CN210514986U - Resistance type strain gauge micro-pressure button and micro-pressure switch - Google Patents

Resistance type strain gauge micro-pressure button and micro-pressure switch Download PDF

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Publication number
CN210514986U
CN210514986U CN201921662743.XU CN201921662743U CN210514986U CN 210514986 U CN210514986 U CN 210514986U CN 201921662743 U CN201921662743 U CN 201921662743U CN 210514986 U CN210514986 U CN 210514986U
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micro
pcb
copper foil
pressure
strain gauge
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邓安亮
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CROWN RICH ELECTRONIC (SHENZHEN) CO LTD
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CROWN RICH ELECTRONIC (SHENZHEN) CO LTD
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Abstract

The utility model relates to a resistance-type strainometer minute-pressure button and minute-pressure switch. The resistance type strain gauge micro-pressure key comprises an I-shaped PCB, a positive PCB copper foil pad, a negative PCB copper foil pad, white glue, a high-precision strain resistor and a copper wire, wherein the positive PCB copper foil pad and the negative PCB copper foil pad are arranged on the same surface of the I-shaped PCB; the high-precision strain resistor is arranged at the central part of a middle vertical rod of the I-shaped PCB; the copper wire is used for connecting the high-precision strain resistor with the positive and negative PCB copper foil bonding pads respectively; the white glue covers on high accuracy strain resistor, and the white glue is used for fixing high accuracy strain resistor on the I shape PCB board. Compare in traditional touch button, the resistance-type strainometer minute-pressure button that this application provided can use on little deformation product, has assembly easy maintenance's advantage.

Description

Resistance type strain gauge micro-pressure button and micro-pressure switch
Technical Field
The utility model relates to a strainometer technical field especially relates to a resistance-type strainometer minute-pressure button and minute-pressure switch.
Background
With the continuous progress of science and technology, touch keys are widely applied to the field of electronic products. However, the touch principle of the conventional touch key is to detect the change of the capacitance value on the surface of the object to indicate whether the touch key reaches the trigger condition, and the touch key cannot be applied to a conductive panel product.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is to provide a resistance-type strainometer micropressure button and micropressure switch that can use on small deformation product.
For realizing the purpose of the utility model, the utility model adopts the following technical scheme:
a resistance-type strain gauge micro-pressure key comprises an I-shaped PCB, positive and negative PCB copper foil pads, white glue, a high-precision strain resistor and a copper wire, wherein the positive and negative PCB copper foil pads are arranged on the same surface of the I-shaped PCB and are respectively arranged on the left side and the right side of the top of an upper beam of the I-shaped PCB; the high-precision strain resistor is arranged at the central part of a middle vertical rod of the I-shaped PCB; the copper wire is used for connecting the high-precision strain resistor with the positive and negative PCB copper foil bonding pads respectively; the white glue covers on the high accuracy strain resistor, the white glue be used for with the high accuracy strain resistor is fixed on the I shape PCB board.
The resistance-type strain gauge micro-pressure key comprises an I-shaped PCB, and positive and negative PCB copper foil pads, white glue, a high-precision strain resistor and a copper wire which are arranged on the same surface of the I-shaped PCB, wherein the positive and negative PCB copper foil pads are respectively arranged on the left side and the right side of the top of an upper beam of the I-shaped PCB; the high-precision strain resistor is arranged at the central part of a middle vertical rod of the I-shaped PCB; the copper wire is used for connecting the high-precision strain resistor with the positive and negative PCB copper foil bonding pads respectively; the white glue covers on high accuracy strain resistor, and the white glue is used for fixing high accuracy strain resistor on the I shape PCB board. Compare in traditional touch button, the resistance-type strainometer minute-pressure button that this application provided can replace traditional touch button to use on little deformation product, has assembly easy maintenance's advantage.
In one embodiment, the high-precision strain resistor is the strain resistor of constantan, illite material, phenolic aldehyde or polyimide base material.
In one embodiment, the I-shaped PCB is made of glass fiber.
In one embodiment, the white glue is made of a silica gel material.
For realizing the purpose of the utility model, the utility model discloses still adopt following technical scheme:
a micro-pressure switch comprises a 24-bit sigma-delta ADC (analog to digital converter) type single chip microcomputer and the resistive strain gauge micro-pressure key as claimed in any one of claims 1 to 5, wherein a positive PCB copper foil pad of the resistive strain gauge micro-pressure key is electrically connected with an AVDD (amplitude voltage division digital) pin of the 24-bit sigma-delta ADC type single chip microcomputer through a voltage division resistor, a positive PCB copper foil pad of the resistive strain gauge micro-pressure key is electrically connected with an AD pin of the 24-bit sigma-delta ADC type single chip microcomputer, a negative PCB copper foil pad of the resistive strain gauge micro-pressure key is grounded, and the 24-bit sigma-delta ADC type single chip microcomputer is used for collecting a key change signal generated by the resistive strain gauge micro-pressure key, performing analog-to-digital conversion and processing on the key change signal and outputting a high-low level signal indicating whether the micro-pressure key reaches a trigger condition or not through an IO port of the.
In one embodiment, the resistive strain gauge micro-pressure keys are multiple.
Drawings
FIG. 1 is a schematic diagram of a front side structure of an I-shaped PCB in an embodiment;
FIG. 2 is a schematic diagram of a back structure of the I-shaped PCB shown in FIG. 1;
fig. 3 is a schematic circuit diagram of a micro-pressure switch according to an embodiment.
Detailed Description
In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise. In the description of the present invention, "a plurality" means at least one, e.g., one, two, etc., unless specifically limited otherwise.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the methods or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
Referring to fig. 1 and 2, the present embodiment provides a resistance type strain gauge micro-pressure button, including an i-shaped PCB 100, and a positive PCB copper foil pad 110, a negative PCB copper foil pad 120, a white glue 130, a high precision strain resistor 140 and a copper wire 150 disposed on the same surface of the i-shaped PCB 100, wherein the positive PCB copper foil pad 110 and the negative PCB copper foil pad 120 are respectively disposed on the left and right sides of the top of an upper beam of the i-shaped PCB 100; the high-precision strain resistor 140 is arranged at the central part of a middle vertical rod of the I-shaped PCB 100; the copper wire 150 is used for connecting the high-precision strain resistor 140 with the positive PCB copper foil bonding pad 110 and the negative PCB copper foil bonding pad 120 respectively; the white glue 130 covers the high-precision strain resistor 140, and the white glue 130 is used for fixing the high-precision strain resistor 140 on the I-shaped PCB 100.
It should be noted that the resistive strain gauge micro-pressure key provided in this embodiment includes an i-shaped PCB 100, and a positive PCB copper foil bonding pad 110, a negative PCB copper foil bonding pad 120, a white glue 130, a high-precision strain resistor 140, and a copper wire 150 disposed on the same surface of the i-shaped PCB 100, where the i-shaped PCB 100 may be made of a glass fiber material and is used for bearing the high-precision strain resistor 140, specifically, the material of the i-shaped PCB may be selected correspondingly according to actual conditions, and this embodiment is not limited. When the double-sided adhesive tape is used, the double-sided adhesive tape can be adhered to a product with a small deformation product only by adhering the double-sided adhesive tape to the other side of the I-shaped PCB 100, which is provided with the positive PCB copper foil pad 110, the negative PCB copper foil pad 120, the white adhesive 130, the high-precision strain resistor 140 and the copper wire 150, so that the assembly and the maintenance are convenient. Specifically, the double-sided adhesive tape may be an industrial-grade 3M adhesive tape.
In this embodiment, the resistive strain gauge micro-pressure button uses the high-precision strain resistor 140, the resistance precision of which can reach one thousandth, and which can generate enough signal changes through small deformation, and the characteristic difference between the buttons is small, and the resistive strain gauge micro-pressure button has the characteristics of high sensitivity and high consistency. The high-precision strain resistor 140 can be made of different base materials according to the use environment, specifically, constantan, illite, phenolic aldehyde or polyimide base can be selected when the use environment temperature is-30-80 ℃; when the environment temperature is within 150 ℃, the polyimide substrate can be obtained. The manufacturing process of the high-precision strain resistor 140 can adopt a single-shaft and sensitive grid structure form, and is matched with the I-shaped PCB 100, so that the vertical direction induction is slow, the horizontal direction induction is sensitive, the problem of up-down crosstalk among multiple rows of keys is solved, and the production and the assembly are facilitated.
In this embodiment, the positive PCB copper foil pad 110 may be used for connection between the strain gauge micro-pressure button and the main control board; the copper wire 150 may be used for connecting the high-precision strain resistor 140 with the positive PCB copper foil pad 110 and the negative PCB copper foil pad 120, specifically, the routing of the copper wire 150 may be set according to actual conditions, and is not limited to the routing structure in fig. 1; white glue 130 can adopt the silica gel material for fixed high accuracy strain resistor 140 has the advantage that adsorption efficiency is high, thermal stability is good, chemical stability is stable, mechanical strength is high, specifically, white glue 130's material can carry out corresponding selection according to actual conditions, and this embodiment does not do the restriction.
The resistance-type strain gauge micro-pressure key comprises an I-shaped PCB (printed circuit board) 100, and a positive PCB copper foil pad 110, a negative PCB copper foil pad 120, white glue 130, a high-precision strain resistor 140 and a copper wire 150 which are arranged on the same surface of the I-shaped PCB 100, wherein the positive PCB copper foil pad 110 and the negative PCB copper foil pad 120 are respectively arranged on the left side and the right side of the top of an upper beam of the I-shaped PCB 100; the high-precision strain resistor 140 is arranged at the central part of a middle vertical rod of the I-shaped PCB 100; the copper wire 150 is used for connecting the high-precision strain resistor 140 with the positive PCB copper foil bonding pad 110 and the negative PCB copper foil bonding pad 120 respectively; the white glue 130 covers the high-precision strain resistor 140, and the white glue 130 is used for fixing the high-precision strain resistor 140 on the I-shaped PCB 100. Compare in traditional touch button, the resistance-type strainometer minute-pressure button that this application provided can replace traditional touch button to use on little deformation product, has assembly easy maintenance's advantage.
Referring to fig. 3, the present embodiment provides a micro-pressure switch, including a 24-bit Σ Δ ADC-type MCU and a resistive strain gauge micro-pressure button as described above, where a positive PCB copper foil pad 110 of the resistive strain gauge micro-pressure button is electrically connected to an AVDD pin of the 24-bit Σ Δ ADC-type MCU through a voltage dividing resistor, the positive PCB copper foil pad 110 of the resistive strain gauge micro-pressure button is electrically connected to an AD pin of the 24-bit Σ Δ ADC-type MCU, a negative PCB copper foil pad 120 of the resistive strain gauge micro-pressure button is grounded, and the 24-bit Σ Δ ADC-type MCU is configured to collect a button change signal generated by the resistive strain gauge micro-pressure button, perform analog-to-digital conversion on the button change signal, and output a high-low level signal indicating whether the micro-pressure button reaches a trigger condition through an IO port of the 24-bit Σ Δ ADC-type.
In this embodiment, the micro-pressure switch further comprises an external power supply, the external power supply is connected with a VDD pin of the single chip microcomputer MCU and used for supplying power to the single chip microcomputer MCU, the power supply range of the external power supply is 3V to 5V, and an AVDD pin of the single chip microcomputer MCU is electrically connected with the micro-pressure key through a voltage dividing resistor and used for supplying power to the micro-pressure key. Specifically, the positive PCB copper foil pad 110 of the resistive strain gauge micro-pressure button may also be connected to other circuits as long as it can provide a matched voltage for the resistive strain gauge micro-pressure button; the AD signal acquisition pin of the single chip microcomputer MCU is electrically connected with the positive PCB copper foil bonding pad 110 in the micro-pressure key and used for acquiring the key change signal of the micro-pressure key, and after the key change signal is acquired, the AD signal acquisition pin can output through an IO port of the micro-pressure key to indicate whether the micro-pressure key is triggered or not, namely whether the trigger condition is reached or not, or send out data through a communication interface of the micro-pressure key. Specifically, since there are a plurality of the AD signal acquisition pins of the 24-bit Σ Δ ADC type single chip microcomputer, there may be a plurality of resistive strain gauge micro-pressure keys.
The circuit working logic is as follows: an AD signal acquisition pin of the single chip microcomputer MCU acquires a key change signal of the micro-press key, a 24-bit sigma delta ADC in the single chip microcomputer MCU converts the key change signal into a digital signal, and after algorithm processing, a high-low level signal is output by an IO port or data is output by a communication interface to indicate whether the micro-press key meets a trigger condition.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims (6)

1. A resistive strain gauge micro-pressure key is characterized by comprising an I-shaped PCB, positive and negative PCB copper foil pads, white glue, a high-precision strain resistor and a copper wire, wherein the positive and negative PCB copper foil pads are arranged on the same surface of the I-shaped PCB, and the positive and negative PCB copper foil pads are respectively arranged on the left side and the right side of the top of an upper beam of the I-shaped PCB; the high-precision strain resistor is arranged at the central part of a middle vertical rod of the I-shaped PCB; the copper wire is used for connecting the high-precision strain resistor with the positive and negative PCB copper foil bonding pads respectively; the white glue covers on the high accuracy strain resistor, the white glue be used for with the high accuracy strain resistor is fixed on the I shape PCB board.
2. The resistive strain gage micro-pressure key of claim 1, wherein the high precision strain resistance is a strain resistance of constantan, illion, phenolic, or polyimide based materials.
3. The resistive strain gauge micro-pressure key according to claim 1, wherein the I-shaped PCB is made of glass fiber.
4. The resistive strain gauge micro-pressure key according to claim 1, wherein the white glue is made of silica gel.
5. A micro-pressure switch, which is characterized in that the micro-pressure switch comprises a 24-bit sigma delta ADC type single chip microcomputer and a resistance type strain gauge micro-pressure key according to any one of claims 1 to 4, the positive PCB copper foil bonding pad of the resistance type strain gauge micro-pressure key is electrically connected with the AVDD pin of the 24-bit sigma delta ADC type singlechip through a voltage dividing resistor, the positive PCB copper foil bonding pad of the resistance type strain gauge micro-pressure key is electrically connected with the AD pin of the 24-bit sigma delta ADC type singlechip, the negative PCB copper foil bonding pad of the resistance type strain gauge micro-pressure key is grounded, the 24-bit sigma delta ADC type single chip microcomputer is used for collecting key change signals generated by the resistance type strain gauge micro-pressure key and carrying out analog-to-digital conversion processing on the key change signals, and outputting a high-low level signal which indicates whether the micro-pressure key reaches a trigger condition through an IO port of the 24-bit sigma delta ADC type single chip microcomputer.
6. The micro-pressure switch according to claim 5, wherein the resistive strain gauge micro-pressure keys are plural.
CN201921662743.XU 2019-09-30 2019-09-30 Resistance type strain gauge micro-pressure button and micro-pressure switch Active CN210514986U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921662743.XU CN210514986U (en) 2019-09-30 2019-09-30 Resistance type strain gauge micro-pressure button and micro-pressure switch

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Application Number Priority Date Filing Date Title
CN201921662743.XU CN210514986U (en) 2019-09-30 2019-09-30 Resistance type strain gauge micro-pressure button and micro-pressure switch

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112378963A (en) * 2020-11-04 2021-02-19 北京航天微电科技有限公司 Humidity sensor with heating and temperature measuring functions and manufacturing method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112378963A (en) * 2020-11-04 2021-02-19 北京航天微电科技有限公司 Humidity sensor with heating and temperature measuring functions and manufacturing method thereof
CN112378963B (en) * 2020-11-04 2024-05-07 北京航天微电科技有限公司 Humidity sensor with heating and temperature measuring functions and manufacturing method thereof

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