro-machined structures, + I raft 娓 山 _ There is a hole in the co-firing ceramic pottery: ί The upper == out uses multiple layers. The Vla is electrically connected with conductive wires, and the top layer is combined with the welding pad with the method of reflow, and the bottom layer is welded with dense J = er and rinf.塾 and micro-machined semiconductor devices (MEMs) at the bottom of the bottom ί ΐ ΐI: But because this method does not add 隹 0, W during the production process, it may produce a library due to different thermal expansion coefficients to make the product life Reduced, and the use of sealing ring joints at the joints of low temperature co-fired ceramics and micro force 2 U-body equipment, the degree of sealing is not disclosed in US Patent 62 1 4644 (4/1 0/200 1) The structural formula * mainly proposes a kind of connection between the wafer and the substrate using microfabrication using solder pads, and filling the wafer with the underfill to make the bonding between the two more tight, and improve Holes = closed holes, and solve the problem of different thermal expansion coefficients between the two. One disadvantage of the method, only An accelerometer or the like is completely sealed junction

[Objective of the Invention] One of the objectives, the second of the objectives, the third of the objectives, the fourth of objectives, the fifth of objectives, the sixth of objectives, and the seventh objective provide a load substrate (LTCC) of small input pads into large input and output pins. Provide an environmental interface to meet the needs of different sensors. A substrate having a double-sided bonding element is provided. Provided is a technology for interfacing and connecting a sensing unit and a packaging material or a chip to reduce mechanical stress, thermal stress, thermal effects, and misalignment. Provide an interface technology for sensing elements and electronic components to reduce) parasitic effects and load effects. The LTCC is connected by the = line and the perforation, so the connection is short. Even in high-frequency applications, there will not be too much parasitic effects and load effects. Ϊ 1 surface technology of electronic components and packaging materials, so as to avoid water rolling, dust, corrosion, damage to the pads and connection lines. S "Electrical wiring technology to reduce electromagnetic interference, and has anti-pull function or wireless transmission function. Inventive technology] A Basically, the function of flip-chip bumps can be used in the present invention ^ ΠΓ • as an electrical phase Tonoda ar A # 4 knows 3 肀 can be summarized as follows: Combined use ^ (sensing element combined with signal processing circuit) V. Description of the invention (10) 2, structuring elements, because the size of the convex input can be It can be changed as required, and it can be used as an electrical element to improve the mechanical strength, such as a pressure gauge. Coins and underfills 3 · Selection sealing function, the use of diversified shapes and sizes of the bumps can achieve the sealing function 4. Heat transfer path, heat dissipation or heat conduction. Even wireless communication 5. Minimize smart sensors (including signal processing circuits and signal circuits). 6 Diversified materials, not limited to lead-tin alloys. 7. :: The hole-filling metal can be used as a matching component between two layers of different transmission line impedances, and the bumps can reduce the consideration of parasitic effects generated by the package. The various types of microsystems have a common structure when packaging. The interface is integrated into the carrier substrate. Here, the carrier substrate is low :: /, the sensing element is mainly based on micro-processing. Micro-system components can be divided into about four types of components = surface = pieces (Single-S1ded component) includes: sensing elements, electronic components, and double-sided components (double_sided c〇mp〇nent) includes

J ,: Low: Both the upper and lower sides of the co-fired ceramics can be used for joining electronic components and testing components, and can also be used as contact pads. 3Single / double-sided components including electrical interface 4

Page 14

Cheng Bian j Low-temperature co-fired ceramics are the principle of the carrier substrate because of its manufacture. A is inherently easy to make double-sided components, which meets the requirements of environmental interfaces and milk interfaces. Its characteristics are as follows: • Can be produced using a die. A large number of open cavities 40 1 are used as the environmental interface to accommodate the medium to be tested into the sensing element, as shown in FIG. 4. With the use of a die, a closed cavity 402 can be made to accommodate the active element, or as a barrier for the element isolation, refer to FIG. • It is possible to use a hole-filling metal in combination with a printed metal cover below to form a cavity for isolation, which has the function of EMC.

4. It can use penetrating metal to make the electrical interface similar to the lead frame under the substrate or the small pads of the probe card to the large pads. 5. The upper substrate is polished or flattened, or the upper substrate with a flat surface is used, and the coplanarity and roughness are sufficiently small. • Passive components such as resistors 501, inductors 502, and capacitors 503 can be selectively printed between the layers, refer to Figure 5. ^ Low-temperature co-fired ceramic tape system is provided by glass / ceramic dielectric tape in the form of a whole roll. It is matched with metal izat ion paste for printing and hole filling. . The metallization paste used can be mixed, such as silver paste for the buried layer, and gold or copper for the upper layer or the bonding layer, so that it can be easily soldered with other separate active or passive components. . Low-temperature co-fired ceramic technology is more like Print Wire Board (PWB) technology, which can process different layers in parallel, and each layer can be punched, printed, and dried, with the best yield and cost efficiency.

Page 15 512505 V. Description of the invention (12) Obtained, because each program has nothing to do with the previous one, it can be tested separately before the convergence, so the yield can be improved. -Once finished, they can be stacked together and co-fired at 800-90 ° (RC, 2 = degree, fully integrated substrate). The material used for low-temperature co-fired ceramic packaging is Acha, a dielectric material. The constant is approximately ~ the extension between allows a wider microwave transmission line, so it has lower conductor loss than Si, = As or the circuit on the Aiumina substrate, and the low-temperature co-firing ceramics has a low 1 〇 ss tangent, about 0 =: 10GHz ', so it has low dielectric attenuation. Low temperature co-firing. It is composed of multi-layer 0.1-0.15mm thick ceramics, and only the second transmission line and some passive components are installed in it. The layers of components are unsintered, and laser or mechanical drilling is used as through-holes. Therefore, compact and dense packaging can be achieved. All transmission lines, bias lines, and control lines can be completed. It is a better package co-fired ceramics proposed by the invention. The top of the substrate can be covered with a two-component mounting board to measure the component (chip) 1G1 and the circuit component (chip) m to cover two f-free 701 and solder. The pad 702 is combined with the substrate, and the required connection lines can be printed. The middle layers are connected by through holes. If the space capacity = 1, the electrical interface 104 [(such as a connector (which can include USB function ^ 03, Fk Λ fork group 604, optical communication module 605, such as infrared communication) (A) —Either one) Place the upper layer 601 of the carrier substrate. If space is limited, :::: air interface is placed on the bottom layer 60 of the substrate. The carrier substrate can be made of a selective punching layer and a porous material. Layer, protective material coating, transparency

Page 16 D125〇5 The crystal cover covers the light path. Another invention description (13) material coating, etc., to meet the needs of the environmental interface. FIG. 7 is another embodiment of FIG. 6. The circuit element and the sensing element are both 3? Some CM0S sensors are all on the same chip, and then the electrical interface is placed on the substrate. The carrier substrate can also be used to seal the bottom layer. Fig. 8 is a bottom layer of another embodiment of Fig. 6. Fig. 9 is another embodiment of Fig. 6. 2. The circuit elements are placed on the substrate. Both are placed in the cavity of the carrier substrate, and then the circuit elements and the sensing elements are placed. Ran M ceramic plate is sealed by the flip-chip method. Figure 10 is the top layer of another real-life substrate on Figure 6. This method involves placing various components on the sensor. Fly is particularly suitable for infrared cameras. Figure 11 is another embarrassing component of Figure 6. It was originally placed in the cavity of the substrate. 2 The sensing element and the electrical diagram 7 to Figure 10 can also be implemented in this way. . It is placed on the top of the substrate; Figure 12 is a low temperature co-firing ceramic pottery of the present invention; ^ ^ ,,, ° 楫 is not intended.芩 According to Figure 12 and Figure 13, the details of the low-temperature co-firing ceramic material "blank breaking two steps are as follows: the shape of 10, 20, 30, and 40. You ▼" cut out the substrate divided into two on the substrate 10, 20, 30 through holes 5 "7, 1 7. 25 and the empty meaning will fill the through holes 5, 15, 25 filled with conductive materials, such as,

V. Description of the invention (14)

Film paste. 4. Print conductive wires 12, 22, and 32 on the substrate and passive components. And selective print welding 5. Check the substrates 10, 20, 30 and 40 for defects. 6 • The substrates 10, 20, 30, and 40 are stacked on each other to form a ceramic combination 50. 7 · Place circuit elements and sensing elements or electrical interfaces 7, 1 7 in. Put it together and heat it under pressure and place it in the hole that was dug in advance. After the above steps are completed, the connector type is regarded as the external connection of the ball. When it is, then the second method: • Place the paste on the pad by plating or printing. I 0 · Place the solder ball on the solder pad. II. The ball is bonded via reflux. (2) The manufacturing process of the connector and the sensing element is as follows: q Temple is packaged in a low-temperature co-fired ceramic 12. Inject an underfill. 13. Clean the entire package. 14. Entire package 髀 15. Electrical test of the entire package. The body is tested for final appearance.

Example 1 I force sensor

Page 18 5125 05. Description of the invention (15) m01 means that the circuit element 103 is placed in a hole dug in advance on the substrate, and the block 701 and the low-temperature co-fired printed pad on the substrate are used as two. Connect and knot 'and use the underfill 801 to fill the flip-chip bumps, so-not only can avoid the reliable production of knots in the harsh external environment ... and this method is also sealed; Process: ι: The complexity of the low-cost process In addition, for passive components such as larger resistances, capacitors, and inductors due to rule two in the circuit components, the passive component 802 is selectively printed on the mt board as a circuit connection or test: two equivalents When measuring the relative pressure, the vent hole 803 is a reference hole or a vent hole, and it is sealed with a straight air. When measuring, when the pressure of the external fluid, the reason is; The fluid pressure is converted to the electrical connector to achieve the effect of small solder pads to large pads ... or when using the package of this embodiment, it must be considered whether the fluid is corrosive, 2 should be coated-protective film or when the fluid Pressure measurement range ^: Nichiji needs to use the finite element method ANSYS To analyze, the large number of flip-chip bumps and the combination with the underfill can be reduced to counteract the total force of the fluid pressure on the film. Evening and mechanical strength: Fifteen is another example of pressure sensing. The same embodiment as in Figure 14, except that the through hole 803 is changed from the sealing method of the square S board. Figure 16 is The cross-sectional view of another embodiment is similar to the four packaging methods. The iron lies in the original circuit components and passive components.]:

512505 V. Description of the invention (16) Below the sensing element, as shown in Figures 103 and 802, this seal uses the characteristics of low-temperature co-fired ceramic to make the sensor body support ^ ^ method can be fully 4 Belling is shrinking. Embodiment 2 Acceleration Sensor FIG. 17 is a cross-sectional view of an embodiment of an acceleration sensor.

The monolithic CMOs produced by Analog Devices Co., Ltd. are widely used in packaging methods similar to Ana log Devices, but the H tester is similar, only on the lead frame of T0-8, and then connected to the chip: pad : = The chip is placed in a protective cover and then vacuum-sealed. The wire frame provided in this embodiment has a sensing element 101 and a low-temperature structure, which are 22 in common and have a structure of 901. A total of two maps are directly related to the future, and the other structures are pressure sensing. The same device is used. The vacuum packaging is required when the two parts are packaged, so that the resonant junctions act together to reduce the sensing error. In addition, the low, and w Α ”connector 902 connector becomes a cadaver / Xia Tao in advance. You can connect the connection to the standard cake, and then set the CMOS chip, lower n from m to A, and lower the pot to the upper layer and the CMOS crystal. Inject the underfill, and then Connector--It is joined with the large solder pads on the lower layer of the low-temperature co-fired ceramic, and finally cut off as a whole. Figure 18 is a cross-sectional view of another embodiment. The packaging method is similar to Figure 16 except that the original circuit components Both the passive element and the passive element are placed under the sensing element, as shown in Figs. 103 and 80. Example 3 Humidity, temperature, gas flu detector

Page 20, Description of the Invention (17), and Figure 19 are examples of the humidity, temperature, and gas flu detectors. The three sensing elements are made on the same chip, and then placed on the channel containing the inlet 1 1 1 ^ It can be used for the feedback control of air-conditioning system, automobile '豕 庭' and hospital.

The f-degree sensor is mainly diffused from the piezoresistance to the silicon wafer. The thin film is formed by micro-processing technology. The hygroscopic layer can be achieved by coating with p〇 丨 y 丨 m 丨 de. Each piezoresistor is placed in the south sensitive area. When the ambient humidity increases, p0 丨 y 丨 m 丨 de will expand and cause changes in piezoresistance, and the relative humidity will be obtained from the circuit. The temperature is achieved using a diffused resistor on a silicon wafer. Gas flu test 1 on a dielectric film made by CM0S, heated by deposited polycrystalline silicon resistance (similar to hot wire) 'and one thermo piies on each side of the resistor to detect the temperature difference on the film caused by the airflow V dT.实施 例 四 Gas sensor

Figure 20 shows a miniature oxygen sensor, which uses a low-temperature co-fired ceramic carrier substrate with vent holes 1 2 1 as the environmental interface with the gas to be measured, and the electrical interface and circuit components can be placed in the carrier substrate. The difference in oxygen concentration between the two sides of the electrode generates voltage, and the proportional relationship between voltage and voltage is used to predict the concentration of the gas to be measured. Its application range includes environmental protection industries such as room, air, and other air quality monitoring, and medical industries such as education Baby room, breathing gas and other oxygen monitoring. Measuring range: 0 ~ 25% 02, accuracy: 0.5%. In addition, the packaging method of carbon monoxide micro-sensors is also similar. In another embodiment, the packaging method is similar to that in FIG.

Page 21 512505 5. The circuit components and passive components of (18) are placed under the sensing components. Example 5 Sonic Sensor Figure 2Η is a condenser microphone made of polyimide on a silicon substrate (including an on-chip CMOS amplifier) (

Pedersen, M., et.al., " A Polymer Condenser

Microphone on Silicon with on-chip CMOS amplifier, ▼▼ Transducers '97, IEEE, Chicago, june 16 — 19, 1 997, pp · 445-446 ·), the bottom of the film has a lower electrode, and the bottom of the porous polyimide backplate is up The electrode, when the film is deformed by the sound pressure, the condenser capacitance value will change, and then take the voltage value of 1 corresponding to the sound value through the On_chip amplifier; the package is only required to cover the output type of the amplifier and the fresh pad of the carrier substrate. *, And Cheng Cheng if if Guang. lyimid ^, just open-through hole (3). The electrical wiring can be connected by solder pads printed on the thick film of the substrate. ,, Board, ceramic substrate with thick film technology can be used. Carrier base at b. In another embodiment, the packaging method and diagram. Circuit components and passive components are placed under the sensing element ^. 'The original embodiment 6 wireless sensor wireless sensor is a sensor with a functional connector,. ^ Xingma wired transmission or I, mainly including a right-stained, secondary wireless transmission with sensing elements and circuits yuan

Page 22 V. Description of the invention (19) Sense of the item>, Head || Crying Pond: Eryang, a module containing a unit that can passively receive electrical energy or a unit that transmits measurement signals As shown in Figure 22, this example is the overall block diagram of the monitoring bud communication module. A piece of clothing Rishou 'is a Bluetooth communication module with a sensing unit and circuit components PI4: clothing on the carrier substrate, and then injected with an underfill agent to seal it. The antenna and J can be placed on the top layer of the board, or It is directly embedded in the substrate. Another implementation method is to make the circuit components, including the ADC and USB processing workers and connectors that provide USB specifications, directly connect the Bluetooth module with USB function to form a wireless with Bluetooth communication function. Sensor. Others, such as the packaging of optical sensors, require a transparent environmental interface, such as glass. It is also easy to use; (Refer to M · r · Gongora-Rubio, et. Al · Overview of l0w temperature co-fired ceramics tape technology f〇r meso-system technology ",

Sensors and Actuators A 89 (20 0 1) 222-24 1) In fact, 'low temperature co-fired ceramics can be combined with other materials, such as glass, talman, metal, and stone, and co-fired or post-fired ( PoSt_fired), this technology is fully compatible with thick film and some thin film technologies. Glass can be co-fired or coated with glass powder (g 1 assfrits) and then fired at a lower temperature to combine with low-temperature co-fired ceramics. Ceramics can be co-firing frits, glazes, epoxy resins, or hard Welding technology to combine with low-temperature co-fired ceramics; silicon can be coated with metallic die-attaching pastes and co-fired or post-fired with low-temperature co-fired ceramics.

The 512505 diagram on page 23 is a simple explanation. The 512505 diagram on page 24 is sufficient for energy efficiency and special purpose. The inspection and review of the commissioner for the detailed description of the map are hereby identified and explained. Step by step more ... There is a post-question question face to face, each piece of fashion is sealed in the system. One picture is intentional-the first diagram means zero. The diagrammatic method of the figure shows the structure of the knot-hole counting machine, the airspeed plus the wind speed, and the micro-OS installation of the CM seal. The type of pottery and a burning mound Illustrations. The original seals of Yuanjia fc, which are intended to display seals, are planted with a brush and printed on the inner tray. The original bearing is as shown in Figures 5-6. JJ, TUJ, rnj. Shi Shi Shi Shi Shi II & one one 5AB one one one one another another / ον / ^ v spoon AR figure figure six hundred sixty-sixth is the figure for the figure figure seventy-eight Ninth, the first, the second, the first, the second, the second, and the other diagrams. Flow. The examples of the maps are intentionally created. The sixth and sixth editions of Mingliufaliu are as shown in Figures 1 and 2. The illustrations are intended to show the temperature of the ceramic porcelain pottery firing and the low temperature of the ceramics are as shown in Figures 3 and 4. The schematic diagram shows the example of the embodiment of the embodiment, the device is implemented, the sensor is a sensor, the force is sensed, the pressure is sensed, and the pressure is increased at another speed. Scoop / 3. Bai Baimingmingfafafa The book is for the purpose of illustrations Figures 567. The illustrations are intended to show the actual Av AMV sampler, which is used to measure the real-world sensor, and to measure the temperature and speed of the spoon. A3. KpTT issued a copy of the book. It is a diagram of the figure. Figure 8 shows the diagram. The figure is a block diagram to illustrate the example of the device. Lanwei's example of the hair is really for the purpose of illustration. Figure 1-2505 Page 512505 Schematic 5 through hole 8 pad 12 conductive wire 17 cavity 2 2 conductive wire 3 0 blank glass ceramic tape 4 0 Blank glass ceramic tape 1 0 0 Carrier substrate 1 0 2 Environmental interface 1 0 4 Electrical interface 2 0 1 Contact pad 2 0 3 Bump 2 0 5 Perforation 2 0 7 Sensor chip 301 Closed cavity 4 0 1 Open air Hole 501 Resistor 5 03 Capacitor 6 0 1 Upper layer of the carrier substrate 6 0 3 Connector 6 0 5 Optical communication module 7 0 1 Flip bump 8 0 1 Underfill 8 0 3 Through hole 8 0 5 Ball 9 0 1 Resonant structure 111 Channel entrance 1 2 1 Through hole 1 3 1 Through hole cavity blank glass ceramic tape through hole White glass-ceramics with the through-hole conductive ceramic compositions sensing element line electronic circuit elements

Packaging materials H Solder pads for connecting wires Bump frame Flip-holes Perforations Sealed holes Inductors Bottom layer of the carrier substrate RF communication module · Solder pads Passive components Perforation Vacuum Channel exit Page

Claims (1)

Six patent application scopes, a common micro-sensing cry-fired ceramic as a carrier substrate, the square root, mainly uses low-temperature common circuit elements or electrical interfaces and uses a flip-chip to combine the sensing unit and the electric circuit; The upper and lower sides are characterized by-the use of low temperature co-fired ceramics to make multilayer ceramic materials, such as punching, lithography, printing, etc.-the so-called carrier substrate is made as a so-called cutting substrate; many), through holes, channels And, cousin, a cavity, a second cavity (or-the sensing element and the circuit element 妾. Circuit and passive components; a hole, a second cavity (or f ^ f electrical interface is placed in the so-called first empty The substrate is electrically connected; and the gaps in the substrate of the load-bearing substrate are filled with flip-chip bumps and If pads and-bottom fillers; in addition to through-holes, circuit elements or electrical interfaces and -environment interfaces are combined with M 'ceramics Wan, Shi Xi, Duo τ #It is placed on the carrier substrate Z with a "test element" method that is connected to transparent glass, metal (grid ~ electric interface can be selected above or connected to the material, such as the first in the scope of patent application: Empty-the point item is Electricity of the common micro-sensor package of the second is made by technology :: the circuit components or the electrical interface 2 (or more) on the underload substrate are slightly larger than those of the sensor unit and the circuit components Holes are inserted in the square, as in the patent application Fanxin: interface. Sensing the porous material layer, protective material coating, etc. of the common micro-sensing rigid device package described in the earlier item. Page 25 512505 VI. Patent application method, in which low temperature co-fired ceramics can pass humidity and temperature through this method. 4. For patent application method, each layer uses low wiring, including passive components. 5. If a patent application method is used, it may or may not be included in a carrier substrate, a junction or a signal, such as a patent application method, where the connection line between the test component and the electric pad has a promise, such as a patent application method, where the component or electrical space In the cavity (or the circuit element or range, the so-called resistance is used at a low temperature, the so-called circuit element carrier substrate, the electric range, and the so-called interface interface). The so-called through hole refers to the so-called bearing. Research technology production—holes to make; Bu = bottom with π, # X #, day 丨-^ from the outside of the sensing medium ί J: such as relative pressure sensors, air / claw sensing ancestors and sound waves Tester. The so-called connection circuit of the common micro-sensor package described in the first item of the scope refers to the various connection layers required through the so-called co-fired ceramics in the so-called carrier substrate, and the through-holes between the layers. One layer of conductive wire and one of the passive components of the common type micro-sensor package mentioned above can be printed on the technology of so-called ceramics and used as a circuit connection when the circuit components cannot be beaten and the inductance is inducted. The two-dimensional connection of the common micro-sensor package described in the second item refers to placing the sensor or air interface containing the flip-chip bumps on the printed substrate and then reflowing it to enable the Sexual connection. The bottom filler of the common micro-sensor package described by one member means that the sensing element and the circuit are filled in the first cavity slightly larger than the size, and then the bottom filler is filled in the sensor. The gap between the component and the surface and the carrier substrate, and when filling __ Page 26 512505 6. Scope of patent application By using the flip-chip bumps on the bottom, the filler can be prevented from flowing into the vacuum or through hole under the sensing unit. 8. The common micro-sensor packaging method described in the first item of the patent application scope, wherein the so-called electrical interface refers to a connector (which can include USB function), a Bluetooth module, an RF communication module, an optical A communication module, such as infrared communication (I r D A), can be placed in the so-called cavity on the carrier substrate with the sensing element and the circuit element, and is electrically connected by the flip-chip bump and the connection line in the substrate. And then fill the underfill. 9. The common micro-sensor packaging method as described in the first item of the patent application scope, wherein the so-called external means refers to printing paste and balls on the upper or lower layer of the so-called carrier substrate. The internal and so-called The connection line is electrically connected, and the outside is connected with a ball and other interfaces. 10. The method for packaging a common type micro-sensor as described in the first item of the scope of patent application, placing the sensing element and the circuit element or the electrical interface in the so-called first cavity, second cavity (or more) ), The preferred method is to allow the sensing element and the circuit element or the electrical interface to be buried in the so-called first cavity and the second cavity (or more) so as to be aligned with the surface of the carrier substrate. 1 1. According to the method of common micro-sensor packaging described in the first item of the scope of patent application, the so-called first cavity and the second cavity (or more) are not required, and the sensing element is directly connected. The circuit components or electrical interfaces are placed on the surface of the so-called carrier substrate. 1 2. A common micro-sensor packaging method, which mainly uses a low-temperature co-fired ceramic as a carrier substrate, and uses a flip-chip to combine the sensing unit and the Page 27 512505 VI. Patent application circuit components or electrical interfaces on the upper and lower sides of the carrier substrate, which can be used to design the carrier substrate according to the electrical, reliability, environment, and housing protection requirements of different sensor applications. Structure, and adjust the low temperature co-fired ceramic material, size, number of layers, thickness, punching and size, shape, structure and circuit design on it. 1 3. The method of common micro-sensing i as described in item 12 of the scope of patent application, wherein the so-called electrical requirements refer to the design of the substrate circuit, including solder pads, flip-chip bumps, conductive wires, The design of the channel, resistance, capacitance and inductance, according to the application of different sensors, can be modified to reduce parasitic effects and load effects, and if necessary, provide an electrical wiring technology to reduce electromagnetic interference and have anti-pull function. Or have the function of wireless transmission. 14. The common micro-sensing method as described in item 12 of the scope of the patent application, wherein the so-called reliability requirement refers to the modification of the bearing base structure according to the application of different sensing states. When manufacturing and superimposing, it can effectively solve the problem of misalignment, reduce mechanical stress and thermal stress, and improve the overall reliability of the sensor. The method of testing, the so-called environmental interface needs, refers to the combination of selective punching layer, porous material layer, protective material cover, transparent material cover and so on to make different feelings cry. The measured medium achieves a selective interface requirement. For the electrical interface, the electrical package of the I package must be integrated with the I package board. Package board can be connected with