CN106153094A - A kind of load plate for photodetector batch testing and load plate system - Google Patents
A kind of load plate for photodetector batch testing and load plate system Download PDFInfo
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- CN106153094A CN106153094A CN201610601770.0A CN201610601770A CN106153094A CN 106153094 A CN106153094 A CN 106153094A CN 201610601770 A CN201610601770 A CN 201610601770A CN 106153094 A CN106153094 A CN 106153094A
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- 238000012360 testing method Methods 0.000 title claims abstract description 65
- 239000002184 metal Substances 0.000 claims abstract description 99
- 229910052751 metal Inorganic materials 0.000 claims abstract description 99
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 47
- 238000005259 measurement Methods 0.000 claims abstract description 14
- 239000011148 porous material Substances 0.000 claims abstract description 12
- 239000000523 sample Substances 0.000 claims description 24
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 239000012777 electrically insulating material Substances 0.000 claims description 6
- 239000007769 metal material Substances 0.000 claims description 6
- 230000003287 optical effect Effects 0.000 claims description 6
- 230000005611 electricity Effects 0.000 claims description 4
- 238000007619 statistical method Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D18/00—Testing or calibrating apparatus or arrangements provided for in groups G01D1/00 - G01D15/00
Abstract
The invention discloses a kind of load plate for photodetector batch testing and load plate system, this batch testing load plate includes the chip slot that multiple array is distributed, and the output of pore, aspirating hole, signal end metalline stake, signal end metal lead wire, signal is touched groove, power end metalline stake, power end metal lead wire and power supply input and touched groove.Described chip slot, pore and aspirating hole are in order to fixing photodetector to be measured；Described signal end metalline stake, signal end metal lead wire and signal output touch groove in order to be read by the measurement signal of photodetector to be measured；Described power end metalline stake, power end metal lead wire and power supply input touch groove with thinking that photodetector to be measured provides power supply.Described batch testing load plate is aided with signal output interface and power input interface, constitutes batch testing load plate system provided by the present invention.The present invention can carry out test rapidly and efficiently to hundreds and thousands of photodetectors simultaneously；And the quick reading of multiple test volume can be conveniently realized, and then easily test volume is carried out statistical analysis rapidly.
Description
Technical field
The present invention relates to microelectronics and photoelectron field tests, particularly relate to one and can be used for detecting simultaneously or test many
The batch testing load plate of individual photodetector and load plate system.
Background technology
The detection of photodetector or test relate to the measurement of electrical quantities and optical quantities.The measurement of photodetector at present
Method is generally adopted by single product test load plate, and single detector to be measured is put into single product test load plate by tester
Upper fixing, it is then assembled in test system, carries out the optical quantities such as measurement and spectral response of the electrical quantities such as current/voltage successively
Measurement.The mode using single test load plate is measured that efficiency is low, is wasted time and energy, and constantly changes due to needs and treat probing
Survey device, measure while therefore cannot realizing multiple detector, be unfavorable for large scale test.Additionally, due to use single test
Its test result relative distribution of the mode of load plate, is unfavorable for that the photodetector manufacturing same batch carries out the statistical of system
Analysis.Thus, in the urgent need to large scale test can be facilitated, the batch testing that multiple test data are gathered can be facilitated to carry again simultaneously
Dish.
Summary of the invention
Present invention seek to address that above technical problem, and provide one to can be used for the test of photodetector rapid batch, and
It is greatly improved batch testing load plate and the load plate system of testing efficiency.For achieving the above object, the present invention provides following technology
Scheme:
A kind of load plate for photodetector batch testing, it is characterised in that be disposed with gas circuit layer from bottom to up
With chip fixed layer, described gas circuit layer and chip fixed layer are tightly connected；Described gas circuit layer includes air cavity and aspirating hole, described gas
Chamber is connected with the external world by described aspirating hole；Described chip fixed layer includes M row N row (value of M and N is all higher than equal to 1) rule
The chip slot then arranged, and signal end metalline stake, power end metalline stake, pore, signal end metal lead wire, power end metal draw
Groove is touched in the output of line, signal and groove is touched in power supply input；The width of described chip slot surface is more than the width bottom it, in order to treat
Being placed and taken out of light-metering electric explorer；Described chip slot is connected with described air cavity by multiple pores；Described signal end metal
Stake lay respectively at power end metalline stake bottom described chip slot relative to two ends, and separated by the plurality of pore, and two
The upper surface of person is all concordant with the bottom faces of described chip slot；Described signal output touch groove by described signal end metal lead wire with
Described signal end metalline stake is electrically connected one by one, in order to the optical measurement amount of photoelectric sensor to be measured or electrical measurement amount to be read
Go out；Groove is touched in every string chip slot correspondence M signal output, and described test load plate has M × N number of signal output and touches groove；Described often
M the signal output that string chip slot is corresponding is touched groove and is equidistantly formed a line according to its corresponding chip slot order in these row；
Described M × N number of signal output is touched groove and is respectively positioned on the same side of described chip fixed layer, and regularly arranged；Described power supply
Input is touched groove and is electrically connected with described power end metalline stake by described power end metal lead wire, with thinking photoelectric sensor to be measured
Power supply is provided；The same power supply that the power end metalline stake of every string is all interconnected to belong to these row by power end metal lead wire is defeated
Entering on tactile groove, M chip slot in described every string chip slot shares a power supply input and touches groove, and described test load plate has N
Groove is touched in the input of individual power supply；The input of described N number of power supply is touched groove and is respectively positioned on described chip fixed layer groove place side tactile with signal output
On a relative side；The input of described N number of power supply is touched groove and is positioned in same level and equidistantly arranges；Described signal end gold
Belong to stake, power end metalline stake, signal end metal lead wire, power end metal lead wire, signal output touch groove and power supply input touch groove that
Electrically insulated from one another between this, and electrically insulated from one another respectively and between chip fixed layer.
Further, between described M row N row chip slot row and row, equidistant spread configuration, the most equidistantly arranges
Row are arranged.This set-up mode is conducive to the manufacture of load plate.
Further, described M × tactile groove of N number of signal output constitutes the signal output of M row N row and touches groove array, and arranges and row
Between equidistant spread configuration.This set-up mode is conducive to the rapid batch to measuring signal to read.
Further, described chip fixed layer is manufactured by electrically insulating material, described signal end metalline stake, power end metal
Groove is touched in stake, the output of signal end metal lead wire, power end metal lead wire, signal and the groove metal material by easy conductive is touched in power supply input
Material manufactures.
Further, described signal end metalline stake, power end metalline stake, signal end metal lead wire, power end metal lead wire,
Groove is touched in signal output and the groove metal material manufacture by easy conductive is touched in power supply input, and its periphery is by electrically insulating material bag
Wrap up in, be used for each other and with the electrically insulated from one another between chip fixed layer.
For realizing the rapidly and efficiently measurement demand of photoelectric detector performance, present invention also offers a kind of for photodetection
The load plate system of device batch testing, it is characterised in that include that the batch testing load plate of aforementioned offer and the output of additional signal connect
Mouth and power input interface；Described signal output interface is the most equidistantly formed a line by M signal output probe and constitutes, M
It is electrically insulated from each other between signal output probe；Described signal output probe includes signal metal spring and signal metal contact pilotage；Institute
The one end stating signal metal spring is electrically connected with signal metal contact pilotage；Described signal metal spring not with signal metal contact pilotage phase
The one end connect is connected with signal lead, in order to the output of test signal；The signal metal contact pilotage of described M signal output probe
Either rank signal output on described batch testing load plate can be inserted simultaneously into touch groove and touch groove realization electrical connection with signal output；
Measure the electrical testing amount obtained and optic test amount touches groove, signal metal contact pilotage, signal metal spring through signal output successively
And signal lead is input to computer or external analytical equipment；Described power input interface comprises a power supply signal probe, institute
State power supply signal probe and include power Metal spring and power Metal contact pilotage, and one end of power Metal spring is touched with power Metal
Pin is electrically connected；One end that described power Metal spring does not connects with power Metal contact pilotage is connected with power supply lead wire, in order to electricity
The input of source signal；The power Metal contact pilotage of described power supply signal probe is inserted on described batch testing load plate any one electricity
Source input is touched groove and touches groove realization electrical connection with power supply input；Power supply signal needed for photodetector draws through power supply successively
The input of line, power Metal spring, power Metal contact pilotage, power supply is touched groove and is input in batch testing load plate.
The invention have benefit that, hundreds and thousands of photodetectors can be tested simultaneously；Can be quick
Realize the measurement of the electrical quantities of multiple photodetector, optical quantities efficiently, without constantly changing detector to be measured；Can
Realize the quick reading of multiple test volume with the output probe of binding signal easily, and then easily test volume is carried out rapidly
Statistical analysis.
Accompanying drawing explanation
Below in conjunction with embodiment and accompanying drawing, the present invention is described in detail, wherein:
Fig. 1 is the front view of carrying disc structure schematic diagram proposed by the invention.
Fig. 2 is the rearview of carrying disc structure schematic diagram proposed by the invention.
Fig. 3 is the cross sectional representation in Fig. 1 (or Fig. 2) along AA '.
Fig. 4 is the cross sectional representation in Fig. 1 (or Fig. 2) along BB '.
Fig. 5 is the top view in one single chip groove region.
Fig. 6 is the metal lead wire connection diagram corresponding to load plate either rank chip slot proposed by the invention.
Fig. 7 is the signal input output interface schematic diagram of load plate system proposed by the invention.
In figure, the implication of each label is as follows: 100-gas circuit layer；102-aspirating hole；103-air cavity；200-chip fixed layer；
201-chip slot；Groove is touched in the output of 202-signal；Groove is touched in the input of 203-power supply；204-pore；205-signal end metalline stake；206-electricity
Source metalline stake；207-signal end metal lead wire；208-power end metal lead wire；300-signal output interface；301-signal is defeated
Go out probe；302-signal metal spring；303-signal metal contact pilotage；304-signal lead；400-power input interface；401-electricity
Source signal probe；402-power Metal spring；403-power Metal contact pilotage；404-power supply lead wire.
Detailed description of the invention
Refer to accompanying drawing 1 to accompanying drawing 6.A kind of load plate for photodetector batch testing, sets gradually from bottom to up
Gas circuit layer (100) and chip fixed layer (200), described gas circuit layer (100) and chip fixed layer (200) is had to be tightly connected；Described
Gas circuit layer (100) includes air cavity (103) and aspirating hole (102), and described air cavity (103) is by described aspirating hole (102) and the external world
It is connected；Described chip fixed layer (200) includes that (value of M and N is all higher than equal to 1 M row N row, and in this embodiment, M and N is equal
Take 3) regularly arranged chip slot (201), and signal end metalline stake (205), power end metalline stake (206), pore (204), letter
Groove (202) and the tactile groove (203) of power supply input are touched in number end metal lead wire (207), power end metal lead wire (208), signal output；Institute
State the width of chip slot (201) surface more than the width bottom it, in order to being placed and taken out of photodetector to be tested；
Described chip slot (201) is connected with described air cavity (103) by multiple pores (204)；Described signal end metalline stake (205) and electricity
Source metalline stake (206) lays respectively at the two ends that described chip slot (201) bottom is relative, and by the plurality of pore (204) point
Separate, and the upper surface of the two is all concordant with the bottom faces of described chip slot (201)；The output of described signal is touched groove (202) and is passed through
Described signal end metal lead wire (207) is electrically connected one by one with described signal end metalline stake (205), in order to by photoelectric sensing to be measured
The optical measurement amount of device or electrical measurement amount read；Groove (202), described test are touched in corresponding 3 signals output of every string chip slot
Load plate has 3 × 3 signal outputs and touches groove (202)；3 signal outputs that described every string chip slot is corresponding are touched groove (202) and are pressed
Equidistantly forming a line according to its corresponding chip slot (201) order in these row, it is equal that groove (202) is touched in described 3 × 3 signals output
It is positioned on the same side of described chip fixed layer (200), and regularly arranged；The input of described power supply is touched groove (203) and is passed through institute
State power end metal lead wire (208) to be electrically connected with described power end metalline stake (206), with thinking that photoelectric sensor to be measured provides
Power supply；And the power end metalline stake (206) of every string all is interconnected to belong to the same of these row by power end metal lead wire (208)
The input of individual power supply is touched on groove (203), and 3 chip slot in described every string chip slot (201) share a power supply input and touch groove
(203), described test load plate has 3 power supply inputs and touches groove (203)；Described 3 power supplys input is touched groove (203) and is respectively positioned on described
Chip fixed layer (200) touches on the side that groove (202) side, place is relative with signal output；Described 3 power supplys input is touched
Groove (203) is positioned in same level and equidistantly arranges；Described signal end metalline stake (205), power end metalline stake (206),
Groove (202) is touched in the output of signal end metal lead wire (207), power end metal lead wire (208), signal and groove (203) is touched in power supply input
Electrically isolated from each other, and electrically insulated from one another respectively and between chip fixed layer (200).
For convenience of the manufacture of load plate, equidistant spread configuration between described 3 row 3 row chip slot (201) row and row, arrange and arrange
Between equidistant spread configuration.Further, for ease of the rapid batch measuring signal is read, described 3 × 3 signals output
Touch groove (202) and constitute the tactile groove array of signal output of 3 row 3 row, and equidistant spread configuration between the column and the column.
For ensureing that photodetector will not be short-circuited when test, necessary electric isolution is necessary.Adoptable side
Case is, described chip fixed layer (200) is manufactured by electrically insulating material, described signal end metalline stake (205), power end metalline stake
(206), groove (202) and the tactile groove of power supply input are touched in signal end metal lead wire (207), power end metal lead wire (208), signal output
(203) by the metal material manufacture of easy conductive；Or, described signal end metalline stake (205), power end metalline stake (206), letter
Number end metal lead wire (207), power end metal lead wire (208), groove (202) is touched in signal output and power supply input touches groove (203) all
By the metal material manufacture of easy conductive, and its periphery is wrapped up by electrically insulating material, for each other and fixing with chip
Electrically insulated from one another between layer (200).
For realizing the rapidly and efficiently measurement demand of photoelectric detector performance, present invention also offers a kind of for photodetection
The load plate system of device batch testing, it is characterised in that include that the batch testing load plate of aforementioned offer and the output of additional signal connect
Mouth (300) and power input interface (400)；Described signal output interface (300) is by 3 signals output probe (301) successively etc.
Spacing forms a line composition, is electrically insulated from each other between 3 signals output probe (301)；Described signal output probe (301) includes
Signal metal spring (302) and signal metal contact pilotage (303)；One end of described signal metal spring (302) is touched with signal metal
Pin (303) is electrically connected；One end that described signal metal spring (302) does not connects with signal metal contact pilotage (303) is drawn with signal
Line (304) is connected, in order to the output of test signal；The signal metal contact pilotage (303) of described 3 signals output probe (301)
Either rank signal output on described batch testing load plate can be inserted simultaneously into touch groove (202) and touch groove (202) in fact with signal output
Now it is electrically connected；Measure the electrical testing amount obtained and optic test amount touches groove (202) through signal output successively, signal metal is touched
Pin (303), signal metal spring (302) and signal lead (304) are input to computer or external analytical equipment；Described power supply is defeated
Incoming interface (400) comprises a power supply signal probe (401), and described power supply signal probe (401) includes power Metal spring
And power Metal contact pilotage (403), and one end of power Metal spring (402) electrically connects with power Metal contact pilotage (403) (402)
Connect；One end that described power Metal spring (402) does not connects with power Metal contact pilotage (403) is connected with power supply lead wire (404), with
It is easy to the input of power supply signal；The power Metal contact pilotage (403) of described power supply signal probe (401) is inserted into described batch and surveys
On examination load plate, groove (203) is touched in the input of any one power supply and groove (203) tactile with power supply input realizes electrical connection；Photodetector institute
The power supply signal needed is successively through power supply lead wire (404), power Metal spring (402), power Metal contact pilotage (403), power supply input
Touch groove (203) to be input in batch testing load plate.
Above-described embodiment is for ease of those skilled in the art it will be appreciated that and use the present invention to describe
's.These embodiments obviously easily can be made various amendment by person skilled in the art, and described herein
General Principle is applied in other embodiments without through performing creative labour.Therefore, the invention is not restricted to above-described embodiment,
Those skilled in the art should be at this according to the announcement of the present invention, the improvement made without departing from scope and amendment
Within bright protection domain.
Claims (6)
1. the load plate for photodetector batch testing, it is characterised in that be disposed with from bottom to up gas circuit layer and
Chip fixed layer, described gas circuit layer and chip fixed layer are tightly connected；Described gas circuit layer includes air cavity and aspirating hole, described air cavity
It is connected with the external world by described aspirating hole；Described chip fixed layer includes M row N row (value of M and N is all higher than equal to 1) rule
Arrangement chip slot, and signal end metalline stake, power end metalline stake, pore, signal end metal lead wire, power end metal lead wire,
Groove is touched in signal output and groove is touched in power supply input；The width of described chip slot surface is more than the width bottom it, in order to be measured
Being placed and taken out of photodetector；Described chip slot is connected with described air cavity by multiple pores；Described signal end metalline stake
Lay respectively at power end metalline stake bottom described chip slot relative to two ends, and separated by the plurality of pore, and the two
Upper surface all concordant with the bottom faces of described chip slot；The output of described signal touches groove by described signal end metal lead wire and institute
State signal end metalline stake to be electrically connected one by one, in order to the optical measurement amount of photoelectric sensor to be measured or electrical measurement amount to be read；
Groove is touched in every string chip slot correspondence M signal output, and described test load plate has M × N number of signal output and touches groove；Described every string
M the signal output that chip slot is corresponding is touched groove and is equidistantly formed a line according to its corresponding chip slot order in these row；Described M
The output of × N number of signal is touched groove and is respectively positioned on the same side of described chip fixed layer, and regularly arranged；The input of described power supply is touched
Groove is electrically connected with described power end metalline stake by described power end metal lead wire, supplies with thinking that photoelectric sensor to be measured provides
Electricity；Groove is touched in the same power supply input that the power end metalline stake of every string is all interconnected to belong to these row by power end metal lead wire
On, M chip slot in described every string chip slot shares a power supply input and touches groove, and described test load plate has N number of power supply
Groove is touched in input；It is relative that the tactile groove of described N number of power supply input is respectively positioned on described chip fixed layer groove place side tactile with signal output
On one side；The input of described N number of power supply is touched groove and is positioned in same level and equidistantly arranges；Described signal end metalline stake,
Groove is touched in the output of power end metalline stake, signal end metal lead wire, power end metal lead wire, signal and power supply input touches groove each other
Electrically insulated from one another, and electrically insulated from one another respectively and between chip fixed layer.
A kind of load plate for photodetector batch testing the most according to claim 1, it is characterised in that described M row N
Equidistant spread configuration between row chip slot row and row, between the column and the column equidistant spread configuration.
3., according to a kind of load plate for photodetector batch testing described in any one of claim 1 to 2, its feature exists
In, described M × N number of signal output is touched the signal output of groove composition M row N row and is touched groove array, and the most equidistantly arranges
Arrange.
4. according to a kind of load plate for photodetector batch testing described in any one of claims 1 to 3, it is characterised in that
Described chip fixed layer is manufactured by electrically insulating material, described signal end metalline stake, power end metalline stake, signal end metal lead wire,
Groove is touched in the output of power end metal lead wire, signal and the groove metal material manufacture by easy conductive is touched in power supply input.
5., according to a kind of load plate for photodetector batch testing described in any one of claims 1 to 3, its feature exists
In, described signal end metalline stake, power end metalline stake, signal end metal lead wire, power end metal lead wire, signal output touch groove and
The groove metal material manufacture by easy conductive is touched in power supply input, and its periphery is wrapped up by electrically insulating material, for each other
And with the electrically insulated from one another between chip fixed layer.
6. the load plate system for photodetector batch testing, it is characterised in that include as claim 1 to 5 is arbitrary
Batch testing load plate described in Xiang and signal output interface and power input interface；Described signal output interface is defeated by M signal
Go out probe the most equidistantly to form a line composition, be electrically insulated from each other between M signal output probe；Described signal output probe bag
Include signal metal spring and signal metal contact pilotage；One end of described signal metal spring is electrically connected with signal metal contact pilotage；Institute
State one end that signal metal spring do not connects with signal metal contact pilotage to be connected with signal lead, in order to the output of test signal；
The signal metal contact pilotage of described M signal output probe can be inserted simultaneously into either rank signal output on described batch testing load plate
Touch groove and touch groove realization electrical connection with signal output；Measure the electrical testing amount obtained and optic test amount is defeated through signal successively
Go out tactile groove, signal metal contact pilotage, signal metal spring and signal lead and be input to computer or external analytical equipment；Described power supply
Input interface comprises a power supply signal probe, and described power supply signal probe includes power Metal spring and power Metal contact pilotage,
And one end of power Metal spring is electrically connected with power Metal contact pilotage；Described power Metal spring not with power Metal contact pilotage phase
The one end connect is connected with power supply lead wire, in order to the input of power supply signal；The power Metal contact pilotage energy of described power supply signal probe
Enough insert any one power supply input on described batch testing load plate touch groove and touch groove realization electrical connection with power supply input；Light electrical resistivity survey
Power supply signal needed for surveying device touches groove be input to through power supply lead wire, power Metal spring, power Metal contact pilotage, power supply input successively
In batch testing load plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610601770.0A CN106153094B (en) | 2016-07-27 | 2016-07-27 | A kind of load plate and load plate system for photodetector batch testing |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610601770.0A CN106153094B (en) | 2016-07-27 | 2016-07-27 | A kind of load plate and load plate system for photodetector batch testing |
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| CN106153094A true CN106153094A (en) | 2016-11-23 |
| CN106153094B CN106153094B (en) | 2018-08-07 |
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| CN113576502A (en) * | 2021-07-12 | 2021-11-02 | 上海奕瑞光电子科技股份有限公司 | Test fixture, test device and test method for batch test of detectors |
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| CN109631974B (en) * | 2018-12-25 | 2021-01-08 | 西南技术物理研究所 | Quadrant class photoelectric detector circular telegram vibration test frock |
| CN110095143A (en) * | 2019-06-04 | 2019-08-06 | 哈尔滨理工大学 | A kind of reliability detection device of trough type photoelectric sensor |
| CN113576502A (en) * | 2021-07-12 | 2021-11-02 | 上海奕瑞光电子科技股份有限公司 | Test fixture, test device and test method for batch test of detectors |
| CN113576502B (en) * | 2021-07-12 | 2024-03-19 | 上海奕瑞光电子科技股份有限公司 | Test fixture, test device and test method for batch test of detectors |
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