CN214627378U - Co-fired ceramic type sensors and sensor networks - Google Patents
Co-fired ceramic type sensors and sensor networks Download PDFInfo
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- CN214627378U CN214627378U CN202121343198.5U CN202121343198U CN214627378U CN 214627378 U CN214627378 U CN 214627378U CN 202121343198 U CN202121343198 U CN 202121343198U CN 214627378 U CN214627378 U CN 214627378U
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Abstract
The application discloses a co-fired ceramic sensor and a sensor network. Wherein, burn ceramic type sensor altogether includes: a first ceramic substrate having a sensing unit printed on a lower surface thereof; the upper part of the second ceramic substrate is provided with a groove, wherein the size of the groove is at least adapted to the maximum deformation of the sensing unit; a third ceramic substrate provided with an analog-to-digital conversion unit; a fourth ceramic substrate provided with a control unit; the sensing unit, the analog-to-digital conversion unit and the control unit are electrically connected in sequence. The sensor structure solves the technical problem of how to set a reasonable sensor structure based on the co-fired ceramic technology in the related technology to reduce the volume of the sensor.
Description
Technical Field
The application relates to the field of sensors, in particular to a co-fired ceramic sensor and a sensor network.
Background
A sensor network is a computer network composed of many spatially distributed sensors that cooperatively monitor physical or environmental conditions (such as temperature, humidity, pressure, motion, etc.) at different locations, and is widely used in many military or civil fields such as aerospace, environmental monitoring, health monitoring, home automation, and traffic control, and begins to play an increasingly important role in industrial production and people's daily life.
While the sensor network technology is developed, people have higher and higher requirements on the volume of the sensor node. Because the performance of a sensor network depends to a large extent on the number of sensor nodes in the network. If the volume of the nodes is large, it is difficult to arrange a sufficient number of nodes in a limited area. Therefore, how to reduce the size of the sensor node also becomes a focus of attention in the sensor network technology. The co-fired ceramic technology is a remarkable integrated component technology developed in recent years, has functions of integrated circuit packaging, embedded passive elements, three-dimensional high-density circuit connection and the like, and is a key mainstream technology for realizing module integration at present.
Aiming at the problem of how to set a reasonable sensor structure based on a co-fired ceramic technology in the related technology to reduce the volume of the sensor, an effective solution is not provided at present.
SUMMERY OF THE UTILITY MODEL
The embodiment of the application provides a co-fired ceramic sensor and a sensor network, and aims to at least solve the technical problem of how to set a reasonable sensor structure based on a co-fired ceramic technology in the related technology to reduce the volume of the sensor.
According to an aspect of an embodiment of the present application, there is provided a co-fired ceramic type sensor including: a first ceramic substrate having a sensing unit printed on a lower surface thereof; the upper part of the second ceramic substrate is provided with a groove, wherein the size of the groove is at least adapted to the maximum deformation of the sensing unit; a third ceramic substrate provided with an analog-to-digital conversion unit; a fourth ceramic substrate provided with a control unit; the sensing unit, the analog-to-digital conversion unit and the control unit are electrically connected in sequence.
Optionally, the sensing unit is: at least one of a pressure detection unit, a temperature detection unit, a humidity detection unit, a brightness detection unit, a voltage detection unit, or a current detection unit.
Alternatively, the pressure detection unit is a piezoresistive sensing unit, a piezoelectric sensing unit, or a capacitive pressure sensing unit.
Optionally, the fourth ceramic substrate is further provided with: and the communication unit is electrically connected with the control unit.
Optionally, the communication unit is a wireless communication unit, wherein the wireless communication unit is a ZigBee module, a WiFi module, or a bluetooth module.
Optionally, the sensor further comprises: the display device comprises a shell, wherein a display device is arranged on the shell.
Optionally, the housing is comparable to the coefficient of thermal expansion of the ceramic substrate of the sensor.
Optionally, in the ceramic substrate of the sensor, every two adjacent ceramic substrates are fixed by epoxy resin bonding.
Optionally, the electrical connection of the sensor is achieved by means of metallized vias and internal traces within the ceramic substrate of the sensor.
According to another aspect of the embodiments of the present application, there is also provided a sensor network, including: at least one sensor of any of the above; and the controller is connected with the sensors, and a communication unit in the controller is matched with a communication unit in the sensors.
In an embodiment of the present application, a co-fired ceramic type sensor includes: a first ceramic substrate having a sensing unit printed on a lower surface thereof; the upper part of the second ceramic substrate is provided with a groove, wherein the size of the groove is at least adapted to the maximum deformation of the sensing unit; a third ceramic substrate provided with an analog-to-digital conversion unit; a fourth ceramic substrate provided with a control unit; the sensing unit, the analog-to-digital conversion unit and the control unit are electrically connected in sequence. According to the scheme, based on the co-fired ceramic technology, the related parts of the sensor are respectively arranged on different ceramic substrates, and the deformation of the sensing unit is accommodated by the groove in the second ceramic substrate, so that the technical problem of how to arrange a reasonable sensor structure based on the co-fired ceramic technology in the related technology to reduce the size of the sensor is solved, the purpose of reasonably reducing the size of the sensor is achieved, and the effect of operating more sensor network nodes is realized.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:
FIG. 1 is an exploded view of an alternative co-fired ceramic type sensor according to example 1 of the present application;
FIG. 2 is a plan view structural view of an alternative co-fired ceramic type sensor according to embodiment 1 of the present application; and
fig. 3 is a schematic structural diagram of an alternative sensor network according to embodiment 2 of the present application.
Wherein the reference numbers are as follows:
1-a first ceramic substrate; 2-a second ceramic substrate; 3-a third ceramic substrate; 4-a fourth ceramic substrate; 5-a sensing unit; 6-groove; 7-an analog-to-digital conversion unit; 8-a control unit; 9-a communication unit of the sensor; 10-a controller; 11-communication unit of the controller.
Detailed Description
In order to make the technical solutions better understood by those skilled in the art, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only partial embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover non-exclusive inclusions, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
Example 1
Before describing further details of embodiments of the present application, an alternative co-fired ceramic type sensor that can be used to implement the principles of the present application will be described with reference to FIG. 1. In its most basic configuration, fig. 1 is an exploded view of a co-fired ceramic type sensor according to an embodiment of the present application. For descriptive purposes, the architecture portrayed is only one example of a suitable environment and is not intended to suggest any limitation as to the scope of use or functionality of the application. Neither should the system be interpreted as having any dependency or requirement relating to any one or combination of components illustrated in FIG. 1.
It should be noted that the Co-fired Ceramic sensor of the present application includes a Low Temperature Co-fired Ceramic (LTCC) sensor and a High Temperature Co-fired Ceramic (HTCC) sensor. Among them, in order to ensure high sintering density under low temperature co-firing conditions, amorphous glass, crystallized glass, low melting point oxide, etc. are usually added to promote sintering, and the metals used are high conductivity materials (Ag, Cu, Au and their alloys, such as Ag-Pd, Ag-Pt, Au-Pt, etc.); the high-temperature co-fired ceramic material is mainly ceramic with alumina, mullite and aluminum nitride as main components, and the conductor slurry is high-melting-point metal heating resistance slurry of tungsten, molybdenum, manganese and the like.
As shown in fig. 1, the present application provides a co-fired ceramic type sensor comprising:
the first ceramic substrate 1 has a sensing unit 5 printed on its lower surface.
In an alternative, the sensing unit may include a device having a sensing function, such as a strain gauge, a photo-resistor, a thermistor, or the like.
The second ceramic substrate 2 is provided with a groove 6 at the upper part thereof, wherein the size of the groove 6 is at least adapted to the maximum deformation of the sensing unit 5.
The size of the groove in the scheme is at least adaptive to the maximum deformation of the sensing unit, so that the sensing unit is prevented from being extruded with the ceramic substrate, and the accuracy of a detection value is prevented from being influenced.
Of course, the thickness of the second ceramic substrate may be appropriately adjusted according to the thickness of the sensor element. The greater the deformation of the sensing element, the greater the thickness of the second ceramic substrate may be.
A third ceramic substrate 3 provided with an analog-to-digital conversion unit 7.
Because the analog-to-digital conversion unit is separately arranged, in order to improve the detection accuracy and/or the detection speed of the sensor, a professional converter with high accuracy and/or high speed can be selected as the analog-to-digital conversion unit in the embodiment of the application.
A fourth ceramic substrate 4 provided with a control unit 8; the sensing unit 5, the analog-to-digital conversion unit 7 and the control unit 8 are electrically connected in sequence.
In an alternative, the control Unit may be a Micro Controller Unit (MCU), a Digital Signal processor (Digital Signal processing dsp), or the like, and is mainly used for analyzing and processing data detected by the sensing Unit.
It should be noted that, the first ceramic substrate, the second ceramic substrate, the third ceramic substrate and the fourth ceramic substrate are manufactured by a standard multilayer co-fired ceramic substrate process, but in order to avoid the extrusion of two adjacent ceramic substrates, components on the ceramic substrates are arranged in a staggered manner; in addition, an insert with certain elasticity can be placed between two adjacent ceramic substrates, and then lamination is carried out.
The following description will be made by taking a low temperature co-fired pressure sensor as an example. The low-temperature co-fired pressure sensor comprises four ceramic substrates which are a first ceramic substrate, a second ceramic substrate, a third ceramic substrate and a fourth ceramic substrate from top to bottom in sequence. The lower surface of the first ceramic substrate is printed with a strain gauge circuit; the upper part of the second ceramic substrate is provided with a groove, and the groove is larger than the strain gauge capable of accommodating the maximum deformation; a high-precision analog-to-digital converter is arranged on the third ceramic substrate; and the fourth ceramic substrate is provided with a singlechip. Wherein, foil gage, analog-to-digital converter, singlechip are connected electrically in proper order. The strain gauge deforms after detecting pressure, the resistance value of the strain gauge changes to cause the voltage applied to the strain gauge to change, and the changed parameter is converted by the analog-to-digital converter and then transmitted to the single chip microcomputer. The single chip microcomputer converts the pressure value into a pressure value after analysis and processing.
Although the above embodiments are exemplified by a low temperature co-fired pressure sensor, the sensor structure of the present application is also applicable to a high temperature co-fired pressure sensor, a temperature sensor, a brightness sensor, and the like, and is not limited herein.
In the above embodiment, the co-fired ceramic type sensor includes: a first ceramic substrate having a sensing unit printed on a lower surface thereof; the upper part of the second ceramic substrate is provided with a groove, wherein the size of the groove is at least adapted to the maximum deformation of the sensing unit; a third ceramic substrate provided with an analog-to-digital conversion unit; a fourth ceramic substrate provided with a control unit; the sensing unit, the analog-to-digital conversion unit and the control unit are electrically connected in sequence. According to the scheme, based on the co-fired ceramic technology, the related parts of the sensor are respectively arranged on different ceramic substrates, and the deformation of the sensing unit is accommodated by the groove in the second ceramic substrate, so that the technical problem of how to arrange a reasonable sensor structure based on the co-fired ceramic technology in the related technology to reduce the size of the sensor is solved, the purpose of reasonably reducing the size of the sensor is achieved, and the effect of operating more sensor network nodes is realized. It is easy to notice that the embodiment of the application distributes the relevant parts of the sensor on different ceramic substrates, thereby not only highly integrating the sensor circuit and reducing the volume of the sensor, but also being applicable to components made of ceramic materials.
Optionally, the sensing unit is: at least one of a pressure detection unit, a temperature detection unit, a humidity detection unit, a brightness detection unit, a voltage detection unit, or a current detection unit.
That is, there may be one or more sensing units on the first ceramic substrate.
If the sensing unit is a pressure detection unit, the corresponding detection part is a strain gauge; if the sensing unit is a brightness detection unit, the corresponding detection component is a photoresistor; if the sensing unit is a temperature sensing unit, the corresponding sensing component is a thermistor, and so on.
Further, the pressure detection unit is a piezoresistive sensing unit, a piezoelectric sensing unit or a capacitive pressure sensing unit.
Optionally, the fourth ceramic substrate is further provided with: and the communication unit is electrically connected with the control unit.
In an alternative, the communication unit may be a wired communication unit or a wireless communication unit.
Further, if the communication unit is a wireless communication unit, the wireless communication unit may be a ZigBee module, a WiFi module, or a bluetooth module; if the communication unit is a wired communication unit, the fourth ceramic substrate may be provided with pins for connecting to or disconnecting from the communication unit.
In addition, the ceramic substrate may be embedded with other functional modules according to the requirements of the application scenario, which is not limited herein.
Optionally, the sensor further comprises: the display device comprises a shell, wherein a display device is arranged on the shell.
In an alternative, the display device may display a detection value obtained by the sensor.
Optionally, the housing is comparable to the coefficient of thermal expansion of the ceramic substrate of the sensor.
Optionally, the sensor further comprises: and the power management unit is respectively connected with the sensing unit, the analog-to-digital conversion unit and the control unit.
The power management unit in the above scheme can provide voltages of different magnitudes for the sensing unit, the analog-to-digital conversion unit and the control unit respectively.
Optionally, in the ceramic substrate of the sensor, every two adjacent ceramic substrates are fixed by epoxy resin bonding.
Figure 2 shows a plan view of an alternative co-fired ceramic type sensor. As shown in fig. 2, the electrical connections of the sensor are made through metallized vias and internal traces (black and bold lines) within the ceramic substrate of the sensor.
In an alternative, the metalized via holes can ensure electrical connection between the ceramic substrates, and the internal routing wires can be silver wires.
Based on the scheme provided by the above embodiment of the present application, the co-fired ceramic sensor includes: a first ceramic substrate having a sensing unit printed on a lower surface thereof; the upper part of the second ceramic substrate is provided with a groove, wherein the size of the groove is at least adapted to the maximum deformation of the sensing unit; a third ceramic substrate provided with an analog-to-digital conversion unit; a fourth ceramic substrate provided with a control unit; the sensing unit, the analog-to-digital conversion unit and the control unit are electrically connected in sequence. According to the scheme, based on the co-fired ceramic technology, the related parts of the sensor are respectively arranged on different ceramic substrates, and the deformation of the sensing unit is accommodated by the groove in the second ceramic substrate, so that the technical problem of how to arrange a reasonable sensor structure based on the co-fired ceramic technology in the related technology to reduce the size of the sensor is solved, the purpose of reasonably reducing the size of the sensor is achieved, and the effect of operating more sensor network nodes is realized. It can be easily noticed that the display device on the shell can visually display the detection value, the elastic insert and the epoxy resin between the adjacent ceramic substrates can ensure the tightness and the space expansion of the structure, the traditional PCB wiring is simplified by the metallized via holes and the internal wiring, and the circuit stability is further improved. The embodiment of the application distributes relevant parts of the sensor on different ceramic substrates, so that the sensor circuit is highly integrated, the size of the sensor is reduced, the sensor is suitable for components made of ceramic materials, and the application prospect is wide.
Example 2
Under the co-fired ceramic type sensor provided in example 1, fig. 3 shows a sensor network comprising: at least one sensor of any one of embodiments 1; and a controller 10 connected with the sensors, wherein a communication unit 11 in the controller 10 is matched with the communication unit 9 in the sensors.
In an alternative, the controller may be a central processing unit, located in a workstation or a monitoring room.
After the data collected by each sensor is transmitted to the controller for analysis and processing through the communication unit, the controller sends commands to different execution components for action, so that the information of the monitored object in the network coverage area is cooperatively sensed, collected and processed, and is sent to the execution components, and high automation integration and unification are realized.
Optionally, the sensing unit is: at least one of a pressure detection unit, a temperature detection unit, a humidity detection unit, a brightness detection unit, a voltage detection unit, or a current detection unit.
Alternatively, the pressure detection unit is a piezoresistive sensing unit, a piezoelectric sensing unit, or a capacitive pressure sensing unit.
Optionally, the fourth ceramic substrate is further provided with: and the communication unit is electrically connected with the control unit.
Optionally, the communication unit is a wireless communication unit, wherein the wireless communication unit is a ZigBee module, a WiFi module, or a bluetooth module.
Optionally, the sensor further comprises: the display device comprises a shell, wherein a display device is arranged on the shell.
Optionally, the housing is comparable to the coefficient of thermal expansion of the ceramic substrate of the sensor.
Optionally, in the ceramic substrate of the sensor, every two adjacent ceramic substrates are fixed by epoxy resin bonding.
Optionally, the electrical connection of the sensor is achieved by means of metallized vias and internal traces within the ceramic substrate of the sensor.
It should be noted that the alternative implementation scheme related to the above example 2 of the present application is the same as the scheme and the application scenario implementation process provided in example 1, but is not limited to the scheme provided in example 1.
The above-mentioned serial numbers of the embodiments of the present application are merely for description and do not represent the merits of the embodiments.
In the above embodiments of the present application, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
The foregoing is only a preferred embodiment of the present application, and it should be noted that any modification, equivalent replacement, improvement, etc. can be made by those skilled in the art without departing from the principle of the present application, and such changes and modifications should also be considered as the protection scope of the present application.
Claims (10)
1. A co-fired ceramic type sensor, comprising:
a first ceramic substrate having a sensing unit printed on a lower surface thereof;
the upper part of the second ceramic substrate is provided with a groove, wherein the size of the groove is at least adapted to the maximum deformation of the sensing unit;
a third ceramic substrate provided with an analog-to-digital conversion unit;
a fourth ceramic substrate provided with a control unit;
the sensing unit, the analog-to-digital conversion unit and the control unit are electrically connected in sequence.
2. The sensor of claim 1, wherein the sensing unit is: at least one of a pressure detection unit, a temperature detection unit, a humidity detection unit, a brightness detection unit, a voltage detection unit, or a current detection unit.
3. The sensor according to claim 2, wherein the pressure detection unit is a piezoresistive sensing unit, a piezoelectric sensing unit, or a capacitive pressure sensing unit.
4. The sensor of claim 1, wherein the fourth ceramic substrate further has disposed thereon:
and the communication unit is electrically connected with the control unit.
5. The sensor of claim 4, wherein the communication unit is a wireless communication unit, wherein the wireless communication unit is a ZigBee module, a WiFi module, or a Bluetooth module.
6. The sensor of claim 1, further comprising:
the display device comprises a shell, wherein a display device is arranged on the shell.
7. The sensor of claim 6, wherein the housing has a coefficient of thermal expansion comparable to a ceramic substrate of the sensor.
8. The sensor according to claim 1, wherein the ceramic substrates of the sensor are bonded and fixed by epoxy resin between every two adjacent ceramic substrates.
9. The sensor of claim 1, wherein electrical connections of the sensor are made through metallized vias and internal traces within the ceramic substrate of the sensor.
10. A sensor network, comprising:
at least one sensor according to any one of claims 1-9;
and the controller is connected with the sensors, and a communication unit in the controller is matched with a communication unit in the sensors.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202121343198.5U CN214627378U (en) | 2021-06-16 | 2021-06-16 | Co-fired ceramic type sensors and sensor networks |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121343198.5U CN214627378U (en) | 2021-06-16 | 2021-06-16 | Co-fired ceramic type sensors and sensor networks |
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| Publication Number | Publication Date |
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| CN214627378U true CN214627378U (en) | 2021-11-05 |
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| CN202121343198.5U Active CN214627378U (en) | 2021-06-16 | 2021-06-16 | Co-fired ceramic type sensors and sensor networks |
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