CN210804145U

CN210804145U - Temperature control constant current circuit module

Info

Publication number: CN210804145U
Application number: CN201921723552.XU
Authority: CN
Inventors: 李梓洋; 周射; 陈代见; 王博
Original assignee: Chengdu Huanyuxin Technology Co ltd
Current assignee: Chengdu Huanyuxin Technology Co ltd
Priority date: 2019-10-15
Filing date: 2019-10-15
Publication date: 2020-06-19
Anticipated expiration: 2029-10-15

Abstract

Temperature control constant current circuit module relates to the electron technique. The utility model discloses a set up temperature measurement bridge circuit, difference circuit, small-signal amplifier circuit, bias voltage circuit and the power output circuit on the base plate, a serial communication port, temperature measurement bridge circuit, small-signal amplifier circuit and bias voltage circuit walk the line structure length the same and the width the same, and the circuit encapsulation on base plate and the base plate is in metal casing to draw forth metal casing through the connecting wire. The utility model discloses an isometric width is walked line structural design, makes each bridge arm resistance value difference of electric bridge obviously reduce so that equal to reduce the error, realize higher accuracy.

Description

Temperature control constant current circuit module

Technical Field

The utility model relates to an electronic technology.

Background

In most of the existing temperature control constant current circuit modules, an operational amplifier is generally adopted to be matched with a high-power transistor to build a constant current circuit, so that the function of accurately controlling output current according to an external temperature sensor is realized; but has obvious disadvantages: low reliability, low integration level, large occupied PCB area, inconvenient use and the like.

SUMMERY OF THE UTILITY MODEL

The utility model provides a technical scheme that technical problem adopted is, temperature control constant current circuit module, including setting up temperature measurement bridge circuit, difference circuit, small-signal amplifier circuit, bias voltage circuit and the power output circuit on the base plate, its characterized in that, the same and width of walking of temperature measurement bridge circuit, small-signal amplifier circuit and bias voltage circuit line structure length is the same, and the circuit encapsulation on base plate and the base plate is in metal casing to draw forth metal casing through the connecting wire.

Further, the substrate and the circuit on the substrate are packaged in a metal housing in a hermetically sealed manner.

The invention has the advantages that the temperature control output current achieves higher precision and has higher reliability. According to the resistivity of the resistance characteristic, the size of the resistor is related to the material, cross sectional area and length of the conductor, and through the design of an equal-length and equal-width routing structure, the difference value of the resistance values of all bridge arms of the bridge is obviously reduced to be equal, so that the error is reduced, and higher precision is realized.

Drawings

Fig. 1 is a schematic structural view (cross-sectional direction) of the present invention.

Fig. 2 is a schematic diagram of a functional circuit structure of the present invention.

Fig. 3 is a schematic diagram of the circuit arrangement of the present invention.

The sequence numbers in the figures illustrate: the temperature control module 1, the base plate 2, the parts 3 (including elements, chips and MOS capacitors), the metal tube shell 4, the binding wire 5 and the pins 6.

Detailed Description

Referring to fig. 1-3, the utility model discloses a temperature control constant current circuit module, including setting up temperature measurement bridge circuit, difference circuit, small-signal amplifier circuit, bias voltage circuit and the power output circuit on the base plate, its characterized in that, temperature measurement bridge circuit, small-signal amplifier circuit and bias voltage circuit walk the line structure length the same and the width the same, and the circuit encapsulation on base plate and the base plate is in metal casing to draw forth metal casing through the connecting wire. The substrate and the circuitry on the substrate are encapsulated in a metal housing in a hermetically sealed manner. The connection between the circuits is binding wire connection. The binding wire connection refers to the connection by using an extremely fine gold wire and adopting a bonding method.

The utility model discloses assemble with base plate, part (including component, chip, MOS electric capacity) and tube. A component mounted on the main surface of the wiring substrate; the wiring structure of the substrate is designed in a special wiring structure aiming at a temperature measuring bridge circuit, a small signal amplifying circuit, a bias voltage circuit and the like, so that the temperature control output current achieves higher precision; meanwhile, the airtight metal tube shell is adopted, the inner wall of the tube shell is thinned by adopting an innovative structural design under limited technological conditions, and the structural substrate is surrounded by the complete metal tube shell to cover the wiring substrate and the components. The conductive pin is arranged outside the shielding layer of the metal tube shell, is fixed on the metal tube shell through a glass sintering process and is connected to the wiring substrate in a binding wire mode.

The utility model has the characteristics of as follows:

a) the module adopts a thick film circuit mode, so that the miniaturization of the module is realized;

b) compared with the circuit of the conventional PCB, the module adopts bare core materials, the integration level is high, and the reliability is greatly improved;

c) because the internal integration level of the module circuit is high, a user does not need to perform functional verification and test on the internal links of the circuit, and the user can conveniently use the module to realize board-level circuit design, thereby saving development and debugging time for the user;

d) the module forms mass production supply, the cost can be effectively controlled, and the project cost is indirectly saved for a user;

e) the module is neat in appearance, and the metal packaging structure is good in anti-seismic effect;

f) the module is light in weight and provides a margin for overall weight considerations for the user.

Claims

1. The temperature control constant current circuit module comprises a temperature measuring bridge circuit, a differential circuit, a small signal amplifying circuit, a bias voltage circuit and a power output circuit which are arranged on a substrate.

2. The temperature-controlled constant current circuit module according to claim 1, wherein the substrate and the circuit on the substrate are packaged in a metal case in a hermetically sealed manner.

3. The temperature-controlled constant current circuit module according to claim 1, wherein the connection between the circuits is a binding wire connection.